JPH0360189B2 - - Google Patents
Info
- Publication number
- JPH0360189B2 JPH0360189B2 JP59121490A JP12149084A JPH0360189B2 JP H0360189 B2 JPH0360189 B2 JP H0360189B2 JP 59121490 A JP59121490 A JP 59121490A JP 12149084 A JP12149084 A JP 12149084A JP H0360189 B2 JPH0360189 B2 JP H0360189B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- led chip
- mold
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、LED（発光ダイオード）を光源と
した各種表示装置の分野に利用できるものであつ
て、プリント基板に装着されたLEDチツプのモ
ールド方法に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention can be used in the field of various display devices using LEDs (light emitting diodes) as light sources. Regarding the method.
［従来の技術］
一般に、プリント基板に装着されたLEDチツ
プは、透光性の合成樹脂でモールドされるが、そ
のモールド方法の一例としては、第１０図に示す
ようにプリント基板ａの印刷配線ｂにボンデイン
グしたLEDチツプｃに、モールド用の合成樹脂
ｄをスプレー等にて塗布し、略山形にコーテイン
グするものである。[Prior Art] Generally, an LED chip mounted on a printed circuit board is molded with a transparent synthetic resin, and one example of the molding method is as shown in FIG. The LED chip c bonded to b is coated with a synthetic resin d for molding by spraying or the like to form a roughly chevron-shaped coating.
ところが、この方法によると、モールドされた
合成樹脂ｄが、暖い傾斜の山形であるため、
LEDチツプｃから光線がL1，L2のように合成樹
脂ｄの表面で全反射（空気の屈折率が１であるの
に対して合成樹脂の屈折率は1.5〜1.6である）
し。あるいは光線L3，L4，L5のようにプリント
基板ａ側へ大きく屈折されることになり、発光効
率を著しく低下させる原因になつていた。また、
樹脂モールドの作業能率が悪く、モールドの形も
一定せず、光学的機能のバラツキの原因となつて
いる。 However, according to this method, since the molded synthetic resin d has a warm sloped mountain shape,
The light beam from the LED chip c is totally reflected on the surface of the synthetic resin d as L 1 and L 2 (the refractive index of air is 1, whereas the refractive index of the synthetic resin is 1.5 to 1.6).
death. Alternatively, the light rays L 3 , L 4 , and L 5 are largely refracted toward the printed circuit board a side, causing a significant reduction in luminous efficiency. Also,
The working efficiency of the resin mold is poor, and the shape of the mold is inconsistent, causing variations in optical function.
［発明が解決しようとする問題点］
本発明は、上記従来の問題点を解決するために
なされ、発光効率を向上させると共に、作業性の
良好な、しかも均一性を付与できるようにした
LEDチツプの合成樹脂モールド方法を提供する
ものである。[Problems to be Solved by the Invention] The present invention was made in order to solve the above-mentioned conventional problems, and it is possible to improve the luminous efficiency and provide good workability and uniformity.
This invention provides a synthetic resin molding method for LED chips.
［問題点を解決するための手段］
問題点を解決する本発明の手段は、プリント基
板に装着されたLEDチツプを合成樹脂でモール
ドする方法において、前記プリント基板のLED
チツプの近傍に貫通孔を設け、前記LEDチツプ
に対応させて所要のレンズ状のキヤビテイを備え
た上型と、前記キヤビテイに対応する湯溜りを備
えた下型とで前記プリント基板を取囲み、前記湯
溜り側からモールド用の合成樹脂を圧入すると共
に、前記貫通孔を介して前記レンズ状のキヤビテ
イ内に導いて一体にモールドすることを特徴とす
るもである。[Means for Solving the Problem] The means of the present invention for solving the problem is a method of molding an LED chip mounted on a printed circuit board with a synthetic resin, in which the LED chip on the printed circuit board is molded.
A through hole is provided near the chip, and the printed circuit board is surrounded by an upper mold having a required lens-shaped cavity corresponding to the LED chip, and a lower mold having a water reservoir corresponding to the cavity, A synthetic resin for molding is press-fitted from the water reservoir side, and is led into the lens-shaped cavity through the through hole and integrally molded.
［実施例］
以下、図面に基づいて本発明の実施例を説明す
ると、１はプリント基板であり、表面にプリント
配線１ａが施され、その所要箇所にLEDチツプ
２が装着され、ワイヤーボンデイング３されてい
る。前記プリント基板１は、前記LEDチツプ２
の近傍に貫通孔１ｂが設けられ、この貫通孔１ｂ
は第６図に示すようにLEDチツプ２を挾むよう
にして円弧状に対設されている。４はトランスフ
ア方式のモールド成形用の上型（キヤビ型）であ
り、前記プリント基板１上のLEDチツプ２に対
応させて略半球状のキヤビテイ４ａが設けられる
と共に、プリント基板設置用のキヤビテイ４ｂが
形成されている。５は前記上型と組合せる下型
（コア型）であり、前記キヤビテイ４ａに対応す
る湯溜り５ａを備え、かつ各湯溜りを連結する通
路（スプル）５ｂが形成されている。この場合、
湯溜り５ａは前記略半球状キヤビテイ４ａの径よ
りもやや大径を有する円形に形成され、前記通路
５ｂは挾幅の凹溝状で各湯溜り５ａを連絡するよ
うに形成されている。そして、通路５ｂの一端は
トランスフアポツト（図示せず）に接続されてい
る。[Example] Hereinafter, an example of the present invention will be described based on the drawings. Reference numeral 1 is a printed circuit board, on the surface of which printed wiring 1a is applied, LED chips 2 are attached to required locations, and wire bonding 3 is applied. ing. The printed circuit board 1 includes the LED chip 2
A through hole 1b is provided near the through hole 1b.
As shown in FIG. 6, the LED chips 2 are arranged opposite each other in an arc shape so as to sandwich the LED chip 2. Reference numeral 4 denotes an upper mold (cabin type) for transfer molding, in which a substantially hemispherical cavity 4a is provided corresponding to the LED chip 2 on the printed circuit board 1, and a cavity 4b for installing the printed circuit board. is formed. Reference numeral 5 denotes a lower mold (core mold) to be combined with the upper mold, and is provided with a pool 5a corresponding to the cavity 4a, and a passage (sprue) 5b connecting each pool. in this case,
The reservoirs 5a are formed in a circular shape having a diameter slightly larger than the diameter of the substantially hemispherical cavity 4a, and the passages 5b are formed in the shape of a scoop-width groove so as to connect the respective reservoirs 5a. One end of the passage 5b is connected to a transfer pot (not shown).
前記上型４と下型５とを用いた合成樹脂モール
ドするには、これらの型の間に前記プリント基板
１をセツトすると共に、前記通路５ｂにモールド
用の合成樹脂をトランスフアポツトから圧送する
ことにより行なう。即ち、圧送された合成樹脂は
下型５の通路５ｂを通つて湯溜り５ａに流入し、
さらに湯溜りから前記貫通孔１ｂを通つて上型４
のキヤビテイ４ａ内に至る。 To perform synthetic resin molding using the upper mold 4 and lower mold 5, the printed circuit board 1 is set between these molds, and synthetic resin for molding is pumped into the passage 5b from a transfer pot. Do it by doing this. That is, the pumped synthetic resin flows into the pool 5a through the passage 5b of the lower die 5,
Furthermore, the upper mold 4 is passed from the hot water pool through the through hole 1b.
into the cavity 4a.
