JPH0313317B2 - - Google Patents
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- Publication number
- JPH0313317B2 JPH0313317B2 JP58156941A JP15694183A JPH0313317B2 JP H0313317 B2 JPH0313317 B2 JP H0313317B2 JP 58156941 A JP58156941 A JP 58156941A JP 15694183 A JP15694183 A JP 15694183A JP H0313317 B2 JPH0313317 B2 JP H0313317B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- loop
- film
- masking layer
- electroplated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明はプラスチツク上への部分電気めつき方
法に関し、更に詳述するとプラスチツク上に電気
めつきを施すに際し、非めつき部を閉塞したルー
プ状とし、このループ状非めつき部に取り囲まれ
た部分及びその外側をそれぞれ電気めつき部とし
て形成でき、それ故例えば数字の0、ローマ字の
A、その他各種の閉塞したループ状の図柄や模様
を透し彫り的な状態で自在に形成することがで
き、かつループ状非めつき部に囲まれた部分とこ
のループ状非めつき部より外側の部分とを互に異
色の電気めつき部とすることができて非常に装飾
性に優れためつき外観を与えるプラスチツク上へ
の電気めつき方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for partial electroplating on plastic, and more specifically, when electroplating on plastic, the non-plated portion is formed into a closed loop shape, and the loop-shaped non-plating portion is closed. The part surrounded by the plating part and the outside thereof can be respectively formed as an electroplating part, so that, for example, the number 0, the Roman letter A, and various other closed loop designs and patterns can be created in an openwork-like manner. It is possible to freely form electroplated parts with different colors, and the part surrounded by the loop-shaped non-plated part and the part outside this loop-shaped non-plated part can be made into electroplated parts of different colors. This invention relates to a method of electroplating onto plastics which gives a highly decorative and glazed appearance to plastics.
従来、プラスチツク上への部分電気めつき方法
として、あらかじめ生地のプラスチツクに表面粗
化液によつてプラスチツク生地よりも表面粗化さ
れ難い高分子化合物溶液或いは着色剤を部分的に
塗布し、その後表面粗化を行ない、次いで化学め
つきを施し、更に電気めつきを施す方法が知られ
ている(特公昭48−16987号、特公昭49−29959
号)。 Conventionally, as a method for partial electroplating on plastic, a polymer compound solution or a coloring agent, which is less likely to roughen the surface of the plastic fabric with a surface roughening liquid, is partially applied to the plastic fabric, and then the surface is coated with a coloring agent. A method is known in which roughening is performed, followed by chemical plating, and then electroplating (Special Publications No. 16987-1987, Publication No. 29959-1971).
issue).
しかし、この方法は非めつき部を閉塞したルー
プ状とし、このループ状非めつき部に取り囲まれ
た部分を電気めつき部として形成することは困難
である。例えば、第1図に示したように裏側が開
放された四角箱形のプラスチツク成形品a上に数
字の0を上述した高分子化合物溶液或いは着色剤
で描き、表面粗化を行なつた後、化学めつきを施
した場合、0の部分bは化学めつきされず、その
内側の部分c及び外側の部分dはそれぞれ化学め
つきされる。しかしながら、第2図に示したよう
に、化学めつきされたプラスチツク成形品aの裏
側をラツクeの枝骨f,fの先端部g,gで支持
し、これら先端部g,gを接点として電気めつき
を行なう場合、前記外側の部分dにはラツクeか
らの電気が接点g,gを経て流れるが、前記内側
の部分cには化学めつきされていない0の部分b
に遮断されて電気が流れない。従つて、0の部分
bの外側の部分dはどの部分も電気めつきされる
が、内側の部分cは電気めつきされずに終る。 However, in this method, the non-plated portion is formed into a closed loop, and it is difficult to form the portion surrounded by the loop-shaped non-plated portion as an electroplated portion. For example, as shown in Figure 1, the number 0 is drawn on a rectangular box-shaped plastic molded article a with an open back side using the above-mentioned polymer compound solution or coloring agent, and the surface is roughened. When chemical plating is applied, the 0 part b is not chemically plated, and the inner part c and the outer part d are each chemically plated. However, as shown in Fig. 2, the back side of the chemically plated plastic molded product a is supported by the tips g, g of the ramus f, f of the rack e, and these tips g, g are used as contact points. When electroplating is carried out, electricity from the rack e flows through the contacts g and g to the outer part d, but the part b of 0, which is not chemically plated, flows to the inner part c.
