JPH0317897B2 - - Google Patents
Info
- Publication number
- JPH0317897B2 JPH0317897B2 JP28517988A JP28517988A JPH0317897B2 JP H0317897 B2 JPH0317897 B2 JP H0317897B2 JP 28517988 A JP28517988 A JP 28517988A JP 28517988 A JP28517988 A JP 28517988A JP H0317897 B2 JPH0317897 B2 JP H0317897B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- melting point
- plating
- wire
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 58
- 238000007747 plating Methods 0.000 claims description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 24
- 230000008018 melting Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 229910020994 Sn-Zn Inorganic materials 0.000 description 9
- 229910009069 Sn—Zn Inorganic materials 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Coating With Molten Metal (AREA)
Description
ａ 産業上の利用分野
本発明は金属細管内面の溶融メツキ方法に関す
る。
ｂ 従来技術および本発明の課題
従来、自動車のブレーキパイプ、クラツチパイ
プおよび各種流体の配管に使用される金属細管
は、両面に銅メツキを施した帯鋼を使つて二重巻
造管法により作られた内面に銅メツキのある二重
巻鋼管又は両面に銅メツキを施した（又は施さな
い）帯鋼を使つて一重巻造管法（電気抵抗溶接造
管法）により作られた内面に銅メツキのある（又
は銅メツキのない）一重巻鋼管が使用されている
が、使用流体によつては内面の耐食性をさらに強
化するためにその内面へ異種金属メツキを施す必
要がある。また、ガソリン、クラツチオイル等の
油類が、内面に銅メツキのある鋼管内を通過し
て、アルミニウム又はアルミニウム合金からなる
容器等の部品に接触すると、容器が銅イオンによ
る電触作用により損傷を受ける。このため、銅メ
ツキを隠蔽する必要から内面に異種金属メツキを
施すことが行われている。
一般に、金属管の内面にメツキを施す方法とし
て、金属細管に亜鉛、錫−亜鉛、若しくはこれら
を主成分とする合金からなる低融点金属線を内挿
し、これを非酸化性雰囲気中にて上記金属線の融
点以上に加熱し、上記金属線の亜鉛成分の一部を
気化させ、溶融した低融点金属を金属細管内面全
体へ均一に付着させてメツキ層を形成させるよう
にした金属細管内面の溶融メツキ方法がある。
この方法は、上記低融点金属線を融点よりも著
しい高温で加熱して低融点金属の亜鉛成分の一部
を気化させその蒸気の作用により金属細管内面の
ぬれ拡がり性を助長し、溶融した低融点金属によ
つて金属細管内面に均一なメツキ層を施すことが
できるようにしたものである。
しかし、上記溶融メツキ方法は、銅メツキのな
い鋼管では、溶融金属のぬれ拡がり性がばらつい
たり、不足したりして量産的に安定した均一なメ
ツキ層を得るには不充分という欠点があつた。ま
た、比較的大径の金属管の場合には管を回転した
り、傾斜させることが必要であつた。
ｃ 課題を解決する手段
本発明者は上記の欠点に鑑み、種々研究の結
果、銅の鉄に対する拡散性の良さおよび銅被覆膜
による酸化防止の効果を積極的に活用することの
できる溶融メツキ方法を開発したもので、その要
旨は、金属細管に錫、亜鉛もしくはこれらの中の
一種又は二種を主成分とする合金からなる合金か
らなる低融点金属線を内挿し、これを非酸化性雰
囲気中にて上記金属線の融点以上に加熱し、上記
金属線を溶融し低融点金属のメツキ層を金属細管
内面に形成させるようにした金属細管内面の溶融
メツキ方法において、上記低融点金属線を銅被覆
したことを特徴とする金属細管内面の溶融メツキ
方法にある。
使用する金属細管は通常、鉄製のものを用いる
が、その種類は問わず、また鉄製の場合、その内
面に銅メツキを施すかどうかは問わない。
上記金属線を銅で被覆する方法は当業者が通常
使用する方法で良く、電気メツキ、クラツド等の
方法が用いられる。
ｄ 実施例
以下図面を参照しながら本発明を説明する。１
は金属細管で、この金属細管１に内径に比例して
選定された線径の錫、亜鉛もしくはこれらの中の
一種又は二種を主成分とする合金からなる低融点
金属線２を銅メツキ層２ａでメツキしたものを第
１図で示すように内挿し、空気と置換された非酸
化性雰囲気中にて低融点金属線２の融点よりも高
い温度で、無回転状態で加熱すると、低融点金属
線２は溶融して金属細管１の内面に低融点金属の
メツキ層３が形成される。
本発明によれば、銅がそれ自体鉄との拡散性が
良いので、金属線の鋼管内面へのぬれ拡がりを助
長する。したがつて、銅メツキのない鋼管あるい
は大口径の金属管の場合であつても、メツキ層が
均一に形成される。また、錫−亜鉛金属線の外面
に銅を被覆すると、この金属線の直接酸化を防止
（特に亜鉛の）するので、金属線の酸化による融
点上昇を防止して、溶融金属のすみやかなぬれ拡
がり性を助ける。もちろん、錫に対しても酸化防
止効果がある。
実施例 １
まず、下記条件でメツキを行ない、線径0.4mm
のSn−Zn合金線２の1μmおよび3μmのメツキ厚
さの銅メツキ層２ａを得た。
(1) 浴組成
ピロリン酸銅 ……85〜90ｇ／
ピロリン酸カリウム ……320〜350ｇ／
アンモニア水 ……３c.c.／
(2) 浴温度 45〜60℃
(3) 電流密度……陰極 ……２〜6A／ｄm2
陽極 ……１〜3A／ｄm2
(4) 極間電圧 ……４〜5V
(5) メツキ速度 ……1μm／min
次いで、上記Sn−Zn合金線２を用いて、以下
の条件で本発明に係る内面溶融メツキを行つた。
なお、比較のため銅メツキ層２ａのないSn−Zn
合金線を使用した場合についても内面溶融メツキ
を行つた。
〔内面溶融メツキ条件〕
チユーブ長 ……10m
（内面に銅メツキのないもの）
チユーブ径 ……8.0mm
チユーブ肉厚 ……0.7mm
雰囲気炉の温度 ……950℃
加熱時間 ……５分
Sn−Zn 合金線組成 ……sn80％
Sn−Zn 合金線融点 ……270℃
上記のようにして内面溶融メツキを行ない以下
の結果を得た。