このようにして、トランスフアモールドが完了
すると、各LEDチツプ２は合成樹脂６で略半球
状にモールドされ、かつ貫通孔１ｂに充填された
結合部６ａ及び湯溜り５ａにより形成されたフラ
ンジ部６ｂと一体にモールドされている。そし
て、フランジ部６ｂは、前記通路５ｂに充填され
た連結部６ｃにより、格子状を呈して一体に連結
されている。 When the transfer molding is completed in this way, each LED chip 2 is molded into a substantially hemispherical shape with the synthetic resin 6, and the flange portion 6b formed by the joint portion 6a filled in the through hole 1b and the pool 5a. It is integrally molded with. The flange portions 6b are integrally connected in a lattice shape by connecting portions 6c filled in the passage 5b.
なお、この実施例においては、LEDチツプ２
の合成樹脂モールドの形態を略半球状としたが、
これに限定することなく任意の光学特性を有する
形態で実施することが可能であり、また、半球状
の樹脂モールドはLEDチツプのジヤンクシヨン
部を中心として半球状にしたものがより理想的で
ある。前記湯溜り５ａは通路５ｂより一段低い凹
部となつているが、前記通路５ｂの面一にした円
形空所であつてもよい。 Note that in this embodiment, LED chip 2
The shape of the synthetic resin mold was approximately hemispherical,
The present invention is not limited to this, and can be implemented in a form having arbitrary optical characteristics, and it is more ideal that the hemispherical resin mold be shaped into a hemispherical shape centered on the junction part of the LED chip. Although the water reservoir 5a is a recessed portion that is one step lower than the passage 5b, it may be a circular cavity flush with the passage 5b.
［発明の効果］
本発明は、LEDチツプを、略半球状等任意の
光学特性を有するレンズ状形態で樹脂モールドす
る方法であるから、従来のようにモールドの表面
でLEDチツプからの光が全反射して放射されな
かつたり、プリント基板側へ大きく屈折して有効
光線とならなかつたりすることはなく、LEDラ
ンプとしての発光効率を著しく向上させることが
できる。[Effects of the Invention] Since the present invention is a method of resin molding an LED chip in a lens-like shape having arbitrary optical characteristics such as a substantially hemispherical shape, the light from the LED chip is not completely absorbed on the surface of the mold as in the conventional method. The light will not be reflected and not emitted, or it will not be significantly refracted toward the printed circuit board and will not become an effective light beam, so the luminous efficiency of the LED lamp can be significantly improved.
また、本発明によると、樹脂モールドの形のバ
ラツキが未然に防止されるので、各LEDの光学
的機能は均一化され、品質及び信頼性を高めるこ
とができる。さらに、樹脂モールドの作業の容易
化が図れて作業能率が向上し、生産性にすぐれて
いる。本発明による場合は、LEDチツプの樹脂
モールドとプリント基板の背面側に形成されるフ
ランジ部とが前記結合部を介して一体にモールド
され、しかもフランジ部同志が連結されているの
で、樹脂モールド部の外力に対する強度アツプを
図ることができる。 Further, according to the present invention, variations in the shape of the resin mold are prevented, so the optical function of each LED is made uniform, and quality and reliability can be improved. Furthermore, the work of resin molding is facilitated, work efficiency is improved, and productivity is excellent. In the case of the present invention, the resin mold of the LED chip and the flange portion formed on the back side of the printed circuit board are integrally molded via the coupling portion, and the flange portions are connected to each other, so that the resin mold portion The strength against external forces can be increased.
第１図は、本発明の一実施例を示すモールド成
形時の断面図、第２図はモールドされた状態を示
す断面図、第３図は同じく表面図、第４図は裏面
図、第５図はプリント基板の斜視図、第６図は第
５図のＡ部の拡大図、第７図は第６図のＢ−Ｂ線
断面図、第８図は同じくＣ−Ｃ線断面図、第９図
はモールド用型の断面図、第１０図は従来例の説
明図である。
１……プリント基板、１ｂ……貫通孔、２……
LEDチツプ、３……ワイヤーボンデイング、４
……上型、４ａ，４ｂ……キヤビテイ、５……下
型、５ａ……湯溜り、５ｂ……通路、６……合成
樹脂、６ａ……結合部、６ｂ……フランジ部、６
ｃ……連結部。
FIG. 1 is a sectional view showing an embodiment of the present invention during molding, FIG. 2 is a sectional view showing the molded state, FIG. 3 is a front view, FIG. 4 is a back view, and FIG. The figure is a perspective view of the printed circuit board, FIG. 6 is an enlarged view of part A in FIG. 5, FIG. 7 is a sectional view taken along line B-B in FIG. 6, and FIG. FIG. 9 is a sectional view of a molding die, and FIG. 10 is an explanatory diagram of a conventional example. 1...Printed circuit board, 1b...through hole, 2...
