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JPH033550B2 - - Google Patents
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JPH033550B2 - - Google Patents

Info

Publication number
JPH033550B2
JPH033550B2 JP59227224A JP22722484A JPH033550B2 JP H033550 B2 JPH033550 B2 JP H033550B2 JP 59227224 A JP59227224 A JP 59227224A JP 22722484 A JP22722484 A JP 22722484A JP H033550 B2 JPH033550 B2 JP H033550B2
Authority
JP
Japan
Prior art keywords
light
processing
workpiece
head
coordinate point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59227224A
Other languages
Japanese (ja)
Other versions
JPS61108485A (en
Inventor
Kozaburo Shibayama
Hidehiko Nakao
Takashi Ikeda
Manabu Kubo
Kazuo Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59227224A priority Critical patent/JPS61108485A/en
Publication of JPS61108485A publication Critical patent/JPS61108485A/en
Publication of JPH033550B2 publication Critical patent/JPH033550B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044Seam tracking

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Numerical Control (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーザビームにより溶接、切断等の
加工を行なうレーザ加工機において、加工線を自
動的に記憶させる自動テイーチング方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an automatic teaching method for automatically memorizing processing lines in a laser processing machine that performs processing such as welding and cutting using a laser beam.

〔従来の技術〕[Conventional technology]

レーザ加工機においては、レーザビームを投射
するヘツドがX,Y,Zの三軸方向に駆動される
ものとなつており、あらかじめ人為的に記憶させ
た加工線に沿つてヘツドを移動し、所定の加工線
により被加工物へ加工を行なうものとなつている
が、加工線を記憶させる操作をテイーチングと称
し、従来は、制御箱のスイツチによりヘツドを移
動させ、この移動軌跡を座標位置としてメモリへ
逐次格納するものとなつている。
In a laser processing machine, the head that projects the laser beam is driven in the three axes of X, Y, and Z, and the head is moved along a processing line that has been artificially memorized in advance to achieve a predetermined position. Machining is performed on the workpiece using the machining line, but the operation of memorizing the machining line is called teaching. Conventionally, the head was moved by a switch in the control box, and this movement trajectory was memorized as the coordinate position. It is designed to be stored sequentially.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、加工形状が複雑となれば、スイツチの
操作による手動テイーチングでは、これの所要時
間が大になると共に、高精度のテイーチングが困
難になる等の問題を生じている。
However, when the shape to be machined becomes complex, manual teaching using a switch requires a long time and poses problems such as difficulty in high-precision teaching.

本発明は、従来のかかる問題点を根本的に解決
する目的を有し、加工面へ加工線に沿つてマーキ
ングを施すのみにより、テイーチングが自動的に
行なえるものとした極めて効果的な、レーザ加工
機の自動テイーチング方法を提供するものであ
る。
The purpose of the present invention is to fundamentally solve these conventional problems, and the present invention is an extremely effective laser system that allows teaching to be performed automatically by simply marking the machined surface along the process line. This provides an automatic teaching method for processing machines.

〔問題点を解決するための手段〕[Means for solving problems]

前述の目的を達成するため、本発明はつぎの手
段により構成するものとなつている。
In order to achieve the above-mentioned object, the present invention is constructed by the following means.

すなわち、被加工物の加工面上へ光線反射率が
加工面と異なるマーキングを加工線の中心に沿つ
て施し、光源から加工面へ投射される光スポツト
に基づく反射光の変化を検出し、レーザビームを
投射するヘツドを反射光の変化が反復する方向に
沿つて移動させ、マーキングによる反射光の変化
が生ずる中心位置の座標点を求め、この座標点を
逐次メモリへ格納するものとしている。
That is, a marking with a light reflectance different from that of the processed surface is applied to the processed surface of the workpiece along the center of the processed line, and changes in reflected light based on a light spot projected from a light source to the processed surface are detected, and the laser The head that projects the beam is moved along the direction in which the reflected light changes repeatedly, and the coordinate point of the center position where the reflected light changes due to marking occurs is determined, and this coordinate point is sequentially stored in the memory.

