JPH0652703B2 - Two-sided exposure method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-sided exposure method capable of forming a continuous pattern on two sides which share one side of a substrate and have an angle.

Configuration of Conventional Example and Problems Thereof In recent years, the production of semiconductor elements or the high density of wiring patterns has advanced, and the development of a technique for forming continuous high density patterns on a plurality of surfaces has also been advanced.

The conventional two-sided exposure method for forming a continuous pattern on two sides will be described below.

FIG. 1 shows a substrate manufactured by photolithography using a conventional exposure method. Reference numeral 1 is a substrate, which has two sides 1a and 1b
A continuous pattern 1c is formed on the surface. When a continuous pattern 1c is formed on the two surfaces 1a and 1b of the substrate 1 as described above, the convex portion 2 is formed on the surface 1b of the substrate 1'as shown in FIG. 2 so as to correspond to the pattern 1c as shown in FIG. Are formed. Next, a photosensitive resin film is formed on the surfaces 1a and 1b by a dip method or the like. Next, the substrate 1 is attached in the state of FIG. 4 to a mask alignment (not shown) provided with a mask (not shown) on which a predetermined pattern is formed.
Is aligned with the convex portion 2 and the surface 1b is exposed in the direction of the arrow. Next, the substrate 1 is set again in the mask alignment so that the substrate 1 and the mask are aligned with each other by the convex portion 2
And the exposure of the surface 1a is performed in the direction of the arrow. Next, the photosensitive resin film of the substrate 1 and the electrode material are etched,
The photosensitive resin film was removed to form a continuous pattern on two surfaces as shown in FIG.

According to the conventional method as described above, it is necessary to perform processing for mask alignment on the substrate itself, which increases the cost of the substrate and attaches the mask alignment apparatus to each surface when exposing two surfaces. There is a problem in that the removal is required, the work process is complicated, and the photosensitive resin film is damaged during the work to increase the defective rate.

Also, when glass glazes are provided on the 1a and 1b surfaces, the convex portions of the substrate are difficult to see with a microscope when aligning with the mask, and high density, for example, pattern formation of 4 lines or more per 1 mm is formed. The problem was that it was difficult.

An object of the present invention is to solve the above-mentioned problems of the prior art. The angle of the substrate once mounted on the rotatable substrate mounting means of the mask alignment apparatus without performing a process for mask alignment on the substrate. It is an object of the present invention to provide a two-sided exposure method capable of exposing two sides formed with the above.

According to the two-sided exposure method of the present invention, the substrate is set at a predetermined position of the rotatable substrate attaching means, and the mask is attached to the mask by the mask aligning portion provided on the substrate attaching means and the marker provided on the mask. Alignment is performed, and the mask and one surface of the substrate are brought into contact with or in proximity to each other to perform the first exposure, and then the substrate mounting means is rotated to bring the other surface of the substrate into contact with or in proximity to the second exposure. By carrying out, it is possible to perform the two-sided exposure capable of forming a high-density pattern without processing the substrate for alignment with the mask and without re-holding the substrate. .