LED chip, 3...Wire bonding, 4
... Upper mold, 4a, 4b ... Cavity, 5 ... Lower mold, 5a ... Reservoir, 5b ... Passage, 6 ... Synthetic resin, 6a ... Joint part, 6b ... Flange part, 6
c...Connection part.
Claims (1)
成樹脂でモールドする方法において、前記プリン
ト基板のLEDチツプの近傍に貫通孔を設け、前
記LEDチツプに対応させて所要のレンズ状のキ
ヤビテイを備えた上型と、前記キヤビテイに対応
する湯溜りを備えた下型とで前記プリント基板を
取囲み、前記湯溜り側からモールド用の合成樹脂
を圧入すると共に、前記貫通孔を介して前記レン
ズ状のキヤビテイ内に導いて一体にモールドする
ことを特徴とするプリント基板に装着された
LEDチツプのモールド方法。 ２ 前記湯溜りはフランジ部を形成し、かつ各フ
ランジ部がモールドにより連結されることを特徴
とする特許請求の範囲第１項記載のプリント基板
に装着されたLEDチツプのモールド方法。[Claims] 1. In a method of molding an LED chip mounted on a printed circuit board with synthetic resin, a through hole is provided in the vicinity of the LED chip of the printed circuit board, and a required lens-shaped hole is formed in correspondence with the LED chip. The printed circuit board is surrounded by an upper mold having a cavity and a lower mold having a reservoir corresponding to the cavity, and a synthetic resin for molding is press-fitted from the reservoir side and is inserted through the through hole. mounted on a printed circuit board characterized by being guided into the lens-shaped cavity and integrally molded.
How to mold LED chips. 2. The method of molding an LED chip mounted on a printed circuit board according to claim 1, wherein the water reservoir forms a flange portion, and each flange portion is connected by a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121490A JPS611067A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121490A JPS611067A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS611067A JPS611067A (en) | 1986-01-07 |
| JPH0360189B2 true JPH0360189B2 (en) | 1991-09-12 |
Family
ID=14812451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59121490A Granted JPS611067A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611067A (en) |
Cited By (1)
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|---|---|---|---|---|
| KR101487422B1 (en) * | 2012-12-20 | 2015-01-30 | 두산건설 주식회사 | Freezimg pipe and ground freezing method using freezimg pipe |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01146376A (en) * | 1987-12-02 | 1989-06-08 | Stanley Electric Co Ltd | Chip led |
| JP2514414B2 (en) * | 1988-11-14 | 1996-07-10 | ローム株式会社 | Light emitting element resin sealing structure for printed circuit board |
| EP0424969A3 (en) * | 1989-10-27 | 1992-08-19 | Brother Kogyo Kabushiki Kaisha | Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus |
| JPH0465463U (en) * | 1990-10-19 | 1992-06-08 | ||
| JPH04111768U (en) * | 1991-03-14 | 1992-09-29 | 株式会社小糸製作所 | Mold structure of modular type LED |
| JP2704321B2 (en) * | 1991-05-22 | 1998-01-26 | シャープ株式会社 | Method for manufacturing optical semiconductor device |
| JP2787388B2 (en) * | 1992-03-06 | 1998-08-13 | シャープ株式会社 | Light emitting device lens molding method |
| US5607227A (en) * | 1993-08-27 | 1997-03-04 | Sanyo Electric Co., Ltd. | Linear light source |
| NL9401104A (en) * | 1994-07-01 | 1996-02-01 | Fico Bv | Method, carrier and mold parts for encapsulating a chip. |
| CA2180807C (en) | 1996-07-09 | 2002-11-05 | Lynda Boutin | Integrated circuit chip package and encapsulation process |
