JPH043109B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wafer holding device, and more particularly to a wafer holding device used when die bonding semiconductor chips or the like onto lead frames or ceramic substrates. .

(Prior Art) In a conventional apparatus, a thin disk-shaped wafer is first placed on a synthetic resin film coated with an adhesive, and then the film is placed on a film as shown in FIGS. 3 and 4. After temporarily pasting the wafer ring onto the wafer ring, the wafer ring is fixed to a wafer ring holder (wafer ring holding member). When fixing the wafer, the alignment direction of each die on the wafer,
The wafer ring and the wafer holder have been adjusted in order to match the moving direction of an X-Y table that moves the wafer holder in the horizontal orthogonal X-Y direction.

(Problems to be Solved by the Invention) However, in the conventional apparatus, when a wafer ring is removed from a wafer holder, replaced with another wafer ring, and then attached, each time the wafer ring and wafer holder are The problem was that the adjustment required was extremely complicated and took a relatively long time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer holding device that extremely simply and accurately positions and holds a wafer ring on which a wafer is placed.

(Means for Solving the Problems) The present invention includes a disk-shaped wafer ring on which a wafer is placed, and a wafer ring storage member having a concave storage portion for storing the wafer ring. The wafer ring has a linear notch provided on its outer periphery, and the wafer storage member has two protrusions provided inside the storage portion to correspond to the notches. , when storing the wafer ring in the storage section,
A pressing member is provided on the opposite side of the two protrusions with respect to the center of the storage portion so as to press the notch portions against the protrusions.

(Function) In the present invention, when replacing a wafer ring with a new wafer ring and attaching the new wafer ring, first the linear notch of the wafer ring is brought into contact with two protrusions, and then the wafer ring When the wafer ring is pressed against the wafer holding member so that the wafer ring is completely stored in the storage portion of the wafer holding member, the notch of the wafer ring is pressed by the pressing member against the two protrusions, thereby achieving accurate positioning. .

(Example) An example of the present invention will be described below with reference to the drawings.

In FIG. 1, a wafer 1 has a notch 3 linearly provided in a disc-shaped wafer ring 2.
Its direction and position are determined based on the straight line portion of the wafer ring 2, and the wafer ring 2 is placed on the wafer ring 2.

The wafer ring holding member 4 has a substantially square plate shape, is made of synthetic resin to reduce weight, and is provided with a substantially circular concave storage portion 23 for storing the wafer ring 2 in its center. There is.

The inner side surface of the storage portion 23 has a raised portion linearly provided so as to correspond to the cutout portion 3 of the wafer ring 2.

Further, protrusions 5 and 6 are provided inside the storage portion 23 and at both ends of the raised portion so as to slightly protrude from the raised portion than the storage portion. The projections 5 and 6 are made of hard metal, and the diameter of the head is larger than that of the body.

In addition, the wafer holding member 4 is located inside the storage portion 23 and at the center of the storage portion 23 in order to press the notch portion 3 against the protrusions 5 and 6 when the wafer ring 2 is stored in the storage portion 23. On the other hand, there is a pressing member 7 which is a plate-shaped spring provided on the opposite side of the two projections 5 and 6. The pressing member 7 has an L-shaped cross section.

The positioning members 8 and 9 are located in a recess provided near the side of the storage part 23 of the wafer holding member 4 and on the pressing member 7 side with respect to the center of the storage part 23, and one end thereof is It is rotatably attached thereto, and the other end is biased by a spring (not shown) so as to elastically push the wafer ring 2 housed therein. That is, these positioning members 8 and 9 are located in the storage section 2 of the wafer ring holding member 4.
3, press the wafer ring 2 from its side,
This is to make the positioning of the wafer ring 2 more accurate.

On the four edges of the wafer ring holding member 4,
V-shaped cutouts 10, 11, 12 and 13 are provided, and the swingable positioning roller 14 is pressed into these cutouts by a spring 15, and the wafer holding device table 23 (second
(see figure).

Therefore, in order to replace the wafer ring 2 with a new wafer ring, when installing the new wafer ring 2, first the linear notch 3 of the wafer ring 2 is brought into contact with the two protrusions 5 and 6. Next, when the wafer ring 2 is pressed against the wafer holding member 4 so that the wafer ring 2 is completely stored in the storage portion 23 of the wafer holding member 4, the notch portion 3 of the wafer ring 2 is pushed into two protrusions by the pressing member 7. Accurate positioning is achieved by being pressed against the parts 5 and 6.

