JPH0352353B2 - - Google Patents
Info
- Publication number
- JPH0352353B2 JPH0352353B2 JP58126234A JP12623483A JPH0352353B2 JP H0352353 B2 JPH0352353 B2 JP H0352353B2 JP 58126234 A JP58126234 A JP 58126234A JP 12623483 A JP12623483 A JP 12623483A JP H0352353 B2 JPH0352353 B2 JP H0352353B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- film
- stencil paper
- sensitive stencil
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
【発明の詳細な説明】
本発明は、多孔性支持体にプラスチツクフイル
ムを貼り合わせた感熱性孔版原紙に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-sensitive stencil paper in which a plastic film is bonded to a porous support.
典具帖紙、合成繊維抄造紙、各種織布、不織布
などの支持体に、厚さ２〜10ミクロン程度の塩化
ビニル、塩化ビニリデン−塩化ビニル共重合体、
ポリプロピレン、ポリエチレンなどの熱可塑性樹
脂によるなるプラスチツクフイルムを貼り合わせ
た感熱性孔版原紙が知られている。このような原
紙から孔版用の原版を作成する方法として、原稿
を原紙のフイルムに密着させて赤外線を含む光を
照射し、赤外線をより多く吸収して温度の高くな
る原稿の黒領域に接したフイルム部分だけを融か
すか凝集させて穿孔することが従来採用されてい
る。また、近年、感熱プリンター、感熱フアクシ
ミリなどの感熱素子を原紙に接し加熱することに
より穿孔することも提案されている。 Vinyl chloride, vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-vinyl chloride copolymer, etc. with a thickness of about 2 to 10 microns are applied to supports such as Tengucho paper, synthetic fiber paper, various woven fabrics, and non-woven fabrics.
Heat-sensitive stencil paper is known in which a plastic film made of a thermoplastic resin such as polypropylene or polyethylene is laminated. In order to create a master plate for stencil printing from such a base paper, the original is brought into close contact with the film of the base paper and irradiated with light containing infrared rays. Conventionally, it has been adopted to perforate only the film portion by melting or coagulating it. In recent years, it has also been proposed to make perforations by bringing a heat-sensitive element, such as a heat-sensitive printer or a heat-sensitive facsimile, into contact with base paper and heating it.
原稿を孔版原紙のフイルムに密着させて、赤外
線を照射して孔版作成する工程において赤外線が
過大に照射される場合、フイルムの熔融により、
フイルムと原稿が融着し、原紙より分離する場合
フイルムが破損したり、また変形を起し、謄写印
刷において印刷物の画質の鮮明性を著るしく低下
することがある。 If an excessive amount of infrared rays is irradiated during the process of making a stencil by bringing the manuscript into close contact with the stencil film and irradiating it with infrared rays, the film may melt and
When the film and original document are fused and separated from the base paper, the film may be damaged or deformed, and the sharpness of the image quality of the printed matter may be significantly reduced in mimeograph printing.
また、感熱素子を用いて孔版を作成する場合に
おいては、フイルムの熔融により感熱素子とフイ
ルムが融着し、著るしい場合は、孔版原紙が走行
しなかつたり、また走行がスムーズでないため画
像ズレが起ることがある。 In addition, when creating a stencil using a heat-sensitive element, the heat-sensitive element and the film may fuse together due to melting of the film, and in severe cases, the stencil paper may not move or may not run smoothly, resulting in image shift. may occur.
このような原稿とフイルムとの融着あるいは感
熱素子とフイルムとの触着を防止するため、従
来、ポリ塩化ビニリデン−塩化ビニル共重合体等
のフイルムに、脂肪酸単体または脂肪酸エステ
ル、または脂肪酸アマイドを練り込んだり、また
前記フイルム面上にステアリン酸ソーダまたはシ
リコーン離型剤を塗布することが行なわれてい
る。 In order to prevent such fusion between the document and the film or the contact between the heat-sensitive element and the film, a single fatty acid, a fatty acid ester, or a fatty acid amide has been added to a film such as polyvinylidene chloride-vinyl chloride copolymer. In addition, sodium stearate or a silicone mold release agent is applied to the surface of the film.
