JPH0370887B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] A method for manufacturing a multilayer chip inductor, in which a large number of coil conductor patterns of the same shape are formed on a non-conductive material, each is rotated by 90 degrees, stacked, cut, fired, and the side surface is formed. By connecting the through-holes formed in

[Industrial application field]

The present invention relates to a method of manufacturing a laminated chip inductor for use in hybrid integrated circuits, etc., and particularly to a method of manufacturing a laminated chip inductor that enables mass production.

In recent years, with the miniaturization of electronic components in electronic devices, chip-shaped components mounted on unitized circuit boards, such as chip-shaped inductors formed on ceramic substrates, have appeared. Since the inductor is spirally formed on a ceramic substrate, the space factor is poor and it is not suitable for high-density mounting.Therefore, there is a strong demand for the development of a manufacturing method for multilayer chip inductors that has a good space factor and is suitable for high-density mounting. .

[Conventional technology]

A conventional chip inductor has a structure in which a coil made of a conductor is wound around a ring-shaped magnetic material, or a conductive pattern is spirally formed on a substrate made of a dielectric material such as ceramic.

[Problem that the invention seeks to solve]

All of the conventional inductors mentioned above have problems such as a poor space factor due to their planar configuration, which hinders high-density packaging, making mass production difficult and expensive.

[Means for solving problems]

The present invention solves the above problems and provides a method for manufacturing a laminated chip inductor that has a good space factor and is suitable for high-density packaging.

That is, with four pieces as a reference unit A, a cross-shaped cutting line that divides the reference unit A into four equal parts is placed on a non-conductive material with dimensions equal to a plurality of reference units A in the same number vertically and horizontally + 1/2 reference unit A. A pilot hole for a through hole was bored in the center of the quarter line of the reference unit A, and a conductor pattern was formed in which a ring-shaped part was removed at the center of one of the reference units A, and the pattern that continued at both ends reached the pilot hole. Each of the non-conductive materials is rotated 90 degrees and stacked, a dummy non-conductive material is layered on top, cut along the cutting line, fired, and then the conductor is applied to the entire surface and the cut surface is placed under the through hole. This problem can be solved by polishing and firing the holes to less than 1/2.

[Effect]

The manufacturing method of the above-mentioned multilayer chip inductor is to make multiple units of 4 + 1/2 standard units on a plate made of the same magnetic material, the same number vertically and horizontally (the number when completed is an odd number), and the standard unit. It is suitable for mass production because it is manufactured by forming concentric and identical conductor patterns, rotating them 90 degrees, stacking them, cutting them, and firing them.

〔Example〕

FIG. 1 is a perspective view showing a conductor pattern formed thereon, explaining one embodiment of the present invention.

In the figure, four reference units A are formed on a non-conductive material 1 made of a magnetic material or the like. Then, on the non-conductive material 1 having the same number of reference units A in the vertical and horizontal directions (3.5 sheets each in the drawing) + 1/2 reference unit A, cross-shaped cutting lines 9 are placed on the non-conductive material 1 that divides the reference unit A into four equal parts. The pilot hole 21 of the through hole 2 is bored in the center of the quarter line.
Then, a conductor pattern 5 is formed in the center of one of the reference units A, with a ring-shaped part removed, and the pattern continuing at both ends reaches the pilot hole 21.

FIG. 2 is a diagram illustrating an embodiment of the present invention.
In the figure, a is an exploded perspective view, b is an assembled perspective view, and c is a circuit diagram, in which parts equivalent to those in FIG. 1 are given the same reference numerals.

In the figure, the non-conductive materials 1 made of magnetic material etc. explained in FIG. 1 are each rotated 90 degrees and stacked.
One semicircular through hole 2 of the conductor pattern 5 of the first sheet of magnetic material 1 matches the semicircular through hole 2 of the second sheet, which is different by 90 degrees, and then The through hole 2 matches the semicircular through hole 2 of the third sheet, which is 90° different. After stacking the required number of non-conductive materials 1 in this way, dummy non-conductive materials 6 are further stacked on the top surface, cut individually along cutting lines 9 and fired, and after coating the entire surface with a conductor, the cut surface is If the through hole 2 is polished to less than 1/2 of the diameter of the pilot hole 21 and fired, a multilayer chip inductor as shown in FIG. 2b is obtained. The circuit representation of this multilayer chip inductor is shown in Figure 2c.
It is.

In addition, in this example, the reference unit A is 3.5 pieces vertically and horizontally on the non-conductive material, but the number when completed is 1.5, 2.5, 3.5, 4.5...100.5 as long as it is an odd number.
It may be individual. Furthermore, although the conductor pattern has been described as being circular, it is not limited to the circular shape, but may be polygonal, such as triangular or square. Further, although the non-conductive material forming the conductive pattern is described as a magnetic material, it is not limited to a magnetic material, and may be an insulating material.

〔Effect of the invention〕

As is clear from the above description, the present invention enables mass production of multilayer chip inductors, can reduce costs, and is extremely effective for high-density mounting of mounted components.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conductor pattern formed thereon, illustrating an embodiment of the present invention, and FIG. 2 is a diagram illustrating an embodiment of the present invention.
is an assembled perspective view, and c is a circuit diagram. In the figure, 1 is a non-conductive material, 2 is a through hole, 5 is a conductive pattern, 6 is a dummy non-conductive material, 7
9 indicates a conductive portion between the laminated layers, 9 indicates a cutting line, and 21 indicates a pilot hole.

Claims (1)

[Claims] 1. With 4 pieces as the reference unit A, cut a cross-shaped cutting line dividing the reference unit A into four equal parts on the non-conductive material 1 with the dimensions of the same number of reference units A in the vertical and horizontal directions + 1/2 reference unit A. Pilot hole 2 of through hole 2 in the center of the quarter line of 9
1, and a ring-shaped part is removed at the center of one of the reference units A, and a conductor pattern 5 is formed at both ends of the non-conductive material 1, with the pattern extending to the pilot hole 21. Rotate and stack a plurality of sheets, further stack a dummy non-conductive material 6 on the top surface,
Manufacture of a multilayer chip inductor characterized in that it is cut along the cutting line 9 and fired, then coated with a conductor over the entire surface, polished to less than 1/2 of the diameter of the pilot hole 21 of the through hole 2, and fired. Method.