JPH04180243A - Film carrier - Google Patents
Film carrierInfo
- Publication number
- JPH04180243A JPH04180243A JP30957090A JP30957090A JPH04180243A JP H04180243 A JPH04180243 A JP H04180243A JP 30957090 A JP30957090 A JP 30957090A JP 30957090 A JP30957090 A JP 30957090A JP H04180243 A JPH04180243 A JP H04180243A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- film carrier
- openings
- punching
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004080 punching Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 239000000969 carrier Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はフィルムキャリアに関し、詳細には、熱転写プ
リンターのサーマルヘッド等に使用されるフィルムキャ
リアのように、絶縁フィルムからなる基材上に導体回路
を形成すると共にこの導体回路の一端上にバンプを形成
し、これを所定形状に打ち抜いて使用するフィルムキャ
リアに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a film carrier, and more particularly, to a film carrier used in a thermal head of a thermal transfer printer, etc., a conductor is coated on a base material made of an insulating film. The present invention relates to a film carrier on which a circuit is formed, a bump is formed on one end of the conductor circuit, and the bump is punched out into a predetermined shape.
（従来の技術）
フィルムキャリアとは、テープ状の絶縁フィルムからな
る基材上に鋼材等からなる導体回路を形成したものであ
り、これを所定形状に切り取って、各種の電子機器に使
用するものである。そして、この種のフィルムキャリア
には、第５図及び第６図に示したような熱転写プリンタ
ーのサーマルヘッド等に使用されるものがある。このフ
ィルムキャリアは、絶縁フィルムからなる基材（１０）
上に導体回路（２０）を形成すると共にこの導体回路（
２０）の一端（２１）上にバンプ（３０）を形成したも
のであり、第５図及び第６図の二点鎖線で示した打ち抜
き予定線（１２）の部分で所定形状に打ち抜かれて使用
されるものである。つまり、この種のフィルムキャリア
は、バンプ（３０）が形成された導体回路（２０）の一
端（２１）の近傍で打ち抜かれ、バンプ（３０）と打ち
抜かれた外形とのクリアランスが数十マイクロメーター
のオーダーとなるように形成されるものである。そして
、その打ち抜き加工は、第７図に示すような金型等を使
って行われるのである。(Prior art) A film carrier is a conductor circuit made of steel or the like formed on a base material made of a tape-shaped insulating film, which is cut into a predetermined shape and used in various electronic devices. It is. Some film carriers of this type are used in thermal heads of thermal transfer printers as shown in FIGS. 5 and 6. This film carrier has a base material (10) made of an insulating film.
A conductor circuit (20) is formed on top of the conductor circuit (20).
20) has a bump (30) formed on one end (21), and is used after being punched out into a predetermined shape at the punching line (12) indicated by the two-dot chain line in Figures 5 and 6. It is something that will be done. In other words, this type of film carrier is punched out near one end (21) of the conductor circuit (20) on which the bump (30) is formed, and the clearance between the bump (30) and the punched outer shape is several tens of micrometers. It is formed to have an order of . The punching process is performed using a mold as shown in FIG.
（発明が解決しようとする課題）
しかしながら、上述の金型等によってバンプ（３０）と
外形とのクリアランスが数十マイクロメートルのオーダ
ーとなるように打ち抜き加工を行う場合には、第８図に
示すように基材（ｌＯ）の伸びや治具等の影響により、
バンプ（３０）の先端や導体回路（２０）を金型で打っ
てしまったり、キズを付けてしまったりすることがあり
、打ち抜いた物が使用できない場合もあるといった不都
合がある。(Problem to be Solved by the Invention) However, when punching is performed using the above-mentioned mold or the like so that the clearance between the bump (30) and the outer shape is on the order of several tens of micrometers, as shown in FIG. Due to the elongation of the base material (lO) and the effects of the jig, etc.,
There are inconveniences such as the tip of the bump (30) or the conductor circuit (20) being hit or scratched by the mold, and the punched product may not be usable.
また、打ち抜く位置が不安定であるため、バンプ（３０
）と外形とのクリアランスが各製品ごとに異なり、品質
の上でも問題が残されていた。In addition, because the punching position is unstable, bumps (30
) and the external shape differed for each product, and there remained a problem in terms of quality.
