JPH02834B2 - - Google Patents

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a contact fitting for an IC socket and a manufacturing method thereof, which can be easily attached to an IC lead insertion hole of an IC socket, and which is durable. excellent in sex, and
In addition to ensuring secure clamping of IC leads, we also aim to reduce costs by eliminating waste in material collection.
Concerning IC socket contact fittings and their manufacturing method.

(Conventional technology) The contact fittings of conventional IC sockets are
Products having the structure shown in the figure are provided on the market.

That is, one strip-shaped metal plate 32 is folded in half and put together, and one half of the two pieces is bent into a dogleg shape, and the other half is bent into a shape of an approximately L.
The L-shaped piece is bent into a letter shape and arranged so that both tips point upward, and by combining this L-shaped piece and the lower half piece of the dogleg shape, a substantially triangular shape is formed.
Then, the guide plates 36 and 37 are formed so as to expand upwardly with the upper half piece of the dogleg shape without appropriately bending the tip of the other piece bent in the L shape, and The two sides sandwiching the bottom side 33 are formed such that their apex portions can be separated from each other against elastic force, and these serve as a clamping piece 34 that clamps the IC lead 4, and this triangular portion as a whole serves as an IC lead clamping part 35.

Further, approximately the original half of the belt-shaped metal plate 32 folded in half is in a state where two sheets are overlapped, but the belt-shaped metal plate 32 is notched in the width direction to be thinner to form a wiring board mounting conductive piece 38, The tip of this wiring board mounting conductive piece 38 is a fold. A retaining pawl 40 is cut and raised at the base 39 of the wiring board mounting conductive piece 38, that is, slightly below the triangular base 33.

(Problems to be Solved by the Invention) <Problems with the Prior Art> Therefore, in the case of this contact fitting 31, since it has a structure that can be formed by continuous press processing, the molding cost is low, and the IC Although it has the advantage of being easy to install into the IC lead insertion hole of the socket, it also has the following problems.

That is, first of all, in order to improve conductivity, the surface of this type of contact fitting 31 is plated with gold when it is in a flat state, or the entire contact fitting is plated with gold after being molded. Therefore, the material must be saved as much as possible, but since the wiring board mounting conductive piece 38 is cut out, a large amount of waste is generated in the cutout portion 41, as shown in FIG. In order to avoid wasteful gold plating on the cutout portion 41, gold plating is applied only to the part that contacts the IC lead.
Partial plating itself is expensive, or if a process of masking and post-plating is required, the masking process is wasted.

Secondly, since the wiring board mounting conductive piece 38 is made of two layers, as shown in FIG. 7, there is waste in the overall material removal.

Thirdly, since the band-shaped metal plate 32 is made of a material such as a spring material in order to keep the clamping piece 34 in the closed state with elastic force, when the band-shaped metal plate 32 is folded in half, the fold They often get cracked or break. Then, the clamping piece 34
This results in it not fulfilling its role of holding the IC lead 4.

<Technical Issues> Therefore, in view of the above-mentioned problems, the present invention provides a device that can be easily attached to the IC lead insertion hole of an IC socket, has excellent durability, and securely holds the IC lead. It was created with the aim of reducing costs by eliminating waste in material collection.