〔作用〕[Effect]

したがつて、マーキングが光学的に検出され、
これの中心位置を示す座標点が逐次メモリへ格納
されるものとなり、これがテイーチングされたデ
ータとなるため、加工線上へマーキングを施すの
みにより、テイーチングが自動的に行なわれる。
The markings are therefore detected optically and
The coordinate points indicating the center position of this are sequentially stored in the memory and become the taught data, so that teaching can be automatically performed simply by marking on the processing line.

〔実施例〕〔Example〕

以下、実施例を示す図によつて本発明の詳細を
説明する。
Hereinafter, details of the present invention will be explained with reference to figures showing examples.

第2図は、レーザビームを投射するヘツドの断
面図であり、外筒1の内部へ設けられた加工レン
ズ2により集束されたレーザビーム3は、被加工
物4へ投射され、この部位に対して加工を行なう
ものとなつていると共に、外筒1の一側方には、
レーザビーム3と別個な波長のレーザ光を発生す
る半導体レーザ発振器等の光源6が配され、これ
からのレーザ光は、投射側に設けた投光レンズ7
により集束されたうえ、被加工物4の面上におけ
るレーザビーム3の近傍へ光スポツト8として投
射されるものとなつている。
FIG. 2 is a cross-sectional view of the head that projects the laser beam. The laser beam 3, which is focused by the processing lens 2 provided inside the outer tube 1, is projected onto the workpiece 4. In addition, on one side of the outer cylinder 1,
A light source 6 such as a semiconductor laser oscillator that generates a laser beam with a wavelength different from that of the laser beam 3 is disposed, and the laser beam from this is transmitted through a projection lens 7 provided on the projection side.
The laser beam 3 is focused on the surface of the workpiece 4 and projected into the vicinity of the laser beam 3 as a light spot 8.

光スポツト8は、被加工物4の面上において反
射され、外筒1の他側方に設けた撮像レンズ11
へ反射光として入射し、受光素子としてのPSD
〔Position Sensitive Detector.〕12へ結像とな
つて投影され、PSD12の両端からは、結像に
よる光線の入射位置に応じた電流iA,iBが各個に
送出される。
The light spot 8 is reflected on the surface of the workpiece 4 and is reflected by an imaging lens 11 provided on the other side of the outer cylinder 1.
The reflected light enters the PSD as a light receiving element.
[Position Sensitive Detector.] 12 as an image is projected, and from both ends of the PSD 12, currents i A and i B corresponding to the incident position of the image-formed light ray are sent out respectively.

ここにおいて、PSD12上の結像位置Pは、
加工レンズ2と被加工物4との対向距離l、投光
レンズ7と撮影レンズ11との水平距離L、およ
び撮影レンズ11と被加工物4との対向間隔Aに
応じて定まるが、このときPSD12から送出さ
れる電流値をiA,iBとすれば、結像位置Pは次の
ような式により求めることもできる。
Here, the imaging position P on the PSD 12 is
It is determined according to the facing distance l between the processing lens 2 and the workpiece 4, the horizontal distance L between the projecting lens 7 and the photographing lens 11, and the facing distance A between the photographing lens 11 and the workpiece 4. If the current values sent out from the PSD 12 are i A and i B , the imaging position P can also be determined by the following equation.

P=iA−iB/iA+iB …(1) また、対向間隔Aは、レーザビーム3の光軸9
に対する光スポツト8の光軸との角度Φ、および
撮影レンズ11の光軸13との角度θに応じて定
まり、次式により示される。
P=i A −i B /i A +i B …(1) Also, the opposing distance A is the optical axis 9 of the laser beam 3.
It is determined according to the angle Φ between the optical axis of the light spot 8 and the angle θ between the optical axis 13 of the photographing lens 11 and is expressed by the following equation.

A=L・tan(90−φ)/1+tan(90−φ)/tan(9
0−φ)…(2) 従つて、Φおよびθが一定値であればAは一定
値になるとともに、対向距離lと対向間隔Aとの
差も一定となることから、これらを基準とした結
像位置Pの値と対向距離lとの関係は、次式で示
すことができる。
A=L・tan(90−φ)/1+tan(90−φ)/tan(9
0−φ)…(2) Therefore, if Φ and θ are constant values, A will be a constant value, and the difference between the facing distance l and the facing distance A will also be constant, so using these as the standard The relationship between the value of the imaging position P and the facing distance l can be expressed by the following equation.

l=K・P …(3) [K:定数] すなわち、結像装置Pの値と対向距離lとの関
係は、互いに比例関係にある。
l=K·P (3) [K: constant] That is, the relationship between the value of the imaging device P and the facing distance l is proportional to each other.

そして、この対向距離lの値が一定となるよう
にヘツドを被加工物4の面に平行移動すれば、光
スポツト8は常にレーザビーム3の投射点にほぼ
一致するものとなり、従つてこの反射光は常に撮
影レンズ11を介してPSD12上の結像点、す
なわち結像位置Pに結像することになる。
If the head is moved parallel to the surface of the workpiece 4 so that the value of this opposing distance l is constant, the light spot 8 will always almost coincide with the projection point of the laser beam 3, and therefore this reflection will be The light always forms an image at an imaging point on the PSD 12, that is, an imaging position P via the photographing lens 11.

こうして、レーザビーム3の投射を行わない状
態において、対向距離lを一定に保ちながらヘツ
ドを平行移動して光スポツト8を被加工物4の加
工面に施したマーキング面に照射させ、反射光に
よるPSD12の出力変化、すなわち電流値iA+iB
を判断すれば、マーキングを検出することができ
る。
In this way, when the laser beam 3 is not projected, the head is moved in parallel while keeping the facing distance l constant, and the light spot 8 is irradiated onto the marking surface made on the processed surface of the workpiece 4, and the reflected light is PSD12 output change, i.e. current value i A + i B
By determining this, markings can be detected.

第3図は光スポツト8によるマーキングの検出
状況を示す平面図であり、被加工物4の加工面上
へ、光スポツト8に対する光線反射率が加工面と
異なるテープ21を加工線の中心22に沿つて貼
着し、これによつてマーキングを施すと共に、こ
の例では、被加工物4の長軸方向をX1−X2軸と
一致させ、これを図上省略したレーザ加工機の加
工台上へ載置するものとしている。
FIG. 3 is a plan view showing the state of detection of markings by the optical spot 8, in which a tape 21 whose light reflectivity for the optical spot 8 is different from that of the processed surface is placed on the processing surface of the workpiece 4 at the center 22 of the processing line. In this example, the long axis direction of the workpiece 4 is aligned with the X1 - X2 axis, and this is attached to the processing table of the laser processing machine (not shown in the figure) It is intended to be placed on top.

したがつて、ヘツドを手動操作によりテープ2
1の基準点23へ一致させると共に、走査方向を
指示したうえ、自動制御によりヘツドを各軸X1
X2,Y1,Y2方向へ駆動すると共に、対向距離l
を正規に保ち、光スポツト8による走査軌跡24
を点線により示すとおり、テープ21による反射
光の変化が反復する方向に沿つてヘツドを移動さ
せれば、テープ21の一側辺25および他側辺2
6と走査軌跡24とが交差する度毎に反射光の変
化が生じ、これによつてテープ21の幅Wが求め
られるため、これの中心を算出すると、加工線の
中心22を示す座標点が逐次求められる。
Therefore, the head can be manually operated to
1, the scanning direction is specified, and the head is automatically controlled to align with the reference point 23 of X 1 ,
While driving in the X 2 , Y 1 , Y 2 directions, the facing distance l
is kept normal, and the scanning trajectory 24 by the light spot 8 is
As shown by the dotted line, if the head is moved along the direction in which changes in the light reflected by the tape 21 are repeated, one side 25 and the other side 2 of the tape 21
6 and the scanning locus 24 intersect each other, the reflected light changes, and the width W of the tape 21 can be determined from this. When the center of this is calculated, the coordinate point indicating the center 22 of the processing line is found. Required sequentially.