It is cut off and no electricity flows. Therefore, any part of the outer part d of part b of 0 is electroplated, but the inner part c ends up not being electroplated.
この場合、閉塞ループで囲まれた部分(0の部
分bの内側の部分c)に対しても電気接点を取
り、ラツクからの電気が流れるようにすれば、内
側の部分cに対する電気めつきが可能となるが、
内側の部分cにも電気接点を取るようにするのは
面倒であり、実際的でない。特に、内側の部分c
が小部分である場合、ここに接点を取ることは非
常に困難である。また、このような接点箇所は、
とりわけプラスチツクに電気をめつきを施した場
合、この箇所が跡(接点跡)となつて残り易く、
このためめつき外観を損なう場合があるので、接
点はたとえ接点跡が生じても目立たず、外観を損
なうおそれの少ない被めつき物の裏側などに取る
のが普通である。しかるに、前記内側の部分c
(この部分は外観上美麗であるべきである)に電
気接点を取つた場合、この接点箇所に接点跡が生
じて外観を損なうおそれがあるため、この点から
しても前記内側の部分cに接点を取るのは実際的
でない。 In this case, if you make an electrical contact also to the part surrounded by the closed loop (part c inside part b of 0) and allow electricity to flow from the rack, electroplating to the inside part c will be possible. It is possible, but
It is troublesome and impractical to make an electrical contact also to the inner part c. Especially the inner part c
If it is a small part, it is very difficult to make contact here. In addition, such contact points are
In particular, when plastic is plated with electricity, these areas tend to remain as marks (contact marks).
Because of this, the appearance of the plating may be impaired, so even if contact marks occur, they are not noticeable and are usually placed on the back side of the object to be plated, where there is less risk of deteriorating the appearance. However, the inner part c
(This part should have a beautiful appearance) If you make an electrical contact, there is a risk that a contact mark will be created at this contact point and spoil the appearance. It is impractical to make contact.
本発明は上記事情を改善するためになされたも
ので、非めつき部を閉塞したループ状とし、それ
に取り囲まれた部分及びその外側の部分を電気め
つき部とする透し彫り的な文字、図柄、模様をプ
ラスチツク上に簡単かつ確実に、しかも自在に形
成することができ、かつループ状非めつき部に囲
まれた部分とこのループ状非めつき部より外側の
部分とを互に異色の電気めつき部とすることがで
きて非常に装飾性に優れためつき外観を与えるプ
ラスチツク上への部分電気めつき方法を提供する
ことを目的とする。 The present invention has been made in order to improve the above-mentioned situation, and includes openwork-like characters in which the non-plated part is in the form of a closed loop, and the part surrounded by it and the part outside thereof are electroplated parts. Designs and patterns can be easily, reliably, and freely formed on plastic, and the part surrounded by the loop-shaped non-plating part and the part outside of the loop-shaped non-plating part have different colors. It is an object of the present invention to provide a method of partial electroplating on plastic which can be used as an electroplated part of plastics and which gives a highly decorative and glazed appearance.
即ち、本発明は上記目的を達成するため、プラ
スチツク表面を粗化し、この粗化表面に触媒金属
核を付着し、次いで化学めつきを施した後、この
化学めつき膜上の一部に閉塞したループを含む所
望の文字、図柄又は模様を形成する非電導性マス
キング層を形成し、次に電気めつきを行なつて前
記マスキング層以外の化学めつき膜上に電気めつ
き膜を形成した後、前記マスキング層を除去し、
更にこのマスキング層の除去によつて現われた部
分の化学めつき膜を除去して前記閉塞したループ
を含む文字、図柄又は模様部分を非めつき部と
し、最後にこのループ状非めつき部より外側の電
気めつき膜にこのめつき膜の表面層と異色の電気
めつき膜を形成する電気めつきを行つて、前記ル
ープ状非めつき部に囲まれた部分とこのループ状
非めつき部より外側の部分とを互に異色の電気め
つき部とするようにしたものである。 That is, in order to achieve the above object, the present invention roughens the surface of plastic, attaches catalytic metal nuclei to the roughened surface, and then performs chemical plating, after which a part of the chemically plated film is blocked. A non-conductive masking layer was formed to form a desired character, design or pattern including loops, and then electroplating was performed to form an electroplated film on the chemically plated film other than the masking layer. After that, removing the masking layer,
Furthermore, the chemically plated film in the part that appeared by removing this masking layer is removed, and the text, design, or pattern part containing the closed loop is made into a non-plated part, and finally from this loop-shaped non-plated part. Electroplating is performed on the outer electroplated film to form an electroplated film having a different color from the surface layer of this plated film, and the area surrounded by the loop-shaped non-plated portion and this loop-shaped non-plated part are separated. The outer portions are electroplated with different colors.