a. Field of Industrial Application The present invention relates to a method for melt plating the inner surface of a metal capillary. b. Prior Art and Problems of the Present Invention Conventionally, thin metal tubes used for automobile brake pipes, clutch pipes, and piping for various fluids have been manufactured by the double winding method using steel strips plated with copper on both sides. A double-wound steel pipe with copper plating on the inner surface, or a steel strip with copper plating on both sides (or not), made by the single-wrap pipe manufacturing method (electrical resistance welding method). Single-wound steel pipes with plating (or without copper plating) are used, but depending on the fluid used, it is necessary to plate the inner surface with a different metal to further strengthen the corrosion resistance of the inner surface. Additionally, if oil such as gasoline or clutch oil passes through a steel pipe with copper plating on the inside and comes into contact with a container or other parts made of aluminum or aluminum alloy, the container may be damaged by the electrolytic action of copper ions. receive. For this reason, the inner surface is plated with different metals to hide the copper plating. Generally, as a method of plating the inner surface of a metal tube, a low melting point metal wire made of zinc, tin-zinc, or an alloy mainly composed of these is inserted into a thin metal tube, and the above-mentioned metal wire is inserted into the metal tube in a non-oxidizing atmosphere. The inner surface of the metal capillary tube is heated above the melting point of the metal wire to vaporize a part of the zinc component of the metal wire, and the molten low melting point metal is uniformly adhered to the entire inner surface of the metal capillary tube to form a plating layer. There is a melt plating method. In this method, the low melting point metal wire is heated to a temperature significantly higher than its melting point to vaporize a part of the zinc component of the low melting point metal, and the action of the vapor promotes wetting and spreading of the inner surface of the metal capillary. A uniform plating layer can be applied to the inner surface of a metal tube using a melting point metal. However, the above-mentioned hot-dip plating method has the disadvantage that in steel pipes without copper plating, the wettability of the molten metal varies or is insufficient, making it insufficient to obtain a stable and uniform plating layer for mass production. . Further, in the case of a relatively large diameter metal tube, it is necessary to rotate or tilt the tube. c. Means for Solving the Problems In view of the above-mentioned drawbacks, the present inventor has conducted various studies and found that a hot-dip plating method that can actively utilize the good diffusivity of copper to iron and the oxidation prevention effect of a copper coating film has been developed. The method was developed by inserting a low melting point metal wire made of tin, zinc, or an alloy containing one or two of these as main components into a thin metal tube, and then inserting it into a non-oxidizing In a method for melt plating the inner surface of a metal capillary tube, the metal wire is heated above the melting point of the metal wire in an atmosphere to melt the metal wire and form a plating layer of a low melting point metal on the inner surface of the metal capillary. A method for melt plating the inner surface of a metal capillary tube, characterized in that the inner surface of a metal tube is coated with copper. The thin metal tubes used are usually made of iron, but the type does not matter, and in the case of iron, it does not matter whether or not the inner surface is plated with copper. The metal wire may be coated with copper by any method commonly used by those skilled in the art, such as electroplating and cladding. d Examples The present invention will be described below with reference to the drawings. 1
