JPH0413855B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a molded product removal device that takes out the molded product from a molding die device after sealing-molding an electronic component attached to a lead frame.

[Background Art] Conventionally, when taking out a molded product after encapsulating an electronic component, the molded product was manually taken out from a molding die device. For this reason, it had the drawback of poor productivity and the need for a large amount of manpower. In addition, since the runner cull taken out together with the molded product was separated in a separate process, an extra step was required and it was troublesome to separate the molded product and the runner cull.

[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to improve productivity by automatically taking out a molded product from a molding die device. At the same time, it is possible to save labor, and when the molded product is taken out, it is possible to confirm that the molded product is retained, and to prevent the molded product from remaining in the molding mold equipment.
Furthermore, it is an object of the present invention to provide a molded product ejecting device for electronic component sealing molding, which can separate the runner cull while holding the molded product, and can easily distinguish between the molded product and the runner cull.

[Disclosure of the Invention] The molded product ejecting device for electronic component encapsulation molding of the present invention includes a chuck body 31a that is movable by moving in and out through a sliding rod 30, and a chuck body 31a that is disposed on both sides of the chuck body 31a so as to be able to approach and separate from each other to open and close. A take-out chuck 31 is formed by a pair of slidable slide chucks 31b having a substantially L-shaped cross section, and a mounting recess on which the molded product 2 is placed on the lower horizontal piece of the slide chuck 31b with the slide chuck 31b closed. 42 is recessed, and the slide chuck 3 is placed in the mounting recess 42.
A sensor 4 that detects the molded product 2 held by 1b
3 is provided on the chuck main body 31a, and the runner cull separating device H for separating the runner cull 39 taken out integrally with the molded product 2 is removed and the chuck 31 is removed.
It is characterized in that it is attached in the vicinity of the conventional example, and by configuring it as described above, the drawbacks of the conventional example are solved. In other words, with the above configuration, the take-out chuck 31 can be moved to the molding die device A, and the slide chuck 31b can be moved to the molding die device A.
When the molded product 2 is opened and closed, the molded product 2 is taken out and held in the chuck 31, and the sensor 43 confirms that the molded product 2 is being held, and the taken out chuck 31 is moved so as to separate it from the molding die device A while holding the molded product 2. The molded product 2 is then taken out and the runner/cull 39 can be separated by the runner/cull separation device H when the molded product 2 is taken out. The molded product 2 can be taken out automatically, which improves productivity and saves labor.Moreover, the sensor 43 can detect when the molded product 2 is held in the take-out chuck 31, and the molded product 2 can be removed from the mold. It is now possible to prevent the molded product 2 from remaining in the device A, and when the molded product 2 is held and taken out by the take-out chuck 31, the runner cull 39 can be separated by the runner cull separation device H, and the runner cull 39 can be separated. This eliminates the need for an extra step of separation, and also makes it easier to differentiate between the molded product 2 and the runner cull 39.

The present invention will be explained in detail below with reference to Examples.

