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JPH0358156B2 - - Google Patents
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JPH0358156B2 - - Google Patents

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Publication number
JPH0358156B2
JPH0358156B2 JP2064084A JP2064084A JPH0358156B2 JP H0358156 B2 JPH0358156 B2 JP H0358156B2 JP 2064084 A JP2064084 A JP 2064084A JP 2064084 A JP2064084 A JP 2064084A JP H0358156 B2 JPH0358156 B2 JP H0358156B2
Authority
JP
Japan
Prior art keywords
support shaft
mold
slip ring
plating
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2064084A
Other languages
Japanese (ja)
Other versions
JPS60165078A (en
Inventor
Kyokazu Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP2064084A priority Critical patent/JPS60165078A/en
Publication of JPS60165078A publication Critical patent/JPS60165078A/en
Publication of JPH0358156B2 publication Critical patent/JPH0358156B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 本発明は、回転体ジヤイロを利用した各種機器
に用いるにスリツプリングアセンブリの製造方法
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a slip ring assembly for use in various types of equipment using a rotating body gyro.

回転体ジヤイロを利用した機器に用いるスリツ
プリングアセンブリは、第1図に示す如くリード
線1が内周面に溶接された複数のスリツプリング
2が一定間隔にエポキシ樹脂の支持軸3の外周に
一体に設けられ、前記各スリツプリング2のリー
ド線1が支持軸端に導出せしめられて成るもので
ある。
As shown in Fig. 1, a slip ring assembly used in a device using a rotary gyroscope has a plurality of slip rings 2, each having a lead wire 1 welded to its inner circumferential surface, integrally mounted on the outer circumference of an epoxy resin support shaft 3 at regular intervals. The lead wire 1 of each slip ring 2 is led out to the end of the support shaft.

従来、斯かる構造のスリツプリングアセンブリ
4を製造するには、先ず導電材より成るプレート
をプレス抜きしてスリツプリング2を作り、次に
この各スリツプリング2の内周面にリード線1を
溶接し、次いで金型内に前記スリツプリング2を
複数個一定間隔に配列セツトすると共に各スリツ
プリング2のリード線1を金型外に導出し、次に
金型内にエポキシ樹脂を充填して支持軸3を成形
すると共に外周にスリツプリング2を一定間隔に
一体形成し然る後外周を切削、研摩して仕上げ整
形していた。
Conventionally, in order to manufacture a slip ring assembly 4 having such a structure, first a plate made of a conductive material is pressed out to form the slip rings 2, and then lead wires 1 are welded to the inner peripheral surface of each slip ring 2. Next, a plurality of slip rings 2 are arranged and set at regular intervals in a mold, and the lead wires 1 of each slip ring 2 are led out of the mold, and then the mold is filled with epoxy resin and supported. While the shaft 3 is molded, slip rings 2 are integrally formed on the outer periphery at regular intervals, and then the outer periphery is cut and polished for finishing shaping.

然し乍ら、斯かる製造方法では、リード線1の
整列が困難で、リード線1同志がからみ合い、絶
縁性が無くなることがしばしば発生し、またスリ
ツプリング2とスリツプリング2との隙間にエポ
キシ樹脂が流れ込んでいきにくく、その結果ピン
ホールが生じたり、最終工程で外周を切削した
際、折損してしまう等の問題点があつた。
However, in this manufacturing method, it is difficult to align the lead wires 1, and the lead wires 1 often get entangled with each other, resulting in a loss of insulation, and epoxy resin is deposited in the gap between the slip rings 2. There were problems such as it was difficult to flow in, resulting in pinholes, and when the outer periphery was cut in the final process, it broke.

特にスリツプリングアセンブリは近時組込む機
器の小型化に伴い一層小型のものが要求されてい
るが、前述の如くリード線1同志のからみ合いか
ら3mm以下の外径に対し10本以上のリード線が通
るような小型のスリツプリング2は実際に作るこ
とができないという問題があつた。
In particular, slip ring assemblies are required to be even smaller due to the miniaturization of the devices they are incorporated into, but as mentioned above, due to the entanglement of each lead wire, it is necessary to have more than 10 lead wires for an outer diameter of 3 mm or less. There was a problem in that it was impossible to actually make a small slip ring 2 that could be passed through.

本発明は上記問題を解消すべくなされたもの
で、小型で絶縁性が高く且つ強度の高いスリツプ
リングアセンブリの製造方法を提供することを目
的とするものである。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a slip ring assembly that is small in size, has high insulation properties, and has high strength.

