JPH0410859B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an apparatus for stamping a mark indicating the type and/or specifications of the electronic component on a synthetic resin molded part of the electronic component such as a transistor. It is related to.

[Conventional technology]

In general, the manufacturing of transistors is made from a thin metal plate into one transistor A, as shown in Figure 3.
A lead frame 1 consisting of a large number of base lead pieces 2, emitter lead pieces 3, and collector lead pieces 4 connected at a constant interval P is punched out, and the tips of the base lead pieces 2 at locations A of each transistor in the lead frame 1 are punched out. A semiconductor chip is die-bonded to the semiconductor chip, and then this semiconductor chip is bonded to an emitter lead piece 3 and a collector lead piece 4.
After wire bonding is performed between the lead pieces 2, 3, and
4 is sealed with a mode part 5 made of synthetic resin in a molding die, as shown in FIG. 4, and the lead pieces 2, 3, 4, leave one lead piece (base lead piece 2 in the figure) and cut the other lead pieces from the lead frame 1. Then, measure the performance of each transistor A connected to the lead frame 1, and measure the performance of each transistor A connected to the lead frame 1. Defective transistors with bonding defects and transistors that are good but out of the specified rank are cut and removed from the lead frame 1 as shown by the two-dot chain line in FIG. 6, and the remaining transistors connected to the lead frame 1 are removed. After stamping a mark a indicating the product type and/or specifications on the mold part 5 of each transistor A, the product transistor A is cut off from the lead frame 1 as shown in FIG. 7. .

As shown in FIG. 6, the following marking device has conventionally been used to stamp the mark a on the mold portion 5 of each transistor A connected to the lead frame 1.

That is, as shown in FIG. 8, the conventional stamping device places a plurality of rubber stamps 7 on the lower surface of a mounting table 9 on which a transistor A connected to a lead frame 1 is horizontally mounted, and a plurality of rubber stamps 7 on the lead frame 1. A stamping stand 6 provided at intervals P of transistors A is arranged so as to be movable up and down, and when the marking stand 6 is in the raised position, the ink supply roll 6 is in contact with each rubber stamp 7 as shown by arrow B. By reciprocating in the lateral direction, ink is adhered and supplied to each rubber stamp 7, and then the stamp stand 6 moves down toward the lead frame 1, and the stamp 7 is applied to the mold of each transistor A in the lead frame 1. By pressing the portion 5, the mark a was stamped.

[Problem that the invention seeks to solve]

However, in this conventional device, ink is adhered to and supplied to each rubber stamp 7 by bringing an ink supply roll 8 that reciprocates laterally into contact with each rubber stamp 7; When the reciprocating ink supply roll 8 comes into contact with the ink supply roll 8, it will be rubbed by the ink supply roll 8, so each of the rubber stamps 7 will be abraded, resulting in low durability of the rubber stamp, and the need to replace the rubber stamp frequently. Moreover, as shown in FIG. 6, the rubber stamps 7 at the positions corresponding to the defective transistors and out-of-rank transistors that have been removed from the lead frame 1 should be made to adhere to the ink supplied to the rubber stamps 7. The stamping operation is completed without being transferred to the transistor side, and ink is deposited and supplied again during the next reciprocating movement of the ink supply roll 8. In other words, the rubber stamp 7 at the location corresponding to the transistor cut out from the lead frame 1 is Since the ink is supplied twice and the amount of ink is increased, when the next time the rubber stamp 7 is used to stamp the transistor located directly below it, the ink may smudge and cause the marking. There were many cases where the mark a could not be identified, that is, it became a defective mark.

Therefore, the present invention aims to solve this problem.

[Means for solving problems]

For this reason, the present invention provides an up-and-down type stamping stand, which is provided with a plurality of rubber stamps on the bottom surface at intervals of each electronic component in the lead frame, above a lead frame in which a plurality of electronic components are connected. On the other hand, on the side of the lead frame, there are a plurality of ink tables corresponding to each of the rubber stamps on the stamp table, and an ink supply roll that reciprocates laterally while contacting the top surface of each ink table. an ink supply mechanism comprising: an ink supply mechanism configured to reciprocate the marking table between a position above the lead frame and a position above the ink table; It is constructed so that it can move downward independently.

[Action/effect of the invention]

In this configuration, when the marking table is in the raised position, the ink supply roll reciprocates, so that
When ink is adhered and supplied to the top surface of each ink table, the stamp table moves to a position above each ink table and then descends to press each rubber stamp on the bottom surface of the stamp table onto the top surface of the corresponding ink table. The ink on the top surface of each ink stand is transferred to each rubber stamp, and then the stamp stand moves to a position above the lead frame and then descends toward the lead frame, transferring each rubber stamp on the bottom surface of the ink stand to the lead frame. A mark is stamped by pressing the mold part of each transistor, and when this stamping is completed, the marking table moves up repeatedly to stamp the mark on each transistor on the lead frame.

Then, when supplying ink to each rubber stamp on the stamp stand, as described above, the present invention applies the following method:
Ink is supplied to each rubber stamp by adhering and supplying ink by an ink supply roll that reciprocates in the horizontal direction while in contact with the upper surface, and by pressing each rubber stamp on the upper surface of each ink table. Moreover, since the ink supply roll that reciprocates laterally does not come into contact with each rubber stamp as in the prior art described above, it is possible to prevent each rubber stamp from being worn out.

Moreover, in the present invention, each of the ink tables is configured to be able to move downward independently, so that when supplying ink to the upper surface of each ink table by reciprocating the ink supply roll in the lateral direction, By lowering any one of the ink beds lower than the other ink beds, it is possible to stop the supply of ink to the upper surface of the lowered ink bed. If some defective transistors or out-of-rank transistors are removed from among the transistors in the frame, by lowering the ink table corresponding to the removed transistors,
This prevents ink from being supplied twice to the rubber stamps corresponding to the removed transistors.