しかし、十分な離型性を得るだけの量の脂肪酸
等を練り込んだフイルムを生産することは、フイ
ルム製造時のスリツピング等の問題があり、極め
て困難であり、また価格的にも高価なものとな
る。また、シリコーン離型剤を塗布することは、
シリコーン離型剤が油状のものであるため、一般
には触媒を添加し、100〜150℃の温度でキユアー
（架橋）する必要があるが、感熱性孔版原紙に用
いられるフイルムは、本来、熱収縮性を持つた
め、加熱時、フイルムが収縮し、カール等の問題
がある。また、シリコーン離型剤は撥水、撥油性
があるため、印刷インキの通過を防げ鮮明な印刷
物が得られない。 However, it is extremely difficult to produce a film that incorporates enough fatty acids to obtain sufficient mold release properties due to problems such as slipping during film production, and it is also expensive. becomes. In addition, applying a silicone mold release agent
Since silicone mold release agents are oily, they generally require the addition of a catalyst and curing (crosslinking) at a temperature of 100 to 150°C. Because of its properties, the film shrinks when heated, causing problems such as curling. Furthermore, since silicone mold release agents are water- and oil-repellent, they prevent printing ink from passing through, making it impossible to obtain clear printed matter.
本発明は、上述のごとき欠点を伴なうことな
く、原稿との融着がない、また感熱素子との融着
のない感熱性孔版原紙を提供することにある。 An object of the present invention is to provide a heat-sensitive stencil paper that does not have the above-mentioned drawbacks and is free from fusion with original documents and without fusion with heat-sensitive elements.
即ち、本発明における感熱性孔版原紙は、多孔
質支持体に熱可塑性樹脂よりなるプラスチツクフ
イルムをラミネートし、さらに前記フイルム表面
にフツ素樹脂を主成分とする耐熱性離型層を設け
たものである。 That is, the heat-sensitive stencil paper of the present invention is one in which a plastic film made of a thermoplastic resin is laminated onto a porous support, and a heat-resistant mold release layer mainly composed of a fluororesin is provided on the surface of the film. be.
本発明において用いられる多孔質支持体として
は、典具帖紙、合成繊維抄造紙、各種織布、不織
布などを用いうる。また、プラスチツクフイルム
としては、塩化ビニール−塩化ビニリデン共重合
体、ポリエステル、ポリエチレン、ポリプロピレ
ンなどのフイルムを用い得る。さらに、多孔質支
持体とフイルムと貼り合わせには、ポリ酢酸ビニ
ル樹脂、ポリアクリル酸エステル樹脂などのエマ
ルジヨンまたは溶液によるラミネートが行われ
る。 As the porous support used in the present invention, tengujo paper, synthetic fiber paper, various woven fabrics, non-woven fabrics, etc. can be used. Furthermore, as the plastic film, films of vinyl chloride-vinylidene chloride copolymer, polyester, polyethylene, polypropylene, etc. can be used. Furthermore, the porous support and the film are laminated using an emulsion or solution of polyvinyl acetate resin, polyacrylic acid ester resin, or the like.
本発明において用いられるフツ素樹脂として
は、ポリテトラフルオロエチレン、ポリクロロト
リフルオロエチレン、テトラフルオロエチレン−
ヘキサフルオロプロピレン共重合体、ポリフツ化
ビニリデン、ポリフツ化ビニルなど、およびこれ
らフツ素系樹脂を、エポキシ樹脂、フエノール樹
脂などにより変性したものが用い得る。 Examples of the fluororesin used in the present invention include polytetrafluoroethylene, polychlorotrifluoroethylene, and tetrafluoroethylene-
Hexafluoropropylene copolymer, polyvinylidene fluoride, polyvinyl fluoride, etc., and these fluorocarbon resins modified with epoxy resin, phenol resin, etc. can be used.