Description of Embodiments FIGS. 6 and 7 are a front view and a side view showing a mask alignment apparatus used in an embodiment of the present invention. 6 and 7, 3 is a light source for exposure, 4 is an optical microscope, 5 is a mask holder, 6 is a mask, 7 is a substrate, 8 is a substrate holding member, 9 is a positioning means, and 10 is an operation panel. is there. The exposure light source 3 radiates parallel rays of ultraviolet light toward the mask 6 and the substrate 7. The exposure light source 3 is configured to irradiate and block parallel light by exposing the exposure light source 3 by incorporating a shutter (not shown) and opening and closing the shutter by operating the operation panel 10. It is fixed to the fixed support rod 3a.
The optical microscope 4 aligns the mask 6 with the substrate 7 or the mask 6 with the substrate attaching means 8 by the aligning means 9 while looking at the mask 6, the substrate 7, and the substrate attaching means 8. Slidably through the guide rod 4b,
When the substrate 7 is irradiated with the light from the exposure light source 3, it is slidably moved in the direction of the arrow so that the light from the exposure light source 3 is not blocked. Guide rods 4b, 4c,
4d is fixed to the holding metal fittings 4e and 4f fixed to the base 11. The mask holder 5 fixes the mask 6 by vacuum suction on the outer peripheral portion of the mask 6 and fixes the light from the exposure light source 3 to the mask 6.
A hole (not shown) is provided so that irradiation can be performed in the necessary area. The mask holder 5 has a flexible pipe 5a so that the vacuum suction operation of the mask 6 can be performed on the operation panel 10.
It is connected to 0. Further, the mask holder 5 is rotatably mounted on the mounting plates 12 and 12 'fixed to the base 11, and has a rotation range up to the state shown by the dashed line in FIG. 7, and in the state shown in FIG. , 12 'by vacuum suction. The mounting plates 12, 12 'are flexible pipes 12a, 1
2'a are respectively connected to the operation panel 10 so that the vacuum adsorption operation of the mask holder 5 can be performed on the operation panel 10. As shown in FIG. 8, the mask 6 has a substrate 7 having a predetermined pattern consisting of a light-transmitting portion of the exposure light source 3 (shown by a white portion) and a light-shielding portion (shown by a black dot).
It is formed on the side surface. In FIG. 8, 6a is a substrate 7
Is a pattern for exposing one surface of the substrate 7, 6b is a pattern for exposing the other surface of the substrate 7, and 6c is a pattern for performing alignment with the substrate mounting means 8. Board 7
As shown in FIG. 9, a plate-shaped conductor layer 7d such as copper is formed on the surfaces 7a, 7b, 7c, and a photosensitive resin film 7e is evenly formed on the surfaces of the surfaces 7a, 7b with a thickness of several μm. Is forming. The surface 7a and the surface 7b have an angle of 90 °. The relationship between the substrate 7 and the mask 6 is that the length L of the substrate 7 is substantially equal to 1 of the mask 6, the width W of the substrate 7 corresponds to the w of the pattern 6a of the mask 6, and the thickness H of the substrate 7 is H. Mask 6
Has a relationship corresponding to the pattern 6b. The substrate 7 and the mask 6 have the above-mentioned relationship.

FIG. 10 is a developed perspective view showing the substrate holding member 8. In FIG. 10, 13 is a support base, 14 is a board mounting means, 15 and 16 are support fittings, and 17 is a spherical base. The support 13 has a U-shape, and a base mounting bracket 14 is located inside. The support brackets 15 and 16 are attached to both ends by screws 18 and the spherical base 17 is mounted on the bottom surface. The board mounting means 14 is rotatably mounted on the support fittings 15 and 16 via bearings 19 and 19 ', and is provided with a groove 14a and a suction hole 14b for vacuum-sucking the board 7. The board mounting surface 14c is provided with a regulating pin 14d for mounting the finished board 7 with good flatness. Further, the convex portion 14e is formed with a height substantially equal to the thickness H of the substrate 7 so as not to be higher than the thickness H of the substrate 7. The surface 14f of the convex portion 14e is finished with good straightness, and the pattern 6 of the mask 6 is formed.
It is configured so that it can be aligned with c. Support bracket 15
Is provided with a hole 15a in which the O-ring 20 and the ring 21 are inserted for vacuum suction of the substrate 7, a hole 15b in which the bearing 19 'is inserted and a hole 15c for vacuum suction. Reference numeral 22 denotes a pipe connecting portion, which is screwed into the hole 15c of the support fitting 15 to connect the flexible pipe 23. The other end of the flexible pipe 23 is connected to the operation panel 10 so that the vacuum adsorption operation of the substrate 7 can be performed on the operation panel 10. The support metal fitting 16 includes a bearing 19, a ring 24, a hole 16a in which the pump washer 25 is inserted, and the bearing 19 in the ring 2.
4. A screw portion 16b that presses the board mounting means 14 with the pressing screw 26 via the pumping washer 25 is mounted rotatably so that there is no play between the board mounting means 14 and the support fitting 15. Further, as shown in the perspective view of FIG. 11, the support fitting 16 is provided with a concave portion 16c on the surface on the side of the board mounting means 14, and the rotary positioning pin 27 provided on the board mounting means 14.
Is locked at two positions of the surface 16d and the surface 16e so as to have a rotation range of 90 °. A rotating lever 28 is fixed to the board mounting means 14 with a screw 29, and is provided with a spring hook portion 28a. 30 is a spring hook pin and a support metal fitting 1
It is attached and fixed to 6. A spring 31 is attached to the spring hooking pin 30 and the spring hooking portion 28a of the turning lever 28 to form a toggle mechanism.

12A and 12B show the rotating state of the board mounting means 14 of the board holding member 8. In the state shown in Fig. 12a, the substrate attaching means 14 comes to press the turning position regulating pin 27 against the surface 16d by the turning force in the direction of arrow A by the toggle mechanism, and is locked by the surface 16d to hold that state. be able to. Next, when the turning lever 28 is turned in the direction of arrow B against the turning force in the direction of arrow A, the state shown in FIG. At this time, the toggle mechanism causes the substrate mounting means 14 to exert a turning force in the direction of arrow B so that the rotary positioning pin 27 has the surface 1
6e is pressed and locked to 6e, and the state is maintained. Although the alignment means 9 is not shown in detail, the X direction, the Y direction, and the θ
And a Z-axis adjusting mechanism for adjusting the substrate 7 and the mask 6, and a spherical seat 9a that engages with the spherical base 17 for adjusting the Z-axis to adjust the mask 6 and the substrate 7.
When they are brought into close contact with each other, the pattern forming surface of the mask 6 and the exposed surface of the substrate 7 are automatically brought into close contact with each other in a uniform state. The spherical base 17 of the substrate holding member 8 is vacuum-sucked to the spherical seat 21 of the aligning means 9 to fix the substrate holding member 8 to the aligning means. Connection is made so that vacuum suction can be performed on the operation panel 10. The relationship between the mask 6, the substrate 7, and the substrate holding member 8 will be described. First
The surface 7a of the substrate 7 is exposed in the state of FIG. 3a, and in this state, the positions of the substrate attaching means 14 and the mask 6 can be adjusted by the convex portions 14e of the substrate attaching means 14 and the pattern 6c. . At this time, since the board mounting means 14 and the board 7 are mounted in a predetermined relationship by the restriction pin 14d, the pattern 6c and the convex portion 1 of the board mounting means 14 are attached.
By adjusting the positional relationship with 4e, a state corresponding to the exposed surface 7a of the substrate 7 and the w portion of the pattern 6a of the mask 6 is obtained. The size of M in FIG. 13a and the size of m ′ of the mask 6 have a corresponding relationship. With this alignment completed, the substrate holding means 8 is vacuum-sucked to the alignment means 9, and then the substrate attachment means 14 is rotated by operating the rotation lever 28 to bring it to the state shown in FIG. The surface 7b is exposed. However, in order to change from the state of FIG. 13a to the state of FIG. 13b, in order to obtain the longest radius of gyration R of the substrate 7, the Z-axis direction of the aligning means 9 is operated to make the relative position between the substrate 7 and the mask 6 The relationship is moved by T larger than the required moving amount S to rotate the substrate attaching means 14, and further the Z axis is adjusted to move by T to bring the mask 6 and the 7b surface of the substrate 7 into close contact with each other. Thirteenth
The state shown in FIG. Since the length U of the exposure surface 7a of the substrate 7 from the rotation center of the substrate mounting means 14 and the length V from the rotation center to the exposure surface 7b are equal, the Z axis is shown in FIG. 13a. And FIG. 13b are at the same position, and the positional relationship with the mask 6 can be maintained accurately in FIGS. 13a and 13b even if there is an operation of adjusting the Z axis and moving by T. it can. The surface 7b of the substrate 7 is exposed in the state of FIG. 13b. The relationship between the mask 6 and the exposed surfaces 7a, 7b of the substrate 7 and the substrate mounting means 14 will be described with reference to FIGS. 13c and 8.

In FIG. 13, the relationship between the substrate 7 and the convex portion 14e of the substrate mounting means 14 is Y between the surface 7b and M between the surface 7a, and the mask 6 corresponds to y and m, respectively. Therefore mask 6
Further, as shown by 6a, 6b and 6c, respective patterns corresponding to the convex portion 14e, the surface 7a and the surface 7b can be formed at different positions. That is 6
Patterns 6a, 6b and 6c are formed at positions different from those of 6a, 6b and 6c, and the substrate holding member 20 is configured so as to correspond to the respective patterns.
When the positions of the mask 6 and the substrate attaching means 14 are adjusted once when the two surfaces of the substrate 6 are exposed, the surface 7a is exposed, and then the Z axis is adjusted and the substrate attaching means 14 is rotated.
Exposure can be performed.

A two-sided exposure method for a substrate will be described using the mask alignment apparatus configured as described above.

14a to 14i show the substrate 7, mask 6,
The relationship between the substrate mounting means 14 and the exposure sequence is shown.

First, the mask holder 5 is rotated to the position shown by the dashed line in FIG. 7 and the Z axis of the alignment means 9 is adjusted to bring the substrate mounting means 14 into the state shown in FIG. 14a. Next, operation panel 1
By operating 0, the mask 6 is vacuum-sucked and fixed to the mask holder 5, and the substrate 7 is vacuum-sucked and fixed to the substrate mounting means 14. At this time, the board 7 is attached to a predetermined position of the board attaching means 14 by the regulating pin 14d, and the convex portion 14 is formed.
It has a predetermined positional relationship with e. Then, the mask holder 5 is rotated, and the operation panel 10 is operated to fix the mask holder 5 to the mounting plates 12 and 12 'by vacuum suction.
That state is shown in FIG. 14c. Next, the Z-axis of the alignment means 9 is adjusted to move the substrate attachment means 14 in the direction of the arrow in FIG. 14c so that both the pattern 6c of the mask 6 and the convex portion 14e can be seen by the optical microscope 4. To do. In this state, the alignment means 9 adjusts the X direction, the Y direction, and θ to match the relationship between the mask 6, the convex portion 14e, and the substrate 7 to a predetermined state. Next, the Z-axis is adjusted by the aligning means 9 to bring the mask 6 and the surface 7a of the substrate 7 into close contact with each other, and the operation panel 10 is operated to vacuum-adhere the substrate holding member 8 to the aligning means 9 to fix it. Mask 6 for parallel light from the light source 3
The surface 7a (first exposure surface) of the substrate 7 is exposed through.
By the exposure, the necessary portion of the photosensitive resin film 7e on the surface 7a is exposed. Next, after the board mounting means 14 is moved in the direction of the arrow in FIG. 14d by the Z-axis direction adjustment of the positioning means 9 by eT in FIG. 14, the board mounting means 14 is moved in the arrow direction (FIG. 14e).
14f, so that the state shown in FIG. Next, the board mounting means 14 is moved by the positioning means 21 in the arrow direction (first
4f) is moved by T to bring the 7b surface (second exposure surface) of the substrate 7 and the mask 6 into close contact with each other, and in the state of FIG. 14g, the operation panel 10 is operated to operate the 7b surface of the substrate 7 ( Second exposed surface)
To expose. By the exposure, the required portion of the photosensitive resin film 7e on the surface 7b is exposed. Next, after the mask 6 and the substrate 7 are separated from each other to bring them into the state of FIG. 14h, the substrate mounting means 14 is rotated in the arrow direction (FIG. 14h). Next, the operation panel 10 is operated to release the vacuum suction of the mounting plates 12 and 12 ', and the mask holder 5 is rotated to the state of the dashed line in FIG.
4 The state shown in FIG. Here, the operation panel 10 is operated to release the vacuum suction of the board mounting bracket 14, and the board 7 is taken out.
Next, the operation panel 10 is operated to release the vacuum suction of the mask holder 5, remove the mask 6, and release the vacuum suction of the alignment means 9 to complete the operation. Two surfaces (first exposure surface 7a, second exposure surface 7
By developing the photosensitive resin film 7e of the substrate 7 exposed to b) and etching the conductor metal 7d, a predetermined conductor metal pattern can be formed on the surfaces 7a and 7b of the substrate 7 as shown in FIG. it can.

As described above, according to the present embodiment, the substrate attaching means can be rotated, and the convex portion (mask aligning portion) provided on the substrate attaching means and the mask align the substrate and the mask.
It is possible to perform exposure that enables pattern formation with high density, which is continuous on two surfaces having an angle of the substrate, without requiring the substrate to be processed for mask alignment.

The second embodiment of the present invention will be described below.