is a metal thin tube 1, and a low melting point metal wire 2 made of tin, zinc, or an alloy containing one or two of these as main components is coated with a copper plating layer and has a wire diameter selected in proportion to the inner diameter. 2a is interpolated as shown in Fig. 1 and heated in a non-oxidizing atmosphere replaced with air at a temperature higher than the melting point of the low melting point metal wire 2 without rotation, the low melting point metal wire 2 is heated. The metal wire 2 is melted to form a plating layer 3 of a low melting point metal on the inner surface of the metal capillary tube 1. According to the present invention, since copper itself has good diffusibility with iron, it facilitates wetting and spreading of the metal wire onto the inner surface of the steel pipe. Therefore, even in the case of a steel pipe without copper plating or a large diameter metal pipe, the plating layer can be formed uniformly. In addition, coating the outer surface of a tin-zinc metal wire with copper prevents direct oxidation of the metal wire (particularly of zinc), thereby preventing an increase in the melting point due to oxidation of the metal wire and allowing the molten metal to quickly spread. Help sex. Of course, tin also has an antioxidant effect. Example 1 First, plating was performed under the following conditions, and the wire diameter was 0.4 mm.
Copper plating layers 2a with plating thicknesses of 1 μm and 3 μm were obtained from the Sn-Zn alloy wire 2. (1) Bath composition Copper pyrophosphate...85~90g/ Potassium pyrophosphate...320~350g/Ammonia water...3c.c./ (2) Bath temperature 45~60℃ (3) Current density...Cathode... …2 to 6 A/dm 2 Anode …1 to 3 A/dm 2 (4) Voltage between electrodes …4 to 5 V (5) Plating speed …1 μm/min Next, using the Sn-Zn alloy wire 2, Internal melt plating according to the present invention was performed under the following conditions.
For comparison, Sn-Zn without copper plating layer 2a
We also performed internal melt plating when using alloy wire. [Conditions for internal melt plating] Tube length...10m (no copper plating on the inner surface) Tube diameter...8.0mm Tube wall thickness...0.7mm Atmosphere furnace temperature...950℃ Heating time...5 minutes Sn-Zn Alloy wire composition: Sn80% Sn-Zn Alloy wire melting point: 270°C The inner surface was melt-plated as described above, and the following results were obtained.
チユーブ長 ……10ｍ
（内面に銅メツキのないもの）
チユーブ径 ……12.7mm
チユーブ肉厚 ……1.0mm
雰囲気炉の温度 ……1050℃
加熱時間 ……７分
Sn−Zn合金線組成 ……sn90％
Zn10％
Sn−Zn合金線融点 ……210℃
上記のようにして内面溶融メツキを行ない以下
の結果を得た。
Tube length...10m (no copper plating on the inside) Tube diameter...12.7mm Tube wall thickness...1.0mm Atmospheric furnace temperature...1050℃ Heating time...7 minutes Sn-Zn alloy wire composition...sn90 % Zn10% Sn-Zn alloy wire melting point...210°C The inner surface was melt-plated as described above, and the following results were obtained.
