JPH0373385B2 - - Google Patents
Info
- Publication number
- JPH0373385B2 JPH0373385B2 JP59251093A JP25109384A JPH0373385B2 JP H0373385 B2 JPH0373385 B2 JP H0373385B2 JP 59251093 A JP59251093 A JP 59251093A JP 25109384 A JP25109384 A JP 25109384A JP H0373385 B2 JPH0373385 B2 JP H0373385B2
- Authority
- JP
- Japan
- Prior art keywords
- plate material
- frequency induction
- cooling plate
- target plate
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Physical Vapour Deposition (AREA)
Description
〔産業上の利用分野〕
この発明は、AlやAl合金、さらにMo、Ta、
Ｗ、タングステンシリサイド、及びモリブデンシ
リサイドなどのスパツタリング用ターゲツト板材
を、未接合部分の発生なく、Cuなどの冷却板材
にろう付けする方法に関するものである。
〔従来の技術〕
従来、一般に上記ターゲツト板材の上記冷却板
材への接合は、シート状ろう材を間に挾んでター
ゲツト板材と冷却板材を重ね合わせ、例えば抵抗
加熱炉において、真空中または不活性ガス雰囲気
中、重し載置による加圧状態で、前記ろう材の溶
融温度以上の温度に加熱してろう付けすることに
より行なわれている。
〔発明が解決しようとする問題点〕
しかしながら、上記の従来ろう付け方法におい
ては、加熱が輻射と熱伝導によつて行なわれるた
め、ターゲツト板材と冷却板材の被ろう付け体
は、その周辺部から温度が上昇し、その中央部の
昇温は遅れるようになり、この傾向は載置した重
しが熱の伝達を妨げるために一層顕著に現われる
ものであり、この結果ろう材も周辺部から溶融
し、中央部のろう材は遅れて溶融するようになる
ので、前記被ろう付け前の接合面の中央部に存在
する酸化物やガス成分が外部へ抜け出せないでそ
のまま残るようになり、接合部には多くの未接合
部分が発生するようになるという問題があり、さ
らに加熱炉中で使用できる重しには自づからその
大きさに限定があるので、接合面積の広い被ろう
付け体にあつては、その単位接合面積にかかる荷
重は小さくなることから、上記重しによる圧接で
は、その圧接力を大きくできないという制約があ
り、重しによる効果を得ることができない。
〔問題点を解決するための手段〕
そこで、本発明者等は、上記のような従来ろう
付け方法のもつ問題点を解決すべく研究を行なつ
た結果、
(1) シート状ろう材を間に挾んで重ね合わせたタ
ーゲツト板材と冷却板材の被ろう付け体を、所
定間隔をおいて互いに対向する一対の渦巻状の
高周波誘導コイル間に位置せしめて、前記被ろ
う付け体と前記高周波誘導コイル間に所定の平
行間隔を保持した状態で、前記被ろう付け体を
前記高周波誘導コイルで加熱すると、前記ろう
付け体中央部の温度が外周部の温度より速く上
昇するようになるので、上記の従来ろう付け方
法とは逆に、ろう材はその中央部から順次外方
に向つて溶融するようになり、それによつて接
合面間にある酸化物やガス成分は外方に向つて
経時的に溶融していくろうの流れに押されて外
部に排出されるようになるので、その接合面に
は前記酸化物やガス成分の残留が原因の未接合
部分が生じないこと。
(2) 上記被ろう付け体を、重しに代つて、上記高
周波誘導コイルを貫通して突出する加圧治具に
よつて加圧する構造にすると、前記加圧治具は
炉外に設置可能な、例えば油圧シリンダーなど
の加圧装置と連結できるので、炉中で重しを載
せるのに比べて、飛躍的に大きな圧力をかける
ことができること。
以上(1)および(2)に示される研究結果を得たので
ある。
この発明は、上記の研究結果にもとづいてなさ
れたものであつて、
シート状ろう材を間に挾んで重ね合わせたスパ
ツタリング用ターゲツト板材と冷却板材を、所定
間隔をおいて互いに対向する一対の渦巻状の高周
波誘導コイル間に位置せしめ、
前記ターゲツト板材と冷却板材を、前記高周波
誘導コイルを貫通して突出する加圧治具によつて
加圧した状態で、
真空中または不活性ガス雰囲気中、前記高周波
誘導コイルで加熱することにより前記シート状ろ
う材の中心部から外方へ向けての経時的溶融をは
かり、未接合部分の形成なく、前記ターゲツト板
材を前記冷却板にろう付けする方法に特徴を有す
るものである。
〔実施例〕
つぎに、この発明の方法を実施例により図面を
参照しながら説明する。
スパツタリング用ターゲツト板材として、半導
体デバイス内の配線および電極の形成に用いられ
る直径：200mm×厚さ：10mmの寸法をもつた高純
度Al円板材（純度：99.999％）を、冷却板材とし
て直径：200mmの寸法をもつた無酸素銅円板材を
用意した。
また、実施装置として、第１図に縦断正面図
で、第２図に縦断側面図で示され、第３図に高周
波誘導コイルと加圧治具の下方部分が平面図で示
される装置を用いた。
図示される通り、外径：50cm×長さ55cmの寸法
を有するSUS304製の円筒状容器（炉）１内に
は、断面が一辺：15mmの正方形を有する水冷銅パ
イプからなる一対の高周波誘導コイル２，２′が
所定間隔をおいて上下に対向して配置されてい
る。前記高周波誘導コイル２，２′は第３図に示
される通り外径：180mmに及ぶ円形の渦巻状を呈
し、この渦巻によつて形成された外周にそう環状
の〓間S1を貫通して、それぞれ直径：20mm×長
さ：100mmの寸法をもつた等間隔の６本の透明石
英製円柱状加圧部材３ａ，３a′が、また中央部の
〓間S2を貫通して直径：25mm×長さ：100mmの寸
法をもつた１本の同じく透明石英製円柱状加圧部
材３ｂ，３b′が突出し、前記加圧部材は基板３
ｃ，３c′にそれぞれ袋ナツトにより固着されて加
圧治具３，３′を形成している。
一方の前記加圧治具３は、油圧シリンダー４の
ピストン５の先端部に固着され、他方の前記加圧
治具３′はロードセル６上に支持されて加圧装置
が形成されている。
ついで、第４図に縦断正面図で示される通り、
温度制御を行なうために、水または油などの冷却
媒材が循環する内部通路（図示せず）を有し、か
つ熱電対８が挿入された純Al製ダミー板材７の
上下両側に、それぞれ上記のターゲツト板材Ａと
冷却板材Ｂとを、Sn−3.5重量％Agの組成および
50μｍの厚さを有するシート状ろう材を間に挾ん
で重ね合わせた状態で上記容器内の加圧装置にセ
ツトし、
上記容器内の雰囲気：５×10-4torrの真空、
上記高周波誘導コイル２，２′による加熱温度
（熱電対８で測定）：250℃、
上記加圧治具３，３′による付加圧力：２Kg
ｆ／cm2、
保持時間：15分、
の条件で本発明法を５回繰り返し行つた。
また、比較の目的で、上記重ね合わせ体を、上
記高周波誘導コイルに代えて、その外周にそつて
約４cm離れて側面配置したニクロム線により加熱
すると共に、上記加圧装置に代えて、20Kgの円板
状の重し２個を使用する以外は同一の条件で従来
法を行なつた。
ついで、それぞれ５回の上記本発明法および上
記従来法によつて得られたターゲツト板材と冷却
板材の接合面をＸ線観察し、接合面全体に対する
未接合部分（ろうのまわらない部分）の割合（面
積％）を算出し、この結果を第１表に示した。
[Industrial Application Field] This invention is applicable to Al and Al alloys, as well as Mo, Ta,
The present invention relates to a method for brazing a sputtering target plate material such as W, tungsten silicide, and molybdenum silicide to a cooling plate material such as Cu without producing any unbonded parts. [Prior Art] Conventionally, the target plate material and the cooling plate material are generally bonded by stacking the target plate material and the cooling plate material with a sheet-shaped brazing material in between, for example, in a resistance heating furnace, in a vacuum or in an inert gas atmosphere. Brazing is carried out by heating the solder material to a temperature higher than the melting temperature of the brazing material under pressure in an atmosphere by placing a weight on it. [Problems to be Solved by the Invention] However, in the conventional brazing method described above, since heating is performed by radiation and heat conduction, the objects to be brazed, which are the target plate material and the cooling plate material, are As the temperature rises, the rise in temperature in the center becomes delayed, and this tendency becomes more noticeable because the weight placed on it impedes heat transfer, and as a result, the brazing metal also melts from the periphery. However, since the brazing material in the center melts with a delay, the oxides and gas components present in the center of the joint surface before being brazed cannot escape to the outside and remain as they are, causing the joint to deteriorate. There is a problem in that many unwelded parts occur in this method, and there is a limit to the size of the weights that can be used in the heating furnace, so it is difficult to In this case, since the load applied to the unit bonding area is small, pressure welding using a weight has the limitation that the pressure welding force cannot be increased, and the effect of the weight cannot be obtained. [Means for Solving the Problems] Therefore, the present inventors conducted research to solve the problems of the conventional brazing method as described above, and found that: A body to be brazed consisting of a target plate material and a cooling plate material which are sandwiched and stacked together is positioned between a pair of spiral high frequency induction coils facing each other at a predetermined interval, and the body to be brazed and the high frequency induction coil are When the object to be brazed is heated by the high-frequency induction coil while maintaining a predetermined parallel interval between them, the temperature at the center of the object to be brazed rises faster than the temperature at the outer periphery. Contrary to conventional brazing methods, the brazing filler metal melts sequentially from the center outward, which causes oxides and gaseous components between the joint surfaces to melt outward over time. Since the melted wax is pushed by the flow and discharged to the outside, no unbonded portions due to residual oxides or gas components will occur on the bonded surfaces. (2) If the object to be brazed is pressurized by a pressurizing jig that protrudes through the high-frequency induction coil instead of a weight, the pressurizing jig can be installed outside the furnace. For example, since it can be connected to a pressurizing device such as a hydraulic cylinder, it is possible to apply significantly greater pressure than placing a weight inside the furnace. We obtained the research results shown in (1) and (2) above. This invention was made based on the above research results, and consists of a sputtering target plate material and a cooling plate material, which are overlapped with a sheet-shaped brazing filler metal sandwiched therebetween, in a pair of spirals facing each other at a predetermined interval. in vacuum or in an inert gas atmosphere, with the target plate material and the cooling plate material being pressurized by a pressurizing jig that protrudes through the high frequency induction coil, A method for brazing the target plate material to the cooling plate without forming an unbonded part by melting the sheet-shaped brazing material from the center outward over time by heating with the high-frequency induction coil. It has characteristics. [Example] Next, the method of the present invention will be described by way of an example with reference to the drawings. A high-purity Al disk material (purity: 99.999%) with dimensions of 200 mm in diameter and 10 mm in thickness, which is used for forming wiring and electrodes in semiconductor devices, was used as a target plate material for sputtering, and a diameter of 200 mm was used as a cooling plate material. An oxygen-free copper disk material with dimensions of was prepared. In addition, as an implementation device, an apparatus is used, which is shown in a longitudinal sectional front view in Fig. 1, a longitudinal sectional side view in Fig. 2, and a plan view of the high-frequency induction coil and the lower part of the pressure jig in Fig. 3. there was. As shown in the figure, inside a cylindrical container (furnace) 1 made of SUS304 with dimensions of outer diameter: 50 cm x length of 55 cm, there is a pair of high-frequency induction coils made of water-cooled copper pipes with a square cross section of 15 mm on each side. 2 and 2' are arranged vertically facing each other at a predetermined interval. As shown in Fig. 3, the high frequency induction coils 2, 2' have a circular spiral shape with an outer diameter of 180 mm, and a circular gap S1 is passed through the outer periphery formed by the spiral. , six equally spaced transparent quartz cylindrical pressure members 3a, 3a', each having dimensions of diameter: 20 mm x length: 100 mm, also pass through the gap S2 in the center and have a diameter of 25 mm. × Length: One cylindrical pressure member 3b, 3b' made of transparent quartz with a dimension of 100 mm protrudes, and the pressure member is attached to the substrate 3.