そこで、案出されたのが本発明であって、その目的とす
るところは、打ち抜き加工を施す際に、バンプや導体回
路にキズ等を付けることなく、かつバンプと外形とのク
リアランスか一定となルヨうに打ち抜くことができるフ
ィルムキャリアを提供することにある。Therefore, the present invention was devised, and its purpose is to ensure that the bumps and conductor circuits are not scratched during punching, and that the clearance between the bumps and the external shape is constant. The purpose of the present invention is to provide a film carrier that can be easily punched out.
（課題を解決するための手段）
以上のような課題を解決するために、本発明か採った手
段は、図面に使用した符号を付して説明すると、
「絶縁フィルムからなる基材（１０）上に導体回路（２
０）を形成すると共にこの導体回路（２０）の一端（２
１）上にバンプ（３０）を形成し、これを所定形状に打
ち抜いて使用するフィルムキャリア（１００）において
、
前記バンプ（３０）が形成された導体回路（２０）の−
端（２１）の近傍であって、前記基材（ｌＯ）の打ち抜
き予定線（１２）上に開口（１１）を形成したことを特
徴とするフィルムキャリア（１００） Ｊ
をその要旨とするものである。(Means for Solving the Problems) In order to solve the above problems, the means taken by the present invention are explained using the reference numerals used in the drawings. Conductor circuit (2
0) and one end (2
1) In a film carrier (100) that is used by forming bumps (30) thereon and punching it into a predetermined shape, - of the conductor circuit (20) on which the bumps (30) are formed
The gist of the film carrier (100) J is characterized in that an opening (11) is formed near the end (21) and on the punching line (12) of the base material (lO). be.
つまり、このフィルムキャリア（１００）は、第１図及
び第２図に示すように打ち抜くべき予定線上の基材（１
０）に予め開口（１１）を設けると共に、この開口（１
１）から必要なりリアランスを取って導体回路（２０）
を形成したのである。In other words, this film carrier (100) is attached to the base material (100) on the planned line to be punched as shown in FIGS.
0) is provided in advance with an opening (11), and this opening (1
Take the necessary clearance from 1) and make the conductor circuit (20)
was formed.
なお、本発明は、熱転写プリンターのサーマルヘッドに
使用されるフィルムキャリア（１００）に限らず、種々
のフィルムキャリア（１００）に適用することができ、
導体回路（２０）の一端（２１）上にバンプ（３０）を
有しており、このバンプ（３０）の近傍を打ち抜いて使
用する他のフィルムキャリア（，１００）にも適用する
ことができることは勿論である。Note that the present invention is not limited to the film carrier (100) used in the thermal head of a thermal transfer printer, but can be applied to various film carriers (100).
The present invention can also be applied to other film carriers (100) that have a bump (30) on one end (21) of the conductor circuit (20) and are used by punching out the vicinity of this bump (30). Of course.
（発明の作用）
そして、上記のような手段を採ることにより、本発明に
係るフィルムキャリア（１００）は、次のように作用す
る。即ち、
打ち抜き予定線（１２）上の基材（１０）に予め開口（
１１）を設けておくことによって、打ち抜き予定線（１
２）に沿ってこのフィルムキャリア（１００）を金型に
より打ち抜く際に、第３図及び第４図に示すように、こ
の開口（１１）が基材（１０）の伸びや歪みを吸収する
ため、導体回路（２０）上に形成されたバンプ（３０）
が破損したり、キズ付いたりすることがないのである。(Function of the Invention) By adopting the above-mentioned means, the film carrier (100) according to the present invention functions as follows. That is, an opening (
11), the planned punching line (1
2) When punching out this film carrier (100) with a die, as shown in FIGS. 3 and 4, this opening (11) absorbs the elongation and distortion of the base material (10). , a bump (30) formed on the conductor circuit (20)
It will not be damaged or scratched.
また、導体回路（２０）は、予め形成された開口（１１
）から所定のクリアランスを持って容易に形成すること
ができるため、打ち抜いた後の製品にバラツキが生せず
、よって高品質のものとなるのである。Further, the conductor circuit (20) has an opening (11) formed in advance.
) can be easily formed with a predetermined clearance, so there is no variation in the punched product, resulting in high quality products.
（実施例）
次に、本発明に係るフィルムキャリア（１００）の一実
施例として、サーマルヘッドに使用されるフィルムキャ
リア（１００）を例に採って説明する。(Example) Next, as an example of the film carrier (100) according to the present invention, a film carrier (100) used in a thermal head will be described.
本実施例に係るフィルムキャリア（１００）は、第１図
及び第２図に示すような構成となっている。The film carrier (100) according to this embodiment has a structure as shown in FIGS. 1 and 2.
つまり、このフィルムキャリア（１００）は、ポリフェ
ニレンエーテル（Ｐ Ｐ Ｅ）やポリイミド、ガラスエ
ポキシ等の絶縁フィルムからなるテープ状の基材（１０
）に、パンチング加工によって連続するスプロケット孔
（１３）や開口（１１）を形成すると共に、接着剤（４
０）を介して貼着された銅箔を所定形状にエツチングし
て導体回路（２０）を形成し、さらにこの導体回路（２
０）の一端（２１）上にニッケルメッキからなる多数の
バンプ（３０）を形成してサーマルヘッドとしたもので
ある。そして、基材（１ｏ）上に形成される開口（１１
）は、後に打ち抜かれる予定線上に形成されており、ま
た、バンプ（３０）が形成される導体回路（２０）の一
端（２１）は、前記開口（１１）から２０μｍとなるよ
うに形成されている。In other words, this film carrier (100) is a tape-shaped base material (100) made of an insulating film such as polyphenylene ether (PPE), polyimide, or glass epoxy.
), continuous sprocket holes (13) and openings (11) are formed by punching, and adhesive (4) is formed in the holes (11) by punching.
A conductor circuit (20) is formed by etching the copper foil pasted through the conductor circuit (20) into a predetermined shape.
A large number of bumps (30) made of nickel plating are formed on one end (21) of 0) to form a thermal head. Then, the opening (11) formed on the base material (1o)
) is formed on the planned line to be punched later, and one end (21) of the conductor circuit (20) on which the bump (30) is formed is formed at a distance of 20 μm from the opening (11). There is.
このように構成された本実施例に係るフィルムキャリア
（１００）は、第３図及び第４図に示すように打ち抜き
予定線（１２）に沿って金型により打ち抜かれ、熱転写
プリンターのサーマルヘッドとして使用されるのである
。その際、基材（１０）に形成された開口（１１）が、
基材（１０）の伸びや歪みを吸収するため、金型により
導体回路（２０）の一端（２１）上に形成されたバンプ
（３０）を打ったり、キズを付けたりすることなく、確
実に打ち抜かれるのである。The film carrier (100) according to this example configured in this way is punched out with a die along the punching line (12) as shown in FIGS. 3 and 4, and used as a thermal head of a thermal transfer printer. It is used. At that time, the opening (11) formed in the base material (10)
In order to absorb the elongation and distortion of the base material (10), the bump (30) formed on one end (21) of the conductor circuit (20) by the mold is reliably removed without hitting or damaging it. It will be punched out.
（発明の効果）
以上詳述したように、本発明に係るフィルムキャリアは
、「絶縁フィルムからなる基材上に導体回路を形成する
と共にこの導体回路の一端上にバンプを形成し、これを
所定形状に打ち抜いて使用するフィルムキャリアにおい
て、
前記バンプが形成された導体回路の一端の近傍であって
、前記基材の打ち抜き予定線上に開口を形成したこと」
をその構成上の特徴としている。(Effects of the Invention) As detailed above, the film carrier according to the present invention is characterized by forming a conductor circuit on a base material made of an insulating film, forming a bump on one end of the conductor circuit, and bumping the conductor circuit in a predetermined manner. In a film carrier that is used by punching out a shape, an opening is formed near one end of the conductor circuit on which the bump is formed and on the planned punching line of the base material.
is its structural feature.
従って、このフィルムキャリアによれば、打ち抜き予定
線上の基材に予め開口を設けておくことによって、打ち
抜き予定線に沿ってこのフィルムキャリアを金型により
打ち抜く際に、この開口が基材の伸びや歪みを吸収する
ため、導体回路上に形成されたバンプが破損したり、キ
ズ付いたりすることかない。Therefore, according to this film carrier, by providing an opening in advance in the base material on the punching line, when punching this film carrier with a die along the punching line, the opening will prevent the elongation of the base material. Since it absorbs distortion, the bumps formed on the conductor circuit will not be damaged or scratched.
