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JPH0362032B2 - - Google Patents
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JPH0362032B2 - - Google Patents

Info

Publication number
JPH0362032B2
JPH0362032B2 JP59232210A JP23221084A JPH0362032B2 JP H0362032 B2 JPH0362032 B2 JP H0362032B2 JP 59232210 A JP59232210 A JP 59232210A JP 23221084 A JP23221084 A JP 23221084A JP H0362032 B2 JPH0362032 B2 JP H0362032B2
Authority
JP
Japan
Prior art keywords
cylinder
resin
light emitting
lead
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59232210A
Other languages
Japanese (ja)
Other versions
JPS61110477A (en
Inventor
Toshihiko Yasumura
Shigeki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59232210A priority Critical patent/JPS61110477A/en
Publication of JPS61110477A publication Critical patent/JPS61110477A/en
Publication of JPH0362032B2 publication Critical patent/JPH0362032B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、発光ダイオード(LED)等の発光
素子を使つて光をケースの前面から出すようにし
た発光表示器の製造方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing a light emitting display that uses a light emitting element such as a light emitting diode (LED) to emit light from the front of a case. .

〔従来の技術〕[Conventional technology]

発光ダイオード(LED)等の発光素子を使つ
た発光表示器1は、リード部2,2の先端の発光
素子部を合成樹脂性等の端面開放状平面視四角筒
等の不透明な筒体3内で少なくとも硬化後におい
て透明な熱硬化性合成樹脂4に封入し、前記両リ
ード部2,2の一端を外部に露出させて成るもの
で、該両リード部2,2に適宜の電圧を掛ける
と、発光素子部から発する光は前記透明な合成樹
脂4を通るが不透明な筒体では反射され、発光表
示器1のケース前面のみから外部に出るようにし
ている(第4図参照)。
A light emitting display 1 using a light emitting element such as a light emitting diode (LED) has the light emitting element part at the tip of the lead parts 2, 2 placed inside an opaque cylinder 3 made of synthetic resin or the like and having an open end and a rectangular cylinder in plan view. At least after curing, it is sealed in a transparent thermosetting synthetic resin 4, and one end of both the lead parts 2, 2 is exposed to the outside, and when an appropriate voltage is applied to the two lead parts 2, 2, The light emitted from the light emitting element portion passes through the transparent synthetic resin 4, but is reflected by the opaque cylinder, so that it exits only from the front of the case of the light emitting display 1 (see FIG. 4).

このような発光表示器1を製造する従来の方法
としては、第5図及び第6図に示すように、上面
に感圧性接着剤5を塗布した接着テープ6に、上
下端が開放された平面視四角状の筒体3の下端面
を押圧接着して、いわば筒体3の下端開口部を接
着テープ6にて封することにより仮の底が出来上
がるようにし、次いで、前記筒体3の上端開口部
から前記リード部2,2先端部を発光素子と共に
内部に臨ませた状態に保持し、筒体3内に透明な
熱硬化性合成樹脂4を流体状にして注入し、適宜
時間加熱して硬化させた後に、前記接着テープ6
を剥がすことにより完成させるか、図示しない
が、接着テープ6を仮に貼着した筒体3内に透明
な熱硬化性合成樹脂4を適宜量だけ注入し、適宜
時間加熱して硬化させた後に、前記接着テープ6
を剥がすことにより、筒体3の下端部に一旦底部
を形成し、該底部に異物や気泡のないものを選ん
でそれにリード部2,2先端部を発光素子部と共
に内部に臨ませた状態に保持し、再度筒体3内に
透明な熱硬化性合成樹脂4を流体状にて注入し、
加熱硬化させることにより完成させるようにして
いた。
As shown in FIGS. 5 and 6, a conventional method for manufacturing such a light emitting display 1 is to use an adhesive tape 6 coated with a pressure-sensitive adhesive 5 on the top surface, and a flat surface with open upper and lower ends. A temporary bottom is completed by press-bonding the lower end surface of the cylinder 3, which is square in appearance, and sealing the lower end opening of the cylinder 3 with an adhesive tape 6, and then the upper end of the cylinder 3. While holding the tips of the lead parts 2, 2 together with the light emitting element in the opening, inject a transparent thermosetting synthetic resin 4 in the form of a fluid into the cylinder 3, and heat it for an appropriate period of time. After curing the adhesive tape 6
Alternatively, although not shown, an appropriate amount of transparent thermosetting synthetic resin 4 is injected into the cylinder 3 to which adhesive tape 6 has been temporarily attached, and the resin is cured by heating for an appropriate period of time. The adhesive tape 6
A bottom is formed at the lower end of the cylindrical body 3 by peeling off the cylindrical body 3, and the bottom is chosen to be free of foreign matter and air bubbles, and the tips of the lead parts 2 and 2 are exposed to the inside together with the light emitting element part. The transparent thermosetting synthetic resin 4 is again injected into the cylinder 3 in a fluid state.
It was completed by heating and curing.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが、前記筒体の下端面にはバリ等が存在
し、また発光表示器Yの小型化に従つて筒体の下
端面の面積が小さくなると、接着テープ6におけ
る感圧性接着剤5との接着が不完全になり易く、
この接着不完全部分から前記流動状樹脂4が漏れ
出し筒体外壁に付着硬化してしまい、その部品は
外観不良品となる。他方、一定の発光面積を維持
しつつ、筒体3の下端面の面積を大きくすべく筒
体の肉厚を厚くすると、発光表示器1の外形が大
型化してしまう。
However, there are burrs etc. on the lower end surface of the cylinder, and as the area of the lower end surface of the cylinder decreases as the light emitting display Y becomes smaller, the adhesion with the pressure-sensitive adhesive 5 in the adhesive tape 6 is reduced. tends to be incomplete,
The fluid resin 4 leaks from this incompletely bonded portion and adheres to the outer wall of the cylindrical body and hardens, resulting in the part having a defective appearance. On the other hand, if the wall thickness of the cylindrical body 3 is increased in order to increase the area of the lower end surface of the cylindrical body 3 while maintaining a constant light emitting area, the external shape of the light emitting display 1 will become large.

またこの接着を完全にするため接着テープ6を
裏から強く押圧すると、筒体3の下端開口部分の
接着テープ6が湾曲変形し、合成樹脂4の硬化後
にはその下端面即ち発光面が湾曲状になり、これ
も不良の原因となる。しかも、この接着テープ6
は使い捨てであり、製造コストが高く付く問題が
あつた。
In addition, when the adhesive tape 6 is strongly pressed from the back side to ensure complete adhesion, the adhesive tape 6 at the lower end opening of the cylinder 3 is deformed into a curve, and after the synthetic resin 4 has hardened, its lower end surface, that is, the light emitting surface, becomes curved. This also causes defects. Moreover, this adhesive tape 6
The problem was that it was disposable and the manufacturing cost was high.

〔問題点を解決するための手段及び作用〕[Means and actions for solving problems]

そこで、本発明では、上下端開口した筒体の内
面に沿わせて注入した流動状の熱硬化性の合成樹
脂にて、当該筒体の下端開口部を封緘した後に、
加熱硬化させ、次いで筒体の下端部と前記硬化樹
脂の下端部とを適宜厚さだけ切削することによ
り、発光表示器用の底部付きのケースを製造する
方法であつて、筒体内に注入すべき流動状の樹脂
の粘性が高いことと表面張力の高いことを利用し
て、この樹脂を筒体内面に沿つて注入すると筒体
の下端開口部が樹脂にて塞がるから、その状態で
加熱硬化させると筒体下端開口部に透明の樹脂に
て底ができることになる。この硬化樹脂の下端部
と前記筒体の下端部とを適宜厚さだけ切り取る
と、その部分を平坦な発光面とする発光表示器を
形成することができる。
Therefore, in the present invention, after sealing the lower end opening of the cylindrical body with a fluid thermosetting synthetic resin injected along the inner surface of the cylindrical body whose upper and lower ends are open,
A method for manufacturing a case with a bottom for a light emitting display by heating and curing, and then cutting the lower end of the cylindrical body and the lower end of the cured resin to an appropriate thickness, the method comprising: Taking advantage of the high viscosity and surface tension of fluid resin, when this resin is injected along the inner surface of the cylinder, the bottom opening of the cylinder is closed with resin, and the resin is heated and cured in that state. A bottom is made of transparent resin at the bottom opening of the cylinder. By cutting off the lower end of this cured resin and the lower end of the cylindrical body by an appropriate thickness, it is possible to form a light-emitting display with a flat light-emitting surface at that portion.

しかも、流動状の樹脂を流し込み硬化させる途
次にその底の方に不純物、異物が沈澱するので前
記切り取り時にその不純物等を取り除くことがで
きる。
Furthermore, since impurities and foreign matter settle at the bottom during pouring and hardening of the fluid resin, these impurities can be removed during the cutting process.

〔実施例〕〔Example〕

次ぎに本発明の実施例を説明すると、第1図に
示すように、不透明な熱硬化性合成樹脂からなる
平面視四角筒状等の上下端開口させてなる筒体1
0を、複数個適宜間隔隔てて配設し、各筒体10
の左右両外側面をチヤツク11,11にて挟持
し、樹脂注入器12を各筒体10の上端開口部に
臨ませ、ここから流動性で、硬化後において透光
性を有する熱硬化性合成樹脂13を常温にて各筒
体10の内壁面に沿わせて流下させ、当該樹脂1
3の高粘性と表面張力の高いことを利用して各筒
体10の下端開口部が流動状の樹脂13にて塞が
れるようにする。この状態では、樹脂13の上面
は下向き凸湾曲状であり、下面は上向き凸湾曲状
となる(第1図参照)。
Next, an embodiment of the present invention will be described. As shown in FIG. 1, a cylindrical body 1 made of an opaque thermosetting synthetic resin and having a rectangular cylindrical shape in a plan view or the like is opened at the upper and lower ends.
0 are arranged at appropriate intervals, and each cylinder 10
The left and right outer surfaces of the cylinder body 10 are held between the chucks 11, 11, and the resin injector 12 is faced to the upper end opening of each cylinder body 10, from which a thermosetting synthetic resin is flowable and has translucency after curing. The resin 13 is caused to flow down along the inner wall surface of each cylindrical body 10 at room temperature.
By utilizing the high viscosity and high surface tension of the resin 13, the lower end opening of each cylindrical body 10 is closed with the fluid resin 13. In this state, the upper surface of the resin 13 has a downwardly convex curved shape, and the lower surface has an upwardly convex curved shape (see FIG. 1).

この状態にて、次ぎに加熱すると前記各筒体1
0内の樹脂13の粘度は一旦少し低くなり、その
下面も下向き凸湾曲状となるが、なお筒体下端開
口部が塞がれた状態を保持しそのまま硬化する
(第2図参照)。
In this state, when heated next, each cylinder 1
The viscosity of the resin 13 in the resin 13 becomes slightly lower once, and its lower surface also becomes downwardly convexly curved, but the lower end opening of the cylinder remains closed and hardens as it is (see FIG. 2).

この硬化完了後、第2図の一点鎖線14で示す
位置で図示しない切削具により、筒体10の下端
部と樹脂13下端部とにわたつて適宜厚さだけ切
り取ると、これによつて底付きのケース15が形
成されることになり、前記切断面は発光表示器1
の前面即ち発光面となる。
After this hardening is completed, an appropriate thickness is cut across the lower end of the cylinder 10 and the lower end of the resin 13 using a cutting tool (not shown) at the position indicated by the dashed line 14 in FIG. A case 15 is formed, and the cut surface is the light emitting display 1.
It becomes the front surface, that is, the light emitting surface.

他方、金属板材を打ち抜いて、発光ダイオード
を構成する一対のカソードリード16及びアノー
ドリード17とを適宜間隔で連設して成るリード
フレーム(図示せず)を構成し、前記各カソード
リード16の先端部に半導体チツプをマウント
し、対をなすカソードリード16とアノードリー
ド17にワイヤーボンデングを施すことにより、
発光素子部18を構成しておく。
On the other hand, a lead frame (not shown) is constructed by punching out a metal plate material and connecting a pair of cathode leads 16 and anode leads 17 constituting a light emitting diode at appropriate intervals, and the tips of each of the cathode leads 16 are By mounting a semiconductor chip on the part and performing wire bonding on the paired cathode lead 16 and anode lead 17,
The light emitting element section 18 is configured in advance.

次いで、第3図に示すように、前記ケース15
内にその上端開口部から前記両リード部16,1
7の下端と発光素子部18とを挿入し、さらに前
記樹脂13と同質の流動性を有する熱硬化性合成
樹脂19をケース15内に充填した後加熱硬化さ
せる。これにより、前記発光素子部18がケース
15内に封入される。
Next, as shown in FIG.
Both lead portions 16, 1 are inserted from the upper end opening thereof into
7 and the light emitting element portion 18 are inserted, and a thermosetting synthetic resin 19 having the same fluidity as the resin 13 is filled into the case 15 and then heated and cured. As a result, the light emitting element section 18 is enclosed within the case 15.

その後、前記前面を研磨する一方、前記リード
フレームを切り離してカソードリード16及びア
ノードリード17が分離するようにすれば、第4
図に示すような両リード部16,17の一端が外
部に突出した状態にて保持された発光表示器1を
完成さるものである。
Thereafter, while polishing the front surface, the lead frame is separated so that the cathode lead 16 and the anode lead 17 are separated.
As shown in the figure, the light emitting display 1 is completed which is held with one end of both lead parts 16 and 17 protruding to the outside.

〔発明の効用〕[Efficacy of invention]

このように、本発明では、上下端が開口した筒
体内壁に沿わせて流動状の樹脂を注入すると、そ
の樹脂の高い粘性のために筒体の下端開口部が塞
がれた状態になることを利用し、そのまま加熱硬
化した後に、その樹脂の下端部と筒体の下端部と
を切除すれば、自と発光面が形成できるのであ
り、従来のように接着テープを使用する必要がな
くその接着テープの分だけコストを低減できる。
In this way, in the present invention, when fluid resin is injected along the inner wall of the cylinder whose upper and lower ends are open, the lower end opening of the cylinder is closed due to the high viscosity of the resin. By taking advantage of this fact, after heating and curing, the lower end of the resin and the lower end of the cylinder can be cut off to form a light-emitting surface, eliminating the need to use adhesive tape as in the past. The cost can be reduced by the amount of adhesive tape.

ケース底部を形成する際の透明樹脂の硬化後
に、その下端部を適宜厚さだけ切削することによ
り、透光性樹脂を露出させるようにするので、発
光表示器の発光面となる箇所を平面状にすること
が簡単であると共に、樹脂注入時に混入する異
物、不純物がその底部に溜まり易いが、これらを
前記切削時に同時に切り取ることができ、この面
からも不良品をなくすることができると云う効果
を奏する。
After the transparent resin is cured when forming the bottom of the case, the lower end is cut to an appropriate thickness to expose the transparent resin, so the area that will become the light emitting surface of the light emitting display is flat. In addition, foreign matter and impurities that get mixed in when resin is injected tend to accumulate at the bottom, but these can be removed at the same time during the cutting process, which also makes it possible to eliminate defective products. be effective.

ケースの側板部の肉厚を薄くしても前記流動状
の樹脂の高粘性を利用した下端開口部の封緘をす
ることができるから、発光表示器の形状を小型化
することができる。
Even if the wall thickness of the side plate portion of the case is reduced, the lower end opening can be sealed using the high viscosity of the fluid resin, so the shape of the light emitting display can be reduced in size.

なお、本実施例では、流動性合成樹脂の注入を
2回に分けた場合を示したが、他の実施例とし
て、上下端開口した筒体内に予め上方からリード
部下端の発光素子部を挿入し、次いで、前記筒体
内面に沿わせて流動状の熱硬化性合成樹脂を、筒
体上面に来るまで一挙に注入すると、当該樹脂の
粘性及び表面張力が高いので、流動状樹脂は筒体
下端から漏れ出すことなく筒体内に留まる。
Although this example shows a case in which the flowable synthetic resin is injected into two parts, in another example, the light emitting element part at the lower end of the lead is inserted in advance from above into a cylinder whose upper and lower ends are open. Then, when a fluid thermosetting synthetic resin is injected all at once along the inner surface of the cylinder until it reaches the top surface of the cylinder, the resin has high viscosity and surface tension, so the fluid resin flows into the cylinder. It stays inside the cylinder without leaking from the bottom end.

この状態で加熱硬化し、その後筒体下端部と前
記硬化樹脂の下端部とを適宜厚さだけ切削する
と、前記実施と全く同様の効果を生ずると共に、
流動状合成樹脂の注入作業を一度で済ませること
ができる。
By heating and curing in this state and then cutting the lower end of the cylindrical body and the lower end of the cured resin to an appropriate thickness, the same effect as in the above embodiment is produced, and
The injection work of fluid synthetic resin can be completed in one go.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は筒体内へその内壁面に沿わせて流動性
樹脂を注入した状態を示す側断面図、第2図は加
熱硬化状態を示す側断面図、第3図は筒体内への
リード部の挿入と流動樹脂の注入状態を示す側断
面図、第4図は完成品の斜視図、第5図は従来例
を示す斜視図、第6図は第5図の−線視断面
図である。 1……発光表示器、2,2……リード部、3…
…筒体、4……熱硬化性樹脂、5……感圧性接着
剤、6……接着テープ、10……筒体、11,1
1……チヤツク、12……注入器、13,19…
…熱硬化性樹脂、15……ケース、16……カソ
ードリード、17……アノードリード、18……
発光素子部。
Fig. 1 is a side sectional view showing a state in which fluid resin is injected into the cylinder along its inner wall surface, Fig. 2 is a side sectional view showing the state of heating and hardening, and Fig. 3 is a side sectional view showing the lead portion inside the cylinder. FIG. 4 is a perspective view of the finished product, FIG. 5 is a perspective view of a conventional example, and FIG. 6 is a sectional view taken along the - line of FIG. 5. . 1... Light emitting indicator, 2, 2... Lead section, 3...
... Cylinder, 4 ... Thermosetting resin, 5 ... Pressure sensitive adhesive, 6 ... Adhesive tape, 10 ... Cylinder, 11, 1
1...chuck, 12...syringe, 13, 19...
...Thermosetting resin, 15...Case, 16...Cathode lead, 17...Anode lead, 18...
Light emitting element part.

Claims (1)

【特許請求の範囲】[Claims] 1 上下端開口した筒体の内面に合わせて注入し
た流動状の熱硬化性の合成樹脂にて、当該筒体の
下端開口部を封緘した後に、加熱硬化させ、次い
で筒体の下端部と前記硬化樹脂の下端部とを適宜
厚さだけ切削することを特徴とする発光表示器の
製造方法。
1. After sealing the lower end opening of the cylinder with a fluid thermosetting synthetic resin injected into the inner surface of the cylinder whose upper and lower ends are opened, the resin is heated and cured, and then the lower end of the cylinder and the A method for manufacturing a light emitting display, comprising cutting a lower end of a cured resin to an appropriate thickness.
JP59232210A 1984-11-02 1984-11-02 Manufacturing method of light emitting display Granted JPS61110477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59232210A JPS61110477A (en) 1984-11-02 1984-11-02 Manufacturing method of light emitting display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59232210A JPS61110477A (en) 1984-11-02 1984-11-02 Manufacturing method of light emitting display

Publications (2)

Publication Number Publication Date
JPS61110477A JPS61110477A (en) 1986-05-28
JPH0362032B2 true JPH0362032B2 (en) 1991-09-24

Family

ID=16935709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59232210A Granted JPS61110477A (en) 1984-11-02 1984-11-02 Manufacturing method of light emitting display

Country Status (1)

Country Link
JP (1) JPS61110477A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2007303511B2 (en) * 2006-09-28 2011-05-19 Sharp Kabushiki Kaisha Solar cell, concentrating solar power generation module, concentrating solar power generation unit, method of manufacturing solar cell, and solar cell manufacturing apparatus
US10790406B2 (en) 2014-04-07 2020-09-29 Solaero Technologies Corp. Parallel interconnection of neighboring space-qualified solar cells via a common back plane

Also Published As

Publication number Publication date
JPS61110477A (en) 1986-05-28

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