In FIG. 16, reference numeral 7'denotes a substrate when the angle between the surface 7a '(first exposure surface) and the surface 7b' (second exposure surface) is 135 degrees (90 degrees shown in the first embodiment). By differently configuring the rotation angle of the substrate mounting means 14 and the length V'of the rotation center and the substrate surface (19a '), the mask 6 and the substrate can be formed similarly to the first embodiment. The surfaces 7a '(first exposure surface) and 7b' (second exposure surface) of 7'can be constructed, and the surfaces 7a 'and 7b' are exposed in the same manner as in the first embodiment. . The surface 7a '(first exposure surface) is exposed in the state shown by the solid line of the substrate 7', and 7b 'is shown in the state shown by the two-dot chain line.
The (second exposed surface) is exposed. Therefore, the range of the concave portion 16c of the support fitting 16 of the first embodiment is made small so that the turning angle is made small. Other configurations and operating methods are the same as those in the first embodiment.

As described above, according to this embodiment, even if the first exposure surface and the second exposure surface are not 90 °, it is possible to perform exposure on two surfaces of the substrate.

In the first and second embodiments, the exposure surface 7 of the substrate 7
Although the convex portion 14e is provided on the a-side substrate attaching means 14 for mask alignment and the 7a surface is the first exposure surface, the convex portion 14e is provided on the 7b-side substrate attaching means 14 for mask alignment. It goes without saying that the 7b surface may be the first exposure surface and the 7a surface may be the second exposure surface.

Further, in the first embodiment, when the mask 6 and the substrate 7 are brought into contact with each other, the alignment means 9 is operated to move the substrate 7, but the mask holder 5 is moved to bring the mask 6 into contact with the substrate 7. It goes without saying that you can do it.

Further, in this embodiment, the mask 6 and the substrate 7 are brought into contact with each other when the exposure is performed, but the exposure may be performed with a slight gap.

According to the two-sided exposure method of the present invention, the substrate is attached to the rotatable substrate attaching means at a predetermined position, and the substrate and the mask are aligned with each other by the mask alignment portion and the mask provided on the substrate attaching means. By once mounting the substrate on the substrate mounting means and rotating the substrate mounting means, it is possible to form a continuous high-density pattern on two angled surfaces without requiring marker processing for mask alignment on the substrate. The practical effect is great.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate on which a pattern is formed by a conventional exposure method, FIGS. 2 to 5 are perspective views of a substrate showing a conventional exposure method, and FIG. 6 is a mask alignment used in the exposure method of the present invention. FIG. 7 is a front view of the apparatus, FIG. 7 is a side view thereof, FIG. 8 is a pattern view of the mask, FIG. 9 is a perspective view of the substrate, and FIG. 10 is an exploded perspective view of a substrate attaching means of the substrate holding member.
FIG. 11 is a perspective view of the support fitting, FIGS. 12a and 12b are side views of the substrate holding member, and FIGS. 13a to 13c are views showing the relationship between the substrate and the mask and the substrate mounting means. 14 Figure a-
i is a view showing the same exposure sequence, FIG. 15 is a perspective view of the substrate showing the same metal conductor pattern forming state, and FIG. 16 is a principle view showing a second embodiment of the present invention. 6 ... Mask, 7 ... Substrate, 7a ... First exposed surface, 7
b ... second exposed surface, 14 ... substrate mounting means, 14d ...
... Regulating pin, 14e ... Convex part, 28 ... Rotating lever, 3
...... Exposure light source, 4 ...... Optical microscope, 9 ...... Alignment means, 8 ...... Substrate holding member, 10 ...... Operation panel.

Front page continued (72) Inventor Keizaburo Kuramasu 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. References JP-A-58-115707 (JP, A) JP-A-55-29170 (JP, A) JP-A-49-84182 (JP, A)

Claims (1)

[Claims] 1. A predetermined position of a substrate mounting means, wherein a mask having a first exposure pattern and a second exposure pattern is set in a mask holder and rotatable about an axis parallel to the mask surface. The substrate is set to, and the mask is aligned with the substrate by the mask alignment portion provided on the substrate attachment means and the marker provided on the mask,
After exposing the first exposure surface of the substrate by bringing the first exposure pattern of the mask and the first exposure surface of the substrate into contact with each other or bringing them into close proximity to each other substantially in parallel, the mask and the substrate are exposed. And the substrate attaching means is rotated, and then the second exposure pattern of the mask and the second exposure surface formed at an angle with the first exposure surface of the substrate are brought into contact with each other. Alternatively, the two-sided exposure method is characterized by exposing the second exposed surface of the substrate in close proximity.