[Structure of the Invention] (Means for Solving the Problems) The present invention is a belt-shaped metal plate bent into a substantially triangular shape that can be attached to an IC lead insertion hole of an IC socket.
The two sides sandwiching the bottom side are formed so that they can be separated from each other by resisting elastic force at the apex portion, and this IC
2 extending upwardly at the upper ends of each of the two sides of the lead holding part.
A wiring board mounting conductive piece formed by cutting a part of the band-shaped metal plate downward from the bottom side and protruding at a predetermined length, and another part of the band-shaped metal plate. A portion is cut and raised downward from the bottom side and placed in contact with the base of the wiring board mounting conductive piece, or placed near it, and a retaining claw is bent or cut in a portion. The above-mentioned problems are solved by the contact fittings, which are made up of a mounting fixing plate formed by raising the IC socket, and a wiring board mounting conductive piece that is inserted and fixed into the IC socket mounting hole of the wiring board, and a wiring board mounting conductive plate. A mounting fixing method that is formed by bending or cutting out a retaining claw that is placed in contact with or near the base of the IC socket, and is inserted into the IC lead insertion hole of the IC socket and fixed so that it does not come out. A score line is provided in advance on the band-shaped metal plate in order to cut and raise the plate, and then the band-shaped metal plate is made into a substantially triangular shape in which the two sides sandwiched by the base can resist elastic force and be separated at the apex portion. The shape is bent so as to have two guide plates each extending upwardly at the upper end of each of the two sides, and the wiring board mounting conductive piece and the mounting plate are bent. The above-mentioned problems are solved by a method of manufacturing a contact fitting in which the fixing plate is cut and raised so as to protrude downward by a predetermined length from the bottom side.

(Function) The contact fitting of the IC socket according to the present invention is a belt-shaped metal plate bent into a substantially triangular shape that can be attached to the IC lead insertion hole of the IC socket 1, and the two sides sandwiching the base thereof are the apex portions. The IC lead clamping part is formed so as to be able to be separated against elastic force, thereby making it easy to install the IC lead clamping part into the IC lead insertion hole, and having excellent strength to securely clamp the IC lead.

Two guide plates extending upwardly from the upper ends of each of the two sides of the IC lead clamping part facilitate the insertion of the IC lead into the IC lead clamping part.

Then, a part of the band-shaped metal plate forming the IC lead holding part is cut and raised downward from the bottom side to protrude at a predetermined length, and a wiring board mounting conductive piece is formed, and the band-shaped metal plate is also formed to protrude at a predetermined length. The other part of the board is cut and raised below the bottom side and placed in contact with the base of the wiring board mounting conductive piece, or is placed near it, and a retaining claw is broken in a part. By providing a mounting fixing plate formed by bending or cutting and bending, the material size is made shorter than that of a conventional contact metal fitting formed by folding in half, and the material can be taken without wasting the material.

The manufacturing method consists of a wiring board mounting conductive piece that is inserted and fixed into the IC socket mounting hole of the wiring board,
Place it in contact with or near the base of the wiring board mounting conductive piece, and bend or cut out the retaining claw that inserts into the IC lead insertion hole of the IC socket and fixes it so that it does not come out. A cut line is provided in advance on the band-shaped metal plate in order to cut and raise the mounting fixing plate to be formed, and then the band-shaped metal plate can be separated by resisting elastic force at the apex portion of the two sides sandwiching the base. It has a roughly triangular shape, with two guide plates that expand upward at the upper ends of each of its two sides.
A series of press processing steps are performed in which the wiring board mounting conductive piece and the mounting fixing plate are bent to form an extended shape one by one, and cut and raised to protrude by a predetermined length downward from the bottom side. This shortens the process and reduces material removal.

(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

That is, the reference numeral 11 shown in FIGS. 1, 3E, and 4 is a contact fitting, which includes an IC lead holding part 15 that holds the IC lead 4, and a wiring cut downward from this IC lead holding part 15. It consists of a board mounting conductive piece 18 and a mounting fixing plate 20.

The IC lead holding part 15 is formed by bending a band-shaped metal plate 12 into a substantially triangular shape that can be attached to the IC lead insertion hole 2 of the IC socket 1. A clamping piece 14 is formed at the corner portion so that it can be separated against elastic force.

Two guide plates 16 and 17 are provided at the upper end of each of the holding pieces 14 so as to expand upwardly. One of the guide plates 16 is longer than the other guide plate 17, and together with one of the clamping pieces 14, it has a substantially dogleg shape. The other guide plate 17 and the other clamping piece 14 form a substantially inverted L-shape. By doing so, the IC lead 4 held by the IC lead holding part 15 expands in the direction of separating the holding pieces 14 against the elastic force, and is inserted and held inside the triangle.

On the other hand, the wiring board mounting conductive piece 18 is formed by making a cut in a part of the band-shaped metal plate 12, in the illustrated case, from the other clamping piece 14 to the bottom side 13, and cutting it downward to a predetermined length. It is formed to protrude downward from the bottom side 13.

The mounting and fixing plate 20 is also attached to the band-shaped metal plate 12.
The other part, as shown in the figure, is cut into the one 14 and cut downward from the bottom side 13 and placed in contact with the base 19 of the wiring board mounting conductive piece 18, or Place it near it. A part of it, as shown in the figure, has a retaining claw 2 at the tip.
For example, as shown in FIG. 1, the distal end portion of the mounting and fixing plate 20 is cut and bent into a triangular inverted claw shape.

This retaining claw 21 has a form shown in FIG. 5, for example.

That is, FIG. 5A shows a shape in which the tip of the mounting and fixing plate 20 is folded back into a V shape to form an inverted claw shape.
In addition, B has a shape in which the vicinity of the tip of the mounting/fixing plate 20 is bent, and C has a shape in which the tip of the mounting/fixing plate 20 is bent into a wave shape to form an inverted claw shape. D is a shape in which an inverted claw-shaped retaining claw 21 is cut and raised approximately at the center in the width direction near the tip of the mounting/fixing plate 20, and E is a shape in which a reverse claw-shaped retaining claw 21 is cut and raised at the end side in the width direction. Further, F has a shape in which a triangular inverted claw is cut and raised at the tip of the mounting fixing plate 20, and is similar to the retaining claw 21 shown in FIG. 1 described above, but the difference is that shown in FIG. For the shape shown in FIG. 2, the mounting and fixing plate 20 was cut with a fold line extending inward from the tip corner, and for F, the tip of the mounting and fixing plate 20 was cut off diagonally and the fold line was cut off. It is cut and raised from a corner in the longitudinal direction of the mounting/fixing plate 20, and is different in this point.

The method for manufacturing the contact metal fitting 11 formed in this manner is as shown in FIG.

That is, first, as shown in FIG. 3A, the wiring board is attached to a band-shaped metal plate 7 wound into a roll having a width equal to or more than the length of the band-shaped metal plate into which contact fittings can be formed. Conductive piece 1
8 and the cutting line 22 to cut and raise the mounting fixing plate 20.
is placed in a predetermined position, and a strip metal plate of a predetermined length and width on which a contact fitting 11 is to be formed is placed on one side edge of the rolled metal strip 7, leaving only one side edge. 12 is attached in the shape of a comb blade, and is completed by cutting in the final process. Moreover, on the contrary, the strip metal plate 1 for forming the contact fitting from the strip metal plate 7 is prepared in advance.
You may separate it by cutting 2. In this case, it is convenient to apply, for example, gold plating only to the contact portion with the IC lead 4 and the conductive portion of the wiring board mounting conductive piece 18 to the wiring board 5 at this stage.

Next, the band-shaped metal plate 12 formed into the comb blade shape is
When explained as a processing process for a separated single item,
As shown in FIG. 3C, the band-shaped metal plate 12 with the cut line 22 shown in FIG. The base 19 of the base 19 may be disposed in contact with or near the base 19 of the base.

Then, as shown in FIG. 3D, only the band-shaped metal plate 12 is bent into an acute hook shape, leaving the wiring board mounting conductive piece 18 slightly bent inward. Furthermore, only the band-shaped metal plate 12 is bent into a triangular shape to form the above-mentioned IC lead holding part 15, and the guide plates 16 and 17 are also bent, and the thus formed product is finally formed as described above. It is completed by being separated from the band-shaped metal plate 7 in the process.

