JPH0330979B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for forming a substrate with an angle by rotating a substrate holding part of a substrate holder.
The present invention relates to an exposure apparatus that exposes two sides of a substrate to light through a mask without removing the substrate.

2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, exposure apparatuses are indispensable for the production of semiconductor elements or for increasing the density of wiring patterns, and various exposure apparatuses have been developed to meet these demands.

A conventional exposure apparatus will be explained below.

1 and 2 show a conventional exposure apparatus, with FIG. 1 being a front view and FIG. 2 being a side view.

In FIGS. 1 and 2, 1 is an exposure light source, 2
3 is a microscope, 3 is a mask holder, 4 is a substrate holder, 5 is an adjustment mechanism for aligning the substrate and the mask, which will be described later, and 6 is an operating section. The exposure light source 1 is configured to emit ultraviolet light as parallel light, and is attached to a support rod 8 fixed to a base 7. The parallel light emitted from the exposure light source 1 is irradiated onto the substrate 10 through the mask 9. The microscope 2
looks at the pattern formed on the mask 9 and the substrate 10, and uses the adjustment mechanism 5 to adjust the pattern on the mask 9 and the substrate 1.
0, and the guide rods 11, 1
The light source 2 is slidably attached to the light source 2, and when performing exposure, it is moved in the direction of the arrow so as not to block the light from the light source 1 for exposure. Further, the mask holder 3 fixes the mask 9 by vacuum suction or the like, and the pattern forming portion of the mask 9 is provided with a hole (not shown) so as not to block the light from the exposure light source 1. This mask holder 3 is attached to support plates 13, 13' so that it can rotate in the direction of arrow A to the state shown by the two-dot chain line, and in the state shown in FIG. It is configured to be fixed by suction or the like. Attachment and detachment of the mask 9 are performed with the mask holder 3 in the position indicated by the two-dot chain line. Further, the mask 9 has a predetermined pattern (not shown) formed on the surface on the substrate 10 side so as to block or pass the light from the exposure light source 1. The substrate 10 has a photosensitive resin coated uniformly on the side surface of the mask 9 to a thickness of several μm, and is configured such that the photosensitive resin is exposed to light passing through the mask 9. Further, the substrate holder 4 fixes the substrate 10 by vacuum suction, and has a spherical portion so that the pattern forming surface of the mask 9 and the photosensitive resin coated surface of the substrate 10 are in close contact with each other or are parallel to each other with a small gap between them. 4a is provided. The adjustment mechanism 5 has three adjustment parts in the X direction, Y direction, and θ, a position where the substrate 10 and the mask 9 are brought into close contact with each other, or parallel with each other with a small interval, and a Z axis for separating them. It is configured to be able to be adjusted in four directions, and is provided with a spherical seat 5a that fits into a part of the spherical portion 4a of the substrate holder 4, so that adjustment in the Z-axis direction can be performed from a state where the substrate 10 and the mask 9 are separated. So board 1
0 to the mask 9, the substrate 10 is automatically
The photosensitive resin forming surface of the mask 9 and the pattern forming surface of the mask 9 can be automatically adjusted so that they are in close contact with each other or parallel to each other with a small distance therebetween. The operation section 6 controls the light from the exposure light source 1.
ON, OFF (Normally, the exposure light source 1 is turned ON and OFF by opening and closing the shutter provided in the exposure light source 1 while the light source 1 remains lit.), Vacuum suction of the mask holder 3, and substrate holder 4 Operations such as vacuum suction of the support plates 13 and 13' are performed at one place. 14,1
4' supports the guide rods 11 and 12 at both ends and supports the base 7.
This is a fixture that is fixed to the

The exposure method for the conventional exposure apparatus configured as described above will be explained.

First, the microscope 2 is moved in the direction of the arrow, the mask holder 3 is rotated to the position indicated by the two-dot chain line, and the substrate holder 4 is moved to the position where the mask 9 and the substrate 10 are separated by the Z-axis adjustment of the adjustment mechanism 5. let Next, the mask 9 and the substrate 10 are vacuum-adsorbed and fixed to the mask holder 3 and the substrate holder 4, respectively.

