JPH0351246B2 - - Google Patents
Info
- Publication number
- JPH0351246B2 JPH0351246B2 JP27505485A JP27505485A JPH0351246B2 JP H0351246 B2 JPH0351246 B2 JP H0351246B2 JP 27505485 A JP27505485 A JP 27505485A JP 27505485 A JP27505485 A JP 27505485A JP H0351246 B2 JPH0351246 B2 JP H0351246B2
- Authority
- JP
- Japan
- Prior art keywords
- membered heterocyclic
- oxidizing agent
- heterocyclic compound
- base material
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は異方導電性表面を形成する方法に関す
る。さらに詳しくは基材表面に複素５員環式化合
物重合体を生成させて異方導電性を有する表面を
形成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of forming an anisotropically conductive surface. More specifically, the present invention relates to a method of forming a surface having anisotropic conductivity by forming a five-membered heterocyclic compound polymer on the surface of a substrate.
複素５員環式化合物の重合体は比較的安定な導
電性高分子であつて、電池材料、センサー材料、
オプトエレクトロニクス材料、エレクトロニクス
デバイスなどの種々の機能素子などに利用できる
有機導電性材料として最近注目されている。これ
らの複素５員環式化合物重合体を用いてフイルム
表面に異方導電性を持たせる方法として、電気化
学的重合法を利用して絶縁高分子フイルム中にポ
リピロールをパターン状に形成する方法が提示さ
れている。〔Hikita et al.、Japan J.Appl.Phys.
Lett.24 L79（1985）〕。しかしながら、この方法
では、特殊な電極を必要とし、可溶性の高分子膜
上にしか形成できず、しかも膜厚が数ミクロンの
ものしか得られない。
Polymers of five-membered heterocyclic compounds are relatively stable conductive polymers, and are useful as battery materials, sensor materials,
Recently, it has attracted attention as an organic conductive material that can be used for various functional elements such as optoelectronic materials and electronic devices. As a method of imparting anisotropic conductivity to the film surface using these five-membered heterocyclic compound polymers, there is a method of forming polypyrrole in a pattern in an insulating polymer film using an electrochemical polymerization method. It is presented. [Hikita et al., Japan J.Appl.Phys.
Lett. 24 L79 (1985)]. However, this method requires a special electrode, can only be formed on a soluble polymer film, and can only obtain a film thickness of several microns.
本発明の目的は、叙上の観点にたつて、簡便に
基材上に異方導電性表面を形成する方法を提供す
ることにある。
In view of the above, an object of the present invention is to provide a method for easily forming an anisotropically conductive surface on a substrate.
本発明者らは上記問題点を解決するために鋭意
検討し、本発明を完成した。
The present inventors conducted extensive studies to solve the above problems and completed the present invention.
すなわち本発明は
表面に一方向に平行線状のみぞが刻まれた基材
を用い、そのみぞ中に液状または溶剤に溶解した
酸化剤を流延した後、複素５員環式化合物と接触
させて基材表面に平行線状に複素５員環式化合物
重合体を生成させることを特徴とする異方導電性
表面の形成方法である。 That is, the present invention uses a base material with parallel linear grooves carved in one direction on its surface, and after casting an oxidizing agent in liquid form or dissolved in a solvent into the grooves, it is brought into contact with a five-membered heterocyclic compound. This is a method for forming an anisotropically conductive surface, which is characterized in that a five-membered heterocyclic compound polymer is formed in parallel lines on the surface of a substrate.
本発明の方法において使用される基材の材質と
しては特に制限はなく、半導体から絶縁体まで、
ほとんどの材料が使用でき、またその形状として
は薄膜、厚膜をはじめ任意の形状の成形体を用い
ることができる。 The material of the base material used in the method of the present invention is not particularly limited, and may include anything from semiconductors to insulators.
Most materials can be used, and molded bodies of any shape, including thin films and thick films, can be used.
本発明の方法においてはこれらの基材の表面に
あらかじめ一方向に平行線状にみぞを加工形成し
ておくことが必要であるが、みぞを形成する方法
は、通常の加工技術を用いて行なえば良く、その
方法については特に制限はない。またここで平行
線状とは、互いにまじわらないという意味であつ
て、幾何学的に正確に平行である必要はない。 In the method of the present invention, it is necessary to process and form grooves in parallel lines in one direction on the surface of these base materials in advance, but the method for forming the grooves can be carried out using ordinary processing techniques. There are no particular restrictions on the method. Moreover, the term "parallel lines" as used herein means that they do not mix with each other, and it is not necessary for them to be geometrically exactly parallel.
本発明の方法において酸化剤としては無機酸、
金属の化合物、あるいは無機や有機の酸化物、過
酸化物などが用いられる。具体的には例えば塩
酸、硫酸、硝酸、クロルスルホン酸などの無機酸
類、チタン、ジルコニウム、クロム、モリブデ
ン、タングステン、マンガン、鉄、ルテニウム、
パラジウム、白金、銅、アルミニウム、スズなど
の金属のハロゲン化物、あるいはそれらの金属の
無機酸塩類が挙げられ、殊にこれらの金属の化合
物でもルイス酸として知られている化合物が好適
な酸化剤として挙げられ、さらにはそれらの金属
のアセチルアセトナートなどの配位化合物も挙げ
られる。さらにはまたペルオキソ二硫酸や過炭酸
などの過酸の塩類や、ベンゾキノンや有機過酸化
物も挙げられる。これらの酸化剤は単独でも、ま
た２種以上の混合としても用いることができる。 In the method of the present invention, the oxidizing agent is an inorganic acid,
Metal compounds, inorganic or organic oxides, peroxides, etc. are used. Specifically, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, chlorosulfonic acid, titanium, zirconium, chromium, molybdenum, tungsten, manganese, iron, ruthenium,
Suitable oxidizing agents include halides of metals such as palladium, platinum, copper, aluminum, and tin, or inorganic acid salts of these metals, and compounds of these metals known as Lewis acids are particularly suitable. Furthermore, coordination compounds such as acetylacetonates of these metals are also mentioned. Further examples include salts of peracids such as peroxodisulfuric acid and percarbonic acid, benzoquinone and organic peroxides. These oxidizing agents can be used alone or in combination of two or more.
また本発明の方法において酸化剤は液状で使用
することが必要であつて、液体の酸化剤を使用す
るか、あるいは酸化剤を溶剤に溶解して使用す
る。使用する溶剤としては酸化剤を溶解するもの
であれば特に制限はなく、例えばアルコール類、
ハロゲン化炭化水素類、芳香族炭化水素類、ニト
ロ化炭化水素類、エーテル類、ニトリル類、水な
どが挙げられる。またこの時に溶剤中に種々のポ
リマーやオリゴマーをバインダーとして加えてお
くこともできる。 Further, in the method of the present invention, it is necessary to use the oxidizing agent in a liquid state, and the oxidizing agent is used either in liquid form or dissolved in a solvent. There are no particular restrictions on the solvent used as long as it dissolves the oxidizing agent, such as alcohols,
Examples include halogenated hydrocarbons, aromatic hydrocarbons, nitrated hydrocarbons, ethers, nitriles, and water. Further, at this time, various polymers and oligomers can be added to the solvent as binders.
本発明の方法で使用される複素５員環式化合物
とは４個の炭素原子と１個のヘテロ原子を有する
不飽和５員環を基本骨格とする化合物であつて、
たとえばピロール、チオフエン、フラン、セレノ
フエン、テルロフエンおよびそれらの誘導体であ
る。これらの化合物は単独でも、また２種以上を
用いることもできる。 The 5-membered heterocyclic compound used in the method of the present invention is a compound whose basic skeleton is an unsaturated 5-membered ring having 4 carbon atoms and 1 heteroatom,
Examples are pyrrole, thiophene, furan, selenophene, tellurofene and their derivatives. These compounds can be used alone or in combination of two or more.
本発明における重合方法はまず上記基材の平行
線状のみぞに液状または溶剤に溶解した酸化剤を
流延する。流延方法には特別な制限はなく、一般
の方法が用いられる。例えば基材の表面に液状の
酸化剤を全面に流延したのち、余分の酸化剤をぬ
ぐいさるなどの方法が用いられる。 In the polymerization method of the present invention, first, an oxidizing agent in liquid form or dissolved in a solvent is cast into the parallel linear grooves of the base material. There are no special restrictions on the casting method, and a general method can be used. For example, a method is used in which a liquid oxidizing agent is spread over the entire surface of the base material, and then the excess oxidizing agent is wiped off.
ついで複素５員環式化合物と接触させる。この
接触方法としては基材及び酸化剤を溶解しない溶
媒中に複素５員環式化合物を溶解し、その中に上
記基材を浸す方法や、あるいは複素５員環式化合
物の蒸気中に上記基材をさらす方法などが用いら
れ、特に基材と複素５員環式化合物の蒸気を接触
させる方法が好適である。 It is then brought into contact with a 5-membered heterocyclic compound. This contact method includes dissolving the five-membered heterocyclic compound in a solvent that does not dissolve the base material and the oxidizing agent, and immersing the base material therein, or immersing the five-membered heterocyclic compound in vapor. A method of exposing the material is used, and a method of bringing the base material into contact with the vapor of the five-membered heterocyclic compound is particularly preferred.
かくして基材表面に平行線状に複素５員環式化
合物を生成させることができ、異方性導電性表面
を形成することができる。 In this way, a five-membered heterocyclic compound can be formed in parallel lines on the surface of the base material, and an anisotropic conductive surface can be formed.
以下実施例により本発明をさらに詳細に説明す
る。
The present invention will be explained in more detail with reference to Examples below.
実施例 １
ポリメチルメタクリル酸の板（２cm×５cm、厚
さ２mm）の表面に巾100ミクロン、深さ50ミクロ
ンのみぞを100ミクロン間隔で平行に刻んだ。塩
化鉄（）・６水和物１ｇをメタノール50mlに溶
解した溶液を酸化剤として用い、上記板上に流延
したのち余分の酸化剤をふき取つた。この板をデ
シケータ中に入れ、ピロールで飽和した窒素ガス
を流通させたところポリビニールがパターン状に
重合しており、みぞ方向の表面抵抗は900Ωであ
り、みぞに垂直方向の表面抵抗は20MΩ以上であ
つた。Example 1 Grooves 100 microns wide and 50 microns deep were cut in parallel on the surface of a polymethyl methacrylic acid plate (2 cm x 5 cm, 2 mm thick) at 100 micron intervals. A solution of 1 g of iron chloride hexahydrate dissolved in 50 ml of methanol was used as an oxidizing agent, and after casting on the plate, excess oxidizing agent was wiped off. When this board was placed in a desiccator and nitrogen gas saturated with pyrrole was passed through it, the polyvinyl was polymerized in a pattern, and the surface resistance in the groove direction was 900Ω, and the surface resistance in the direction perpendicular to the grooves was over 20MΩ. It was hot.
実施例 ２
ガラス板（２cm×５cm、厚さ0.5mm）表面に巾
50ミクロン、深さ20ミクロンのみぞを100ミクロ
ン間隔で平行にエツチングした。酸化剤溶液とし
て無水塩化鉄（）を飽和したニトロメタン溶液
を使用して上記ガラス板上に流延したのち余分の
酸化剤をふき取つた。このガラス板をデシケータ
中に入れ、チオフエンで飽和した窒素ガスを流通
させたところポリチオフエンがパターン状に重合
しており、みぞ方向の表面抵抗は460Ωであり、
みぞに垂直方向の表面抵抗は20MΩ以上であつ
た。Example 2 Width on the surface of a glass plate (2 cm x 5 cm, thickness 0.5 mm)
Grooves of 50 microns and 20 microns deep were etched in parallel at 100 micron intervals. A nitromethane solution saturated with anhydrous iron chloride (2) was used as the oxidizing agent solution, and after casting on the glass plate, excess oxidizing agent was wiped off. When this glass plate was placed in a desiccator and nitrogen gas saturated with thiophene was passed through it, polythiophene was polymerized in a pattern, and the surface resistance in the groove direction was 460Ω.
The surface resistance in the direction perpendicular to the groove was more than 20 MΩ.
実施例 ３、４
実施例２において、チオフエンの代りにフラン
及びセレノフエンを用いた以外は実施例２と同様
に行なつたところそれぞれポリフラン、ポリセレ
ノフエンがパターン状に重合した。みぞ方向の表
面抵抗はそれぞれ9MΩ、350KΩであり、みぞに
垂直方向の表面抵抗はどちらも20MΩ以上であつ
た。Examples 3 and 4 Example 2 was carried out in the same manner as in Example 2, except that furan and selenophene were used instead of thiophene. Polyfuran and polyselenophene were polymerized in a pattern, respectively. The surface resistances in the groove direction were 9MΩ and 350KΩ, respectively, and the surface resistances in the direction perpendicular to the grooves were both 20MΩ or more.
本発明の方法によれば種々の基材の上に容易に
かつ工業的に有利に異方導電性表面を形成させる
ことができる。
According to the method of the present invention, anisotropically conductive surfaces can be easily and industrially advantageously formed on various substrates.
Claims (1)
材を用い、そのみぞ中に液状または溶剤に溶解し
た酸化剤を流延した後、複素５員環式化合物と接
触させて基材表面に平行線状に複素５員環式化合
物重合体を生成させることを特徴とする異方導電
性表面の形成方法。1 Using a base material with parallel linear grooves carved in one direction on its surface, after casting an oxidizing agent in liquid form or dissolved in a solvent into the grooves, the base material is brought into contact with a five-membered heterocyclic compound. 1. A method for forming an anisotropically conductive surface, the method comprising forming a five-membered heterocyclic compound polymer in parallel lines on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27505485A JPS62136708A (en) | 1985-12-09 | 1985-12-09 | Manufacture of anisotropic conductive surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27505485A JPS62136708A (en) | 1985-12-09 | 1985-12-09 | Manufacture of anisotropic conductive surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136708A JPS62136708A (en) | 1987-06-19 |
| JPH0351246B2 true JPH0351246B2 (en) | 1991-08-06 |
Family
ID=17550200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27505485A Granted JPS62136708A (en) | 1985-12-09 | 1985-12-09 | Manufacture of anisotropic conductive surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62136708A (en) |
-
1985
- 1985-12-09 JP JP27505485A patent/JPS62136708A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62136708A (en) | 1987-06-19 |
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