c and 3c', respectively, with cap nuts to form pressing jigs 3 and 3'. One of the pressure jig 3 is fixed to the tip of the piston 5 of the hydraulic cylinder 4, and the other pressure jig 3' is supported on the load cell 6 to form a pressure device. Next, as shown in the vertical front view in Fig. 4,
In order to control the temperature, the above-mentioned dummy plates 7 are installed on both upper and lower sides of a pure Al dummy plate 7, which has an internal passage (not shown) through which a coolant such as water or oil circulates, and in which a thermocouple 8 is inserted. The target plate material A and the cooling plate material B have a composition of Sn-3.5% by weight Ag and
The sheets of brazing filler metal having a thickness of 50 μm were sandwiched and stacked one on top of the other and set in the pressurizing device in the container, and the atmosphere in the container was a vacuum of 5×10 -4 torr and the high frequency induction coil. Heating temperature by 2, 2' (measured with thermocouple 8): 250℃, Additional pressure by the above pressure jig 3, 3': 2Kg
The method of the present invention was repeated five times under the following conditions: f/cm 2 , holding time: 15 minutes. For the purpose of comparison, the above-mentioned stacked body was heated by a nichrome wire placed on the side at a distance of about 4 cm along the outer periphery instead of the above-mentioned high-frequency induction coil, and in place of the above-mentioned pressurizing device, a 20 kg The conventional method was carried out under the same conditions except that two disc-shaped weights were used. Next, the bonded surfaces of the target plate material and the cooling plate material obtained by the above-mentioned method of the present invention and the above-mentioned conventional method were observed with X-rays five times each, and the ratio of the unbonded part (the part where the wax does not spread) to the entire bonded surface was determined. (Area %) was calculated and the results are shown in Table 1.
第１表に示される結果、従来法ではろうのまわ
らない未接合部分がかなりの割合で存在するが、
本発明法ではろうのまわりが完全で、ターゲツト
板材と冷却板材の接合は強固なものになることが
明らかである。
上述のように、この発明の方法によれば、ター
ゲツト板材と冷却板材の間に挾んだシート状ろう
材が、その中心部から順次外方に向つて溶融し、
これに伴つて接合面間に存在する酸化物やガス成
分が外方に向つて経時的に溶融していくろうの流
れに押されて外部へ排出されるようになると共
に、高周波誘導コイルを貫通して突出する加圧治
具による圧力が制限されることがなく、大きな圧
力をかけることできるので、未接合部分のない接
合面を形成することができるようになど工業上有
用な効果がもたらされるのである。
The results shown in Table 1 show that in the conventional method, there is a considerable proportion of unbonded parts that cannot be filled with solder.
It is clear that in the method of the present invention, the area around the solder is perfect and the joint between the target plate and the cooling plate is strong. As described above, according to the method of the present invention, the sheet-shaped brazing material sandwiched between the target plate material and the cooling plate material is sequentially melted outward from the center thereof,
Along with this, oxides and gas components existing between the joint surfaces are pushed outward by the flow of wax that melts over time and are discharged to the outside, and also penetrate the high frequency induction coil. Since the pressure caused by the pressure jig that protrudes from the surface is not restricted and a large amount of pressure can be applied, industrially useful effects such as the ability to form a bonded surface with no unbonded parts are brought about. be.
