JPH0351297B2 - - Google Patents
Info
- Publication number
- JPH0351297B2 JPH0351297B2 JP19816484A JP19816484A JPH0351297B2 JP H0351297 B2 JPH0351297 B2 JP H0351297B2 JP 19816484 A JP19816484 A JP 19816484A JP 19816484 A JP19816484 A JP 19816484A JP H0351297 B2 JPH0351297 B2 JP H0351297B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- electronic component
- electronic components
- present
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品用キヤツプに係り、さらに詳
しくは基板上に電子部品が直接搭載されワイヤー
ボンデイングにより基板回路と前記電子部品が電
気的に接続されており、前記電子部品用キヤツプ
が基板上に載置され、搭載された前記電子部品及
び電気的接続部が密封され、加熱により前記電子
部品用キヤツプと前記基板とが接合一体化されて
成る電子部品用キヤツプに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a cap for electronic components, and more specifically, to a cap for electronic components, and more specifically, a cap for electronic components that is directly mounted on a substrate and that the circuit board and the electronic component are electrically connected by wire bonding. The electronic component cap is placed on a board, the mounted electronic components and electrical connections are sealed, and the electronic component cap and the board are bonded and integrated by heating. Regarding caps for electronic components.
本発明による電子部品用キヤツプはカメラや時
計のチツプオンボードとして用いられるばかりで
なく、チツプキヤリアやピングリツドアレーなど
のパツケージの封止用として用いられるものであ
る。 The electronic component cap according to the present invention is used not only as a chip-on-board for cameras and watches, but also for sealing packages such as chip carriers and pin grid arrays.
従来、第３図に示すようなセラミツクス製の電
子部品用キヤツプ５があり、セラミツクスの一部
を型に流し込んで凹部を成形したり、一枚の板を
金型を用いてしぼり加工することにより前記凹部
を形成し、前記キヤツプと基板との接合部６を
Au−Snで共晶することにより接合一体化する方
法が用いられている。
Conventionally, there has been a cap 5 for electronic components made of ceramics as shown in Fig. 3, which is made by pouring a part of the ceramic into a mold to form a recess, or by squeezing a single plate using a mold. The concave portion is formed, and the joint portion 6 between the cap and the substrate is formed.
A method of integrating the bonding by eutectic Au-Sn is used.
しかしながら、上記従来方法によれば、セラミ
ツクスは高価であるばかりでなく、基板との接合
一体化をする際に、Au−Snで共晶するなど複雑
な工程を得るため時間がかかり、又高温下で作業
するため製造コストが極めて高くなる欠点を有し
ている。
However, according to the above-mentioned conventional method, ceramics are not only expensive, but also time-consuming and complex processes such as Au-Sn eutectic formation are required when bonding them to the substrate, and they are produced under high temperature conditions. The disadvantage is that the manufacturing cost is extremely high because the work is done in
また、セラミツクス製の電子部品用キヤツプ
は、プリント配線板への接合がきわめて困難であ
つた。 Furthermore, caps for electronic components made of ceramics are extremely difficult to bond to printed wiring boards.
本発明はこのような従来のセラミツクス製のキ
ヤツプをプラスチツクス製又は金属製のキヤツプ
にすることにより、接着シートを介してプリント
配線基板上に簡易迅速に接合でき、しかも電子部
品等を外気の湿分や外部衝撃から完全に保護でき
る電子部品保護用のキヤツプ（以下電子部品用キ
ヤツプという）を提供することを目的とするもの
である。 The present invention replaces the conventional ceramic cap with a plastic or metal cap, thereby making it possible to easily and quickly bond it to a printed wiring board via an adhesive sheet, and to protect electronic components from moisture in the outside air. The purpose of this invention is to provide a cap for protecting electronic components (hereinafter referred to as a cap for electronic components) that can completely protect the electronic components from external shocks.
すなわち、本発明は前記従来技術の欠点すべて
を除去改善することを目的とし、前記特許請求の
範囲各項に記載の電子部品用キヤツプを提供する
ことにより、その目的を達成できるものである。 That is, an object of the present invention is to eliminate and improve all the drawbacks of the prior art, and this object can be achieved by providing a cap for electronic components as set forth in each of the claims.
〔問題点を解決するための手段およびその作用〕
以下、本発明を図面に基づいて具体的に説明す
る。第１図のａは本発明の電子部品用キヤツプの
断面図であり、第１図のｂは板の片面に銅箔３が
ある点でａと異なり、キヤツプの縦方向の水の浸
入は防止でき耐水性の良いキヤツプ構造となつて
いる。第２図は本発明の電子部品用キヤツプの製
造工程を断面図で示している。板４の片面に接着
用被膜２を形成後、該接着用被膜面側にザグリ加
工により凹部を形成すると、第１図のａに示すよ
うな本発明の電子部品用キヤツプとなる。[Means for Solving the Problems and Their Effects] Hereinafter, the present invention will be specifically explained based on the drawings. Figure 1a is a cross-sectional view of the electronic component cap of the present invention, and Figure 1b is different from a in that there is a copper foil 3 on one side of the plate, which prevents water from entering in the vertical direction of the cap. It has a cap structure with good water resistance. FIG. 2 is a cross-sectional view showing the manufacturing process of the electronic component cap of the present invention. After forming the adhesive coating 2 on one side of the plate 4, a recess is formed by counterboring on the side of the adhesive coating, resulting in a cap for an electronic component of the present invention as shown in FIG. 1A.