Therefore, if this process is carried out, the manufacturing cost can be reduced because the molding can be performed by progressive press working, and compared to the conventional contact fitting 31 described above, at least the step of folding in two can be omitted. , the press mold becomes cheaper, which greatly contributes to cost reduction.

The contact fitting 11 formed in this way is installed in the IC lead insertion hole 2 of the IC socket 1 and secured by the retaining claw 21, as shown in FIG.
It is fixed in the IC lead insertion hole 2. At that moment,
Only the wiring board mounting conductive piece 18 is formed so as to protrude from the bottom surface of the IC socket 1, and the protruding wiring board mounting conductive piece 18 is inserted into the IC socket mounting hole 6 of the wiring board 5, and then the protruding conductive piece 18 is inserted into the IC socket mounting hole 6 of the wiring board 5 on the opposite side of the wiring board 5. The inserted wiring board mounting conductive piece 18 is soldered to each wiring of the wiring board 5 so as to be connected and conductive. The IC 3 can be easily attached to the wiring board 5 by simply inserting the IC lead 4 of the IC 3 into the contact fitting 11 attached in this manner.

Furthermore, as is clear from a comparison of FIG. 2 and FIG. 7, the material of the contact fitting 11 formed in this manner is such that there is no wastage of the notch portion 41, and moreover, it can be folded in two. Band-shaped metal plate 32
There is a significant difference between the metal strip 12 and the metal strip 12 that is not folded in half, and the latter requires a much shorter material, and in the case of mass production, etc., this difference has a large effect. This makes it possible to significantly reduce costs.

It goes without saying that the shape and manufacturing method of the contact fitting 11 are not limited to those of the above embodiment.

[Effects of the Invention] The present invention configured as described above includes a belt-shaped metal plate 12 bent into a substantially triangular shape that can be attached to the IC lead insertion hole 2 of the IC socket 1, and the two sides sandwiching the bottom side 13 of the belt-shaped metal plate 12 are attached to the IC lead insertion hole 2 of the IC socket 1. An IC lead clamping part 15 formed at the corner part so as to be able to be separated against elastic force, and an upper end of each of the two sides of this IC lead clamping part 15,
Since it has two guide plates 16 and 17 each extending in a shape that expands upward, there is no folded part compared to the shape of the conventional contact fitting 31, so it is easy to use as a material when collecting materials. The length of the band-shaped metal plate 12 can be shortened, and there is no step of folding it in half, so it is possible to reduce costs.

Furthermore, a wiring board mounting conductive piece 18 formed by cutting and raising a part of the band-shaped metal plate 12 downward from the bottom side 13 to protrude at a predetermined length, and the other parts of the band-shaped metal plate 12 are also provided. A part is cut and raised below the bottom side 13 and placed in contact with the base 19 of the wiring board mounting conductive piece 18, or placed in the vicinity thereof, and a retaining claw 21 is broken in a part. Since the mounting fixing plate 20 is formed by bending or cutting and bending, compared to the contact fitting 31, the wiring board mounting conductive piece 38 part is not required to be folded in half, and the metal strip is bent into a substantially triangular shape. By forming the wiring board mounting conductive piece 18 and the mounting fixing plate 20 from a part of the board 12, it is possible to eliminate waste of material and enable efficient material collection. This is a strip metal plate 12
In addition to applying gold plating to the surface to improve conductivity, the number of gold-plated parts can be further reduced, resulting in cost reduction.

Considering the overall shape, the fact that there are no double-folded parts means that there are no unreasonable folded parts, so there is no possibility of cracks in the folded parts and breaking, which improves strength, especially durability. It has excellent target strength.