第4図は、反射光の変化状況を示す波形図、す
なわち光スポツト8が照射される座標点とこの反
射光によるPSD12から送出される電流値の和iA
+iBとの関係を示す図である。そして、この図に
波形として示すとおり、テープ21の幅Wと対応
するパルス幅のパルスが生じ、これをクロツクパ
ルスのカウント等により数値として求め、更り1/
2を乗ずれば中心22が求められ、これにしたが
つて、パルスの前縁と後縁との生じた座標点を基
準として演算すれば、中心22と一致する中心位
置の座標点が求められる。
FIG. 4 is a waveform diagram showing how the reflected light changes, that is, the sum of the coordinate point where the light spot 8 is irradiated and the current value sent out from the PSD 12 due to this reflected light .
It is a diagram showing the relationship with + iB . Then, as shown as a waveform in this figure, a pulse with a pulse width corresponding to the width W of the tape 21 is generated, which is determined as a numerical value by counting clock pulses, etc.
By multiplying by 2, the center 22 can be found. Accordingly, by calculating based on the coordinate points where the leading and trailing edges of the pulse occur, the coordinate point of the center position that coincides with the center 22 can be found. .

第5図は、PSD12の出力を処理すると共に、
各種の制御を行なう制御部のブロツク図であり、
マイクロプロセツサ等のプロセツサ〔以下、
CPU〕31を中心とし、固定メモリ〔以下、
ROM〕32、可変メモリ〔以下、RAM〕33、
インターフエイス〔以下、I/F〕34〜39を
周辺に配し、母線によりこれらを接続しており、
ROM32へ格納された命令をCPU31が実行
し、所定のデータをRAM33へアクセスしなが
ら制御を行なうものとなつている。
FIG. 5 shows that while processing the output of the PSD 12,
It is a block diagram of a control unit that performs various controls;
Processors such as microprocessors [hereinafter referred to as
Mainly CPU] 31, fixed memory [hereinafter referred to as
ROM] 32, variable memory [hereinafter referred to as RAM] 33,
Interfaces (hereinafter referred to as I/F) 34 to 39 are arranged around the periphery, and these are connected by a bus bar.
The CPU 31 executes instructions stored in the ROM 32 and performs control while accessing predetermined data to the RAM 33.

また、光スポツト8の反射光に基づくPSD1
2からの出力電流iA,iBは、各々が負荷抵抗器R
へ通じ、これの端子電圧が増幅器41A,41B
により各個に同一利得として増幅されたうえ、
I/F35からの制御信号に応じ、高速により選
択動作を行なうセレクタ42を介し、アナログ・
デイジタル変換器〔以下、A/D〕43へ与えら
れ、ここにおいてデイジタル信号へ変換されてか
ら、I/F36を経てCPU31へ与えられるも
のとなつており、これに基づいてCPU31が上
述の距離測定演算を行ない、対向距離lを規定値
へ保つ方向の制御信号を送出し、I/F39およ
び駆動回路〔以下、DR〕53を介してZ軸用の
モータ〔以下、MZ〕を駆動するものとなつてい
る。
In addition, PSD1 based on the reflected light of light spot 8
The output currents i A and i B from 2 are each connected to a load resistor R
The terminal voltage of this is connected to amplifiers 41A and 41B.
In addition to being amplified with the same gain for each individual,
In response to the control signal from the I/F 35, the analog
The signal is sent to a digital converter (hereinafter referred to as A/D) 43, where it is converted into a digital signal, and then sent to the CPU 31 via the I/F 36.Based on this, the CPU 31 performs the distance measurement described above. A device that performs calculations, sends out a control signal in the direction of keeping the facing distance l at a specified value, and drives the Z-axis motor [hereinafter referred to as M Z ] via the I/F 39 and drive circuit [hereinafter referred to as DR] 53. It is becoming.

一方、CPU31は、操作箱44からのI/F
34を介する指令に応動し、I/F37,38お
よびDR51,52を経て、図上省略した三軸移
動機構に備えるX軸用のモータ〔以下、MX〕5
4およびY軸用のモータ〔以下、MY〕55を駆
動し、ヘツドを第3図に示すX1−X2方向および
Y1−Y2方向へ移動させると共に、自動テイーチ
ングの際には、A/D43の出力によつて示され
る反射光の変化に応じ、MX54、MY55を駆動
して第3図に示す走査制御を行ない、中心22の
各座標点を求めたうえ、これを逐次RMA33へ
格納し、これを加工時に読み出してヘツドを自動
的に移動させる制御を行なう。
On the other hand, the CPU 31 is connected to the I/F from the operation box 44.
In response to a command via I/F 37, 38 and DR 51, 52, an X-axis motor (hereinafter referred to as M
4 and the Y-axis motor [hereinafter referred to as M Y ] 55, the head is moved in the X 1 -
In addition to moving in the Y 1 - Y 2 direction, during automatic teaching, M The scanning control shown in FIG. 12 is performed to obtain each coordinate point of the center 22, which is sequentially stored in the RMA 33, read out during machining, and controlled to automatically move the head.