Therefore, according to the present invention, the durability of the rubber stamp can be improved and the labor required for replacing the rubber stamp can be reduced. Therefore, defects can be reliably prevented, and clear markings can be continuously stamped.

〔Example〕

The present invention will be explained below with reference to the drawings (FIG. 1) of an embodiment. In the drawing, 15 is a mounting table on which a lead frame 1 on which a plurality of transistors A are connected at a constant interval P is mounted in a substantially horizontal state; 10 is
It shows a stamping stand arranged above the above-mentioned placing stand 15,
A plurality of rubber stamps 11 are provided on the bottom surface of the stamp stand 10.
a, 11b, 11c, 11d, and 11e are provided at intervals P equal to those of the transistor A in the lead frame 1.

Reference numeral 12 indicates an ink supply mechanism disposed on the side of the lead frame 1, and the ink supply mechanism 12
are the respective rubber stamps 11a, 11b, 11c, 11
A plurality of ink stands 1 corresponding to each of d and 11e.
3a, 13b, 13c, 13d, 13e, and each ink table 13a, 13b, 13c, 13d, 13
The ink supply roller 14 reciprocates as shown by the arrow B while being in contact with the upper surface of the ink supply roller 14.

Note that ink is supplied to the outer peripheral surface of the ink supply roll 14, as is well known in the art, when the ink supply roll 14 returns to the position shown by the solid line in the drawing, the ink in the ink reservoir tank (not shown) is coated. This is done by being worn.

Each ink table 1 in the ink supply mechanism 12
3a, 13b, 13c, 13d, and 13e are configured to be able to move downward as shown by arrow C, while the marking stand 10 is positioned above the lead frame 1 and each of the ink stands 13a, 13
b, 13c, 13d, and 13e in the horizontal direction as shown by the solid line arrow D1 and the dotted line arrow D2, and at the upper position of the lead frame 1 as shown by the dotted line arrow E1 and the solid line arrow E2. After descending to
In the upper position of a, 13b, 13c, 13d, and 13e, it is configured to descend and then rise as shown by a solid arrow F1 and a dotted arrow F2.

When the marking table 10 is in the raised position as shown by the solid line in the figure, the ink supply roll 14 reciprocates as shown by the arrow B, so that each ink table 13a, 13b, 13c, 13d, 13e is When the ink is adhered and supplied to the upper surface, the marking table 10 is attached to each ink table 13a, 13 as shown by the solid arrow D1.
b, 13c, 13d, 13e, and then descend as indicated by the solid arrow F1, and each rubber stamp 11a, 11 on the lower surface of the stamping table 10
b, 11c, 11d, 11e respectively corresponding to the ink trays 13a, 13b, 13c, 13d,
By pressing the top surface of the rubber stamp 13e, the ink on the top surface of each ink stand 13a, 13b, 13c, 13d, 13e is applied to each rubber stamp 11a, 11b, 11c, 1.
It adheres and migrates to 1d and 11e.

When this is completed, the marking table 10 rises as shown by the dotted arrow F2, moves to a position above the lead frame 1 as shown by the dotted arrow D2, and then descends toward the lead frame 1 as shown by the dotted arrow E1. , stamp the mark a by pressing each rubber stamp 11a, 11b, 11c, 11d, 11e on the lower surface of the stamping table 10 to the mold part of each transistor A on the lead frame 1,
When this marking is completed, the marking table 10 repeats the upward movement as shown by the solid arrow E2, and stamps the mark a on each transistor A on the lead frame 1.

As shown in FIG. 6 among the transistors A in the lead frame 1, for example, if the third transistor from the left is determined to be a defective transistor or an out-of-rank transistor and is removed, each Ink stand 13a,
3 from the left among 13b, 13c, 13d, and 13e
As shown in FIG.
d, 13e by an appropriate height H, it is possible to stop only the supply of ink to the third ink table 13c.
Since the third transistor in the lead frame 1 is cut out from the lead frame, it is possible to prevent ink from being supplied twice to the third rubber stamp 11c. If the first transistor is removed, only the first ink table 13a needs to be lowered, and if two transistors in the lead frame 1 are removed, the corresponding All that is required is to lower the two ink tables.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of the device of the present invention, FIG. 2 is a diagram showing the operating state of FIG. 1, FIGS.
5, 6, and 7 are diagrams showing the manufacturing process of a transistor, and FIG. 8 is a side view showing a conventional device. 1... Lead frame, A... Transistor, a... Marking, 15... Lead frame mounting stand, 10... Stamping stand, 11a, 11b, 11c,
11d, 11e...Rubber stamp, 12...Ink supply mechanism, 13a, 13b, 13c, 13d, 13e
...Ink stand, 14...Ink supply roll.

Claims (1)

[Claims] 1. Above a lead frame in which a plurality of electronic components are connected, a vertically-elevating stamping stand having a plurality of rubber stamps provided on the bottom surface at intervals of each electronic component in the lead frame is disposed, while the lead frame On the side of the ink supply mechanism, the ink supply mechanism includes a plurality of ink tables corresponding to each of the rubber stamps on the stamp stand, and an ink supply roll that reciprocates in the lateral direction while being in contact with the top surface of each ink table. , the marking stand is configured to reciprocate between a position above the lead frame and a position above the ink stand, and each of the ink stands can be independently moved down. A marking device for a marking on an electronic component, characterized in that it is configured as follows.