本発明によれば、非電導性のマスキング層が閉
塞したループ状に形成されているが、このループ
状マスキング層によつて囲まれた部分の化学めつ
き膜とその外側の部分の化学めつき膜とはループ
状マスキング層下にある化学めつき膜を介して連
続しているので、ループ状マスキング層の外側の
化学めつき膜の所望箇所に接点を取り、電気を流
せば、ループ状マスキング層によつて囲まれた部
分にも電気が流れ、この部分も良好に電気めつき
される。また、このようにして電気めつきを行つ
た後は、前記マスキング層を除去し、更にこのマ
スキング層の除去によつて現われた部分の化学め
つき膜を除去して前記閉塞したループを含む文
字、図柄又は模様部分を非めつき部とし、最後に
このループ状非めつき部より外側の電気めつき膜
にこのめつき膜の表面層と異色の電気めつき膜を
形成する電気めつきを施すことにより、今度はル
ープ状非めつき部によつて囲まれた部分はこの非
めつき部に遮られて電気が流れないので、ループ
状非めつき部に囲まれた部分はめつきされず、ル
ープ状非めつき部より外側の部分のみがめつきさ
れ、これにより非常に簡単にループ状非めつき部
に囲まれた部分とこのループ状非めつき部より外
側の部分とを互に異色の電気めつき部とすること
ができる。従つて、ループ状マスキング層によつ
て囲まれる部分に電気接点を取る必要がなく、こ
の部分にめつき外観を損なう接点跡が生じること
がないので、ループ状マスキング層(最終的には
ループ状非めつき部)によつて囲まれる部分の電
気めつき外観を良好なものとすることができ、か
つこの部分を簡単、確実に電気めつきすることが
できるものである。 According to the present invention, the non-conductive masking layer is formed in a closed loop shape, and the chemically plated film is formed in the portion surrounded by the loop-shaped masking layer and the chemically plated portion in the outside portion thereof. The film is continuous with the chemically plated film below the loop masking layer, so if you make a contact at a desired point on the chemically plated film outside the loop masking layer and apply electricity, the loop masking layer will be connected to the film. Electricity also flows through the area surrounded by the layer, and this area is also well electroplated. After electroplating is performed in this manner, the masking layer is removed, and the chemically plated film in the area exposed by the removal of the masking layer is removed to form a character including the closed loop. , the design or pattern part is used as a non-plated part, and finally the electroplated film outside the loop-shaped non-plated part is electroplated to form an electroplated film with a different color from the surface layer of this plated film. As a result, the part surrounded by the loop-shaped non-plated part is blocked by this non-plated part and no electricity flows, so the part surrounded by the loop-shaped non-plated part is not plated. , only the part outside the loop-shaped non-plated part is plated, and this makes it very easy to differentiate the part surrounded by the loop-shaped non-plated part and the part outside this loop-shaped non-plated part from each other. It can be used as an electroplating part. Therefore, it is not necessary to make an electrical contact in the area surrounded by the loop-shaped masking layer, and contact marks that spoil the plating appearance are not generated in this area. It is possible to improve the electroplating appearance of the portion surrounded by the non-plated portion (non-plated portion), and to easily and reliably electroplate this portion.
以下、本発明につき図面を参照して更に詳しく
説明する。 Hereinafter, the present invention will be explained in more detail with reference to the drawings.
本発明において、めつきすべきプラスチツクの
種類は特に制限されず、ABS樹脂、ポリカーボ
ネイト樹脂、ポリプロピレン樹脂等の通常めつき
に用いられるプラスチツクが使用し得る。 In the present invention, the type of plastic to be plated is not particularly limited, and plastics commonly used for plating, such as ABS resin, polycarbonate resin, and polypropylene resin, can be used.