チユーブ長 ……10ｍ
（内面に銅メツキのないもの）
チユーブ径 ……25.4mm
チユーブ肉厚 ……1.0mm
雰囲気炉の温度 ……1000℃
加熱時間 ……10分
Sn−Zn合金線組成 ……Sn70％
Zn30％
Sn−Zn合金線融点 ……310℃
上記のようにして内面溶融メツキを行ない以下
の結果を得た。
Tube length...10m (no copper plating on the inside) Tube diameter...25.4mm Tube wall thickness...1.0mm Atmosphere furnace temperature...1000℃ Heating time...10 minutes Sn-Zn alloy wire composition...Sn70 % Zn30% Sn-Zn alloy wire melting point...310°C The inner surface was melt-plated as described above, and the following results were obtained.
【表】
ｅ 効果
以上説明したように、本発明によれば、予め銅
メツキが施されていない鋼管や、大口径の鋼管の
内面に均一な被膜が得られる。また、合金線に銅
を被覆するので、銅の含有量が増大するにしたが
つて硬化しもろくなるSn−CuあるいはSn−Zn−
Cu合金を太い線から細くする場合に比して線引
き加工が容易となり、安価で品質の安定した線材
を使用することができるなど、その効果は大き
い。[Table] e Effects As explained above, according to the present invention, a uniform coating can be obtained on the inner surface of a steel pipe that has not been previously copper-plated or a large-diameter steel pipe. In addition, since the alloy wire is coated with copper, Sn-Cu or Sn-Zn- which becomes hardened and brittle as the copper content increases.
Compared to the process of making Cu alloy from thick wire to thin wire, the wire drawing process is easier, and wire rods with stable quality can be used at low cost.
第１図は本発明実施の１例を示す金属細管の断
面図、第２図は本発明のメツキ方法によりメツキ
が施された金属細管の断面図である。
１……金属細管、２……低融点金属線、３……
メツキ層。
FIG. 1 is a cross-sectional view of a metal capillary tube showing an example of an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a metal capillary tube plated by the plating method of the present invention. 1...Metal thin tube, 2...Low melting point metal wire, 3...
Metsuki layer.
Claims (1)
種又は二種を主成分とする合金からなる低融点金
属線を内挿し、これを非酸化性雰囲気中にて上記
金属線の融点以上に加熱し、上記金属線を溶融
し、低融点金属のメツキ層を金属細管内面に形成
させるようにした金属細管内面の溶融メツキ方法
において、上記低融点金属線を銅被覆したことを
特徴とする金属細管内面の溶融メツキ方法。1. A low melting point metal wire made of tin, zinc, or an alloy containing one or two of these as main components is inserted into a thin metal tube, and heated to a temperature higher than the melting point of the metal wire in a non-oxidizing atmosphere. , a method for melt plating the inner surface of a metal capillary tube, in which the metal wire is melted and a plating layer of a low melting point metal is formed on the inner surface of the metal capillary tube, wherein the low melting point metal wire is coated with copper. Melt plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28517988A JPH02133558A (en) | 1988-11-11 | 1988-11-11 | Hot dip coating method for inside surface of fine metallic pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28517988A JPH02133558A (en) | 1988-11-11 | 1988-11-11 | Hot dip coating method for inside surface of fine metallic pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02133558A JPH02133558A (en) | 1990-05-22 |
| JPH0317897B2 true JPH0317897B2 (en) | 1991-03-11 |
Family
ID=17688126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28517988A Granted JPH02133558A (en) | 1988-11-11 | 1988-11-11 | Hot dip coating method for inside surface of fine metallic pipe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133558A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2801874C (en) * | 2010-06-09 | 2014-09-09 | Sanoh Kogyo Kabushiki Kaisha | Metal pipe for vehicle piping and method of surface-treating the same |
| JP6467195B2 (en) | 2014-11-10 | 2019-02-06 | 三桜工業株式会社 | Coated metal pipe for vehicle piping |
-
1988
- 1988-11-11 JP JP28517988A patent/JPH02133558A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02133558A (en) | 1990-05-22 |
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