第1図は、CPU31による自動テイーチング
時の制御状況を示すフローチヤートであり、第4
図のパルス幅Wをクロツクパルスのカウントによ
り求めるための“Wカウンタ・クリア”101、
および、求めた中心位置の座標点を格納する
RAM33のアドレス指定を行なう“アドレスカ
ウンタ←0”102を行ない、初期状態を設定す
ると共に、第3図に示す基準点23の座標点を
MX54、MY55の現制御状況に基づいて求め、
“基準X・Y→RAM”103により格納してか
ら、“MX・X1方向駆動”111、“MY・Y1方向
駆動”112、および、“MZ・修正駆動”113
を行ない、“A/D出力変化あり?”114が
NOの間はステツプ111以降を反復する。
FIG. 1 is a flowchart showing the control situation during automatic teaching by the CPU 31, and the fourth
“W counter clear” 101 for determining the pulse width W shown in the figure by counting clock pulses;
And store the coordinate point of the found center position
“Address counter ← 0” 102 is executed to specify the address of the RAM 33, and the initial state is set, and the coordinate point of the reference point 23 shown in Fig. 3 is set.
Obtained based on the current control status of M X 54 and M Y 55,
After storing by “Reference XY →RAM 103 ,M
and “A/D output change?” 114 is displayed.
If NO, steps 111 and subsequent steps are repeated.

光スポツト8がテープ21の一側辺25から逸
脱し、ステツプ114がYESとなれば、“アドレ
スカウンタ+1”121によりアドレス指定を歩
進させたうえ、“MY・反転方向駆動”122およ
び“MZ・修正駆動”123を行ない、ヘツドを
テーブル21側へ移動させ、“A/D出力変化あ
り?”131がYESとなり、光スポツト8がテ
ープ21の一側辺25へ達すれば、これの座標点
を“X・Y→バツフアメモリ”132により
RAM33のバツフアエリアへ格納し、Wカウン
タによる“Wカウンタ開始”133を行ない、更
に、“MZ・修正駆動”134により対向距離lを
規定値としながら、同一方向へヘツドを移動させ
る。
When the light spot 8 deviates from one side 25 of the tape 21 and step 114 becomes YES, the address specification is incremented by the "address counter +1" 121, and the " MY /reverse direction drive" 122 and " MZ /correction drive" 123 is performed, the head is moved to the table 21 side, "A/D output change?" 131 becomes YES, and when the light spot 8 reaches one side 25 of the tape 21, this The coordinate point is set by “X・Y→Buffer memory” 132.
The data is stored in the buffer area of the RAM 33, "W counter start" 133 is performed using the W counter, and the head is moved in the same direction using " MZ /correction drive" 134 while setting the facing distance l to the specified value.

ただし、ステツプ131がNOの間は、CPU3
1中に構成したタイマーにより所定時間“t1
過?”141を監視し、これがNOであればステ
ツプ123以降を反復するが、タイマーのタイム
アツプによりステツプ141がYESとなれば、
“MX・反転方向駆動”142により今までと反対
に、X2方向の移動とし、“A/D出力変化あ
り?”142がYESとなるとステツプ132へ
移行する。
However, while step 131 is NO, CPU3
The timer configured in step 1 monitors the predetermined time "t 1 elapsed?" 141, and if this is NO, steps 123 and subsequent steps are repeated, but if the timer times up and step 141 becomes YES,
`` MX /reverse direction drive'' 142 causes movement in the X 2 direction, opposite to the previous one, and when ``A/D output change?'' 142 becomes YES, the process moves to step 132.

また、ステツプ143がNOの間は、同様のタ
イマーにより“t2経過?”151を監視し、NO
であればステツプ123以降を反復するが、ステ
ツプ151がタイムアツプによりYESとなれば、
“MY・反転方向駆動”152によりヘツドを今ま
でと反対のY1方向へ移動させ、ステツプ123
以降を反復する。
Also, while step 143 is NO, a similar timer monitors "t 2 elapsed?" 151, and NO
If so, step 123 and subsequent steps are repeated, but if step 151 becomes YES due to time-up,
The head is moved in the Y1 direction opposite to the previous one by "M Y /reverse direction drive" 152, and step 123
Repeat the following.

したがつて、ヘツドををステツプ111および
122によりX1およびY2方向へ移動させても、
テープ21が存在しなければ、ステツプ142,
152によりX2およびY2方向への移動に転じ、
テープ21の探索が行なわれる。
Therefore, even if the head is moved in the X1 and Y2 directions by steps 111 and 122,
If tape 21 is not present, steps 142,
152, it changes to the movement in the X 2 and Y 2 directions,
A search for tape 21 is performed.

テープ21の一側辺25が検出され、ステツプ
132〜134が実行された後は、光スポツト8
がテープ21を横断し他側辺26へ達すると、
“A/D出力変化あり?”161がYESとなり、
このときの座標点を“X・Y→バツフアメモリ”
162によりRAM33のバツフアエリアへ格納
し、“Wカウント停止”163を行なつてから、
Wカウンタのカウント値に基づき“W/2演算”
164および“中心座標点演算”165を行な
い、これによつて求めた中心位置の座標点を“中
心X・Y→RAM”166により、RAM33の
アドレスカウンタによつて指定されたアドレスへ
格納し、“Wカウンタ・クリア”167を行なつ
た後、“A/D出力なし?”191がNOの間は
ステツプ121以降を反復する。
After one side 25 of the tape 21 is detected and steps 132 to 134 are executed, the light spot 8
crosses the tape 21 and reaches the other side 26,
“A/D output change?” 161 becomes YES,
The coordinate point at this time is “X・Y→Buffer memory”
After storing it in the buffer area of RAM 33 by 162 and performing "W count stop" 163,
“W/2 calculation” based on the count value of the W counter
164 and "center coordinate point calculation" 165 are performed, and the coordinate point of the center position obtained thereby is stored in the address specified by the address counter of the RAM 33 by "center X/Y → RAM" 166, After performing "W counter clear" 167, steps 121 and subsequent steps are repeated while "No A/D output?" 191 is NO.

ただし、ステツプ161のNOに対し、上述と
同様に“t3経過?”171〜“A/D出力変化あ
り?”173、“t4経過?”181、MY・反転方
向駆動”182の各ステツプが設けてあり、テー
プ21の横断方向誤りの修正を行なうものとなつ
ている。
However, in response to NO in step 161, each of "t 3 elapsed?" 171 to "A/D output change?" 173, "t 4 elapsed?" 181, and M Y /reverse direction drive" 182 is answered in the same manner as described above. Steps are provided to correct transverse errors in the tape 21.

このため、第3図のとおり、“MY・反転方向駆
動”122,152,182および“MX・反転
方向駆動”142,172により、各々直前の状
態と反対方向の走査がなされ、テープ21に対す
る反復走査が行なわれ、一側辺25および他側辺
26による“A/D出力変化あり?”131,1
43,161,173がYESとなる状態を反復
する方向へヘツドが移動し、ステツプ121によ
るアドレス指定の歩進にしたがいステツプ166
により中心22と一致する中心位置の各座標点
X・YがRAM33へ逐次格納される。
Therefore, as shown in FIG. 3, the "M Y /reverse direction drive" 122, 152, 182 and the " M 131, 1 "A/D output change?" 131, 1
The head moves in a direction in which the states 43, 161, and 173 become YES repeatedly, and in accordance with the progress of address specification in step 121, the head moves in step 166.
Accordingly, each coordinate point X and Y of the center position that coincides with the center 22 is sequentially stored in the RAM 33.

また、テープ21の走査を完了し、光スポツト
8が被加工物4から逸脱すれば、ステツプ191
がYESとなり、タイマーによる“t5経過?”19
2がYESとなるのに応じ、“MX,MY,MZ停止”
193を行ない、自動テイーチングを終了する。
Further, when the scanning of the tape 21 is completed and the optical spot 8 deviates from the workpiece 4, the process proceeds to step 191.
becomes YES, and the timer says “t 5 elapsed?”19
2 becomes YES, “M X , M Y , M Z stop”
193 to end automatic teaching.

したがつて、テープ21を加工線上へ貼着する
のみにより、加工線の各座標点がRAM33へ格
納され、加工開始の指令に応じてCPU31が
RAM33の各座標点を逐次読み出し、これにし
たがつたMX54、MY55の駆動を行なうものと
なり、加工線に沿つたレーザビーム3による加工
が自動的に行なわれるため、テイーチングの容易
化および高速化ならびに高精度化が実現する。
Therefore, by simply pasting the tape 21 onto the machining line, each coordinate point of the machining line is stored in the RAM 33, and the CPU 31 is activated in response to a command to start machining.
Each coordinate point of the RAM 33 is read out sequentially, and the M This results in faster speed and higher precision.

ただし、光源6を複数とし、レーザビーム3の
近傍周囲へ互に対称な位置として光スポツト8を
投射すると共に、これらの反射光をPSD12に
より一括受光し、各光スポツト8による平均位置
に基づいて対向距離lを測定してもよく、光源6
としては、ランプ、発光ダイオード等の発光素子
を用いても同様であり、光源の種別にしたがい、
これらの発光波長を通過させ、かつ、レーザビー
ム3および加工点の発熱による発光波長を阻止す
る光学フイルタを撮像レンズ11側へ設ければよ
い。
However, a plurality of light sources 6 are used, and the light spots 8 are projected at mutually symmetrical positions near the laser beam 3, and these reflected lights are collectively received by the PSD 12, and based on the average position of each light spot 8. The facing distance l may be measured, and the light source 6
The same applies to the use of light-emitting elements such as lamps and light-emitting diodes, and according to the type of light source,
An optical filter may be provided on the imaging lens 11 side to allow these emission wavelengths to pass and to block emission wavelengths caused by the laser beam 3 and heat generated at the processing point.

また、SPDを用いる代りに、フオトダイオー
ドアレイ等を用いてもよく、これに応じて抵抗器
R乃至A/D43の回路を選定すれば同様であ
り、CPU31を用いず、各種の論理回路および
演算回路の組み合せを用いてもよい等、第4図の
構成は選定が任意であると共に、第1図において
は、状況によりステツプを入替え、または、同等
の他のものと置換し、あるいは、不要のものを省
略してもよく、条件により走査軌跡24を正弦波
状、矩形波状とし、あるいは、テープ21の曲折
に応じて走査周期を短縮してもよい。
Furthermore, instead of using the SPD, a photodiode array or the like may be used, and the same effect can be obtained by selecting the circuits of the resistor R to A/D43 accordingly. Instead of using the CPU 31, various logic circuits and calculation The configuration in Figure 4 can be selected arbitrarily, such as using a combination of circuits, and in Figure 1, steps may be replaced or replaced with equivalent ones, or unnecessary steps may be replaced depending on the situation. Depending on the conditions, the scanning trajectory 24 may be made sinusoidal or rectangular, or the scanning period may be shortened depending on the bending of the tape 21.

なお、テープ21を貼着する代りに、加工面と
異なる光線反射率の塗料等によりマーキングを施
しても同様であり、マーキングの色彩が加工面と
異なれば、光線反射率がほぼ同等であつても、光
学フイルタにより判別を可能とすれよい等、本発
明は種々の変形が自在である。
Incidentally, instead of pasting the tape 21, the same effect can be applied by marking with paint or the like having a light reflectance different from that of the processed surface.If the color of the marking is different from that of the processed surface, the light reflectance is almost the same. However, the present invention can be modified in various ways, such as making it possible to discriminate using an optical filter.

〔発明の効果〕〔Effect of the invention〕

以上に説明により明らかなとおり、本発明によ
れば、加工線のテイーチングが容易かつ高速にな
ると共に高精度となり、自動加工を行なうレーザ
加工機において顕著な効果が得られる。
As is clear from the above description, according to the present invention, teaching of a processing line becomes easy and fast, and high accuracy is achieved, and a remarkable effect can be obtained in a laser processing machine that performs automatic processing.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の実施例を示し、第1図は制御状況
のフローチヤート、第2図はヘツドの断面図、第
3図はマーキングの検出状況を示す平面図、第4
図は反射光の変化状況を示す波形図、第5図は制
御部のブロツク図である。 1…外筒、2…加工レンズ、3…レーザビー
ム、4…被加工物、6…光源、7…投光レンズ、
8…光スポツト、11…撮像レンズ、12…
PSD(受光素子)、21…テープ(マーキング)、
22…中心、23…基準点、24…走査軌跡、2
5…一側辺、26…他側辺、31…CPU(プロセ
ツサ)、32…ROM(固定メモリ)、33…RAM
(可変メモリ)、44…操作箱、54…MX(X軸用
のモータ)、55…MY(Y軸用モータ)、56…
MZ(Z軸用モータ)。
The figures show an embodiment of the present invention, and FIG. 1 is a flowchart of the control situation, FIG. 2 is a sectional view of the head, FIG. 3 is a plan view showing the marking detection situation, and FIG.
The figure is a waveform diagram showing changes in reflected light, and FIG. 5 is a block diagram of the control section. DESCRIPTION OF SYMBOLS 1...Outer cylinder, 2...Processing lens, 3...Laser beam, 4...Workpiece, 6...Light source, 7...Light projection lens,
8...Light spot, 11...Imaging lens, 12...
PSD (light receiving element), 21...tape (marking),
22...Center, 23...Reference point, 24...Scanning trajectory, 2
5...One side, 26...Other side, 31...CPU (processor), 32...ROM (fixed memory), 33...RAM
(variable memory), 44...operation box, 54...M X (X-axis motor), 55...M Y (Y-axis motor), 56...
M Z (Z-axis motor).

Claims (1)

【特許請求の範囲】[Claims] 1 テイーチングされた曲線状の加工線に沿つて
加工を施し、かつ、光源より被加工物へ投射され
た光スポツトを撮像してレーザビームを投射する
ヘツドと前記被加工物との対向距離を測定するレ
ーザ加工機において、前記被加工物の加工面上へ
光線反射率が加工面と異なるマーキングを加工線
の中心に沿つて施し、前記光スポツトによる反射
光の変化をPSD素子により検出し、前記ヘツド
を前記反射光の変化が反復する方向に沿つて移動
させ、前記マーキングによる反射光の変化が生ず
る中心位置の座標点を求め、該座標点を逐次メモ
リへ格納することを特徴とするレーザ加工機の自
動テイーチング方法。
1 Perform processing along the taught curved processing line, and measure the facing distance between the head that projects the laser beam and the workpiece by imaging the light spot projected onto the workpiece from the light source. In the laser processing machine, a marking having a light reflectance different from that of the processing surface is applied to the processing surface of the workpiece along the center of the processing line, a change in reflected light due to the light spot is detected by a PSD element, Laser processing characterized in that the head is moved along a direction in which the change in the reflected light repeats, a coordinate point of a central position where the change in the reflected light due to the marking occurs is found, and the coordinate point is sequentially stored in a memory. Automatic teaching method of the machine.
JP59227224A 1984-10-29 1984-10-29 Automatic teaching system of laser beam machine Granted JPS61108485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227224A JPS61108485A (en) 1984-10-29 1984-10-29 Automatic teaching system of laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227224A JPS61108485A (en) 1984-10-29 1984-10-29 Automatic teaching system of laser beam machine

Publications (2)

Publication Number Publication Date
JPS61108485A JPS61108485A (en) 1986-05-27
JPH033550B2 true JPH033550B2 (en) 1991-01-18

Family

ID=16857441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227224A Granted JPS61108485A (en) 1984-10-29 1984-10-29 Automatic teaching system of laser beam machine

Country Status (1)

Country Link
JP (1) JPS61108485A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906418A (en) * 1987-10-23 1990-03-06 Toyoda-Koki Kabushiki-Kaisha Method for teaching a machining line
JPH01141303A (en) * 1987-11-27 1989-06-02 Ishikawajima Harima Heavy Ind Co Ltd Teaching sensor for 3D machining
JP7288786B2 (en) * 2019-03-29 2023-06-08 株式会社総合車両製作所 LASER WELDING METHOD AND LASER WELDING APPARATUS

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209481A (en) * 1982-05-28 1983-12-06 Hitachi Zosen Corp Tracing control method

Also Published As

Publication number Publication date
JPS61108485A (en) 1986-05-27

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