| DE19833039A1 (en) * | 1998-07-22 | 2000-01-27 | Elcos Gmbh Electronic Componen | Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination |
| JP3930710B2 (en) * | 2000-09-13 | 2007-06-13 | シチズン電子株式会社 | Chip-type light emitting diode and manufacturing method thereof |
| JP3801931B2 (en) | 2002-03-05 | 2006-07-26 | ローム株式会社 | Structure and manufacturing method of light emitting device using LED chip |
| DE102004033533B4 (en) * | 2004-07-09 | 2007-06-21 | G.L.I. Global Light Industries Gmbh | Light unit with integrated circuit board |
| WO2005056269A2 (en) * | 2003-12-09 | 2005-06-23 | G.L.I. Global Light Industries Gmbh | Method for the production of light-emitting semiconductor diodes on a printed circuit board, and illumination units comprising an integrated circuit board |
| DE10357818B4 (en) * | 2003-12-09 | 2009-10-08 | Odelo Gmbh | Method for producing light-emitting semiconductor diodes on a circuit board |
| JP5004410B2 (en) | 2004-04-26 | 2012-08-22 | Ｔｏｗａ株式会社 | Optical element resin sealing molding method and resin sealing molding apparatus |
| JP5128047B2 (en) | 2004-10-07 | 2013-01-23 | Ｔｏｗａ株式会社 | Optical device and optical device production method |
| US7344902B2 (en) | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| KR100784057B1 (en) * | 2005-06-24 | 2007-12-10 | 엘지이노텍 주식회사 | Light emitting device package and mauufacture method of light emitting device package |
| US7985357B2 (en) | 2005-07-12 | 2011-07-26 | Towa Corporation | Method of resin-sealing and molding an optical device |
| KR100621154B1 (en) * | 2005-08-26 | 2006-09-07 | 서울반도체 주식회사 | Light emitting diode manufacturing method |
| DE102005048498B4 (en) * | 2005-10-07 | 2007-06-21 | Schefenacker Vision Systems Germany Gmbh | Multicolored vehicle exterior light |
| CN100481546C (en) * | 2007-11-26 | 2009-04-22 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| TW201128812A (en) | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
| KR101034114B1 (en) * | 2009-12-01 | 2011-05-13 | 엘지이노텍 주식회사 | Light emitting device and manufacturing method |
| JP5343939B2 (en) * | 2010-07-08 | 2013-11-13 | 富士電機株式会社 | Manufacturing method of semiconductor device |
| KR101218367B1 (en) * | 2010-08-04 | 2013-01-03 | 에이프로시스템즈 (주) | Manufacturing method of lens and lens mounted board |
| US10164159B2 (en) * | 2016-12-20 | 2018-12-25 | Samsung Electronics Co., Ltd. | Light-emitting diode package and method of manufacturing the same |
| FR3065276B1 (en) * | 2017-04-12 | 2019-11-29 | Valeo Vision | OVERMOLDING AN OPTICAL ELEMENT ON A THERMOPLASTIC FRAME |
| CN113193096B (en) * | 2021-04-29 | 2022-09-16 | 吴冬梅 | Low-cost LED light-emitting device and preparation method thereof |
-
1984
- 1984-06-13 JP JP59121490A patent/JPS611067A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101487422B1 (en) * | 2012-12-20 | 2015-01-30 | 두산건설 주식회사 | Freezimg pipe and ground freezing method using freezimg pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS611067A (en) | 1986-01-07 |
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| JPS63293584A (en) | Light emitting display body | |
| JPH0367461U (en) |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |