JPH02854B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor chip alignment method for aligning a large number of semiconductor chips with their polarities aligned in a specific direction.

[Prior Art] When mass producing semiconductor devices, for example, as shown in FIG. 3, a semiconductor wafer 1 on which a predetermined PN junction is formed is divided into individual semiconductor chips 2, and then the electrical characteristics of the chips 2 are determined. A method is adopted in which each piece is picked up using vacuum tweezers (not shown) while being checked, mounted at a predetermined position on the lead frame 3, and then subjected to predetermined processing.

Alternatively, after checking the characteristics of the individually divided semiconductor chips 2 on the sheet 4 before mounting them on the lead frame 3, the semiconductor chips 2 are sucked one by one onto a separately prepared tray using vacuum tweezers to align the polarity and then lead further. A method is adopted in which the image is moved onto frame 3.

However, the above method has the disadvantage that work efficiency cannot be improved because a large number of small pieces of semiconductor chips must be handled manually.

[Summary of the invention] The present invention has been made based on the above circumstances, and
To provide a semiconductor chip arranging method capable of arranging only non-defective semiconductor chips in large quantities with their polarities aligned in a specific direction while checking the electrical characteristics and polarity of the semiconductor chips.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 schematically shows the elements of an apparatus for carrying out the method of the invention.

In the figure, 10 is the first transfer plate, 11 is the second transfer plate, and 11 is the second transfer plate.
These are transfer plates having a large number of recesses 10 vertically and horizontally on the surface for storing semiconductor chips.
The recesses 10a and 11a are formed at the same pitch and at positions that coincide with each other when the first transfer plate 10 is inverted and stacked on the second transfer plate 11.

The first transfer plate 10 and the second transfer plate 11
is made of an insulating material, and the first transfer plate 10 is provided with a conductor 12 communicating with the recess 10a.

This conductor 12 contacts one surface of the semiconductor chip 13 housed in the recess 10a and serves as a common electrode for checking electrical characteristics and polarity.

Further, the first transfer plate 10 is provided with a through hole 10b communicating with each recess 10a, and this through hole 10b communicates with a main passage 10c, and one end of this main passage 10c is connected to a vacuum pump 14.

Reference numeral 15 denotes a moving measuring head for checking the electrical characteristics and polarity of the semiconductor chip 13.
A plurality of measuring needles 1 whose pitch matches the pitch of 0a
It has 5a. The measuring needles 15a are each connected to a measuring power source 17 via a connecting line 16, and the measuring power source 17 is connected to a control device 18.

The control device 18 stores the electrical characteristics and polarity of the semiconductor chip 13 measured by the measuring needle 15a,
An output command is given to a vacuum suction nozzle, which will be described later, so as to pick up only semiconductor chips 13 with poor characteristics and a specific polarity, and vacuum suction is performed to release semiconductor chips 13 with poor characteristics from being picked up during the suction movement process of the semiconductor chips 13. It has the function of giving commands to the nozzle.

19 is a suction nozzle stand, and this nozzle stand 1
9 is provided with a plurality of suction nozzles 19a matching the pitch of the recesses 10a, 11a, and each of the suction nozzles 19a is connected to a vacuum pump 20 via a vacuum valve 19b.

The suction nozzle stand 19 is connected to the first transfer plate 10 and the second transfer plate 1 according to an output command from the control device 18.
1 horizontal movement and raising and lowering them to predetermined columns.

In the figure, 21 is a defective semiconductor chip storage box disposed between the first transfer plate 10 and the second transfer plate 11.

Next, a method for aligning semiconductor chips according to the present invention will be described using the apparatus configured as described above.

First, semiconductor chips 13, which are divided into individual chip chips from a semiconductor wafer on which predetermined PN junctions have been formed, are supplied to the recesses 10a of the first transfer plate 10.

In response to a command from the control device 18, the measuring movable head 15 descends onto the first row of recesses 10a of the first transfer plate 10, and the measuring needles 15a are moved to each recess 1.
It is brought into contact with the surface of the semiconductor chip 13 in 0a.

The lower surface of the semiconductor chip 13 is in contact with a conductor 12, and this conductor 12 is connected to a measurement power source 17 via a connecting wire 22 to form a closed circuit, and the semiconductor chip 13 has good electrical characteristics such as withstand voltage and forward characteristics. , defective products, and polarity are measured, and the measurement results are stored in the control device 18.

Next, after raising the measurement moving head 15 to a predetermined position, the suction nozzle stand 19 is moved in the horizontal direction according to a command from the control device 18, and the recess 10a of the first row of the first transfer plate 10 is moved. lower to the top.

Based on the stored measurement results, the control device 18 determines which semiconductor chips 13 have polarity in a particular direction and which have defective characteristics, and issues an "open" output command to the vacuum valve 19b in order to attract only these chips 13.

As a result, vacuum is supplied from the vacuum pump 20 to the suction nozzle 19a, and the other semiconductor chips 13 are suctioned by the suction nozzle 19a, except for the semiconductor chips 13 whose polarity is opposite to the polarity in the specific direction.

After the suction nozzle stand 19 is raised to a predetermined position by the output command from the control device 18, it is horizontally moved to the position of the defective semiconductor chip storage box 21, where it picks up the semiconductor chips determined to have defective characteristics by the output command from the control device 18 as well. "Close" the vacuum valve 19b of the suction nozzle 19a that is suctioning 13.
An output command is issued to make the semiconductor chips 13 with defective characteristics fall from the suction nozzle 19a into the defective semiconductor chip storage box 21.

Next, the suction nozzle stand 19 is moved horizontally again to the corresponding example of the second transfer plate 11, for example, when moving the column [] of the first transfer plate 10, to a position directly above the column [] of the second transfer plate 11. After moving, the semiconductor chip 13 is lowered into the recess 11a.
to store.

In this way, the semiconductor chips 13 aligned with the same polarity are in the [] column of the second transfer plate 11, except for the previous defective semiconductor chip and the semiconductor chips 13 left on the first transfer plate 10, in a so-called missing state. are aligned.

After repeating the above operations until the final row, move on to the next step.

The vacuum valve 14a is opened in response to an output command from the control device 18 to supply vacuum from the vacuum pump 14 to the external pipe 10d communicating with the main passage 10c provided inside the first transfer plate 10, and the recess of the first transfer plate 10 is The first transfer plate 10 is inverted onto the second transfer plate 11 while adsorbing the remaining non-defective semiconductor chips 13 of the polarity opposite to the specific polarity 10a, and the first transfer plate 10 is superimposed on the second transfer plate 11 to form the state shown in FIG. 2B. .

When the vacuum valve 14a is closed in response to an output command from the control device 18 and the supply of vacuum to the recess 10a is cut off, the remaining semiconductor chips 13 in the recess 10a are turned over and transferred to the recess of the second transfer plate 11. 11
Move inside a.

Finally, after the first transfer plate 10 is returned to the initial position by an output command from the control device 18, the portion of the second transfer plate 11 where the semiconductor chip 13 is not housed, that is, the part with defective characteristics, is removed. Since the number of recesses 11a corresponding to the recesses 10a of the first transfer plate 10 is small, the semiconductor chip 1 is manually aligned in a specific direction.
Replenish 3.

Note that the measuring needle 15a and the suction nozzle 19a
By setting the pitch at every other pitch of the transfer plates 10a and 11a, and moving the chips by measuring and suctioning the holes in one row twice, micro-sized chips can also be handled.

[Effects of the Invention] Since the present invention is constructed as described above, the polarities of the semiconductor chips on the second transfer plate are all aligned in the same direction, and the alignment is automatically performed for each row at the same time. In addition to improving work efficiency, since the polarities are aligned in the same direction in the next step, for example, when semiconductor chips are fed to a lead frame, the feeding process can be easily automated. In other words, if a large number of devices are fabricated in a semiconductor wafer, divided into individual semiconductor chips on an adhesive tape, and only the defective chips are removed after testing the electrical characteristics of the semiconductor chips, there will be no defective chips on the adhesive tape. There are traces of missing chips, so when multiple semiconductor chips are placed on a lead frame, no semiconductor chips will be placed on the lead frame in the area where the defective chip was removed, and nothing will happen. The semiconductor chip supply process cannot be automated unless some replenishment process is added. However, in the present invention, since the non-defective semiconductor chips are aligned on the transfer plate without falling out, it is possible to easily automatically supply them in rows on the lead frame.

Furthermore, semiconductor chips with poor characteristics can be automatically removed in the process of transferring from the first transfer plate to the second transfer plate, contributing to improved reliability of the final product.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing an example of an apparatus used to carry out the semiconductor chip alignment method of the present invention;
FIG. 2A is a partially cutaway cross-sectional view showing the configuration of the first transfer plate of the above device, and FIG. The cross-sectional view and FIG. 3 are diagrams for explaining a conventional alignment method. 10...First transfer plate, 10a...Recess, 11
... second transfer plate, 11a ... recess, 13 ... semiconductor chip, 15 ... moving head for measurement, 15 ...
... Measuring needle, 18 ... Control device, 19 ... Suction nozzle stand, 19a ... Suction nozzle.

Claims (1)

[Claims] 1. A first having a plurality of recesses arranged vertically and horizontally.
A process of supplying individually separated semiconductor chips onto a first transfer plate, measuring the characteristics and polarity of the semiconductor chips supplied to the first transfer plate for each row, and storing the results. A process of identifying semiconductor chips with polarity in a specific direction and defective characteristics, and a process in which only the semiconductor chips with polarity in a specific direction and defective characteristics determined in this process are simultaneously picked up from the first transfer plate one row at a time during the conveyance process. a step of removing only the semiconductor chips with poor characteristics; a step of transferring the adsorbed semiconductor chips of good quality and polarity in a specific direction one by one into corresponding recesses of the second transfer plate; The semiconductor chips remaining on the transfer plate that are good and have a polarity opposite to the specific polarity are inverted and stacked together with the first transfer plate on a second transfer plate, and the remaining semiconductor chips are transferred to the second transfer plate. 1. A method for arranging semiconductor chips, comprising the step of transferring semiconductor chips of the same polarity and good quality to a vacant space and arranging them on a second transfer plate.