JPH039867B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides an electronic component manufactured using a lead frame, such as a transistor, in which the type and specifications of the electronic component are printed on the synthetic resin molded portion, etc. This invention relates to a stamping device for stamping a mark such as a class.

[Conventional technology]

Generally, transistors are manufactured through the steps shown in FIGS. 4 to 9.

That is, first, as shown in FIG. 4, a lead frame is made of a thin metal plate, which is formed by connecting a large number of base lead pieces 2, emitter lead pieces 3, and collector lead pieces 4, which constitute one transistor, at a constant interval P. 1 is punched out, a semiconductor chip is die bonded to the tip of each base lead piece 2 in the lead frame 1, and then the semiconductor chip is wire bonded to the emitter lead piece 3 and the collector lead piece 4, and then the leads at each transistor location are die bonded. The tips of the pieces 2, 3, and 4 are sealed with a mold part 5 formed by molding a synthetic resin in a molding die, as shown in FIG.

Then, as shown in FIG. 6, among the lead pieces 2, 3, and 4 of each transistor, one lead piece (base lead piece 2 in the figure) is left and the other lead pieces are separated from the lead frame 1. By measuring the performance of each transistor connected to the lead frame 1, each transistor is classified according to its performance as, for example, a Q class transistor.
The transistors are classified into three classes: Aq, R class transistor Ar, and P class transistor Ap.

Then, as shown in FIG. 7, among the transistors, the P class transistor Ap is first cut off from the lead frame 1, and then, as shown in FIG. 8, the R class transistor Ar is cut off from the lead frame 1. Finally, as shown in FIG. 9, the Q-class transistor Aq is cut from the lead frame 1 to be manufactured.

Conventionally, as a means of stamping each of the transistors Aq, Ar, and Ap of different classes with a mark indicating the class, only a rubber stamp was used to mark the Q class on the transfer path of the lead frame 1. By providing a mark that can be moved up and down, only the Q class transistor Aq is marked with a mark a indicating the Q class before it is cut from the lead frame 1, while the P class transistor Ap and the R class transistor Ar are marked with a mark a indicating the Q class. After cutting them from the lead frame 1, they are arranged in a line in a parts feeder, and marks are individually stamped on each class of transistors using a stamping device equipped with a rubber stamp for each class. I was doing it.

[Problem to be solved by the invention]

However, this conventional method requires a step of separately cutting each class of transistors from the lead frame 1 and a step of separately stamping a mark on each class of transistors. The process is extremely complicated and productivity is low. Furthermore, the conventional method requires multiple parts feeders and marking devices for the transistors separated from the lead frame, making the entire device large. There was also a problem in that equipment costs increased as the technology became more sophisticated.

Furthermore, when aligning at the parts feeder,
Another problem was that the lead pieces were bent or the molded parts were damaged, making it easy to produce defective products.

The purpose of the present invention is to provide a stamping device that can reliably solve these productivity problems, problems related to the increase in size of the device, equipment costs, and problems such as the occurrence of defective products in the stamping process. That is.

[Means to solve the problem]

In order to achieve this object, the present invention provides a lead frame in which a plurality of electronic components are connected in a line at regular intervals, and a vertical movement mechanism is provided above a transfer path in which the lead frame is intermittently transferred at intervals of the electronic components. A marking table that is reciprocated up and down is arranged so as to be able to reciprocate in a horizontal direction intersecting the direction in which the lead frame is transported, and a mark indicating a class or the like is stamped on the electronic component on the lower surface of the marking table. A plurality of types of rubber stamps are provided in a row at appropriate intervals along a direction intersecting the direction of transport of the lead frame, while on the stamping stand,
A horizontal movement mechanism is provided for reciprocating the stamping stand at intervals of the rubber stamps in a horizontal direction intersecting the direction in which the lead frame is transported.

[Action/effect of the invention]

With this configuration, by reciprocating the stamping table in a direction perpendicular to the direction in which the lead frame is transported by the horizontal movement mechanism, any one of the plurality of rubber stamps provided on the bottom surface of the stamping table can be printed. The rubber stamp corresponding to the class of the electronic component located directly below the stamping stand can be positioned directly above the electronic component during transfer. By reciprocating horizontally, a specific type of mark can be selected according to the class of each electronic component being transferred while connected to the lead frame, without stamping other electronic components. This means that it can be stamped.