以下本発明のスリツプリングアセンブリの製造
方法を図によつて説明する。第2図に示す如く
Be−Cu,SUS等の棒5にエポキシ等の樹脂で絶
縁被覆6を施したものを補強芯棒7とし、次に第
3図に示す如く絶縁被覆を施したリード線又は絶
縁被覆の一端を削り取りその部分にエポキシ等の
樹脂で絶縁被覆し直したリード線8を一定間隔に
粘着テープ9上に整列して取付け、次いでこれを
前記補強芯棒7に第4図に示す如く巻いて瞬間接
着剤にて固定し、粘着テープ9を取り除く。次に
これを金型内に入れ、リード線8の一端を金型外
に導出しておいて金型内にエポキシ等の樹脂を充
填して第5図に示す如く円柱形の支持軸10を形
成する。次いでこの円柱形の支持軸10の外周面
に長手方向に一定間隔を存して第6図aに示す如
くリード線8と同数の環状溝11を溝切り加工に
て形成する。この溝切り加工の深さは、最大でも
第6図bに示す如くリード線8の絶縁被覆まで到
達しないところまでとする。次に環状溝11の底
の一部を円弧状に深く切り込んでいき、第7図に
示す如くリード線8の絶縁被覆を破り、リード線
8の導通部を一部露出させて円弧状凹部12を形
成する。この切り込み加工は、リード線一本に対
し一個づつ順次対応させながら行つて、全ての環
状溝11の底の一部に夫々異なるリード線8の一
部を露出せしめるものである。次いで環状溝11
の底部のみに無電解めつき又はスリツプリングア
センブリ若しくは導電性ペイントの塗布を行つて
第8図に示す如く電極13を形成する。無電解め
つき、スパツタリングなどの場合、環状溝11の
全面に付着するので、底部にのみ残るようにレジ
ストなどによりエツチング処理を行うものとす
る。次に各リード線8を通して第9図に示す如く
環状溝11内に電気めつき14を施す。このめつ
きとしては、Cuめつきを数μ乃至数10μ施した後
Au又はAu合金などの貴金属めつきを施すか、直
接Au又はAu合金などの貴金属めつきを施す。こ
のようにしてめつき厚さを図示の如く環状溝11
の溝深さより厚く施し、支持軸10の外周面より
突出するようにする。然る後第10図に示す如く
支持軸10の外周面を切削加工して円柱形に形成
し、且つ環状溝11内のめつき14の部分の外周
を溝切り加工して桟いV形溝15を形成し、最後
に研摩して仕上げ、スリツプリングアセンブリ1
6を製作する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a slip ring assembly according to the present invention will be explained below with reference to the drawings. As shown in Figure 2
A reinforcing core rod 7 is a rod 5 made of Be-Cu, SUS, etc., coated with an insulating coating 6 using a resin such as epoxy, and then one end of the insulated lead wire or the insulated coating is attached as shown in Fig. 3. Lead wires 8 that have been scraped off and re-insulated with a resin such as epoxy are attached to the adhesive tape 9 at regular intervals, and then wrapped around the reinforcing core rod 7 as shown in FIG. 4 and instantly bonded. Fix it with adhesive and remove the adhesive tape 9. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the mold is filled with resin such as epoxy to form a cylindrical support shaft 10 as shown in FIG. Form. Next, the same number of annular grooves 11 as the lead wires 8 are formed at regular intervals in the longitudinal direction on the outer peripheral surface of the cylindrical support shaft 10, as shown in FIG. 6a, by grooving. The depth of this grooving is at most such that it does not reach the insulation coating of the lead wire 8, as shown in FIG. 6b. Next, a part of the bottom of the annular groove 11 is deeply cut in an arc shape, the insulation coating of the lead wire 8 is broken as shown in FIG. form. This cutting process is performed one by one for each lead wire, so that different parts of the lead wire 8 are exposed at a part of the bottom of all the annular grooves 11. Next, the annular groove 11
Electroless plating or slip ring assembly or application of conductive paint is performed only on the bottom portion of the electrode 13 to form the electrode 13 as shown in FIG. In the case of electroless plating, sputtering, etc., since it adheres to the entire surface of the annular groove 11, etching treatment is performed using a resist or the like so that it remains only at the bottom. Next, each lead wire 8 is passed through and electroplated 14 is applied inside the annular groove 11 as shown in FIG. This plating is done after applying Cu plating of several microns to several tens of microns.
Plating with precious metals such as Au or Au alloys, or directly plating with precious metals such as Au or Au alloys. In this way, the plating thickness is adjusted to the annular groove 11 as shown in the figure.
The depth of the groove is greater than the depth of the groove, and the groove is made to protrude from the outer circumferential surface of the support shaft 10. Thereafter, as shown in FIG. 10, the outer peripheral surface of the support shaft 10 is cut to form a cylindrical shape, and the outer periphery of the plating 14 in the annular groove 11 is cut to form a crosspiece V-shaped groove. 15 and finally polished and finished, the slip ring assembly 1
Produce 6.

