JPH0351248B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of forming a conductive pattern on the surface of a substrate. More specifically, the present invention relates to a method of forming a conductive pattern by forming a five-membered heterocyclic compound polymer in a pattern on the surface of a substrate.

[Conventional technology]

Polymers of five-membered heterocyclic compounds are relatively stable conductive polymers, and are useful as battery materials, sensor materials,
Recently, it has attracted attention as an organic conductive material that can be used for various functional elements such as optoelectronic materials and electronic devices. When used in these functional devices, if these five-membered heterocyclic compound polymers are formed into a device pattern, the range of applications will be extremely wide. As such a method, a method has been proposed in which polypyrrole is formed in a pattern in an insulating polymer film using an electrochemical method. [Hikita et al., Japan J.
Appl. Phys. Lett. 24 L79 (1985)]. however,
This method requires special electrodes, can only be formed on soluble polymer films, and can only obtain films with a thickness of several microns.

[Problem that the invention seeks to solve]

In view of the above, an object of the present invention is to provide a method for easily forming a conductive pattern on a base material.

[Means for solving problems]

The present inventors have made extensive studies to solve the above problems and have completed the present invention.

That is, the present invention uses a base material having grooves formed in a pattern on its surface, and after casting an oxidizing agent in liquid form or dissolved in a solvent into the grooves, the base material is brought into contact with a five-membered heterocyclic compound. This is a method for forming a conductive pattern, which is characterized by forming a 5-membered heterocyclic compound polymer in a pattern on the surface.

The material of the base material used in the method of the present invention is not particularly limited, and may include anything from semiconductors to insulators.
Most materials can be used, and molded bodies of any shape, including thin films and thick films, can be used.

In the method of the present invention, it is necessary to process and form grooves in a pattern on the surface of these base materials in advance, but the grooves can be formed using ordinary processing techniques; There are no particular restrictions on the method.

In the method of the present invention, the oxidizing agent is an inorganic acid,
Metal compounds, inorganic or organic oxides, peroxides, etc. are used. Specifically, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, chlorosulfonic acid, titanium, zirconium, chromium, molybdenum, tungsten, manganese, iron, ruthenium,
Suitable oxidizing agents include halides of metals such as palladium, platinum, copper, aluminum, and tin, or inorganic acid salts of these metals, and compounds of these metals known as Lewis acids are particularly suitable. Also included are coordination compounds such as acetylacetonates of these metals. Further examples include salts of peracids such as peroxodisulfuric acid and percarbonic acid, benzoquinone and organic peroxides. These oxidizing agents can be used alone or as a mixture of two or more.

Further, in the method of the present invention, it is necessary to use the oxidizing agent in a liquid state, and the oxidizing agent is used either in liquid form or dissolved in a solvent. There are no particular restrictions on the solvent used as long as it dissolves the oxidizing agent, such as alcohols,
Examples include halogenated hydrocarbons, aromatic hydrocarbons, nitrated hydrocarbons, ethers, nitriles, and water. Further, at this time, various polymers and oligomers can be added to the solvent as binders.

The 5-membered heterocyclic compound used in the method of the present invention is a compound whose basic skeleton is an unsaturated 5-membered ring having 4 carbon atoms and 1 heteroatom,
Examples are pyrrole, thiophene, furan, selenophene, tellurofene and their derivatives. These compounds can be used alone or in combination of two or more.

In the polymerization method of the present invention, first, an oxidizing agent in liquid form or dissolved in a solvent is cast into grooves formed in a pattern. There are no special restrictions on the casting method, and a general method can be used. For example, a method is used in which a liquid oxidizing agent is spread over the entire surface of the base material, and then the excess oxidizing agent is wiped off.

It is then brought into contact with a 5-membered heterocyclic compound. This contact method includes dissolving the five-membered heterocyclic compound in a solvent that does not dissolve the base material and the oxidizing agent, and immersing the base material therein, or immersing the five-membered heterocyclic compound in vapor. A method of exposing the material is used, and a method of bringing the base material into contact with the vapor of the five-membered heterocyclic compound is particularly preferred.

In this way, a five-membered heterocyclic compound can be formed in a pattern on the surface of the base material, and a conductive pattern can be formed.

〔Example〕

The present invention will be explained in more detail with reference to Examples below.

Example 1 On the surface of a polymethyl methacrylic acid plate (2 cm x 5 cm, thickness 2 mm), a width of 50 microns, a length of 3 mm, and a depth of
The pattern shown in FIG. 1 was formed by cutting grooves of 30 microns at intervals of 100 microns and connecting them.
In the figure, A and B indicate deposited gold, and C indicates a portion removed after forming the conductive pattern. A solution of 1 g of iron chloride hexahydrate dissolved in 50 ml of methanol was used as an oxidizing agent, and after casting on the plate, excess oxidizing agent was wiped off. When this plate was placed in a desiccator and nitrogen gas saturated with pyrrole was passed through it, polypyrrole was polymerized in a pattern according to the pattern shown in Figure 1.
The resistance value between them was 19KΩ, which was more than 20MΩ when section C in the figure was removed.

Example 2 Width on the surface of a glass plate (2 cm x 5 cm, thickness 0.5 mm)
The pattern shown in Figure 1 was etched with grooves of 50 microns and 20 microns deep. A nitromethane solution saturated with anhydrous iron chloride (2) was used as the oxidizing agent solution, and after casting on the glass plate, excess oxidizing agent was wiped off. When this glass plate was placed in a desiccator and nitrogen gas saturated with thiophene was passed through it, polythiophene was polymerized in a pattern, and the resistance value between A and B was 4KΩ.
The resistance value after removing part C was 20 MΩ or more.

Examples 3 and 4 Example 2 was carried out in the same manner as in Example 2, except that furan and selenophene were used instead of thiophene. Polyfuran and polyselenophene were polymerized in a pattern, respectively. The resistance values between A and B were 15 MΩ and 850 KΩ, respectively, and the resistances after removing C were both 20 MΩ or more.

〔Effect of the invention〕

According to the method of the present invention, conductive patterns can be easily and industrially advantageously formed on the surfaces of bases made of various materials.

[Brief explanation of drawings]

FIG. 1 shows an example of the conductive pattern of the present invention.

Claims (1)

[Claims] 1 Using a substrate with patterned grooves formed on its surface, a liquid or solvent-dissolved oxidizing agent is cast into the grooves, and then brought into contact with a five-membered heterocyclic compound to form a pattern on the surface of the substrate. 1. A method for forming a conductive pattern, the method comprising forming a five-membered heterocyclic compound polymer.