Next, the mask holder 3 is rotated to the state shown in FIG. 1, and is fixed by vacuum suction using the support plates 13 and 13'. Next, the microscope 2 is returned to the state shown in FIG. 1, and the pattern of the mask 9 and the substrate 1 are
The pattern of the mask 9 and the substrate 10 are aligned in a predetermined state by making adjustments in each direction while looking at 0, and the microscope 2 is moved in the direction of the arrow so that the light from the exposure light source 1 is not blocked. Next, the exposure light source 1 is turned on for a predetermined period of time to expose the photosensitive resin film of the substrate 10 to light.

Next, the mask 9 and the substrate 10 are separated by the Z-axis adjustment of the adjustment mechanism 5, and the vacuum suction of the support plates 13 and 13' is released, and the mask holder 3 is rotated as shown by the two-dot chain line. Next, when the vacuum suction of the substrate holder 4 is released and the substrate 10 is taken out, the exposure step of exposing the photosensitive resin by mask alignment is completed.

The photosensitive resin coated on one surface of the substrate 10 can be exposed to light through a mask pattern using the method described above.

There is also an exposure apparatus that provides an exposure light source and a mask on both sides of a substrate and simultaneously exposes both opposing surfaces of the substrate.

However, in the above configuration, as shown in FIG. 3, although two parallel planes facing each other, such as planes 10a and 10b of the substrate 10, can be exposed at the same time, exposure of planes 10a and 10c can be carried out simultaneously. There is a problem in that it is not possible to expose the two surfaces formed at an angle as shown in FIG.
Furthermore, in the method of exposing the 10a side and then the 10c side, it is not possible to perform exposure to continuously form a fine pattern P on the 10a side and the 10c side as shown in Fig. 4. There was a problem that it could not be done. Note that the substrate 10 shown in FIG.
is used, for example, in an end-face type thermal head, and the pattern P on one side 10a is connected to a control circuit (for example, a transistor circuit), and the other pattern P formed at an angle with this one side 10a is used. The pattern P on the side 10c is connected to a heating resistor.

OBJECT OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and is an exposure apparatus capable of exposing two surfaces formed at an angle through a mask once a substrate is attached to a substrate holder. Our goal is to provide the following.

Structure of the Invention In order to achieve this object, the present invention includes an exposure light source, a mask holder, and a substrate holder, in which a substrate holding part of the substrate holder is rotatable, and a mask is provided with a substrate. First and second patterns are provided corresponding to one side and the other side, and after one side of the substrate is exposed using these patterns, the other side formed at an angle is exposed by rotating the substrate holder. By exposing the substrate at an angle, it is possible to expose two angled surfaces of the substrate without having to re-hold the substrate.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 5 and 6 are a front view and a side view showing an exposure apparatus according to an embodiment of the present invention.

In FIGS. 5 and 6, 15 is an exposure light source;
16 is an optical microscope, 17 is a mask holder, 18
1 is a mask, 19 is a substrate, 20 is a substrate holding member, 2
1 is a positioning means, and 22 is an operation panel. The exposure light source 15 emits parallel ultraviolet light to the mask 1.
8. Irradiate toward the substrate 19. The exposure light source 15 is configured to have a built-in shutter (not shown), and the shutter is opened and closed by operating the operation panel 22 to irradiate and block the parallel light from the exposure light source 15. Support rod 15 fixed to 23
It is fixed at a. Further, the optical microscope 16 uses the alignment means 21 while looking at the mask 18, the substrate 19, and the substrate holding member 20 to align the mask 18 and the substrate 19, or the mask 18 and the substrate holding member 20.
It is slidably attached to the guide rods 16b, 16c, and 16d via the mounting rod 16a, and when the substrate 19 is irradiated with the light from the exposure light source 15, it is slid in the direction of the arrow. , exposure light source 1
The configuration is such that the light of No. 5 is not blocked. The guide rods 16b, 16c, and 16d are fixed to holding fittings 16e and 16f fixed to the base 23. The mask holder 17 fixes the mask 18 by vacuum suction at its outer periphery, and is provided with a hole (not shown) so that the light from the exposure light source 15 can be irradiated onto a required range of the mask 18. This mask holder 17 is connected to the operation panel 22 through a flexible pipe 17a so that the vacuum suction operation of the mask 18 can be performed using the operation panel 22. The mask holder 17 is rotatably attached to mounting plates 24 and 24' fixed to the base 23, and has a rotation range up to the state shown by the two-dot chain line in FIG. It is configured to be fixed to the mounting plates 24, 24' by vacuum suction. The mounting plates 24, 24' are flexible pipes 24a, 24'a.
are connected to the operation panel 22, respectively, so that the vacuum suction operation of the mask holder 17 can be performed using the operation panel 22.

As shown in FIG. 7, the mask 18 has a predetermined pattern formed on the surface of the substrate 19, consisting of a portion that transmits the light from the exposure light source 15 (indicated by the white area) and a portion that blocks the light (indicated by the black dot). is formed. In FIG. 7, 18a is a first pattern for exposing one side of the substrate 19, 18b is a second pattern for exposing the other side of the substrate 19, and 18c is a second pattern for exposing one side of the substrate 19.
is a pattern for alignment with the substrate holding member 20.

As shown in FIG. 8, the substrate 19 is plate-shaped and has a surface 19.
A conductor layer 19d made of copper or the like is formed on surfaces 19a, 19b, and 19c, and a photosensitive resin film 19e is uniformly formed on the surfaces of surfaces 19a and 19b to a thickness of several μm, and surfaces 19a and 19b are formed at an angle of 90 degrees. It has an angle.
The relationship between the substrate 19 and the mask 18 is such that the length L of the substrate 19 is approximately equal to the length l of the mask 18, the width W of the substrate 19 corresponds to the w of the pattern 18a of the mask 18, and the thickness of the substrate 19 is The relationship is such that the height H corresponds to the pattern 18b of the mask 18. Board 19
and mask 18 are configured to have the above relationship.

FIG. 9 is an exploded perspective view showing the substrate holding member 20. FIG. In FIG. 9, 25 is a support base, 26 is a board mounting bracket, 27 and 28 are support brackets, and 29 is a spherical table. The support base 25 has a U-shape with a board mounting bracket 26 located inside, has support brackets 27 and 28 attached to both ends with screws 44, and has a spherical base 29 attached to the bottom surface. . The board mounting bracket 26 includes a bearing 30,
It is rotatably attached to the supporting metal fittings 27 and 28 via 30', and is provided with a groove 26a and a suction hole 26b for vacuum suctioning the substrate 19. The board mounting surface 26c of the board mounting bracket 26 is finished with good flatness and is provided with a regulating pin 26d for mounting the board 19. In addition, the board mounting bracket 26
The convex portion 26 is formed at a height approximately equal to the thickness H of the substrate 19 so as not to be higher than the thickness H of the substrate 19.
It constitutes e. The surface 26f of the convex portion 26e is finished with good straightness so that it can be aligned with the pattern 18c of the mask 18. The support fitting 27 has a hole 27 into which an O-ring 31 and a ring 32 are inserted to vacuum-adsorb the substrate 19.
a, a hole 27b into which the bearing 30' is inserted, and a hole 27c for vacuum suction. Reference numeral 33 denotes a pipe connection portion, which is screwed into the hole 27c of the support fitting 27, and a flexible pipe 34 is connected thereto. The other end of the flexible pipe 34 is connected to the operation panel 22, so that the vacuum suction operation of the substrate 19 can be performed using the operation panel 22. In addition, the support fitting 28
The bearing 30 is inserted into the hole 28a into which the bearing 30, the ring 35 and the wave washer 36 are inserted, and the press screw 37 is inserted through the ring 35 and the wave washer 36.
Threaded portion 28b pressed against board mounting bracket 26 by
The board mounting fitting 26 is rotatably attached to the support fitting 27 so that there is no play between the board mounting fitting 26 and the supporting fitting 27. Further, as shown in the perspective view of FIG. 10, the support fitting 28 is provided with a recessed portion 28c on the side surface of the board mounting fitting 26, and the rotation position regulating pin 38 provided on the board mounting fitting 26 is connected to the surface 28d and the surface 28e. lock in position,
It is configured to have a rotation range of 90 degrees. 39
is a rotating lever which is fixed to the board mounting bracket 26 with a screw 42 and has a spring hook 39a. Reference numeral 40 denotes a spring hook pin, which is attached and fixed to the support fitting 28. A spring 41 is applied between the spring hook pin 40 and the spring hook portion 39a of the rotating lever 39 to form a toggle mechanism.

FIGS. 11a and 11b show the rotational state of the board mounting bracket 26 constituting the board holding member 20. FIG.

In the state shown in FIG. 11a, the board mounting bracket 26 is rotated by the toggle mechanism in the direction of the arrow ○A, and the rotation position regulating pin 38 is pressed against the surface 28d of the support bracket 28, and is engaged at the surface 28d. can be stopped and maintained in that state.

Next, when the rotary lever 39 is rotated in the direction of arrow ○B against the rotational force in the direction of arrow ○a, as shown in FIG.
The state will be as follows. At this time, the toggle mechanism applies a rotational force to the board mounting bracket 26 in the direction of the arrows ◯ and ◯, and the rotational position regulating pin 38 is pressed into contact with the surface 28e of the support bracket 28, and this state is maintained.

Further, the alignment means 21 has a mechanism for adjusting the angle θ in the X direction, the Y direction, and a Z-axis direction adjustment mechanism for adjusting the distance between the substrate 19 and the mask 18, although the specific configuration thereof is not shown. In addition, a spherical seat 21a that engages with the spherical table 29 is provided, and the substrate 19 is attached to the mask 18 by adjusting the Z-axis direction.
When brought into close contact with each other, the pattern forming surface of the mask 18 and the exposed surface of the substrate 19 are automatically brought into close contact uniformly over the entire surface. Further, the spherical table 29 of the substrate holding member 20 is vacuum-adsorbed to the spherical seat 21a of the alignment means 21 to fix the substrate holding member 20 to the alignment means 21. 22, so that vacuum suction operations can be performed from the operation panel 22.

Next, the mask 18, the substrate 19, and the substrate holding member 2
The relationship with 0 will be explained using FIG.
First, the surface 19a of the substrate 19 is exposed in the state shown in FIG.
8 pattern 18c, the substrate holding member 20
The structure is such that the position between the mask 18 and the mask 18 can be adjusted. At this time, since the substrate holding member 20 and the substrate 19 are attached with a predetermined relationship by the regulating pin 26d, by adjusting the positional relationship between the pattern 18c and the convex portion 26e of the substrate holding member 20, The exposed surface 19a of the substrate 19 is the mask 18
The state corresponds to the w portion of the pattern 18a.
At this time, the dimension M in FIG. 12a and the dimension m of the mask 18 correspond to each other. After this alignment is completed, the substrate holding member 20 is fixed to the alignment means 21 by vacuum suction. Next, the substrate mounting bracket 26 is rotated by operating the rotation lever 39 to bring it into the state shown in FIG. 12b, and the surface 19b of the substrate 19 is exposed.

However, in order to change the state from the state shown in FIG. 12a to the state shown in FIG. Move the positional relationship by T, which is larger than the required movement amount S, rotate the board mounting bracket 26, and further adjust the Z axis and move by T to bring the mask 18 and the surface 19b of the board 19 into close contact. Then, the state shown in FIG. 12b is obtained. here,
Since the length U from the rotation center of the substrate mounting bracket 26 to the exposure surface 19a of the substrate 19 is equal to the length V from the rotation center to the exposure surface 19b, the Z axis is Even if the position is the same in Figure a and Figure 12B, and the Z-axis is adjusted and moved by T, the positional relationship with the mask 18 is
It is possible to maintain accuracy between Figure 2a and Figure 12b. In the state shown in FIG. 12b, the surface 19b of the substrate 19
to expose.