かように本発明のスリツプリングアセンブリの
製造方法では、Be−Cu,SUSなどの補強芯棒7
を中心に配設するので、後に支持軸10の外周に
環状溝11を溝切り加工した際、さらにはその環
状溝11の底の一部をさらに深く切り込み加工し
た際、支持軸10は補強芯棒7により補強されて
折損することが無い。また前記の切削加工時補強
芯棒7を用いてセンター出しを行うことができる
ので、高精度に切削加工できる。さらにリード線
8は予め粘着テープ9上に整列配置したのを補強
芯棒7の外周に巻いて取付けるので、支持軸10
の内部でリード線8同志がからみ合うようなこと
がなく、絶縁性の高い高信頼性のスリツプリング
アセンブリが得られる。また支持軸10のモール
ド樹脂成形は、障害物の無い略円柱形のものに行
うので、ピンホールの無い支持軸10が形成され
る。さらにまた前記の如くリード線8同志のから
み合いが無いので、補強芯棒7の太さ、リード線
8の太さ及びそれらの絶縁被覆の厚さを変えるこ
とにより小型のものまで製造することができる。
As described above, in the method for manufacturing a slip ring assembly of the present invention, the reinforcing core rod 7 made of Be-Cu, SUS, etc.
Since the support shaft 10 is arranged around the reinforcing core, when the annular groove 11 is later cut into the outer periphery of the support shaft 10, and when a part of the bottom of the annular groove 11 is further cut deeper, the support shaft 10 has a reinforcing core. It is reinforced by the rod 7 and will not break. Furthermore, since centering can be performed using the reinforcing core rod 7 during cutting, highly accurate cutting can be performed. Furthermore, since the lead wires 8 are arranged in advance on the adhesive tape 9 and wound around the outer periphery of the reinforcing core rod 7, the support shaft 10
There is no possibility that the lead wires 8 become entangled with each other inside the lead wire 8, and a highly insulating and highly reliable slip ring assembly can be obtained. Further, since the support shaft 10 is molded with resin into a substantially cylindrical shape without any obstructions, the support shaft 10 without pinholes is formed. Furthermore, as mentioned above, since there is no entanglement between the lead wires 8, it is possible to manufacture even small products by changing the thickness of the reinforcing core rod 7, the thickness of the lead wires 8, and the thickness of their insulation coatings. can.

次に本発明のスリツプリングアセンブリの製造
方法の具体的な実施例と従来例について説明す
る。
Next, specific examples and conventional examples of the method for manufacturing a slip ring assembly of the present invention will be described.

〔実施例〕〔Example〕

第2図に示す如く直径0.9mmのBe−Cuの棒5に
エポキシ樹脂で絶縁被覆6を施したものを補強芯
棒7とし、次に第3図に示す如く直径0.2mmのCu
線にSnめつき5μ施したテフロン絶縁線の先端部
20mmを削り取りエポキシ樹脂を15〜20μ施した
リード線8を13本一定間隔に粘着テープ9上に整
列して取付け、次いでこの粘着テープ9上に整列
して取付けたリード線8を前記補強芯棒7に第4
図に示す如く巻いて瞬間接着剤にて補強芯棒7に
リード線8を固定し、粘着テープ9を取り除い
た。次にこれを金型内に入れ、リード線8の一端
を金型外に導出し且つ補強芯棒7をセンターとし
て係止し、金型内にエポキシ樹脂を充填し固化し
て第5図に示す如く円柱形の支持軸10を形成し
た。次いでこの円柱形の支持軸10の外周面の長
手方向に第6図a,bに示す如く1mm間隔に幅
0.6mm、深さ0.35mmの環状溝11を13個溝切り加
工にて形成した。次にこの環状溝11の底の一部
を円弧状に深く切り込んでいき、第7図に示す如
く夫々リード線8の絶縁被覆を破り、リード線8
の導通部を一部露出させて円弧状凹部12を形成
した。次いで環状溝11内にCuの無電解めつき
を行つて0.5〜1μのCuめつきを施し、環状溝11
の底部にレジストを塗布し、エツチング処理を行
つた後レジストを取除いて第8図に示す如く電極
13を形成した。次にリード線8を通して第9図
に示す如く電極13にて環状溝11内にCuを2μ
電気めつきし、さらにAu〜Ag1%を0.5mm電気め
つき14を施して支持軸10の外周面より突出し
た。然る後支持軸10の外周面を切削加工して直
径2.3mmの円柱形に成形し、環状溝11内のめつ
き14の部分の外周を溝切り加工して深さ80μの
浅いV形溝15を形成し、最後に研摩して第10
図に示す如きスリツプリングアセンブリ16を製
作した。
As shown in Fig. 2, a reinforcing core rod 7 is a Be-Cu rod 5 with a diameter of 0.9 mm and an insulating coating 6 made of epoxy resin.
Scrape off 20 mm of the tip of a Teflon insulated wire coated with 5μ of Sn plating, and attach 13 lead wires 8 coated with 15 to 20μ of epoxy resin in a row on the adhesive tape 9 at regular intervals, and then attach them to the adhesive tape 9. The lead wires 8 that are aligned and attached to the reinforcing core rod 7 are attached to the fourth
The lead wire 8 was wound as shown in the figure and fixed to the reinforcing core rod 7 with an instant adhesive, and the adhesive tape 9 was removed. Next, this is put into a mold, one end of the lead wire 8 is guided out of the mold, and the reinforcing core rod 7 is locked at the center, and the mold is filled with epoxy resin and solidified, as shown in Fig. 5. As shown, a cylindrical support shaft 10 was formed. Next, in the longitudinal direction of the outer peripheral surface of this cylindrical support shaft 10, as shown in FIG.
Thirteen annular grooves 11 each having a length of 0.6 mm and a depth of 0.35 mm were formed by grooving. Next, a part of the bottom of this annular groove 11 is deeply cut in an arc shape, and the insulation coating of each lead wire 8 is broken as shown in FIG.
An arc-shaped recess 12 was formed by partially exposing the conductive portion. Next, electroless plating of Cu is performed inside the annular groove 11 to give a Cu plating of 0.5 to 1μ, and the annular groove 11 is
After applying a resist to the bottom of the substrate and performing an etching process, the resist was removed to form an electrode 13 as shown in FIG. Next, as shown in FIG.
Electroplating was performed, and further electroplating 14 of 0.5 mm of 1% Au to Ag was applied to protrude from the outer peripheral surface of the support shaft 10. After that, the outer peripheral surface of the support shaft 10 is cut to form a cylindrical shape with a diameter of 2.3 mm, and the outer periphery of the plating 14 in the annular groove 11 is cut to form a shallow V-shaped groove with a depth of 80 μm. 15, and finally polished to form the 10th
A slip ring assembly 16 as shown in the figure was manufactured.

こうして製作したスリツプリングアセンブリ
100個について試験した処、絶縁劣化を起すもの
は皆無であつた。また製作中に折損したものも皆
無であつた。
The slip spring assembly produced in this way
When 100 pieces were tested, none caused insulation deterioration. Also, none of them were broken during production.

〔従来例〕[Conventional example]

厚さ0.6mmのAu−Ag1%より成るプレートをプ
レス抜きして内径1.8mm、外径3mmのスリツプリ
ングを作り、次にこの各スリツプリングの内周面
に直径0.2mmのCuより成るリード線を溶接し、次
いで金型内に前記スリツプリングを13個0.4mm間
隔に配列セツトすると共に各スリツプリングのリ
ード線を金型外に導出し、次に金型内にエポキシ
樹脂を充填して支持軸を成形すると共に外周面に
スリツプリングを一体に形成し、然る後外周を切
削加工して直径2.3mmの支持軸を形成し、表面を
研摩して仕上げ整形し、スリツプリングアセンブ
リを製作した。
Slip rings with an inner diameter of 1.8 mm and an outer diameter of 3 mm are made by pressing a plate made of Au-Ag1% with a thickness of 0.6 mm, and then lead wires made of Cu with a diameter of 0.2 mm are attached to the inner circumference of each slip ring. Then, 13 slip rings were arranged and set at 0.4 mm intervals in the mold, and the lead wires of each slip ring were led out of the mold. Next, the mold was filled with epoxy resin and supported. The shaft was molded and a slip ring was integrally formed on the outer circumferential surface.The outer circumference was then cut to form a support shaft with a diameter of 2.3 mm.The surface was polished and finished to form a slip ring assembly. .

こうして製作したスリツプリングアセンブリ
100個について実施例と同じ評価した処、製作中
(切削加工中)に折損したものが6個あり、絶縁
試験で63個が不合格となり、また合格品を外観検
査した処3個にピンホールの発生が見られ、最終
合格となつたものは28個で不良率は72%であつ
た。
The slip spring assembly produced in this way
When 100 pieces were evaluated in the same manner as in the example, 6 pieces were broken during manufacturing (cutting), 63 pieces failed the insulation test, and 3 pieces had pinholes when the appearance of the passed pieces was inspected. There were 28 products that passed the test, and the defective rate was 72%.

以上で明らかなように本発明の製造方法によれ
ば、絶縁性が高く且つ強度の高くその上品質良好
なスリツプリングアセンブリを得ることができ、
しかも小型、軽量のスリツプリングアセンブリを
容易に得ることができるなどの優れた効果があ
る。
As is clear from the above, according to the manufacturing method of the present invention, it is possible to obtain a slip ring assembly with high insulation properties, high strength, and good quality.
Furthermore, there are excellent effects such as the ability to easily obtain a small and lightweight slip ring assembly.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のスリツプリングアセンブリを示
す縦断面図、第2図乃至第10図は本発明による
スリツプリングアセンブリの製造方法の工程を示
す図である。 5……棒、6……絶縁被覆、7……補強芯棒、
8……リード線、9……粘着テープ、10……支
持軸、11……環状溝、12……円弧状凹部、1
3……電極、14……電気めつき、15……V形
溝、16……スリツプリングアセンブリ。
FIG. 1 is a longitudinal sectional view showing a conventional slip ring assembly, and FIGS. 2 to 10 are views showing steps of a method for manufacturing a slip ring assembly according to the present invention. 5... Rod, 6... Insulation coating, 7... Reinforcement core rod,
8... Lead wire, 9... Adhesive tape, 10... Support shaft, 11... Annular groove, 12... Arc-shaped recess, 1
3...electrode, 14...electroplating, 15...V-shaped groove, 16...slip ring assembly.

Claims (1)

【特許請求の範囲】[Claims] 1 絶縁被覆した補強芯棒の外周面上に複数のリ
ード線を固定し、次にこれを金型内にセツトして
各リード線の一端を金型外に導出し、次いで金型
内に樹脂にて円柱形の支持軸を形成し、次に支持
軸の外周上にリード線と同数の環状溝を一定間隔
に形成し、次いで各環境状の底の一部を深く切り
込んで夫々一本のリード線の導通部を露出し、次
に環状溝の底部に無電解めつき、スパツタリング
又は導電性ペイントの塗布によりめつき用電極を
作り、次いでめつき用電極を利用して環状溝内に
電気めつきを施して支持軸の外周面より突出さ
せ、然る後支持軸の外周を切削、研摩して仕上げ
整形することを特徴とするスリツプリングアセン
ブリの製造方法。
1 A plurality of lead wires are fixed on the outer circumferential surface of an insulated reinforcing core rod, then set in a mold, one end of each lead wire is led out of the mold, and then resin is poured into the mold. to form a cylindrical support shaft, then form the same number of annular grooves as the lead wires at regular intervals on the outer periphery of the support shaft, and then deep cut a part of the bottom of each environment to form one each. Expose the conductive part of the lead wire, then make a plating electrode at the bottom of the annular groove by electroless plating, sputtering, or applying conductive paint, and then use the plating electrode to inject electricity into the annular groove. A method for producing a slip ring assembly, which comprises plating the support shaft to protrude from the outer circumference thereof, and then cutting and polishing the outer circumference of the support shaft for finishing shaping.
JP2064084A 1984-02-07 1984-02-07 Method of producing slip ring assembly Granted JPS60165078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2064084A JPS60165078A (en) 1984-02-07 1984-02-07 Method of producing slip ring assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2064084A JPS60165078A (en) 1984-02-07 1984-02-07 Method of producing slip ring assembly

Publications (2)

Publication Number Publication Date
JPS60165078A JPS60165078A (en) 1985-08-28
JPH0358156B2 true JPH0358156B2 (en) 1991-09-04

Family

ID=12032821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2064084A Granted JPS60165078A (en) 1984-02-07 1984-02-07 Method of producing slip ring assembly

Country Status (1)

Country Link
JP (1) JPS60165078A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658816B2 (en) * 1986-09-01 1994-08-03 株式会社日立製作所 Current collector for rotating electric machine
CN102790336B (en) * 2011-05-17 2016-08-24 科德数控股份有限公司 A kind of conducting slip ring
DE102015224798A1 (en) 2015-12-10 2017-06-14 Continental Reifen Deutschland Gmbh Apparatus and process for the preparation of a finished rubber at least one reactive additive mixture

Also Published As

Publication number Publication date
JPS60165078A (en) 1985-08-28

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