As shown in FIGS. 1a and 1b, a molding die device A and a molding material supplying device F are arranged on the molding device container 3. Molding mold device A is lead frame 1
This is a device for sealing electronic components by compression molding, and an upper mold 4 and a lower mold 5 are arranged to face each other vertically, as in a normal compression molding apparatus. The lead frame 1 is inserted into the cavity between the mold 4 and the lower mold 5, and molding material is supplied to the pot, and the upper mold 4 and the lower mold 5 are compressed to form a molded product 2. It is becoming possible to obtain it. The molding material supply device F includes a material hopper 6, a material measurer 7, a charging chute 8, and a conveying cylinder 9.
The main body is composed of the upper and lower cylinders 10, and the molding material supplied from the material hopper 6 is measured by the material measuring device 7 and supplied to the input chute 8.
The feeding tube 8 is moved above the pot of the mold by the conveyance cylinder 9, the charging tube 8 is lowered by the up/down cylinder 10, and the material is charged from the loading tube 8 into the pot. It is now being returned to its position. A lower support plate 12 is installed on top of the loading/unloading container 11, and an upper support plate 13 is installed above the lower support plate 12.
and the lower support plate 12 are connected by a guide shaft 14 that faces in the vertical direction. Elevating body 1 on guide shaft 14
5 is mounted so that it can be raised and lowered up and down, and the elevating body 15
is equipped with a frame loading device C and a molded product unloading device E of the present invention. This elevating body 15 can be raised and lowered by rotationally driving a ball screw shaft 17 with a servo motor 16. A frame rack B is arranged on the side of the elevating body 15 on the lower support plate 12, and the frame rack B is mounted on the mounting table 24 of the frame positioning device G.
The mounting table 24 of this frame positioning device G can be driven up and down by driving a ball screw shaft 18 with a step motor, thereby making it possible to move the frame rack B up and down and position it. There is. In this embodiment, a pair of frame racks B are arranged side by side. A frame rack B stores a large number of lead frames 1 mounted with electronic components in the vertical direction. The main body of the frame loading device C is composed of a loading chuck 19 and a sliding rod 20 slidably inserted into the elevating body 15. Below this sliding rod 20 is a fluid pressure drive unit 2.
1 is provided, and a drive body 2 in the fluid pressure drive unit 21 is provided.
By driving 2, a sliding rod 20 interlocking with a driving body 22 moves in and out. A pair of charging chucks 19 are attached to the tip of a sliding rod 20 so as to be perpendicular to the longitudinal direction of the sliding rod 20, and as shown in FIGS. 2a and 2b, a chuck main body 19a and a pair of slide chucks 19b The subject is constituted by That is, slide chucks 19b each having an L-shaped cross section are provided on both sides of the chuck body 19a so as to be able to approach and separate from each other.
b can be driven by a cylinder,
The lead frame 1 can be held by closing the pair of slide chucks 19b, and the lead frame 1 can be dropped downward by opening the pair of slide chucks 19b. A guide rail portion 41 on which the lead frame 1 is placed and slid is recessed on the lower horizontal piece of the slide chuck 19b. A set pin 26 urged upward by a spring 25 is attached to the tip side of the chuck body 19a, and a sensor 27 for detecting the lead frame 1 is provided near the set pin 26. The set pin 26 is tapered so that its lower end is pointed. Chuck body 1
A feed roller 28 serving as a frame feed device D is attached to the rear part of the frame 9a, and a rubber ring 29 is attached to the outer periphery of the feed roller 28. When the lead frame 1 is made to protrude from the frame rack B, the leading end of the lead frame 1 touches the chuck body 19a.
The lead frame 1 enters the guide rail section 41 between the slide chuck 19b and the slide chuck 19b, and the lead frame 1 is fed by the drive of the feed roller 28 motor. At the same time, the set pin 26 and the positioning hole of the lead frame 1 align, and the set pin 26 is pressed by air pressure from above.
enters the positioning hole to position the lead frame 1. The sensor 27 detects the presence or absence of the lead frame 1 and also detects the tip of the lead frame 1 to stop the rotation of the feed roller 28. The molded product take-out device E has substantially the same construction as the frame loading device C, and is mainly composed of a sliding rod 30 and a take-out chuck 31. A fluid pressure drive section 32 is provided below this slide rod 30, and by driving a drive body 33 of the fluid pressure drive section 32, the slide rod 30 interlocked with the drive body 33 moves in and out. There is. Removal chuck 31
A pair of chucks are attached to the tip of the sliding rod 30 so as to be perpendicular to the longitudinal direction of the sliding rod 30, and as shown in FIG. 6, the main body is composed of a chuck body 31a and a pair of slide chucks 31b. There is. In other words, slide chucks 31b having an L-shaped cross section are provided on both sides of the chuck body 31a so as to be able to approach and separate from each other, and the molded product 2 can be held by closing the pair of slide chucks 31b, and opening the pair of slide chucks 31b. This allows the molded product 2 to be inserted between the pair of slide chucks 31b. A mounting recess 42 for the lead frame 1 is provided on the lower horizontal piece of the slide chuck 31b. Further, a sensor 43 for detecting the presence or absence of the molded product 2 is provided on the chuck body 31a. A runner/cul separation device H is provided between the pair of take-out chucks 31. This runner/cull separation device H is composed of a pressing pin 34 and a cylinder 35 that drives the pressing pin 34.

Next, the operation of the apparatus constructed as described above will be explained. First, from the state shown in Figure 3a, frame rack B
1 pitch to the top lead frame 1.
and the feed roller 28 of the input chuck 19, and blow air from the air blowing nozzle 36 provided on the back of the frame rack B as shown in FIG. Insert it into the guide rail section 41 between it and the nail 19b. When the leading end of the lead frame 1 enters, the feed roller 28 is driven and the lead frame 1 moves forward along the guide rail portion 41 between the chuck body 19a and the slide chuck 19b. When the lead frame 1 is fed, the tip of the lead frame 1 hits the stopper 40, and when the sensor 27 detects the tip of the lead frame 1, the feed roller 28 is stopped, and air pressure is activated to stop the feed roller 28 as shown in Figs. 3c and 4. As shown in FIG. 2, the set pin 26 is inserted into the positioning hole to position the lead frame 1. The lead frame 1 is supplied one after another by moving the frame rack B up one pitch at a time by a frame positioning device G. Insert the lead frame 1 into the charging chuck 1 as shown in Figure 5a.
9, the sliding rod 20 is protruded, and the fifth
As shown in FIG. b, the charging chuck 19 is moved to a position above the lower mold 5. If the lead frame 1 falls or shifts its position when the charging chuck 19 moves, the sensor 27 detects this and the machine stops. In the above state, the elevating body 15 is lowered so that the charging chuck 19 is placed on the lower mold 5 as shown in FIG. 5c. Next, as shown in FIG. 5d, the slide chuck 19b is opened and the lead frame 1 is placed on the lower mold 5. At this time, the pilot pin 37 of the lower mold 5 fits into the positioning hole and is positioned. When the lead frame 1 is placed on the lower mold 5, the elevating body 15 is raised and the charging chuck 1 is raised.
9 is raised as shown in FIG. 5e, the slide rod 20 is retired, the charging chuck 19 returns to its original position, and the slide chuck 19b is closed.
On the other hand, the weighed molding material is supplied to the charging pit 8 of the molding material supply device F, the charging bowl 8 is projected above the lower mold 5, the charging bowl 8 is lowered to the pot, and the molding material is charged into the pot. Ru. After charging the molding material from the charging box 8, the charging box 8 returns to its original state. In this state, the upper mold 4 and the lower mold 5 are matched, pressed together and compression molded to seal and mold the electronic components of the lead frame 1 to form the molded product 2. The mold is released upward. When the upper mold 4 is released, the slide chuck 31 is released as shown in FIG. 6a.
When b is open, the sliding rod 30 protrudes and the ejecting chuck 31 protrudes, and the ejecting chuck 31
corresponds to the upper part of the molded product 2 of the lower mold 5, and the elevating body 15 is lowered to lower the take-out chuck 31 as shown in FIG. 6b. Next, the knockout pin 38 is driven to remove the molded product 2 and the runner cull 3.
9 is knocked out to make the molded product 2 and the runner cull 39 protrude upward as shown in FIG. It is held in the mounting recess 42 between the two. With the slide chuck 31b open in this way, the molded product 2 is knocked out and the molded product 2 is placed into the slide chuck 31.
If the molded product 2 is held between the slide chuck 31b and the slide chuck 31b, the molded product 2 can be held securely. When the molded product 2 is held in the take-out chuck 31, the molded product 2 is detected by the sensor 43, and it is confirmed that the molded product 2 and the runner cull 39 are not left in the lower mold 5 of the molding mold device A. It is also possible to detect if the molded product 2 or the runner cull 39 falls during the movement of the take-out chuck 31. Next, the elevating body 15 is raised with the molded product 2 held in the take-out chuck 31, and the sliding rod 30 is retired, so that the take-out chuck 31
is retiring. When the take-out chuck 31 is retired, the press pin 34 is driven and the runner cull 39
is made to fall. By separating the runner cull 39 while holding the molded article 2 in this manner, the molded article 2 and the runner cull 39 can be easily distinguished. When the take-out chuck 31 is retired and the runner cull 39 is separated, the slide chuck 3
1b is opened and the molded product 2 is taken out into a molded product rack or the like.

[Effects of the Invention] Since the present invention is configured as described above, the take-out chuck is moved to the molding mold device, the molded product is taken out by opening and closing the slide chuck, and held in the chuck, and the molded product is detected by the sensor. Check that the molded product is retained, move the take-out chuck so as to separate it from the mold device while holding the molded product, and take out the molded product.When taking out the molded product, the runner cull can be separated by the runner-cull separation device. The molded product can be held in the take-out chuck and automatically taken out from the molding mold device, which makes it possible to automate the take-out of the molded product, improve productivity and save labor. The sensor can detect when the mold is being held, preventing the molded product from remaining in the molding device, and preventing accidents such as the molding device being clamped even though the molded product remains. Since the molded product is detected by a sensor, it is possible to detect if the molded product falls while moving the ejection chuck.
Furthermore, when the molded product is held in the take-out chuck and taken out, the runner/cul can be separated by the runner/cul separation device, which eliminates the extra step of separating the runner/cul and also separates the molded product from the runner/cul. Furthermore, since it is easy to classify the types, it is easy to proceed to the next process (after separating the runners and cals, inserting the molded product from the take-out chuck into the molded product rack).

[Brief explanation of drawings]

FIG. 1a is a partially cutaway front view of an embodiment of the present invention, FIG. 1b is a side view of FIG. 1a, FIG. Figure 2b is a front sectional view of Figure 2a, Figure 3a,
b and c are side sectional views explaining the feeding state of the lead frame as above, Fig. 4 is a front sectional view of the lead frame held in the loading chuck as above, and Fig. 5 a, b, c, d, and e are Figures 6a, b, c, d, and e are front sectional views illustrating the operation of feeding the lead frame to the lower mold with the same feeding chuck as above, and the front sectional views illustrating the state of taking out the molded product as above. 2 is a molded product, 31 is a take-out chuck, 31
a is the chuck body, 31b is the slide chuck,
39 is a runner cull, 42 is a mounting recess, 43 is a sensor, and H is a runner cull separating device.

Claims (1)

[Claims] 1. A take-out chuck is formed by a chuck body that is movable by moving in and out of a sliding rod, and a pair of slide chucks having a substantially L-shaped cross section that are arranged on both sides of the chuck body so as to be able to approach and separate from each other and can be opened and closed. , a mounting recess on which the molded product is placed when the slide chuck is closed is provided on the lower horizontal piece of the slide chuck, and a sensor detects the molded product placed in the mounting recess and held by the slide chuck. A molded product ejecting device for electronic component encapsulation molding, characterized in that the chuck body is provided with a runner/cul separation device for separating the runner/cul taken out integrally with the molded product near the chuck. .