JPH0374194B2 - - Google Patents
Info
- Publication number
- JPH0374194B2 JPH0374194B2 JP59117239A JP11723984A JPH0374194B2 JP H0374194 B2 JPH0374194 B2 JP H0374194B2 JP 59117239 A JP59117239 A JP 59117239A JP 11723984 A JP11723984 A JP 11723984A JP H0374194 B2 JPH0374194 B2 JP H0374194B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- protective film
- heat generating
- print head
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
この発明はサーマルプリントヘツドの製造方
法、特にリード導体に特徴を有するサーマルプリ
ントヘツドの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method of manufacturing a thermal print head, and more particularly to a method of manufacturing a thermal print head having features in lead conductors.
(ロ) 従来の技術
一般に、サーマルプリントヘツドは、第２図に
示すように、基板１上に形成される、ドツト２、
ドツト２に接続されるリード３、IC４、及びリ
ード５、さらにリード３とIC４、IC４とリード
５を接続するワイヤ６等から構成される場合が多
い。もつともIC４が外付けになつているものも
ある。(b) Prior Art In general, a thermal print head has dots 2, 2, and 3 formed on a substrate 1, as shown in FIG.
It is often composed of a lead 3, an IC 4, and a lead 5 that are connected to the dot 2, and a wire 6 that connects the lead 3 and the IC 4, and the IC 4 and the lead 5. However, there are some that have IC4 externally attached.
IC４を実装したもの、あるいは外付けしたも
のにかかわらず、これらサーマルプリントヘツド
のドツト２近傍の層構造は、第３図に示すように
なつている。同図において１１はセラミツク等が
使用される基板であり、この基板１１上に、発熱
抵抗体１２が形成され、さらにこの発熱抵抗体１
２上に、発熱部１３（ドツト２に相当）を除い
て、リード用の導体１４が形成され、さらに発熱
部１３及び導体１４を覆つて保護膜１５が形成さ
れている。このサーマルプリントヘツドにおい
て、導体１４→発熱抵抗体１２→導体１４の経路
で電流を流すと、発熱部１３が発熱し、この部分
が印刷紙に押しつけられると、その熱により、印
字が行われる。この場合、リード用の導体１４の
持つ抵抗値が大きいと、印字精度が悪くなる。し
たがつて、導体１４の抵抗値を小さくするため
に、導体１４の厚味を大にするとよいが、導体１
４の厚味を大にすると、発熱部１３の保護膜１５
の落ち込みが大きくなり、ドツトから感熱紙等へ
の熱移動の効率を下げるという問題がある。 Regardless of whether the IC 4 is mounted or externally attached, the layer structure near the dot 2 of these thermal print heads is as shown in FIG. In the figure, reference numeral 11 denotes a substrate made of ceramic or the like, and on this substrate 11, a heating resistor 12 is formed, and furthermore, this heating resistor 1
A conductor 14 for a lead is formed on the heat generating part 13 (corresponding to the dot 2), and a protective film 15 is further formed to cover the heat generating part 13 and the conductor 14. In this thermal print head, when a current is passed through the path of conductor 14→heating resistor 12→conductor 14, heat generating portion 13 generates heat, and when this portion is pressed against printing paper, printing is performed by the heat. In this case, if the lead conductor 14 has a large resistance value, printing accuracy will deteriorate. Therefore, in order to reduce the resistance value of the conductor 14, it is better to increase the thickness of the conductor 14.
When the thickness of 4 is increased, the protective film 15 of the heat generating part 13 is
There is a problem in that the drop in temperature becomes large and the efficiency of heat transfer from the dots to the thermal paper etc. decreases.
そこで、この問題を解決するために、従来の他
の例として第４図に示すように、発熱抵抗体１２
上に、発熱部１３を除いて、リード用の第１の導
体１４を形成し、この第１の導体上に、第１の導
体の発熱部１３近傍を除いて、第２の導体を形成
し、この第２の導体の厚味を大にしたものであ
る。このサーマルプリントヘツドによれば、発熱
部１３の保護膜１５の落込みがなだらかになるの
で、ドツトから感熱紙等への熱移動の効率も下が
らないし、また第２の導体を厚くできるので、リ
ード抵抗も小さくできる。 Therefore, in order to solve this problem, as another conventional example, as shown in FIG.
A first conductor 14 for a lead is formed on the first conductor except for the heat generating part 13, and a second conductor is formed on the first conductor except for the vicinity of the heat generating part 13 of the first conductor. , the thickness of this second conductor is increased. According to this thermal print head, the fall of the protective film 15 of the heat generating part 13 is gentle, so the efficiency of heat transfer from the dot to the thermal paper etc. does not decrease, and the second conductor can be thickened, so the lead Resistance can also be reduced.