また、導体回路は、予め形成された開口から所定のクリ
アランスを持って容易に形成することができるため、打
ち抜いた後の製品にバラツキが生ぜず、よって高品質の
ものとなるのである。Further, since the conductor circuit can be easily formed with a predetermined clearance from the pre-formed opening, there is no variation in the product after punching, and the product is therefore of high quality.
第１図は本発明に係るフィルムキャリアの一実施例を示
す部分平面図、第２図は第１図におけるＡ−Ａ拡大断面
図、第３図は第１図に示したフィルムキャリアを打ち抜
く前の部分拡大断面図、第４図は第１図に示したフィル
ムキャリアを打ち抜いた後の部分拡大断面図である。
第５図は従来のフィルムキャリアを示す部分平面図、第
６図は第５図におけるＢ−Ｂ拡大断面図、第７図は第５
図に示した従来のフィルムキャリアを打ち抜く前の部分
拡大断面図、第８図は第５図に示した従来のフィルムキ
ャリアを打ち抜いた後の部分拡大断面図である。
符 号 の 説 明
１００・・・フィルムキャリア、１ｏ・・・基材、１１
・・・開口、１２・・・打ち抜き予定線、１３・・・ス
プロケット孔、２ｏ・・・導体回路、２１・・・一端、
３ｏ・・・バンプ、４ｏ・・・接着剤。
以 上Fig. 1 is a partial plan view showing an embodiment of the film carrier according to the present invention, Fig. 2 is an enlarged cross-sectional view taken along line A-A in Fig. 1, and Fig. 3 shows the film carrier shown in Fig. 1 before being punched out. FIG. 4 is a partially enlarged sectional view of the film carrier shown in FIG. 1 after being punched out. FIG. 5 is a partial plan view showing a conventional film carrier, FIG. 6 is an enlarged sectional view taken along the line BB in FIG. 5, and FIG.
FIG. 8 is a partially enlarged cross-sectional view of the conventional film carrier shown in FIG. 5 before being punched out, and FIG. 8 is a partially enlarged cross-sectional view of the conventional film carrier shown in FIG. 5 after being punched out. Explanation of codes 100...Film carrier, 1o...Base material, 11
... opening, 12 ... punching line, 13 ... sprocket hole, 2o ... conductor circuit, 21 ... one end,
3o...Bump, 4o...Adhesive. that's all
Claims (1)
共にこの導体回路の一端上にバンプを形成し、これを所
定形状に打ち抜いて使用するフィルムキャリアにおいて
、 前記バンプが形成された導体回路の一端の近傍であって
、前記基材の打ち抜き予定線上に開口を形成したことを
特徴とするフィルムキャリア。[Claims] A film carrier in which a conductor circuit is formed on a base material made of an insulating film, a bump is formed on one end of the conductor circuit, and the bump is punched out into a predetermined shape. A film carrier characterized in that an opening is formed near one end of the conductive circuit and on the planned punching line of the base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309570A JP2852703B2 (en) | 1990-11-14 | 1990-11-14 | Film carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309570A JP2852703B2 (en) | 1990-11-14 | 1990-11-14 | Film carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04180243A true JPH04180243A (en) | 1992-06-26 |
| JP2852703B2 JP2852703B2 (en) | 1999-02-03 |
Family
ID=17994620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2309570A Expired - Lifetime JP2852703B2 (en) | 1990-11-14 | 1990-11-14 | Film carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2852703B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008069135A1 (en) * | 2006-12-06 | 2008-06-12 | Sharp Kabushiki Kaisha | Ic chip mounting package |
| CN103547082A (en) * | 2012-07-11 | 2014-01-29 | 富葵精密组件(深圳)有限公司 | How to make a circuit board |
-
1990
- 1990-11-14 JP JP2309570A patent/JP2852703B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008069135A1 (en) * | 2006-12-06 | 2008-06-12 | Sharp Kabushiki Kaisha | Ic chip mounting package |
| US8129825B2 (en) | 2006-12-06 | 2012-03-06 | Sharp Kabushiki Kaisha | IC chip package employing substrate with a device hole |
| CN103547082A (en) * | 2012-07-11 | 2014-01-29 | 富葵精密组件(深圳)有限公司 | How to make a circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2852703B2 (en) | 1999-02-03 |
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