Also, in the manufacturing method, the wiring board mounting conductive piece 18 that is inserted and fixed into the IC socket mounting hole 6 of the wiring board 5 and the base 19 of the wiring board mounting conductive piece 18 are arranged in contact with or in the vicinity thereof. At the same time, in order to cut and cut the mounting fixing plate 20, which is formed by bending or cutting the retaining claw 21 that is inserted into the IC lead insertion hole 2 of the IC socket 1 and fixed so that it does not come out, A cut line 22 is provided in advance on the plate 12, and then this band-shaped metal plate 12 is cut into a substantially triangular shape in which the two sides sandwiching the base 13 can be separated by resisting elastic force at the apex portion. At the upper end of each side, two guide plates 16 and 17 that expand upward are bent so as to extend one by one, and the wiring board mounting conductive piece 18,
Since the contact fitting 11 is formed by cutting and raising the mounting fixing plate 20 so as to protrude downward by a predetermined length from the bottom side 13, it can be manufactured by a series of sequential press processing steps, and the contact fitting 31 can be manufactured by a series of sequential pressing steps.
Since there is no double-folded part, this process can be omitted, and the mold is also cheaper, which greatly contributes to contact down.

As explained above, according to this invention, the IC
It can be easily attached to the IC lead insertion hole of the socket.
Moreover, it has excellent durability, can securely hold IC leads, has a shape that can be mass-produced, eliminates waste in material collection, reduces costs, and has various excellent effects such as being able to provide it at a low price. play.

[Brief explanation of drawings]

Figures 1 to 5 show enlarged embodiments of the present invention; Figure 1 is a perspective view, Figure 2 is a developed view, Figure 3 is a manufacturing process diagram, and Figure 4 is a cross-sectional view of the state in use. 5 and 5 are perspective views of essential parts of other embodiments of the retaining pawl, FIG. 6 is a perspective view of a conventional contact fitting, and FIG. 7 is a developed view of the same. 1...IC socket, 2...IC lead insertion hole, 3...
IC, 4...IC lead, 5...wiring board, 6...IC socket mounting hole, 7...band-shaped metal plate, 11...contact metal fitting, 12...band-shaped metal plate, 13...bottom, 14...clipping piece, 15...IC lead clamping Part, 16...Guide plate,
17...Guide plate, 18...Wiring board mounting conduction piece, 1
9...Base, 20...Mounting fixing plate, 21...Removal prevention claw,
22... Cut line, 31... Contact metal fitting, 32...
Band-shaped metal plate, 33...bottom side, 34...clamping piece, 35...
IC lead holding part, 36... Guide plate, 37... Guide plate, 38... Wiring board mounting conductive piece, 39... Base,
40...Preventing claw, 41...Notch part.

Claims (1)

[Scope of Claims] 1. A belt-shaped metal plate bent into a substantially triangular shape that can be attached to the IC lead insertion hole of an IC socket, and the two sides sandwiching the base are separated by resisting elastic force at the apex part. an IC lead holding part formed so as to be able to hold the IC lead, two guide plates extending upwardly at the upper ends of each of the two sides of the IC lead holding part, and the band-shaped metal plate. A wiring board mounting conductive piece is formed so as to protrude by a predetermined length by cutting a part downward from the bottom side, and also cut and cutting another part of the band-shaped metal plate downward from the bottom side. The mounting fixing plate is arranged in contact with or near the base of the wiring board mounting conductive piece, and is formed by bending or cutting out a retaining claw in a part. IC socket contact fittings characterized by: 2. A wiring board mounting conductive piece that is inserted and fixed into the IC socket mounting hole of the wiring board, and a conductive piece that is placed in contact with or near the base of the wiring board mounting conductive piece, and the IC lead insertion hole of the IC socket. A cut line is provided in advance on the band-shaped metal plate in order to cut out the attachment fixing plate formed by bending or cutting up the retaining claw that is inserted into the inside and fixed so that it will not come out. The plate has a substantially triangular shape in which the two sides sandwiching the base can be separated by resisting elastic force at the apex portion, and two guide plates are provided at the upper ends of each of the two sides to expand upward. are bent one by one into an extended shape, and cut and raised so that the wiring board mounting conductive piece and the mounting fixing plate protrude downward by a predetermined length from the bottom side. did
Manufacturing method for IC socket contact fittings.