The operation of the wafer holding device of the present invention in a die bonding apparatus will be explained below with reference to FIG.

In FIG. 2, a plurality of lead frames 17 are stored in a stacked state in a lead frame supply device 18 disposed on a die bonding device 16. These lead frames 17 are
Each sheet is picked up by the suction head 19 provided on the lead frame supply device 18 and transferred onto the lead frame feed table of the lead frame conveyance device 20.

This lead frame 17 is first transferred to the adhesive supply position on the die bonding device 16 while being held by the gripping device, and is coated with adhesive by the adhesive supply device 21 . Next, the lead frame 17 is transferred and positioned to the die bonding position while being held in the same manner. The die transferred by the wafer holding device table 30 by the die bonding head is bonded to a predetermined position on the lead frame 17. Thereafter, the lead frame 17 is stored in the magazine 24.

When the plurality of storage stages of the magazine 24 are filled with lead frames 17, the magazine 24 is stored in the lead frame storage device 25 located above.

Wafer ring 2 and wafer ring holding member 4
A wafer holding device having a wafer holding device is fed onto a wafer holding device table 30 by an automatic wafer feeding device 26. Next, the wafer holding device is stored in the wafer storage device 27.

During the above operation, the wafer 1 is placed on the wafer ring 2 after adjusting its position relative to the wafer ring 2, and as described above, the wafer 1 is placed on the wafer ring 2.
The wafer ring 2 is held in place by pressing the wafer ring 2 into the wafer ring holding member 4.
The wafer 1 and wafer ring 2 can be adjusted in position with respect to the wafer ring holding member 4.
and the positions of the wafer ring holding device relative to each other are determined. Therefore, when the wafer holding device to which the wafer ring 2 is attached is positioned on the wafer holding device table 30 by the positioning roller 14, the wafer 1 is accurately positioned with respect to the holding table 23.

Furthermore, when wafers need to be replaced, all that is needed is to replace the wafer holding device, and no position adjustment is required.If a large number of wafer holding devices on which wafers 1 are placed are prepared, wafers 1 can be replaced immediately. becomes possible.

Further, a protrusion 5 that contacts the wafer ring 2,
Since the wafer ring 6 is made of a strong metal, the wear of the wafer ring 2 made of synthetic resin is extremely small even during long-term use, so that the wafer ring 2 can be made lighter.

(Effects of the Invention) The present invention includes a wafer ring for placing a wafer thereon, and a wafer ring storage member having a concave storage portion for storing the wafer ring. The wafer storage member has two protrusions provided inside the storage portion to correspond to the notch portion, and a wafer ring is stored in the storage portion. When the wafer ring is replaced with a new wafer ring, it is configured to have a pressing member provided on the opposite side of the two protrusions with respect to the center of the storage part so as to press the notch part against the protrusion part. When installing the new wafer ring, first make sure that the straight notch of the wafer ring touches the two protrusions, and then completely store the wafer ring in the storage part of the wafer holding member. When the wafer ring is pressed against the wafer holding member, the notch of the wafer ring is pressed against the two protrusions by the pressing member, and accurate positioning is achieved. and can be held very easily.

[Brief explanation of drawings]

FIG. 1 is an exploded external perspective view of a wafer holding device according to an embodiment of the present invention, FIG. 2 is an external perspective view of a die bonding device equipped with the same wafer holding device, and FIGS. 3 and 4 are: FIG. 2 is an external perspective view of a conventional wafer ring. In the figure, 1... wafer, 2... wafer ring, 3... notch, 4... wafer ring holding member, 5, 6... projection, 7... pressing member, 8, 9... positioning member .

Claims (1)

[Claims] 1 A wafer ring storage member having a disc-shaped wafer ring on which a wafer is placed, and a wafer ring storage member having a concave storage portion for storing the wafer ring, the wafer ring being provided on the outer periphery of the wafer ring. The wafer storage member has two protrusions provided inside the storage portion so as to correspond to the cutout portion, and the wafer ring is stored in the storage portion. a pressing member provided on the opposite side of the two projections with respect to the center of the storage portion so as to press the notch against the projection when the wafer holding device is pressed.