第１〜３図は本発明法の実施装置を示す図で、
第１図が縦断正面図、第２図は縦断側面図、第３
図が下方部分の高周波誘導コイルと加圧治具を示
す平面図、第４図は本発明法の実施態称を示す縦
断正面図である。
１……容器、２，２′……高周波誘導コイル、
３，３′……加圧治具、４……油圧シリンダー、
５……ピストン、６……ロードセル、７……ダミ
ー板材、８……熱電対、Ａ……ターゲツト板材、
Ｂ……冷却板材。
1 to 3 are diagrams showing an apparatus for implementing the method of the present invention,
Figure 1 is a vertical front view, Figure 2 is a vertical side view, and Figure 3 is a vertical front view.
The figure is a plan view showing the high frequency induction coil and the pressurizing jig in the lower part, and FIG. 4 is a longitudinal sectional front view showing an embodiment of the method of the present invention. 1... Container, 2, 2'... High frequency induction coil,
3, 3'...pressure jig, 4...hydraulic cylinder,
5... Piston, 6... Load cell, 7... Dummy plate material, 8... Thermocouple, A... Target plate material,
B...Cooling plate material.
Claims (1)
パツタリング用ターゲツト板材と冷却板材を、所
定間隔をおいて互いに対向する一対の渦巻状の高
周波誘導コイル間に位置せしめ、 前記ターゲツト板材と冷却板材を、前記高周波
誘導コイルを貫通して突出する加圧治具によつて
加圧した状態で、 真空中または不活性ガス雰囲気中、前記高周波
誘導コイルで加熱することにより前記シート状ろ
う材の中心部から外方へ向けての経時的溶融をは
かることを特徴とするスパツタリング用ターゲツ
ト板材を冷却板材にろう付けする方法。[Claims] 1. A sputtering target plate material and a cooling plate material, which are stacked with a sheet-shaped brazing material sandwiched between them, are positioned between a pair of spiral high-frequency induction coils facing each other at a predetermined interval, The target plate material and the cooling plate material are heated by the high frequency induction coil in a vacuum or in an inert gas atmosphere while the target plate material and the cooling plate material are pressurized by a pressurizing jig that protrudes through the high frequency induction coil, thereby forming the sheet. A method for brazing a target plate material for sputtering to a cooling plate material, characterized by melting the shaped brazing material from the center outward over time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25109384A JPS61159265A (en) | 1984-11-28 | 1984-11-28 | Method and device for joining plate-shaped member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25109384A JPS61159265A (en) | 1984-11-28 | 1984-11-28 | Method and device for joining plate-shaped member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61159265A JPS61159265A (en) | 1986-07-18 |
| JPH0373385B2 true JPH0373385B2 (en) | 1991-11-21 |
Family
ID=17217536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25109384A Granted JPS61159265A (en) | 1984-11-28 | 1984-11-28 | Method and device for joining plate-shaped member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61159265A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6471569A (en) * | 1987-09-10 | 1989-03-16 | Furukawa Electric Co Ltd | Production of heat exchanger |
| JP2854304B2 (en) * | 1988-02-16 | 1999-02-03 | 旭電化工業株式会社 | Method for producing elastic mold and method for producing molded article using elastic mold |
| JP5451865B1 (en) * | 2012-11-29 | 2014-03-26 | 株式会社俄 | Method for producing semi-finished product for jewelry and method for producing jewelry |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5350112U (en) * | 1976-09-30 | 1978-04-27 |
-
1984
- 1984-11-28 JP JP25109384A patent/JPS61159265A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61159265A (en) | 1986-07-18 |
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