JPH0449252B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for inserting a lead frame into a molding die device when sealing molding an electronic component attached to the lead frame.

[Background Art] Conventionally, when sealing and molding electronic components, a lead frame containing the electronic components was manually placed into a molding die device. For this reason, it had the drawback of poor productivity and the need for a large amount of manpower. In addition, when doing it mechanically, it is possible to suction the lead frame with a suction pad, move it onto the lower mold of the molding mold device, and drop the lead frame onto the lower mold by releasing the suction. It is difficult to position and hold the lead frame or position and place it on the lower mold, and it is difficult to accurately insert the lead frame into a predetermined position of the lower mold.

[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to automatically insert a lead frame into the lower mold of a forming mold device by mechanical means. This improves productivity and saves labor. Furthermore, the lead frame can be positioned and held in the charging chuck, and the lead frame can also be positioned and placed on the lower mold, making it possible to accurately place the lead frame in the specified position on the lower mold. An object of the present invention is to provide a method for inserting a lead frame into a molding die device for electronic component sealing molding, which allows the lead frame to be inserted into a molding die device.

[Disclosure of the Invention] A method for charging a lead frame into a molding mold device for encapsulation molding of an electronic component according to the present invention is as follows.
Close the slide chuck 19b of No. 9, hold the lead frame 1 in the charging chuck 19, insert the tapered set pin 26 with a sharp tip into the first positioning hole 45 of the lead frame, and position the lead frame 1. The held charging chuck 19 is moved onto the lower mold 5 of the molding mold apparatus A which has been opened, and the charging chuck 19 is lowered to bring the lead frame 1 close to the upper surface of the lower mold 5, and the lead frame 1 is moved into the lower mold 5. Insert the upright tapered pilot pin 37 into the second positioning hole 46 of the lead frame 1, and in this state, pull out the set pin 26 from the first positioning hole 45 and open the slide chuck of the closing chuck 19. Open 19b and drop the lead frame 1 onto the lower mold 5, and then open the charging chuck 1.
9 is raised to move the charging chuck 19 away from the molding die device A, and by configuring it as described above, the drawbacks of the conventional example are solved. In other words, the lead frame 1 is held in the charging chuck 19 and moved onto the lower mold 5, and the slide chuck 19b is opened to feed the lead frame 1 into the lower mold 5. can be charged into the lower mold 5, improving productivity and saving labor.Moreover, when the lead frame 1 is held in the charging chuck 19, the set pin 26 can be inserted into the first positioning hole 45 to position the lead frame 1. The pilot pin 37 can be held in the second positioning hole 4 before the lead frame 1 is dropped into the lower mold 5.
6, the lead frame 1 can be positioned, placed on the lower mold 5, and the lead frame 1 can be positioned at a predetermined position and placed accurately.

The present invention will be explained in detail below with reference to Examples.