本発明のプラスチツク上への電気めつきにおい
ては、まずプラスチツクのめつきすべき表面に対
して粗化処理を施す。この粗化処理は、使用する
プラスチツクの種類、その表面状態等に応じ、適
宜な物理的又は化学的粗化処理法を採用して行な
うもので、例えばABS樹脂の場合はクロム酸−
硫酸液を用いてエツチングを行ない、またポリカ
ーボネイト樹脂等の場合は適宜な溶剤でプリエツ
チングを行なつた後、上記のクロム酸−硫酸液で
エツチングを行なうなど、通常採用されている粗
化処理法が用いられる。 In electroplating on plastic according to the present invention, the surface of the plastic to be plated is first subjected to a roughening treatment. This roughening treatment is carried out by adopting an appropriate physical or chemical roughening treatment method depending on the type of plastic used and its surface condition. For example, in the case of ABS resin, chromic acid
Commonly used roughening treatment methods include etching with a sulfuric acid solution, or pre-etching with an appropriate solvent in the case of polycarbonate resin, followed by etching with the above-mentioned chromic acid-sulfuric acid solution. is used.
プラスチツクに対して表面粗化を行なつた後
は、この粗化表面に対して触媒金属核を付着する
活性化処理を行なう。この活性化処理も通常行な
われている活性化処理法が採用できる。例えば、
塩化第1錫酸性溶液に浸漬(センシタイジング処
理)後、塩化パラジウム酸性溶液に浸漬(アクチ
ベイチング処理)する方法、塩化第1錫と塩化パ
ラジウムとのコロイド酸性溶液に浸漬後、酸又は
アルカリ溶液に浸漬する方法、塩化パラジウム酸
性溶液に浸漬後、還元剤溶液に浸漬する方法な
ど、種々の方法が適宜選択して採用され得、プラ
スチツク表面に金属パラジウム等の触媒金属核を
付着するものである。 After the surface of the plastic is roughened, an activation treatment is performed to attach catalytic metal nuclei to the roughened surface. A commonly used activation method can also be used for this activation process. for example,
A method of immersing in an acidic solution of stannous chloride (sensitizing treatment) and then immersing it in an acidic palladium chloride solution (activating treatment), a method of immersing a colloid of stannous chloride and palladium chloride in an acidic solution, and then immersing it in an acid or alkali solution. Various methods can be selected and adopted as appropriate, such as immersion in a solution, immersion in an acidic palladium chloride solution, and then immersion in a reducing agent solution, which attach catalytic metal nuclei such as metallic palladium to the plastic surface. be.
次いで、上記の活性化処理後、化学めつきを施
し、前記触媒金属核付着表面に化学めつき膜を形
成する。この化学めつきの種類も特に制限はな
く、通常用いられている化学銅めつき液或いは化
学ニツケルめつき液などが用いられて化学めつき
が行なわれる。この場合、化学めつき膜の厚さは
必ずしも制限されないが、0.1〜1μm程度の膜厚
とすることが好ましい。 Next, after the above activation treatment, chemical plating is performed to form a chemically plated film on the surface to which the catalyst metal nuclei are attached. The type of chemical plating is not particularly limited, and chemical plating can be performed using a commonly used chemical copper plating solution, chemical nickel plating solution, or the like. In this case, the thickness of the chemically plated film is not necessarily limited, but it is preferably about 0.1 to 1 μm thick.
第3図は以上の処理工程によりプラスチツク成
形品1上に化学めつき膜2を形成した状態を示す
ものである。 FIG. 3 shows the chemically plated film 2 formed on the plastic molded article 1 through the above processing steps.
本発明においては、化学めつき後、化学めつき
膜上の一部に閉塞したループを含む所望の文字、
図柄又は模様を形成する非電導性のマスキング層
を形成する。このマスキング層の形成はレジスト
インク、その他適宜な非電導性物質の溶液を使用
し、印刷法等の適宜な方法を採用して行なうこと
ができる。 In the present invention, after chemical plating, a desired character containing a partially closed loop on the chemical plating film,
A non-conductive masking layer forming a design or pattern is formed. This masking layer can be formed using a solution of resist ink or other appropriate non-conductive substance, and by employing an appropriate method such as a printing method.
第4図及び第5図は化学めつき膜2上に閉塞し
たループ3aを含む四角枠状図柄を形成する非電
導性のマスキング層3を形成した状態を示す。 4 and 5 show a state in which a non-conductive masking layer 3 forming a square frame pattern including closed loops 3a is formed on the chemically plated film 2. FIG.
次に、マスキング層を形成した後、電気めつき
を行なう。この場合、第5図に示したように、接
点箇所は前記ループ状マスキング層3外側の化学
めつき膜2aの適宜な箇所、好ましくは被めつき
物(プラスチツク成形品)裏側等の接点跡が生じ
てもめつき外観を損なわない箇所とする(第5図
中4はラツク、5は枝骨、6は枝骨先端部C接点
部)である)。 Next, after forming a masking layer, electroplating is performed. In this case, as shown in FIG. 5, the contact points are located at appropriate locations on the chemically plated film 2a outside the loop-shaped masking layer 3, preferably on the back side of the object to be plated (plastic molded product). The location should be such that the appearance of the plating will not be impaired even if it occurs (in Fig. 5, 4 is the rack, 5 is the ramus, and 6 is the contact point C of the tip of the ramus).
ここで、電気めつきの種類は制限されず、また
電気めつき膜は単層でも多層でもよい。例えば、
多層めつきとして銅−ニツケル−クロムの3層構
成とすることができる。 Here, the type of electroplating is not limited, and the electroplating film may be a single layer or a multilayer. for example,
A three-layer structure of copper-nickel-chromium can be used as multilayer plating.
この電気めつきの過程において、前記ループ状
マスキング層3aで取り囲まれた化学めつき膜部
分2bは、第5図に示したようにその外側の化学
めつき膜部分2aとループ状マスキング層3a下
の化学めつき膜部分2cを介して連続しているの
で、前記外側の化学めつき膜部分aにのみ接点6
を取るだけであつても、ループ状マスキング層3
a内側の化学めつき膜部分2bにも電気が流れ、
従つて第6図に示したようにループ状マスキング
層3aの外側の化学めつき膜部分2aのみならず
内側の化学めつき膜部分2b上にも電気めつき膜
7が形成される。 During this electroplating process, the chemically plated film portion 2b surrounded by the loop-shaped masking layer 3a is separated from the chemically plated film portion 2a on the outside and under the loop-shaped masking layer 3a, as shown in FIG. Since it is continuous through the chemically plated film portion 2c, the contact 6 is connected only to the outer chemically plated film portion a.
Even if you just remove the loop-shaped masking layer 3,
Electricity also flows through the chemically plated film portion 2b inside a.
Therefore, as shown in FIG. 6, the electroplated film 7 is formed not only on the outer chemically plated film portion 2a of the loop-shaped masking layer 3a but also on the inner chemically plated film portion 2b.
このようにして電気めつき膜を形成した後は、
適宜な溶解液を用いるなどしてマスキング層を除
去し(第7図)、次いでマスキング層の除去によ
つて顕われた化学めつき膜を適宜な溶解液で除去
する(第8図)ことにより、第9図に示したよう
に閉塞したループを含む文字、図柄又は模様部分
が非めつき部8となり、このループ状非めつき部
8aの外側及び内側がそれぞれ電気めつき部7
a,7bとなつた、透し彫り的な表示部(文字、
図柄又は模様)がプラスチツク素材1に形成され
るものである。 After forming the electroplated film in this way,
By removing the masking layer using an appropriate dissolving solution (Fig. 7), and then removing the chemically plated film revealed by the removal of the masking layer using an appropriate dissolving solution (Fig. 8). As shown in FIG. 9, the character, design, or pattern portion including the closed loop becomes the non-plated portion 8, and the outside and inside of this loop-shaped non-plated portion 8a are respectively electroplated portions 7.
a, 7b, openwork-like display (letters,
A design or pattern) is formed on the plastic material 1.
なお、マスキング層及び化学めつき膜の除去に
溶解液を用いる場合、これら溶解液は電気めつき
膜を溶解しないものを選定することが好ましい。 Note that when a dissolving solution is used to remove the masking layer and the chemically plated film, it is preferable to select a dissolving solution that does not dissolve the electroplated film.
上述した化学めつき膜の除去処理後は、前記ル
ープ状非めつき部外側の電気めつき部7aの適宜
箇所に再度接点を取り、この電気めつき部7a上
に更に前記電気めつき部7a,7bと異色の電気
めつき膜を形成し得る電気めつきを施す。この場
合、ループ状非めつき部で囲まれた内側の部分は
このループ状非めつき部に遮断されて電気が流れ
ず、このためこの内側の部分にはそれ以上電気め
つき膜が形成されない。従つて、この方法による
ときは、ループ状非めつき部内外で互に異なる色
彩の電気めつき膜を形成でき、興趣のある電気め
つき外観を与えることができる。 After the above-mentioned chemical plating film removal process, contacts are made again at appropriate locations on the electroplated part 7a outside the loop-shaped non-plated part, and the electroplated part 7a is further placed on this electroplated part 7a. , 7b, electroplating is performed to form an electroplated film with a different color. In this case, the inner part surrounded by the loop-shaped non-plated part is blocked by the loop-shaped non-plated part and no electricity flows, so no further electroplated film is formed in this inner part. . Therefore, when this method is used, electroplated films of different colors can be formed inside and outside the loop-shaped non-plated portion, and an interesting electroplated appearance can be provided.
なお、プラスチツクとして透明なものを用いる
場合、化学めつき膜上の一部に閉塞したループを
含む文字、図柄又は模様を形成する非電導性マス
キング層を形成する際に、このマスキング層に対
応する被めつき物の裏面にも同じ文字、図柄又は
模様の非電導性マスキング層を形成するか、或い
は被めつき物裏面のマスキング層対応部分を含む
所用箇所に非電導性マスキング層を形成し、電気
めつき後表面側の非電導性マスキング層及び化学
めつき膜を除去するときに、同時に裏面側の非電
導性マスキングソウ及び化学めつき膜を除去する
ことができ、これにより透明なプラスチツクを用
いた場合に非常に鮮明な浮き彫り的なループ状表
示部が形成できる。 In addition, when transparent plastic is used, when forming a non-conductive masking layer that forms letters, designs, or patterns containing partially closed loops on the chemically plated film, a masking layer corresponding to this masking layer is used. Forming a non-conductive masking layer with the same letters, designs or patterns on the back side of the plated object, or forming a non-conductive masking layer at the required location including the masking layer corresponding part on the back side of the plated object, When removing the non-conductive masking layer and chemical plating film on the front side after electroplating, the non-conductive masking layer and chemical plating film on the back side can be removed at the same time. When used, a very sharp raised loop-shaped display can be formed.
以上説明したように、本発明によれば非めつき
部閉塞したループ状とし、このループ状非めつき
部に囲まれた部分及びその外側をそれぞれ電気め
つき部とする閉塞ループ状の文字、図柄、模様を
透し彫り的な状態で簡単かつ確実、自在な電気め
つき外観とすることができるものである。更に、
ループ状非めつき部に囲まれた部分とこのループ
状非めつき部より外側の部分とを互に異色の電気
めつき部とすることができて非常に装飾性に優れ
た興趣あるめつき外観を与えることができる。 As explained above, according to the present invention, a closed loop-shaped character is formed in which the non-plated portion is closed and the portion surrounded by the loop-shaped non-plated portion and the outside thereof are electroplated portions, To easily, reliably, and freely produce a pattern or pattern in an openwork-like electroplated appearance. Furthermore,
The part surrounded by the loop-shaped non-plated part and the part outside of this loop-shaped non-plated part can be made into electroplated parts of different colors, making the plating very attractive and highly decorative. can give an appearance.
次に、実施例を示して本発明を具体的に説明す
るが、本発明は下記の実施例に限定されるもので
はない。 Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.
実施例
ABS樹脂成形品を下記エツチング液
CrO3 400g/
H2SO4 200ml/
に65℃で10分間浸漬してエツチング処理を行な
い、次いで水洗、中和、水洗を行なつた後、下記
センシタイジング液
SnCl2 10g/
HCl PH2
に室温で1分間浸漬し、、水洗後、下記アクチベ
イテイング液
PdCl2 2g/
HCl PH2
に室温で1分間浸漬し、次いで化学ニツケルめつ
きを施し、約0.2μmの化学めつき膜を形成した。Example An ABS resin molded product was etched by immersing it in the following etching solution CrO 3 400 g/H 2 SO 4 200 ml/ at 65°C for 10 minutes, followed by water washing, neutralization, and water washing. After rinsing with water, immerse in the following activating solution PdCl 2 2 g/HCl PH2 for 1 minute at room temperature, and then apply chemical nickel plating to approximately 0.2 μm. A chemically plated film was formed.
次に、ハイソートジヤパン社製のPR3003メツ
キレジストを使用し、第4図に示したように四角
枠状の図柄からなる非電導性マスキング層を形成
した後、光沢硫酸銅めつき、光沢ニツケルめつ
き、クロムめつきを順次施した。この場合、接点
は第5図に示したように被めつき物の裏側に取つ
た。 Next, a non-conductive masking layer consisting of a square frame pattern as shown in Figure 4 was formed using PR3003 metal resist manufactured by Hi-Sot Japan Co., Ltd., followed by bright copper sulfate plating and bright nickel plating. Then, chrome plating was applied sequentially. In this case, the contact was placed on the back side of the covered object as shown in FIG.
電気めつき後、苛性ソーダ15%溶液を用いてマ
スキング層を溶解除去し、次いでマスキング層の
除去によつて顕われた化学ニツケルめつき膜を10
%硝酸を用いて溶解除去した。これによつて第9
図に示したように四角枠状の図柄を非めつき部と
する透し彫り状表示部を有する電気めつき膜が形
成された。この場合、ループ状非めつき部に取り
囲まれた電気めつき外観は良好なものであつた。 After electroplating, the masking layer was dissolved and removed using a 15% caustic soda solution, and then the chemical nickel plating film revealed by the removal of the masking layer was removed using a 15% caustic soda solution.
It was dissolved and removed using % nitric acid. With this, the 9th
As shown in the figure, an electroplated film was formed which had an openwork-like display area with a square frame-shaped pattern as a non-plated area. In this case, the electroplated appearance surrounded by the loop-shaped non-plated portion was good.
次いで、接点を第5図に示したように取り、苛
性ソーダ溶液中で品物を陽極として電解した。こ
れにより、ループ状非めつき部より外側の電気め
つき部のクロムめつき膜が電解剥離され、ニツケ
ルめつき膜が露呈したが、ループ状非めつき部に
囲まれた部分のクロムめつき膜は電気遮断状態に
あるため剥離されなかつた。 The contacts were then made as shown in Figure 5 and electrolyzed in a caustic soda solution with the item as the anode. As a result, the chrome plating film on the electroplated part outside the loop-shaped non-plated part was electrolytically peeled off and the nickel plating film was exposed, but the chrome plating film in the part surrounded by the loop-shaped non-plated part was removed. The film was not peeled off because it was in an electrically disconnected state.
このようにしてループ状非めつき部より外側の
電気めつき部のクロムめつき膜を剥離した後、金
めつきを施した。これによりループ状非めつき部
より外側の電気めつき部のニツケルめつき膜上に
のみ金めつき膜が形成され、一方、ループ状非め
つき部に囲まれた電気めつき部は上述したように
クロムめつき膜が剥離されず、また金めつき膜も
形成されないので、ループ状非めつき部内外に互
に異色の電気めつき膜が形成されていると共に、
ループ状非めつき部が透し彫り的な興趣を与える
非常に外観の優れた多色部分めつきが施された。 After the chrome plating film on the electroplated portion outside the loop-shaped non-plated portion was peeled off in this manner, gold plating was applied. As a result, a gold-plated film is formed only on the nickel-plated film of the electroplated part outside the loop-shaped non-plated part, while the electroplated part surrounded by the loop-shaped non-plated part is formed as described above. As the chrome plating film is not peeled off and the gold plating film is not formed, electroplated films of different colors are formed inside and outside the loop-shaped non-plated part, and
The loop-shaped non-plated portions are multi-colored partial plating with an extremely excellent appearance that gives an openwork-like interest.
第1図はプラスチツク成形品に閉塞したループ
状の文字からなる非めつき部を形成する状態を示
す斜視図、第2図はプラスチツク成形品を電気め
つきする場合のラツクの支持態様と接点箇所を示
す側面断面図、第3図乃至第9図は本発明方法の
一実施態様を説明するもので、第3図はプラスチ
ツク成形品に化学めつき膜を形成した状態の断面
図、第4図は閉塞したループを含む文字からなる
非電導性マスキング層を形成した状態の平面図、
第5図はラツクによるプラスチツク成形品の支持
態様及び接点箇所を示す断面図、第6図は電気め
つき膜形成後の状態を示す断面図、第7図はマス
キング層除去後の状態を示す断面図、第8図は化
学めつき膜除去後の状態を示す断面図、第9図は
同平面図である。
1……プラスチツク成形品、2……化学めつき
膜、3……マスキング層、7……電気めつき膜、
8……非めつき部。
Figure 1 is a perspective view showing the state in which a non-plated part consisting of closed loop-shaped characters is formed on a plastic molded product, and Figure 2 shows the support mode and contact points of the rack when electroplating a plastic molded product. 3 to 9 are side sectional views showing an embodiment of the method of the present invention. FIG. 3 is a sectional view of a plastic molded product with a chemically plated film formed thereon, and FIG. is a plan view of a state in which a non-conductive masking layer consisting of characters including closed loops is formed;
Fig. 5 is a cross-sectional view showing how the plastic molded product is supported by the rack and the contact points, Fig. 6 is a cross-sectional view showing the state after the electroplated film is formed, and Fig. 7 is a cross-sectional view showing the state after the masking layer is removed. 8 are cross-sectional views showing the state after the chemical plating film has been removed, and FIG. 9 is a plan view thereof. 1... Plastic molded product, 2... Chemically plated film, 3... Masking layer, 7... Electroplated film,
8...Non-metal part.
Claims (1)
触媒金属核を付着し、次いで化学めつきを施した
後、この化学めつき膜上の一部に閉塞したループ
を含む所望の文字、図柄又は模様を形成する非電
導性マスキング層を形成し、次に電気めつきを行
つて前記マスキング層以外の化学めつき膜上に電
気めつき膜を形成した後、前記マスキング層を除
去し、更にこのマスキング層の除去によつて現わ
れた部分の化学めつき膜を除去して前記閉塞した
ループを含む文字、図柄又は模様部分を非めつき
部とし、最後にこのループ状非めつき部より外側
の電気めつき膜にこのめつき膜の表面層と異色の
電気めつき膜を形成する電気めつきを行つて、前
記ループ状非めつき部に囲まれた部分とこのルー
プ状非めつき部より外側の部分とを互に異色の電
気めつき部とすることを特徴とするプラスチツク
上への部分電気めつき方法。1. After roughening the plastic surface, adhering catalytic metal nuclei to this roughened surface, and then applying chemical plating, desired characters, designs, or patterns containing partially closed loops are formed on the chemically plated film. a non-conductive masking layer is formed, and then electroplating is performed to form an electroplated film on the chemically plated film other than the masking layer, the masking layer is removed, and the masking layer is removed. The portion of the chemically plated film that appears when the layer is removed is removed, and the character, design, or pattern portion containing the closed loop is made into a non-plated portion, and finally, the area outside of this loop-shaped non-plated portion is electrically coated. Electroplating is performed on the plated film to form an electroplated film having a different color from the surface layer of the plated film, and the area surrounded by the loop-shaped non-plated part and the outside of the loop-shaped non-plated part are A method for partial electroplating on plastic, characterized in that the parts are electroplated parts of different colors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15694183A JPS6050196A (en) | 1983-08-26 | 1983-08-26 | Partial electroplating method on plastic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15694183A JPS6050196A (en) | 1983-08-26 | 1983-08-26 | Partial electroplating method on plastic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6050196A JPS6050196A (en) | 1985-03-19 |
| JPH0313317B2 true JPH0313317B2 (en) | 1991-02-22 |
Family
ID=15638690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15694183A Granted JPS6050196A (en) | 1983-08-26 | 1983-08-26 | Partial electroplating method on plastic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050196A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288094A (en) * | 1985-06-13 | 1986-12-18 | Sony Corp | Plating method for light transmittable plastic |
| JPS62185895A (en) * | 1986-02-10 | 1987-08-14 | Mitsubishi Motors Corp | Partial plating method |
| JPS62185896A (en) * | 1986-02-10 | 1987-08-14 | Mitsubishi Motors Corp | Partial plating method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494636A (en) * | 1972-05-06 | 1974-01-16 |
-
1983
- 1983-08-26 JP JP15694183A patent/JPS6050196A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6050196A (en) | 1985-03-19 |
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