また、第２図のイ及びロの前記接着用被膜２は
イミド樹脂、エポキシ樹脂、アクリル樹脂、マレ
イミドトリアジン樹脂の１種又は２種以上から選
ばれた半硬化と状態にある接着シートであること
を特徴としている。第３図は従来のセラミツクス
製の電子部品用キヤツプの断面図であり、接合部
６をAu−Snで共晶することにより接合一体化さ
れる。第４図は回路形成されたプリント配線板７
上に、電子部品９を凹部８内に搭載しボンデイン
グワイヤー１０により電子部品と基板回路を電気
的に接続した後、前記特許請求の範囲第１項に記
載の電子部品用キヤツプを基板上に搭載し、加熱
により前記電子部品用キヤツプと前記基板とが接
合一体化された断面図である。 In addition, the adhesive film 2 in A and B in FIG. 2 is an adhesive sheet in a semi-cured state selected from one or more of imide resin, epoxy resin, acrylic resin, and maleimide triazine resin. It is characterized by FIG. 3 is a cross-sectional view of a conventional cap for electronic components made of ceramics, which is integrally bonded by eutecticizing the bonding portion 6 with Au-Sn. Figure 4 shows a printed wiring board 7 on which a circuit is formed.
After mounting the electronic component 9 in the recess 8 and electrically connecting the electronic component and the board circuit with the bonding wire 10, the electronic component cap according to claim 1 is mounted on the board. FIG. 3 is a cross-sectional view of the electronic component cap and the substrate being joined and integrated by heating.
以上のように、本発明によれば、凹部を有する
電子部品用キヤツプを用いることにより簡単にか
つ経済的に安価に電子部品が密封できる利点があ
る。また、本発明においては板の片面に接着用被
膜を形成した後、ザグリ加工により凹部を形成す
るので接着用シートがキヤツプからはみ出すこと
なく接着できる利点がある。
As described above, according to the present invention, there is an advantage that electronic components can be sealed simply and economically at low cost by using a cap for electronic components having a recessed portion. Further, in the present invention, after forming the adhesive film on one side of the plate, the concave portion is formed by counterboring, so there is an advantage that the adhesive sheet can be adhered without protruding from the cap.
第１図ａ及びｂは本発明の電子部品用キヤツプ
の断面図であり、第２図イ及びロは本発明の電子
部品用キヤツプの製造工程を概略的に図示した断
面図である。第３図は従来のセラミツクス製の電
子部品用キヤツプの断面図である。第４図は本発
明の電子部品用キヤツプと回路形成された基板と
が接合一体化された断面図である。
これらの図面において、１……電子部品用キヤ
ツプ、２……接着用被膜、３……銅箔、４……
板、５……セラミツクス製の電子部品用キヤツ
プ、６……接合部、７……有機系樹脂素材からな
るプリント配線板、８……電子部品搭載用凹部、
９……電子部品、１０……ボンデイングワイヤ
ー。
1A and 1B are cross-sectional views of a cap for electronic parts according to the present invention, and FIGS. 2A and 2B are cross-sectional views schematically illustrating the manufacturing process of the cap for electronic parts according to the present invention. FIG. 3 is a sectional view of a conventional cap for electronic components made of ceramics. FIG. 4 is a cross-sectional view of the electronic component cap of the present invention and a circuit-formed circuit board integrated together. In these drawings, 1...cap for electronic parts, 2...adhesive coating, 3...copper foil, 4...
Plate, 5... cap for electronic components made of ceramics, 6... joint, 7... printed wiring board made of organic resin material, 8... recess for mounting electronic components,
9...Electronic parts, 10...Bonding wire.
Claims (1)
に、ザクリ加工により形成された凹部を有する電
子部品用キヤツプ。 ２ 前記板は金属または有機系樹脂素材から成る
ことを特徴とする特許請求の範囲第１項記載の電
子部品用キヤツプ。 ３ 前記接着用被膜は有機系樹脂接着シートであ
ることを特徴とする特許請求の範囲第１項記載の
電子部品用キヤツプ。[Scope of Claims] 1. A cap for an electronic component having a recessed portion formed by counterbore processing on the adhesive coating surface side of a plate on which an adhesive coating is formed. 2. The electronic component cap according to claim 1, wherein the plate is made of metal or organic resin material. 3. The electronic component cap according to claim 1, wherein the adhesive film is an organic resin adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198164A JPS61179557A (en) | 1984-09-20 | 1984-09-20 | Cap for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198164A JPS61179557A (en) | 1984-09-20 | 1984-09-20 | Cap for electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179557A JPS61179557A (en) | 1986-08-12 |
| JPH0351297B2 true JPH0351297B2 (en) | 1991-08-06 |
Family
ID=16386527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59198164A Granted JPS61179557A (en) | 1984-09-20 | 1984-09-20 | Cap for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179557A (en) |
-
1984
- 1984-09-20 JP JP59198164A patent/JPS61179557A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61179557A (en) | 1986-08-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |