JPH0366132B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an apparatus for preheating a molding resin material (hereinafter referred to as a "tablet") used in a transfer molding machine.

[Prior art]

Generally, tablets used in transfer molding machines such as press equipment for semiconductor encapsulation need to be preheated, and there are no places near the transfer molding machine.
A tablet preheating device is provided. That is, the transfer molding machine and the tablet preheating device are usually arranged as a pair. Therefore, when a plurality of transfer molding machines are installed, the number of tablet preheating devices corresponding to those transfer molding machines is installed. This tablet preheating device usually uses a high frequency heating device. This high-frequency heating device has a high-frequency power source and a tablet preheating electrode section connected to the high-frequency power source, but it is thought that disposing the high-frequency power source and the tablet preheating electrode section apart may cause power loss. ing. Therefore, conventionally, a high frequency heating device has been used in which a high frequency power source and a tablet preheating electrode part are integrated.

Therefore, when a plurality of transfer molding machines are installed, the same number of tablet preheating devices installed corresponding to them each have a high frequency power source and an electrode section for tablet preheating. There is. For example, when two transfer molding machines are installed, the transfer molding machines and the tablet preheating device are installed as shown in FIG. That is, the two tablet preheating devices 1, 1 are connected to the tablet stocker 3 by the conveying devices 2, 2, respectively, and are connected to the transfer molding machines 5, 5 by the conveying devices 4, 4, respectively. has been done. As this transfer molding machine 5, for example, a press device for semiconductor encapsulation as shown in FIG. 6 is used.
This semiconductor encapsulation press device 5 has an upper crown 5b connected by four tie bars 5a.
and a lower bed 5c. A transfer cylinder 5d is supported on the upper surface of the crown 5b, and an upper mold 5e is supported on the lower surface. This upper mold 5e has a tablet inlet 5f.
and a pot of 5g is formed. Further, a lower mold 5i is supported on the upper surface of the platen 5h, which is controlled to move up and down by the four tie bars 5a, . . . . This lower mold 5i and the upper mold 5
When the molds are clamped together, a cavity is formed. Then, the preheated tablet T transported by the transport device 4
is inserted into the pot 5g from the tablet input port 5f.

The tablet preheating devices 1, 1 are both high frequency heating devices, and each has a high frequency power source and a tablet preheating electrode section.

[Problem that the invention seeks to solve]

However, as mentioned above, if each tablet preheating device is equipped with a high frequency power source and a tablet preheating electrode section, each tablet preheating device becomes relatively large, resulting in poor space efficiency, and the high frequency power source is expensive. Therefore, there was a problem of high cost. Moreover, if such a relatively large tablet preheating device is integrated with a transfer molding machine, the integrated device will be very large, and its handling (for example, transportation, installation, maintenance, There was also the problem that inspections, etc.) were difficult.

In view of the above-mentioned circumstances, the inventors of the present invention have conducted various studies and found that even if the high-frequency power source and the tablet preheating electrode section are configured separately, if the connecting cables between them are not made too long, there will be no loss due to high-frequency attenuation. I came to the conclusion that there was no need to make much of an issue.

Therefore, the present invention reduces the number of high-frequency power supplies by sequentially driving a plurality of tablet preheating electrode parts with one high-frequency power supply, thereby reducing the size of the entire device and reducing costs. With the goal.

[Means for solving problems]

In order to achieve the above object, the tablet preheating device for a transfer molding machine of the present invention includes a tablet preheating electrode section disposed corresponding to each of a plurality of transfer molding machines, one high frequency power source, The present invention is characterized by comprising a connection switching means for selectively connecting the high frequency power source to each of the tablet preheating electrode portions via a high frequency transmission cable.

Note that the distance between the transfer molding machines should be within 5 to 6 m, and the length of the high frequency transmission cable should be 2.5 to 3 m, taking into account the above-mentioned high frequency attenuation.
It is desirable that the attenuation rate is within a range of several percent to 10 percent.

[Effect]

Next, the operation of the tablet preheating device for a transfer molding machine of the present invention having the above-mentioned configuration will be explained.

A high frequency power source is connected to one of the plurality of tablet preheating electrode parts by the connection switching means,
The tablet preheating electrode section is driven. The tablet preheated by the driven tablet preheating electrode section is used in a transfer molding machine corresponding to the tablet preheating electrode section. After driving the one tablet preheating electrode section, the connection switching means switches and connects the high frequency power source to another tablet preheating power source section. Then, this newly connected tablet preheating electrode section is driven. Thereafter, by repeating this process, a plurality of tablet preheating electrode sections are sequentially driven by one high frequency power source.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, two semiconductor sealing press devices 6, 6' serving as transfer molding machines are respectively provided with tablet preheating electrode portions 7, 7'. These semiconductor sealing press devices 6 and 6',
The tablet preheating electrode parts 7 and 7' have the same structure, and the structure is shown in FIGS. 2 and 3.
The semiconductor encapsulation press device 6 and the tablet preheating electrode section 7 shown in the figure will be explained as examples.

As shown in FIG. 2, the semiconductor sealing press device 6 includes an upper crown 6b and a lower bed 6c connected by four tie bars 6a, . . . . A transfer cylinder 6d is supported on the upper surface of the crown 6b, and an upper mold 6e is supported on the lower surface. A tablet insertion opening 6f and a pot 6g are formed in this upper mold 6e. Further, a lower mold 6i is supported on the upper surface of the platen 6h, which is controlled to move up and down by the four tie bars 6a, . . . . When the lower mold 6i and the upper mold 6e are closed,
A cavity is beginning to form. The tablet T conveyed by a conveying device to be described later is inserted into the pot 6g from the tablet input opening 6f. In the above configuration, the semiconductor encapsulation press device 6 includes:
This is the same as the conventional semiconductor encapsulation press device 5, except that a stopper 6j that can be moved in and out is provided above the pot 6g, and a tablet preheating electrode section 7 is provided above the stopper 6j. There is a difference.

The tablet preheating electrode section 7 is shown in FIG. 3, and the structure of the tablet preheating electrode section 7 shown in FIG. 3 is conventionally known. This conventionally known tablet preheating electrode section 7
is a positive side electrode 7b surrounded by an insulator 7a and a pair of roller electrodes 7 in contact with this positive side electrode 7b.
c, 7c, and a ground side electrode 7d. These roller electrodes 7c, 7c and the ground side electrode 7d are attached above the stopper 6j in the upper mold 6e of the semiconductor sealing press device 6. And, in the tablet preheating electrode part 7,
High frequency power is supplied from the high frequency power supply 8. Therefore, the tablet T inserted through the tablet input port 6f is stopped by the stopper 6j projecting above the pot 6g, and is positioned within the tablet preheating electrode section 7. In this position, the tablet T
is preheated by the tablet preheating electrode section 7. After the tablet T is preheated, stopper 6
When the tablet T is retracted, the tablet T is placed into the pot 6g. The press device 6' for semiconductor encapsulation and the electrode section 7' for preheating the tablet are constructed in the same manner as the press device 6 for semiconductor encapsulation and the electrode section 7 for preheating the tablet described above.

In FIG. 1, tablet inlets 6f and 6 are connected to the tablet preheating electrode portions 7 and 7'.
f' is connected to the tablet stocker 10 by means of transport devices 9, 9'. Further, the tablet preheating electrode parts 7, 7' are connected to the high frequency transmission cable 1.
1 and 11', it is connected to connection switching means 12. The connection switching means 12 is attached to the high frequency power source 8 and is configured to selectively switch and connect the high frequency power source 8 to either the high frequency transmission cable 11 or 11'. Further, the connection switching means 12 and the high frequency power source 8
is disposed exactly between the tablet preheating electrode portions 7 and 7'. Therefore, the lengths of the high frequency transmission cables 11 and 11' are approximately equal. This equalizes the power loss caused by both high frequency transmission cables 11 and 11',
This is to supply the same amount of power to each tablet preheating electrode section 7, 7'. Next, the operation of the embodiment of the present invention having the above-described configuration will be explained.

First, the upper molds 6e, 6e' and the lower molds 6i, 6i' of the press apparatuses 6, 6' for semiconductor encapsulation are closed to form a cavity, and the semiconductor to be encapsulated is placed in the cavity. I'll keep it. Then, the tablet T (see FIGS. 2 and 3) stored in the tablet stocker 10 is transferred from the tablet stocker 10 to the tablet input port 6f of the semiconductor sealing press device 6, 6' by the conveying device 9, 9'. , 6f'. At this time, stopper 6
By making the pots 6g, 6j' project above the pots 6g, 6g', the tablet T is placed within the tablet preheating electrode portions 7, 7'. Next, the connection switching means 12 connects one of the tablet preheating electrode parts 7 and 7', for example, the tablet preheating electrode part 7, to the high frequency power supply 8, and then connects the high frequency power supply 8 to the high frequency power supply 8.
and drives the tablet preheating electrode section 7. Then, the tablet T present in the tablet preheating electrode section 7 is preheated. When the tablet T is preheated by the tablet preheating electrode section 7, the stopper 6j is retracted to
The preheated tablet T is dropped into a 6g pot. Next, when the transfer cylinder 6d is operated, the tablet T in the pot 6g is
flows into the cavity where the semiconductor is placed,
Used for semiconductor encapsulation. Thereafter, the conveying device 9 is operated and a new tablet T is placed into the tablet preheating electrode section 7.

Further, when the preheating of the tablet T by the tablet preheating electrode section 7 is completed, the connection switching means 12 is switched to connect the high frequency power source 8 to the tablet preheating electrode section 7'. Preheat the Tablet T in the and,
The same thing as in the case where the high frequency power source 8 is connected to the tablet preheating electrode section 7 is performed. By sequentially repeating the above operations, the tablet preheating electrode part 7
and 7', the tablets T are sequentially preheated.

According to the embodiment of the present invention described above, since the tablet preheating electrode parts 7 and 7' are attached to the semiconductor sealing press devices 6 and 6', respectively, the semiconductor sealing press can be used without cooling the preheated tablet T. It can be used in devices 6, 6'.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the embodiments described above, and various design changes can be made without departing from the scope of the invention described in the claims. Is possible.

For example, it is also possible to use a transfer molding machine other than the press equipment for semiconductor encapsulation, and the number of transfer molding machines is not limited to two.
It is also possible to have three or more.

Furthermore, instead of attaching the tablet preheating electrode parts 7, 7' to the semiconductor sealing press apparatus 6, 6', as shown in FIG. It may be configured separately from the press devices 6, 6', and a conveyance device may be disposed between them. At this time, the tablet preheating electrode parts 7, 7' and the semiconductor sealing press device 6,
6' with as short an interval as possible, the preheated tablet T can be supplied to the semiconductor sealing press devices 6, 6' before it cools down.

〔Effect of the invention〕

As described above, the tablet preheating device for a transfer molding machine of the present invention is configured by dividing the high frequency power source and the tablet preheating electrode section, and drives a plurality of tablet preheating electrode sections with one high frequency power source. This makes it possible to reduce the number of high-frequency power supplies. Therefore, the device as a whole can be made smaller, space efficiency is improved, and costs can be reduced. Moreover, since the tablet preheating electrode section can be constructed to be relatively small and lightweight, it can be easily attached to a transfer molding machine.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of a device using a tablet preheating device for a transfer molding machine according to the present invention, and FIG. 2 is a plan view of a transfer molding machine equipped with an electrode section for tablet preheating according to the same embodiment. 3 is an explanatory diagram of the tablet preheating electrode part of the same embodiment, FIG. 4 is a plan view of another embodiment of the device of the present invention, and FIG. 5 corresponds to FIG. 1. FIG. 6 is an explanatory diagram of a conventional example of a press apparatus for encapsulating a semiconductor. 6, 6'... Transfer molding machine (semiconductor encapsulation press equipment), 7, 7'... Tablet preheating electrode section, 11... Connection switching means, 8... High frequency power source.

Claims (1)

[Claims] 1. A tablet preheating electrode section 7 disposed corresponding to each of the plurality of transfer molding machines 6, 6';
7', one high frequency power source 8, and connection switching means 12 for selectively connecting this high frequency power source 8 to each of the tablet preheating electrode sections 7, 7' via high frequency transmission cables 11, 11'. Equipped with a tablet preheating device for transfer molding machines. 2. In the tablet preheating device for a transfer molding machine as set forth in claim 1, the connection switching means 12 is arranged at approximately the same distance from the plurality of transfer molding machines. Tablet preheating device for transfer molding machines.