Therefore, according to the present invention, different types of markings can be selectively imprinted on each electronic component that is continuously transferred while being connected to a lead frame, depending on its class. Since the marking process for all electronic components can be performed simultaneously with other processes such as cutting when the lead frame is stopped for other processes such as cutting the electronic components, productivity of electronic parts is improved. Moreover, regardless of the class or number of electronic components, if one device consisting of a marking stand, a vertical movement mechanism, and a horizontal movement mechanism is installed on the lead frame transfer path, This has the effect of significantly reducing the size of the stamping device and significantly reducing equipment costs.

Furthermore, since all electronic components are stamped while connected to a lead frame, there is a risk of bending the electronic component lead wires or damaging the mold part during the stamping process, resulting in defective products. Accidents like this can be definitely prevented.

〔Example〕

Hereinafter, embodiments of the present invention will be explained based on drawings (Figs. 1 to 3) in which the markings of transistors as shown in Fig. 6 are applied. A transfer table is shown for intermittently transferring a large number of lead frames 1 connected at intervals at intervals of transistors, and above the transfer table 10 there is a measuring table for measuring the class of each transistor attached to the lead frame 1. A device 11 is provided.

Reference numeral 12 indicates a transfer table 1 at a position forward of the measuring device 11 in the transfer direction of the lead frame 1.
0 is shown, and the stamping stand 12 is shown above.
is arranged so that it can freely reciprocate up and down as shown by arrow C by a vertical movement mechanism (not shown), and can also freely reciprocate in a horizontal direction intersecting the transport direction of the lead frame 1 as shown by arrow D. and a rubber stamp 13q with the letters Q class engraved on the bottom surface of the stamp stand 12, according to the class of the transistor;
Rubber stamp 13r engraved with the letters R class, and P
Three types of rubber stamps 13p having class characters engraved thereon are arranged in a line at appropriate intervals along a direction (direction of arrow D) intersecting the direction of transport of the lead frame 1.

A servo motor is mounted on the stamping table 12 as an example of a horizontal movement mechanism for horizontally reciprocating the stamping table 12 in the D direction intersecting the transport direction of the lead frame 1 at intervals of the rubber stamps 13q, 13r, and 13p. 14, and the servo motor 14 and the measuring device 1 are classified into classes of transistors by the measurement by the measuring device 11.
When the rubber stamp corresponding to the class of transistor is located directly below the transistor, the stamp stand 12 is associated via the control circuit 15 so that the rubber stamp corresponding to the transistor of the class is located directly above the transistor.

In this configuration, for example, if an R class transistor Ar is sent directly below the stamp stand 12, the stamp stand 12 is moved to the R class rubber stamp 13.
Move it by the servo motor 14 so that r is positioned directly above the transistor Ar, and then move the stamping stand 1
2 toward lead frame 1 and move down, R
By pressing the class rubber stamp 13r onto the R class transistor Ar, a mark indicating that it is an R class transistor can be stamped on the R class transistor Ar.

In this way, while the lead frame 1 is being intermittently transferred, the servo motor 14 is used to move the marking table 12.
By reciprocating horizontally, only the specific rubber stamp corresponding to the class of transistor located directly below the stamping table 12 can be positioned directly above the transistor. For each of Ar and Ap, a mark indicating its class can be selectively stamped.

[Brief explanation of the drawing]

1 is a plan view showing an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, FIG. 3 is a sectional view of FIG. 1, and FIGS. 4, 5, and 6. Figure, 7th
8 and 9 are diagrams showing the manufacturing process of the transistor. 1... Lead frame, Aq, Ar, Ap... Transistor as an example of electronic component, a... Marking, 10
...Lead frame transfer table, 11...Measuring device, 1
2... Stamp stand, 13q, 13r, 13p... Rubber stamp,
14... Servo motor as an example of horizontal movement mechanism,
15...Control circuit.

Claims (1)

[Claims] 1. A marking table that is reciprocated up and down by a vertical movement mechanism is placed above a transfer path in which a lead frame in which a plurality of electronic components are connected in a line at regular intervals is transferred intermittently at intervals of the electronic components. A plurality of types of rubber stamps are disposed so as to be reciprocally movable in a horizontal direction intersecting the direction of transport of the lead frame, and are arranged on the bottom surface of the stamping table for stamping marks such as class marks on the electronic components. While the frames are arranged in a line at appropriate intervals along the direction intersecting the transport direction of the frame,
Stamping a mark on an electronic component, characterized in that the marking stand is provided with a horizontal movement mechanism configured to reciprocate the marking stand at intervals of the rubber stamp in a horizontal direction intersecting the direction of transport of the lead frame. Device.