Here, the mask 18 and the exposed surface 19 of the substrate 19
The relationship between a, 19b and the board mounting bracket 26 will be explained using FIG. 12c and FIG. 7. Figure 12c
The relationship between the substrate 19 and the convex portion 26e of the substrate mounting bracket 26 is Y between the surface 19b and M between the surface 19a, which corresponds to y and m in the mask 18, respectively. Therefore, in the mask 18, 18a, 18b,
As shown in 18c, the protrusions 2 are located at different positions.
6e, surface 19a, and surface 19b, each pattern can be formed. In other words, the patterns necessary for the mask 18 are
b and 18c, and by configuring the substrate holding member 20 to correspond to the respective patterns, the surfaces 19a and 19b of the substrate 19 can be formed at different positions.
When exposing two surfaces, once the positions of the mask 18 and the substrate holding member 20 are adjusted, the surface 1
After exposing the surface 9a, the surface 19b can be exposed simply by adjusting the Z axis and rotating the board mounting bracket 26.

With the above-mentioned relationship, the substrate holding member 20 and the alignment means 21 constitute a substrate holder.

The operation of the exposure apparatus of this embodiment configured as described above will be explained below. FIGS. 13 a to 13 show the mask 18 and substrate 1 according to the order of operation.
9 shows the relationship between the board mounting fittings 26 constituting the board holder.

First, the mask holder 17 is rotated to the position shown by the two-dot chain line in FIG.
Adjust the Z-axis of the board mounting bracket 26 as shown in Figure 13a.
Move it in the direction of the arrow. Next, by operating the operation panel 22, the mask 18 is fixed to the mask holder 17 by vacuum suction, and the substrate 19 is fixed to the board mounting bracket 26 by vacuum suction. This state is shown in FIG. 13b. Next, the mask holder 17 is rotated, and the operation panel 22 is operated to fix the mask holder 17 to the mounting plates 24, 24' by vacuum suction. This state is the state shown in FIG. 13c. next,
By adjusting the Z-axis of the positioning means 21 and moving the substrate holding member 20 in the direction of the arrow in FIG. shall be. In this state, the alignment means 21 performs the X direction, Y direction, and θ adjustment, and the mask 18 and the convex portion 2 are aligned.
The relationship between 6e and the substrate 19 is adjusted to a predetermined state. Next, the Z-axis is adjusted by the alignment means 21 to bring the mask 18 and the surface 19a of the substrate 19 into close contact with each other,
By operating the operation panel 22, the substrate holding member 20 is vacuum-adsorbed and fixed to the alignment means 21, and the exposure light source 1 is fixed.
The parallel light from 5 is irradiated onto the substrate 19 through the mask 18 to expose the photosensitive resin film 19e on the substrate 19.
Expose the necessary parts of the Next, board mounting bracket 2
6 in the direction of the arrow in FIG. 13d by the Z-axis adjustment of the positioning means 21 by T in FIG. 13e, and then rotate the board mounting bracket 26 in the direction of the arrow in FIG. The state shown in FIG. 13f is established. next,
The board mounting bracket 26 is placed in the first position by the alignment means 21.
Move the mask 18 by an amount T in the direction of the arrow in FIG.
1 on the board 19 by operating the operation panel 22.
9b side is exposed. Next, the mask 18 and the substrate 19
After separating them to the state shown in FIG. 13h, the board mounting bracket 26 is rotated in the direction of the arrow in FIG. 13h. Next, operate the operation panel 22 to install the mounting plates 24 and 2.
4', and rotate the mask holder 17 to the state shown by the two-dot chain line in Fig. 13.
state. Here, the operation panel 22 is operated to release the vacuum suction of the board mounting bracket 26 and the board 19 is removed. Next, the operating panel 22 is operated to release the vacuum suction of the mask holder 17, the mask 18 is removed, and the vacuum suction of the positioning means 21 is released, thereby completing the operation.

By developing the photosensitive resin film 19e of the substrate 19 exposed using the exposure apparatus according to the present embodiment as described above and etching the conductive metal 19d, the surface 19a of the substrate 19, as shown in FIG.
A predetermined conductive metal pattern can be formed on 19b. Note that the substrate 19 in FIG. 14 is used for an end-face type thermal head, and one surface 19a
A control circuit is connected to the pattern on the other side 1.
A heating resistor is connected to the pattern 9b.

As described above, according to this embodiment, by providing the substrate holding member of the substrate holder in a rotatable manner,
Exposure operations can be performed simply by holding the substrate once on two sides of the substrate that are angled (90 degrees).

A second embodiment of the present invention will be described below with reference to FIG. 15.