As shown in FIGS. 1a and 1b, a molding die device A and a molding material supplying device F are arranged on the molding device container 3. Molding mold device A is lead frame 1
This is a device for sealing electronic components by compression molding, and an upper mold 4 and a lower mold 5 are arranged to face each other vertically, as in a normal compression molding apparatus. The lead frame 1 is inserted into the cavity between the mold 4 and the lower mold 5, and molding material is supplied to the pot, and the upper mold 4 and the lower mold 5 are compressed to perform compression molding to obtain the molded product 2. It is now possible to do so. A pilot pin 37 for positioning is provided protruding from the upper surface of the lower mold 5, and the pilot pin 37 is formed into a tapered shape so that the upper end thereof is pointed. The molding material supply device F includes a material hopper 6, a material measurer 7, a charging chute 8, and a conveying cylinder 9.
The main body is composed of the upper and lower cylinders 10, and the molding material supplied from the material hopper 6 is measured by the material measuring device 7 and supplied to the input chute 8.
The feeding tube 8 is moved above the pot of the mold by the conveyance cylinder 9, the charging tube 8 is lowered by the up/down cylinder 10, and the material is charged from the loading tube 8 into the pot. It is now being returned to its position. A lower support plate 12 is installed on top of the loading/unloading container 11, and an upper support plate 13 is installed above the lower support plate 12.
and the lower support plate 12 are connected by a guide rod 14 that faces in the vertical direction. Lifting body 1 on guide rod 14
5 is mounted so that it can be raised and lowered up and down, and the elevating body 15
There is a frame loading device C and a molded product unloading device E.
It is equipped with. This elevating body 15 can be raised and lowered by rotationally driving a ball screw shaft 17 with a servo motor 16. Lower support plate 12
At the top, a frame rack B is arranged on the side of the elevating body 15, and the frame rack B is mounted on a mounting table 24 of a frame positioning device G. The mounting table 24 of this frame positioning device G can be driven up and down by driving a ball screw shaft 18 with a step motor, so that the frame rack B can be moved up and down and positioned. . In this embodiment, a pair of frame racks B are arranged side by side. A frame rack B stores a large number of lead frames 1 mounted with electronic components in the vertical direction. The main body of the frame loading device C is composed of a loading chuck 19 and a sliding rod 20 slidably inserted into the elevating body 15.
A fluid pressure drive section 21 is provided below the slide rod 20, and the slide rod 2 is interlocked with the drive body 22 by driving a drive body 22 in the fluid pressure drive section 21.
0 is going in and out. A pair of charging chucks 19 are attached to the tip of a sliding rod 20 so as to be perpendicular to the longitudinal direction of the sliding rod 20, and as shown in FIGS. 2a and 2b, a chuck main body 19a and a pair of slide chucks 19b It is mainly composed of. In other words, the cross section L is on both sides of the chuck body 19a.
A pair of slide chucks 19b are provided so as to be movable close to and apart from each other, and the pair of slide chucks 19b can be driven by a cylinder, and the lead frame 1 can be held by closing the pair of slide chucks 19b. By opening the pair of slide chucks 19b, the lead frame 1 can be dropped downward. A guide rail portion 41 on which the lead frame 1 is placed and slid is recessed on the lower horizontal piece of the slide chuck 19b. A set pin 26 urged upwardly by a spring 25 is attached to the tip side of the chuck body 19a, and a sensor 27 for detecting the lead frame 1 is provided near the set pin 26. The set pin 26 is tapered so that its lower end is pointed. At the rear of the chuck body 19a, a feed roller 28 serving as a frame feed device D is provided.
A rubber ring 29 is attached to the outer periphery of the feed roller 28. However, frame rack B
When the lead frame 1 is projected from the chuck, the tip of the lead frame 1 enters the guide rail portion 41 between the chuck body 19a and the slide chuck 19b, and the lead frame 1 is fed by the motor of the feed roller 28. The tip of the lead frame 1 hits the stopper 40 and the feed roller 28 is stopped, and at the same time, the set pin 26 and the first positioning hole 45 of the lead frame 1 align, and the set pin 26 is pressed by air pressure from above.
enters the first positioning hole 45 to position the lead frame 1. The sensor 27 detects the presence or absence of the lead frame 1 and also detects the tip of the lead frame 1 to stop the rotation of the feed roller 28. The molded product take-out device E has substantially the same structure as the frame loading device C, and is mainly composed of a sliding rod 30 and a take-out chuck 31.
A fluid pressure drive section 32 is provided below the slide rod 30, and the slide rod 30 is interlocked with the drive body 33 by driving the drive body 33 of the fluid pressure drive section 32.
are starting to come in and out. A pair of take-out chucks 31 are attached to the tip of the slide bar 30 so as to be perpendicular to the longitudinal direction of the slide bar 30, and as shown in FIG. It is configured. In other words, slide chucks 31b having an L-shaped cross section are provided on both sides of the chuck body 31a so as to be able to approach and separate from each other, and the molded product 2 can be held by closing the pair of slide chucks 31b, and opening the pair of slide chucks 31b. This allows the molded product 2 to be inserted between the pair of slide chucks 31b. Slide chuck 31b
The mounting recess 42 for the lead frame 1 is placed on the lower horizontal piece of the
is provided. A runner-cul separation device H is provided between the pair of take-out chucks 31. This runner/cull separation device H is composed of a pressing pin 34 and a cylinder 35 that drives the pressing pin 34.

Next, the method of the present invention will be explained using the apparatus configured as described above. First, frame rack B is raised one pitch from the state shown in FIG. Air is blown out from the air blowing nozzle 36, and the tip of the lead frame 1 is placed into the guide rail section 41 between the feed roller 28 and the slide chuck 19b. When the leading end of the lead frame 1 enters, the feed roller 28 is driven and the lead frame 1 moves forward along the guide rail portion 41 between the chuck body 19a and the slide chuck 19b. When the lead frame 1 is fed, the tip of the lead frame 1 hits the stopper 40, and when the sensor 27 detects the tip of the lead frame 1, the feed roller 28 is stopped, and air pressure is activated to stop the feed roller 28 as shown in Figs. 3c and 4. Set pin 2 as shown in
6 is inserted into the first positioning hole 45 of the lead frame 1, and the lead frame 1 is positioned.
In this way, the set pin 26 is inserted into the first positioning hole 4.
5, it is positioned and held by the charging chuck 19 and does not shift when moved.
Further, if the lead frame 1 is detected by the sensor 27 and the lead frame 1 falls while the charging chuck 19 moves, the fall can be detected and the machine can be stopped. The lead frame 1 is supplied one after another by moving the frame rack B up one pitch at a time by a frame positioning device G. Insert the lead frame 1 into the charging chuck 1 as shown in Figure 5a.
9, the sliding rod 20 is protruded, and the fifth
As shown in FIG. b, the charging chuck 19 is moved to a position above the lower mold 5. In the above state, the elevating body 15 is lowered so that the charging chuck 19 is placed on the lower mold 5 as shown in FIG. 5c. At this time, the pilot pin 37 is inserted into the second positioning hole 46 of the lead frame 1.
is inserted, and the lead frame 1 is positioned on the lower mold 5. Next, the set pin 26 is removed from the second positioning hole 46, the slide chuck 19b is opened, and the lead frame 1 is placed on the lower mold 5, as shown in FIG. 5d. At this time, if the opening of the slide chuck 19b is delayed by several seconds from the release of the set pin 26, the setting becomes stable. When the lead frame 1 is placed on the lower mold 5, the elevating body 15 is raised and the charging chuck 19 is raised as shown in FIG. At the same time, the slide chuck 19b is closed. On the other hand, the weighed molding material is supplied to the input box 8 of the molding material supply device F,
The charging chamber 8 is projected above the lower mold 5, and the charging chamber 8
is lowered into the pot and the molding material is poured into the pot. After charging the molding material from the charging box 8, the charging box 8 returns to its original state. In this state, the upper mold 4 and the lower mold 5 are matched, pressed together and compression molded to seal and mold the electronic components of the lead frame 1 to form the molded product 2. The mold is released upward. When the upper mold 4 is released, the slide chuck 31b is opened as shown in FIG. Molded product 2
The elevator 15 is lowered to correspond to the upper part of the sixth
The take-out chuck 31 is lowered as shown in Figure b. Next, the knockout pin 38 is driven to knock out the molded product 2 and the runner cull 39, causing the molded product 2 and the runner cull 39 to protrude upward as shown in FIG.
1b and slide the molded product 2 into the chuck 31b.
and the chuck main body 31a. Next, the molded product 2 is placed in the take-out chuck 31.
The elevating body 15 is raised while holding the slide bar 30, and the take-out chuck 31 is retired. When the take-out chuck 31 is retired, the push pin 34 is driven and the runner cull 39 is dropped. When the take-out chuck 31 is retired and the runner cull 39 is separated, the slide chuck 31b is opened and the molded product 2 is taken out into a molded product rack or the like.

[Effects of the Invention] Since the present invention is configured as described above, the lead frame can be held in the charging chuck and moved onto the lower mold, and the slide chuck can be opened to charge the lead frame into the lower mold. The lead frame can be automatically loaded into the lower mold by mechanical means, improving productivity and saving labor.However, when held in the charging chuck, the set pin is
The pilot pin can be inserted into the second positioning hole to position and hold the lead frame, and before the lead frame is dropped into the lower mold, the pilot pin can be inserted into the second positioning hole to position it and place it on the lower mold. The lead frame can be placed in a predetermined position and placed into the lower mold accurately, and the set pin inserted into the first positioning hole and the pilot pin inserted into the second positioning hole have sharp tips. Since it is tapered, even if the lead frame is slightly misaligned, it can be corrected and positioned without causing any problems in automation.

[Brief explanation of drawings]

FIG. 1a is a partially cutaway front view of an apparatus for carrying out the method of the present invention, FIG. 1b is a side view of FIG. 1a, and FIG. 2a is a side sectional view of the loading chuck of the same frame loading device. Figure 2b is a front sectional view of Figure 2a, Figures 3a, b, and c are side sectional views illustrating the feeding state of the lead frame in the above, and Figure 4 shows the lead frame held in the loading chuck in the same. Front sectional view of state, 5th
Figures a, b, c, d, and e are front cross-sectional views illustrating the operation of feeding the lead frame to the lower mold using the same charging chuck, and Figures 6 a, b, c, d, and e are the same as the above molding. It is a front sectional view illustrating the state in which the product is taken out, and 1 is a lead frame, 5 is a lower mold, 19 is a charging chuck, 19b is a slide chuck, 26 is a set pin, 37 is a pilot pin, and 45 is a first
The positioning hole 46 is a second positioning hole.

Claims (1)

[Claims] 1. Close the slide chuck of the input chuck, hold the lead frame in the input chuck, and insert a tapered set pin with a sharp tip into the first positioning hole of the lead frame to position it.
The charging chuck holding the lead frame is moved over the lower mold of the molding mold device with the mold opened, and the charging chuck is lowered to bring the lead frame closer to the top surface of the lower mold, and the tip of the lower mold is placed vertically. Insert a tapered pilot pin with a sharp point into the second positioning hole of the lead frame. In this state, pull out the set pin from the first positioning hole, open the slide chuck of the charging chuck, and place the lead frame on the lower mold. 1. A method for charging a lead frame into a molding die device for encapsulation molding of electronic parts, characterized by dropping the lead frame into a molding die device for electronic component sealing molding, and moving the charging chuck upward to move the charging chuck away from the molding device.