本発明の感熱性孔版原紙を製造する場合は上述
のフツ素樹脂の水性サスペンジヨン、溶剤系サス
ペンジヨン、または極性溶剤の溶液をプラスチツ
クフイルム上へ塗布、乾燥し、フイルム面上へ耐
熱性離型層を作成する。塗布量としては、0.05〜
0.5ｇ／m2程度が好ましい。なお、離型層の塗布
は、多孔質支持体とフイルムとの貼り合わせの
前・後いずれでもよい。 When producing the heat-sensitive stencil paper of the present invention, an aqueous suspension, a solvent-based suspension, or a solution of a polar solvent of the above-mentioned fluororesin is applied onto a plastic film, dried, and heat-resistant mold release is applied onto the film surface. Create layers. The application amount is 0.05~
Approximately 0.5 g/m 2 is preferable. The release layer may be applied either before or after the porous support and the film are bonded together.
次に、実施例により本発明を具体的に説明す
る。 Next, the present invention will be specifically explained with reference to Examples.
実施例 １
厚さ4μのポリエステルフイルムを12ｇ／m2の
典具貼紙に酢酸ビニル系エマルジヨンで貼り合わ
せて標準感熱性孔版原紙を作成した。Example 1 A standard heat-sensitive stencil paper was prepared by laminating a 4 μm thick polyester film to a 12 g/m 2 paper with a vinyl acetate emulsion.
次に、この原紙のフイルム面上にポリフツ化ビ
ニリデンの５％ジメチルアセトアミド溶液を塗
布、乾燥して、塗布量約0.2ｇ／m2の耐熱性離型
層を作成した。 Next, a 5% dimethylacetamide solution of polyvinylidene fluoride was applied onto the film surface of this base paper and dried to form a heat-resistant release layer with a coating amount of about 0.2 g/m 2 .
実施例 ２
実施例１の標準感熱性孔版原紙のフイルム面上
に、ポリクロロトリフルオロエチレンの５％塩化
メチレンサスペンジヨンを塗布、乾燥して、塗布
量約0.1ｇ／m2の耐熱性離型層を作成した。Example 2 A 5% methylene chloride suspension of polychlorotrifluoroethylene was applied onto the film surface of the standard heat-sensitive stencil paper of Example 1 and dried, resulting in a heat-resistant mold release with a coating amount of approximately 0.1 g/m 2 Created a layer.
次に、以上のようにして得た標準感熱孔版原紙
と、実施例１，２で得た孔版原紙を三菱電機(株)
製、感熱フアクシミリFA−80で孔版し、通常の
輪転謄写印刷機で印刷し、比較評価した。結果、
耐熱性離型層を設けていない標準感熱性孔版原紙
は、感熱フアクシミリで穿孔中、感熱素子と原紙
のフイルムが融着し途中で原紙の送行が止まり製
版することができなかつた。一方、本発明の実施
例１，２の孔版原紙はいずれもフアクシミリでの
走行がスムーズであり、良好な印刷物を得ること
ができた。 Next, the standard heat-sensitive stencil paper obtained as described above and the stencil paper obtained in Examples 1 and 2 were transferred to Mitsubishi Electric Corporation.
The paper was stenciled using a heat-sensitive facsimile machine FA-80 produced by the company, and printed using a conventional rotary mimeograph machine for comparative evaluation. result,
With standard heat-sensitive stencil paper without a heat-resistant release layer, during perforation with a heat-sensitive facsimile, the heat-sensitive element and the film of the base paper fused together, and the feed of the base paper stopped midway through, making it impossible to make a plate. On the other hand, both the stencil sheets of Examples 1 and 2 of the present invention ran smoothly in facsimile, and good printed matter could be obtained.
Claims (1)
スチツクフイルムを貼り合わせたラミネート型の
感熱性孔版原紙において、前記フイルムの表面に
フツ素樹脂を主成分とする層を設けたことを特徴
とする感熱性孔版原紙。 ２ 前記フツ素樹脂が、ポリテトラフルオロエチ
レン、ポリクロロトリフルオロエチレン、テトラ
フルオロエチレン−ヘキサフルオロプロピレン共
重合体、ポリフツ化ビニリデン、ポリフツ化ビニ
ル、およびこれらをエポキシ樹脂またはフエノー
ル樹脂で変性したものから選ばれる特許請求の範
囲第１項記載の感熱性孔版原紙。 ３ 前記フツ素樹脂が、ポリフツ化ビニリデンま
たはポリクロロトリフルオロエチレンである特許
請求の範囲第１項記載の感熱性孔版原紙。 ４ 前記フツ素樹脂を主成分とする層が、該樹脂
を0.05〜0.5ｇ／m2の割合で塗布形成したもので
ある特許請求の範囲第１項記載の感熱性孔版原
紙。[Scope of Claims] 1. A laminate-type heat-sensitive stencil paper in which a porous support and a plastic film made of a thermoplastic resin are bonded together, and a layer mainly composed of a fluororesin is provided on the surface of the film. A heat-sensitive stencil paper characterized by: 2 The fluororesin is polytetrafluoroethylene, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polyvinylidene fluoride, polyvinyl fluoride, and those modified with epoxy resin or phenol resin. Selected heat-sensitive stencil paper according to claim 1. 3. The heat-sensitive stencil paper according to claim 1, wherein the fluororesin is polyvinylidene fluoride or polychlorotrifluoroethylene. 4. The heat-sensitive stencil paper according to claim 1, wherein the layer containing the fluororesin as a main component is formed by coating the resin at a rate of 0.05 to 0.5 g/m 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12623483A JPS6019591A (en) | 1983-07-13 | 1983-07-13 | Heat-sensitive stencil paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12623483A JPS6019591A (en) | 1983-07-13 | 1983-07-13 | Heat-sensitive stencil paper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6019591A JPS6019591A (en) | 1985-01-31 |
| JPH0352353B2 true JPH0352353B2 (en) | 1991-08-09 |
Family
ID=14930104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12623483A Granted JPS6019591A (en) | 1983-07-13 | 1983-07-13 | Heat-sensitive stencil paper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6019591A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719468B2 (en) * | 1982-03-26 | 1995-03-06 | シチズン時計株式会社 | Cassette tape automatic assembly equipment |
| JPS6048398A (en) * | 1983-08-29 | 1985-03-16 | Ricoh Co Ltd | Thermal screen printing stencil paper |
| JPS612598A (en) * | 1984-06-15 | 1986-01-08 | Daito Kako Kk | Heat-sensitive stencil paper |
| JPH061628B2 (en) * | 1985-07-22 | 1994-01-05 | 阿波エンジニアリング株式会社 | Magnetic recording tape cassette filling method |
| JPH0752568B2 (en) * | 1985-09-05 | 1995-06-05 | 富士写真フイルム株式会社 | Assembly method and device for tape cassette |
| JPS63128995A (en) * | 1986-11-19 | 1988-06-01 | Unitika Ltd | Thermal stencil printing base paper and production thereof |
| JP2729251B2 (en) * | 1987-05-29 | 1998-03-18 | 株式会社リコー | Base paper for heat sensitive stencil |
| JPH035195A (en) * | 1989-06-02 | 1991-01-10 | Tomoegawa Paper Co Ltd | Thermosensitive stencil paper |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4830570A (en) * | 1971-08-20 | 1973-04-21 | ||
| JPS5813359B2 (en) * | 1978-07-03 | 1983-03-12 | 富士化学紙工業株式会社 | Thermal transfer material |
-
1983
- 1983-07-13 JP JP12623483A patent/JPS6019591A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6019591A (en) | 1985-01-31 |
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