JPH0338729B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention elastically holds chip components such as chip capacitors and chip resistors by pushing them into chip component storage holes formed in an elastic body constituting a chip component holding plate. The present invention relates to a method for holding chip components on the chip component holding plate.

Since chip parts such as chip capacitors and chip resistors are very small, it is extremely difficult to process them one by one in, for example, an electrode application process. Therefore, a chip component holding plate as shown in FIGS. 1 and 2 has been proposed, and a plurality of chip components can be processed simultaneously. In other words, 1 is a hard substrate made of metal such as aluminum, resin, etc., and a flat plate part 4 with a plurality of through holes 3 is integrally formed inside a frame part 2. An elastic body 5 such as silicone rubber is provided on both sides through a through hole 3, and this elastic body 5
A chip component storage hole 6 is formed in the through hole 3 portion.

In the chip component holding plate constructed in this way, the chip component is pushed into the chip component storage hole 6 by the means shown in FIGS. 3 and 4, and the chip component is held by the elastic force of the elastic body 5. It is something to keep. That is, a guide plate 9 having a plurality of through holes 8 formed in the same arrangement as the chip component storage holes 6 is placed on the upper surface of the chip component holding plate 7 having the above structure, and the guide plate 9 is inserted into the through holes 8 of the guide plate 9. Place the chip part 10 into the press pin 1
1 to push the chip component 10 downward into the storage hole 6, and elastically hold the chip component 10 in a state in which the lower side of the chip component 10 protrudes toward the lower surface of the holding plate 7. In order to apply, for example, an electrode to the chip component held in this way, as shown in FIG.
Press the holding plate 7 on top.

The conventional chip component holding plate with the above structure is
In this way, the chip component is pushed into the storage hole from the upper surface side where the guide plate is arranged and held in such a state that it protrudes from the lower surface side, and is used in various processes such as the electrode application process, so it can be used in various ways. I have a problem. In other words, since there are unavoidable variations in the length of the chip components, the dimensions of the part protruding from the bottom of the holding plate will vary accordingly, and for example, when applying electrodes, variations will occur in the state of attachment of the electrodes. become. Additionally, if the press pin shifts and hits the inner wall of the storage hole when pushing the chip component into the storage hole of the holding plate, the inner wall of the storage hole will be damaged due to the large pressing force, and the subsequent chip component It becomes difficult to push in. In addition, debris generated on the inner wall of the storage hole gets mixed into the electrode paste, etc., and has an adverse effect on electronic components. Furthermore, since the chip component is moved within the storage hole while being elastically pressed, a large pressing force is required, which increases the size of the device for driving the press pin. Furthermore, since the chip components are pushed in with a large pressing force, the elastic body stretches and unevenness is created on the lower surface of the elastic body from which the chip components protrude, thereby causing variations in the protruding state of the chip components.

The present invention has been made in view of these points, and provides a chip component in a chip component holding plate that allows the chip component holding plate to hold the chip component with high precision and also extends the life of the holding plate. The purpose is to provide a method for retaining.

To this end, the present invention is characterized in that the structure of the guide plate is improved and the chip components are held in such a manner that they protrude from the upper surface of the holding plate.

An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 6, reference numeral 21 denotes a chip component holding plate, which has the same structure as the conventional one, in which a chip component storage hole 23 is formed in an elastic body 22 made of silicone rubber or the like. The shape of this chip component storage hole 23 may be any shape such as circular or square, but it is usually formed into a circular shape with a smaller diameter than the chip component. Reference numeral 24 denotes a guide plate, which has a plurality of through holes 25 formed in the same arrangement as the storage holes 23 of the chip component holding plate 21, and a concave portion 26 shaped like a cone around the through holes on the upper surface side. There is. Further, a recess 27 is formed on the lower surface side of the guide plate 24 over substantially the entire area.
Note that the diameter of the through hole 25 of this guide plate is
It is larger than the diameter of the storage hole 23 of the holding plate 21. Such a guide plate 24,
The respective holes are arranged on the upper surface of the chip component holding plate 21 so as to communicate with each other. Then, the chip parts 28 are inserted into the respective through holes 25 of the guide plate 24 arranged on the holding plate 21 in this manner. In this case, guide plate 2
When a plurality of chip parts are placed on the upper surface of the chip 4 and are rocked back and forth, the chip parts will naturally be inserted into the through hole 25 because the upper part of the through hole 25 is in the shape of a dovetail. Then, as shown in FIG. 7, the chip component 28 is pressed downward with the press pin 29, so that the upper side is exposed in the recess 27 on the lower surface side of the guide plate 24, and only the lower side is stored in the holding plate 21. so that it is pushed into the hole 23. Finally, the guide plate 24 is removed from the holding plate 21. At this time, since a recess 27 is formed on the lower surface side of the guide plate 24 over almost the entire area, the guide plate 24
The chip parts are held in a state where they are accurately pressed into the holding plate 21 without tilting the chip parts. In this way, the holding plate 2
In order to apply electrodes to the chip part 28 which is elastically held at the tip part 1, the holding plate 21 may be rotated by 180 DEG and by conventional means as shown in FIG.

Since the method for holding chip components on the chip component holding plate of the present invention is configured as explained above, even if there is variation in the length of the chip components, the variation in the protrusion dimension of the chip components from the holding plate will be reduced. , which is determined only by the variation in the length of the press pins, so by setting the lengths of the press pins with high precision, the variation in the protrusion dimensions of the chip parts can be reduced to virtually zero. Can be done. Further, since the press pin is not directly inserted into the storage hole of the elastic body, the inner wall of the storage hole is not damaged, and the life of the holding plate can be significantly extended. Furthermore,
Since only the lower part of the chip component is pushed into the storage hole, a large pressing force is not required as in the conventional case, and as a result, the press pin drive device can be downsized. In addition, since a large pressing force is not required and only the lower side of the chip component is pushed into the storage hole, unevenness does not occur on the elastic body surface due to the stretching of the elastic body, and furthermore, no recesses are formed on the lower surface side. Even if the upper side of the chip part protrudes from the holding plate, when the guide plate is removed from the holding plate, the guide plate will not touch the chip part and cause the chip part to tilt. It can be held without tilting. Also,
When holding a chip part on a holding plate, even if the elastic body is pressed by the chip part and bulges out to the top of the holding plate, it can be released by the recess, so it always It is capable of holding chip parts with high precision and stability.
Furthermore, the holding plate is mainly composed of an elastic body made of resin, and when used in a place where there are large environmental temperature changes such as in the electrode application process, the elastic body may expand. A recess is formed in almost the entire area of the lower surface, and this recess can absorb the expansion of the elastic body caused by temperature changes, allowing the chip component to be inserted into the holding plate accurately.

[Brief explanation of the drawing]

Figure 1 is an inclined cutaway view of the main part of a conventional chip component holding plate, Figure 2 is a vertical sectional view of the main part, and Figure 3 is a longitudinal sectional view of the main part.
4 and 4 are vertical cross-sectional partial views of a chip component holding plate and a guide plate for explaining the conventional method of holding chip components on a chip component holding plate, and FIG. 6 and 7 are longitudinal sectional views of a chip component holding plate and a guide plate, and a longitudinal sectional view of the guide plate, respectively, for explaining an embodiment of the present invention. It is a diagram. 21... Chip component holding plate, 22... Elastic body, 23... Chip component storage hole, 24... Guide plate, 25... Through hole, 26, 27... Recess, 28... Chip component, 29... Press pin.

Claims (1)

[Scope of Claims] 1. A chip component holding plate that pushes a chip component into a plurality of chip component storage holes formed in an elastic body and elastically holds the chip component within the storage hole. (a) A plurality of through holes are formed in the same arrangement as storage holes of a holding plate of a chip component, and a concave portion in the shape of a pin is formed on the upper surface side of each of the through holes. (b) arranging a guide plate on the chip component holding plate, the guide plate having a recess formed over substantially the entire area on the lower surface side of the guide plate so that the end thereof does not come into contact with the chip component holding plate; Step of inserting the chip component into the through hole of the guide plate from the top side; (c) Pressing the chip component inserted into the through hole of the guide plate downward with a press pin, and inserting the top side of the chip component into the guide plate. A method for holding a chip component in a chip component holding plate, comprising the step of pushing only the lower side into a storage hole of the chip component holding plate so that it is exposed in the recess position on the bottom surface side.