(ハ) 発明が解決しようとする課題
上記した従来の第１の導体上に第２の導体を形
成するものは、この構造のサーマルプリントヘツ
ドを製作するには、第１の導体と第２の導体に異
なる材料を使用して、選択的エツチングを可能に
するか、もしくはバインダ層を設ける必要があ
り、工程が複雑になるという問題があつた。(c) Problems to be Solved by the Invention In the conventional method described above in which the second conductor is formed on the first conductor, it is necessary to form the first conductor and the second conductor in order to manufacture a thermal print head with this structure. It is necessary to use a different material for the conductor to enable selective etching or to provide a binder layer, complicating the process.
この発明は、上記問題点に着目してなされたも
のであつて、リード導体の抵抗値が小でドツトか
ら感熱紙への熱移動の効率が良いサーマルプリン
トヘツドが得られ、しかも製作が容易とし得るサ
ーマルヘツドの製造方法を提供することを目的と
している。 This invention was made in view of the above-mentioned problems, and provides a thermal print head that has a small resistance value in the lead conductor, has high heat transfer efficiency from the dots to the thermal paper, and is easy to manufacture. The object of the present invention is to provide a method for manufacturing a thermal head that obtains a thermal head.
(ニ) 課題を解決するための手段及び作用
この発明のサーマルプリントヘツドの製造方法
は、基板上に発熱抵抗体を形成し、この発熱抵抗
体上に発熱部を除いて第１の導体を形成し、前記
発熱低抗体の発熱部及び前記第１の導体の発熱部
近傍の部分を覆つて保護膜を形成し、その後に前
記第１の導体の端部及び保護膜端部に被さつて第
２の導体を形成するようにしている。(d) Means and effects for solving the problems In the method for manufacturing a thermal print head of the present invention, a heating resistor is formed on a substrate, and a first conductor is formed on the heating resistor excluding the heating part. A protective film is formed to cover the heat generating part of the heat generating hypoantibody and a portion of the first conductor near the heat generating part, and then a protective film is formed to cover the end of the first conductor and the end of the protective film. 2 conductors are formed.
この発明のサーマルプリントヘツドの製造方法
では、第１の導体を形成し、次に保護膜を形成
し、その後、第２の導体を、第１の導体と保護膜
に被さつて形成している。そのため第２の導体に
エツチングを適用する際、第１の導体が保護膜で
覆われているので、第１の導体がエツチングされ
ることはない。したがつて第１と第２の導体を同
一材料とすることも可能にでき、バインダ処理等
特別の処理も不要となる。 In the method for manufacturing a thermal print head of the present invention, a first conductor is formed, a protective film is formed next, and then a second conductor is formed by covering the first conductor and the protective film. . Therefore, when etching is applied to the second conductor, the first conductor is not etched because the first conductor is covered with the protective film. Therefore, the first and second conductors can be made of the same material, and special treatments such as binder treatment are not required.
(ホ) 実施例
以下、実施例により、この発明をさらに詳細に
説明する。(E) Examples The present invention will be explained in more detail below with reference to Examples.
第１図は、この発明の１実施例のサーマルプリ
ントヘツドを示している。このサーマルプリント
ヘツドは、セラミツクの基板２１上に、発熱抵抗
体２２が形成され、この発熱抵抗体２２上の発熱
部２３を除いて、リード用の第１の導体２４が形
成されている。この点、第４図に示した従来のサ
ーマルプリントヘツドと同様である。 FIG. 1 shows a thermal print head according to one embodiment of the invention. In this thermal print head, a heating resistor 22 is formed on a ceramic substrate 21, and a first conductor 24 for a lead is formed on the heating resistor 22, except for a heating portion 23. In this respect, it is similar to the conventional thermal print head shown in FIG.
また発熱部２３及び第１の導体２４の発熱部近
傍の部分２４ａを覆つて保護板２５が形成されて
いる。そして第１の導体２４の端部２４ｂと保護
膜２５の端部２５ａに被さつて第２の導体２６が
形成されている。そして発熱部２３の近傍の第１
の導体２４は薄く、また発熱部２３から離れた第
２の導体２６は厚くされている。そのため、保護
膜２５の端部２５ａに第２の導体２６が被さる部
分は、第２の導体２６の厚味により、若干突出す
るが、発熱部２３上に保護膜２５の表面は略平面
となる。第２の導体２６の厚味をある程度大にし
ても、この発熱部２３上の保護膜２５の平面性を
確保することができる。 Further, a protection plate 25 is formed to cover the heat generating portion 23 and a portion 24a of the first conductor 24 near the heat generating portion. A second conductor 26 is formed to cover the end 24b of the first conductor 24 and the end 25a of the protective film 25. And the first one near the heat generating part 23
The conductor 24 is thin, and the second conductor 26 remote from the heat generating part 23 is thick. Therefore, the portion where the second conductor 26 covers the end 25a of the protective film 25 protrudes slightly due to the thickness of the second conductor 26, but the surface of the protective film 25 on the heat generating part 23 is approximately flat. . Even if the thickness of the second conductor 26 is increased to some extent, the flatness of the protective film 25 on the heat generating portion 23 can be ensured.
また、この実施例サーマルプリントヘツドで
は、保護膜２５を形成した後で、第２の導体２６
を、第１の導体２４の端部２４ｂと保護膜２５の
端部２５ｂ上に形成するものであるから、エツチ
ングを施す部分の下方は保護膜２５を介在するこ
とになり、第２の導体２６のエツチングで、第１
の導体２４がエツチングされるおそれはない。そ
れゆえ、第１の導体２４と第２の導体２６は同一
材料を使用することができる。 Further, in this embodiment of the thermal print head, after forming the protective film 25, the second conductor 26 is
is formed on the end 24b of the first conductor 24 and the end 25b of the protective film 25, so the protective film 25 is interposed below the part to be etched, and the second conductor 26 is etched. With etching, the first
There is no risk that the conductor 24 will be etched. Therefore, the first conductor 24 and the second conductor 26 can use the same material.
(ヘ) 発明の効果
この発明によれば、この発明によつて製造され
るサーマルプリントヘツドは、発熱部表面の平面
性を確保して、リード導体の厚味を大にできるの
で、ドツトから感熱紙等への熱移動の効率を低下
させることなく、リードの抵抗値を下げることが
できるので、印字品質の良いものを得ることがで
きる。また、保護膜を形成した後で、第１の導体
の端部と保護膜の端部に被さつて第２の導体を形
成するものであるから、第２の導体のエツチング
を施す部分の下方が保護膜であり、第２の導体の
エツチングで第１の導体がエツチングされること
はない。そのため、第１の導体と第２の導体に同
一材料を使用しても、特別の処理を必要とせず
に、エツチング等が可能であり、製造工程が簡略
化でき、製造が容易となる。(F) Effects of the Invention According to the present invention, the thermal print head manufactured by the present invention can secure the flatness of the surface of the heat generating part and increase the thickness of the lead conductor, so that heat-sensitive Since the resistance value of the leads can be lowered without reducing the efficiency of heat transfer to paper etc., it is possible to obtain prints of good quality. In addition, since the second conductor is formed by covering the end of the first conductor and the end of the protective film after forming the protective film, the lower part of the second conductor to be etched is is a protective film, and the first conductor is not etched when the second conductor is etched. Therefore, even if the same material is used for the first conductor and the second conductor, etching, etc. can be performed without requiring any special treatment, and the manufacturing process can be simplified and manufacturing can be facilitated.
第１図は、この発明の１実施例のサーマルヘツ
ドを示し、第１図ａは同サーマルヘツドの発熱部
近傍の断面図、第１図ｂは同サーマルヘツドの部
分平面図、第２図は一般的なサーマルヘツドを示
す概略斜視図、第３図及び第４図は従来のサーマ
ルヘツドの発熱部近傍の断面図である。
２１…基板、２２…発熱抵抗体、２３…発熱
部、２４…第１の導体、２５…保護膜、２６…第
２の導体。
FIG. 1 shows a thermal head according to an embodiment of the present invention, FIG. 1a is a sectional view of the vicinity of the heat generating part of the thermal head, FIG. A schematic perspective view showing a general thermal head, and FIGS. 3 and 4 are cross-sectional views of the vicinity of the heat generating part of a conventional thermal head. 21... Substrate, 22... Heat generating resistor, 23... Heat generating section, 24... First conductor, 25... Protective film, 26... Second conductor.
Claims (1)
体上に発熱部を除いて第１の導体を形成し、前記
発熱抵抗体の発熱部及び前記第１の導体の発熱部
近傍の部分を覆つて保護膜を形成し、その後に前
記第１の導体の端部及び保護膜端部に被さつて第
２の導体を形成するようにしたことを特徴とする
サーマルプリントヘツドの製造方法。1. A heating resistor is formed on a substrate, a first conductor is formed on the heating resistor excluding the heating part, and the heating part of the heating resistor and a portion of the first conductor near the heating part are formed. A method of manufacturing a thermal print head, comprising: forming a protective film over the first conductor, and then forming a second conductor over the end of the first conductor and the end of the protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11723984A JPS60259467A (en) | 1984-06-06 | 1984-06-06 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11723984A JPS60259467A (en) | 1984-06-06 | 1984-06-06 | Thermal printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60259467A JPS60259467A (en) | 1985-12-21 |
| JPH0374194B2 true JPH0374194B2 (en) | 1991-11-26 |
Family
ID=14706826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11723984A Granted JPS60259467A (en) | 1984-06-06 | 1984-06-06 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60259467A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | 京セラ株式会社 | Thermal head and thermal printer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54128746A (en) * | 1978-03-29 | 1979-10-05 | Matsushita Electric Ind Co Ltd | Production of thin film type thermal head |
| JPS55103982A (en) * | 1979-02-01 | 1980-08-08 | Matsushita Electric Ind Co Ltd | Thermal printing head and preparation therefor |
| JPS57159672A (en) * | 1981-03-27 | 1982-10-01 | Ricoh Co Ltd | Thermal head and manufacture thereof |
-
1984
- 1984-06-06 JP JP11723984A patent/JPS60259467A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60259467A (en) | 1985-12-21 |
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