In FIG. 15, 19' is a board where the angle between surfaces 19a' and 19b' is 135 degrees (different from 90 degrees shown in the first embodiment), and the board mounting bracket 2
Rotation angle R' of 6, length between rotation center and board 19' surface
By appropriately selecting and configuring V', the mask 18 and the surface 19 of the substrate 19' can be
a' and 19b', and the surfaces 19a' and 19b' can be exposed by the same operation. At this time, the surface 19a' of the substrate 19' is exposed as shown by a solid line, and the surface 19b' is exposed as shown by a two-dot chain line. Therefore, the concave portion 28 of the support fitting 28 of the first embodiment
The range of c is configured to be small, and the rotation angle is made small. For other configurations and operations, see
This is similar to the embodiment.

As described above, according to the second embodiment, by changing the rotation angle of the substrate mounting bracket and the length between the rotation center and the exposure surface of the substrate from the first embodiment,
Even if the angle between the two exposed surfaces of the substrate is not 90°, the two exposed surfaces can be exposed.

Note that in the first and second embodiments, the substrate 19
Patterns 18a and 18b are provided on the mask 18 so as to correspond to the exposed surfaces 19a and 19b of It goes without saying that it is not necessary to form mask patterns on each of the surfaces 19a and 19b of the substrate 19 as in this embodiment, as it is only necessary to adjust the alignment means 21 and perform exposure. do not have.

Further, in the first embodiment, when the mask 18 and the substrate 19 are separated from each other or brought into close contact with each other, the alignment means 21 is operated to move the substrate 19 side. It goes without saying that the substrate 19 may be placed close to or separated from each other.

Effects of the Invention The mask alignment apparatus of the present invention is provided with a substrate holder having an alignment means and a rotatable substrate holding member, and the mask has first and second holders corresponding to one side of the substrate and the other side of the substrate. Since the pattern is provided, it is possible not only to expose two angled surfaces while holding the substrate, but also to perform exposure to accurately produce a fine pattern that connects the angled surfaces. The practical effects are great.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a conventional exposure device, FIG. 2 is a side view thereof, FIG. 3 is a perspective view showing a substrate exposed by the same device, and FIG. 4 is a partial perspective view of the substrate showing a pattern forming state. , FIG. 5 is a front view of an exposure device showing the first embodiment of the present invention, FIG. 6 is a side view thereof, FIG. 7 is a pattern diagram of a mask constituting the same device, and FIG. 8 is a diagram showing the same device. FIG. 9 is an exploded perspective view of the board mounting bracket that also constitutes the board holding member, FIG. 10 is a perspective view of the support bracket of the board holding fixture, and FIGS. 11a and 11b are A side view illustrating the operation of the substrate holding fitting, FIG. 12a,
b and c are diagrams explaining the relationship between the mask, the substrate, and the substrate holding fittings, Figures 13a to 13i are diagrams also explaining the order of their operations, and Figure 14 shows the state of metal conductor pattern formation after etching. FIG. 15, a perspective view of the substrate, is a diagram for explaining the principle of the second embodiment of the present invention. 15...Light source for exposure, 17...Mask holder, 18...Mask, 19...Substrate, 20...Substrate holding member, 21...Positioning means, 26...Substrate mounting bracket.

Claims (1)

[Claims] 1. An exposure light source that emits parallel light, a mask holder that holds a mask formed with a predetermined pattern that can block or pass light along the path of the light from the exposure light source, and a photosensitive resin layer on the surface. a substrate holder holding a substrate provided with a substrate, the substrate holder having a first position where one surface of the substrate and a pattern forming surface of the mask are substantially parallel, and an angle with one surface of the substrate. a substrate holder rotatably provided to take a second position in which the other surface formed by the mask is parallel to the pattern forming surface of the mask, the pattern of the mask, the substrate, and the substrate holder; a positioning means for aligning the substrate and the mask; and a separating means for relatively moving the substrate and the mask between a state in which they are in contact or close to each other and a state in which they are separated, and the pattern of the mask is The method is characterized by comprising a first pattern corresponding to one side of the substrate when the substrate holding member is in the first position, and a second pattern corresponding to the other side of the substrate when the substrate holding member is in the second position. exposure equipment.