JPH043121B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] A microwave in which a microwave ceramic substrate applied to the microwave band, millimeter wave band, etc. (hereinafter collectively referred to as microwave) is sealed in a box-shaped metal base. In the wave module, a coaxial vertical terminal is provided that passes perpendicularly through the bottom plate member through a metal base with the terminal tip of the inner conductor positioned below the top surface of the ceramic substrate. By providing a coaxial horizontal terminal that connects to the frequency circuit and penetrates the side wall of the metal base and connects to the microwave circuit, the terminal can be distributed in a distributed manner to prevent interference between terminals and provide a broadband microwave module.

[Industrial application field]

The present invention relates to an improvement of a microwave module that is applied to the microwave band to millimeter wave band and has a microwave circuit board sealed in a box-shaped metal base.

Frequency converters, low noise amplifiers, high output amplifiers, switches, applicable to microwave bands to millimeter wave bands,
Attenuators etc. are distributed constant circuits on ceramic substrates.
A lumped constant circuit is formed on a microwave ceramic substrate, and this microwave ceramic substrate is sealed in a box-shaped metal base to form a microwave module.
It is generally incorporated into communication equipment.

In recent years, several functions such as the frequency converter function, low-noise amplifier function, high-output amplifier function, switch function, and attenuator function as mentioned above are configured on the same ceramic substrate, making it multifunctional. , microwave modules that are smaller in size are being used.

[Conventional technology]

There are two types of conventional microwave modules: those having only coaxial vertical terminals as shown in FIG. 4, and those having only coaxial horizontal terminals as shown in FIG.

In FIG. 4, 1 is a ground conductor 3 on the bottom surface of a ceramic substrate 1A such as an alumina substrate.
This is a microwave circuit board on which a microwave integrated circuit consisting of a desired distributed constant circuit, lumped constant circuit, etc. is formed on the upper surface.

The surface of the ground conductor 3 of the microwave circuit board 1 is closely fixed to the upper surface of a flat metal base 4A made of copper coated with gold, for example, to connect the microwave circuit board 1 to the outside. A plurality of coaxial vertical terminals 6 are provided near the outer edge of the wave circuit board 1 to vertically penetrate the metal base 4A.

The coaxial vertical terminal 6 is constructed by a conductor pin passing through the center of a glass 6A whose outer peripheral surface is coated with a metal film, and a conductor pin is inserted into a hole provided in the metal base 4A.
The A part is inserted and the metal film and the metal base 4A are soldered to be sealed and fixed.

The terminal tip of the inner conductor of the coaxial vertical terminal 6 is connected to a desired line of the microwave circuit board 1 via a connecting wire (for example, a gold ribbon) 7.

The desired line refers to a line such as a DC line for a power source, a baseband line, or an intermediate frequency line.

And a cap-shaped metal plate (e.g. stainless steel)
By attaching the cover 5 made of the above metal base 4A to the metal base 4A, the microwave circuit board 1 is sealed and the deterioration of the circuit elements is prevented.

In FIG. 5, the microwave circuit board 1 is mounted on the top surface of the bottom plate member of a box-shaped metal base 4B,
It is sealed with a cover 9.

In order to connect such a microwave circuit board 1 to the outside, a coaxial horizontal terminal 8 is provided on the side wall of the metal base 4B in parallel to the ceramic board 1A.

The coaxial horizontal terminal 8 has an inner conductor penetrating the center of a glass 8A whose outer peripheral surface is covered with a metal film, and is inserted into a groove provided in the side wall to connect the metal film and the metal base 4B. It is sealed and fixed by soldering.

The terminal tip of the inner conductor of the simultaneous horizontal terminal 8 is connected to the microwave line of the microwave ceramic substrate 1 via a connecting wire (for example, a gold ribbon) 7.

[Problem that the invention seeks to solve]

However, in the former example of the above conventional example, that is, one with only a coaxial vertical terminal, the microwave line of the microwave circuit board and the coaxial vertical terminal intersect perpendicularly, so the transmission path becomes discontinuous in terms of electromagnetic waves, and the operating frequency is reduced. The problem is that it is difficult to apply to a wide band.

The latter, i.e., those with only coaxial horizontal terminals,
Since it is difficult to provide the coaxial horizontal terminal at the corner portion of the side wall of the metal base, the locations where the coaxial horizontal terminal can be provided are limited.

Therefore, when applied to a microwave module that requires a large number of multifunctional terminals, there is a problem in that it is difficult to provide a considerable number of coaxial horizontal terminals.

Furthermore, if the coaxial horizontal terminal is made smaller and a large number of coaxial horizontal terminals are attached, it becomes impossible to obtain the specified impedance due to the miniaturization, and the strength of the coaxial horizontal terminal itself becomes weaker. A problem occurs.

[Means for solving problems]

In order to solve the above conventional problems, the present invention provides a module in which a microwave circuit board 1 is sealed and mounted on a box-shaped metal base 10, as shown in FIG. is connected to a coaxial horizontal terminal 15 that hermetically passes through the side wall of the metal base 10.

On the other hand, the lines other than the microwave line are placed between the ceramic substrate 1A and the metal base 1A so that the terminal tips of the inner conductors are located below the top surface of the ceramic substrate 1A.
Coaxial vertical terminal 1 hermetically installed through the bottom of 0
Connect to 6.

Alternatively, lines other than the microwave line are connected only to the coaxial vertical terminal 16 that is hermetically mounted through the bottom of the metal base 10 so that the terminal tip of the inner conductor is below the top surface of the ceramic substrate 1A. shall be.

[Effect]

According to the means of the present invention, even when the microwave circuit board 1 is multifunctional and requires a large number of external connection terminals, those terminals can be connected to the coaxial vertical terminal 16;
The coaxial horizontal terminals 15 provided on the side wall can be distributed and arranged.

Therefore, the number of simultaneous horizontal terminals 15 provided on the side wall of the metal base 10 is reduced, and the number of coaxial horizontal terminals 1
There is no need to specifically downsize the terminal 5, and a coaxial terminal having sufficiently high strength and a predetermined impedance can be obtained.

Further, the coaxial horizontal terminal 15 is connected to the ceramic substrate 1A.
Since it is parallel to the upper surface of the microwave ceramic substrate 1, it is connected to the strip line which is the microwave line of the microwave ceramic substrate 1 within the same plane. Therefore, the transmission path is not discontinuous in terms of electromagnetic waves, and the microwave module can be applied to a wide band.

On the other hand, the DC line, baseband line, and intermediate frequency line are connected to the coaxial vertical terminal 16, and the terminal tip 16a of the inner conductor of the coaxial vertical terminal 16 is provided at a position lower than the top surface of the ceramic substrate 1A, so that microwaves can be transmitted. It can be prevented from going around the coaxial vertical terminal 16.

Furthermore, since the number of coaxial vertical terminals 16 is reduced, it is easy to set the capacity of the coaxial vertical terminal 16 to a desired capacity that blocks microwaves and passes direct current and intermediate frequencies. It is further prevented from getting around to the terminal 16.

〔Example〕

The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.

Fig. 1 is a configuration diagram of one embodiment of the present invention, a is a perspective view, b is a partially cutaway side view, Fig. 2 is a side sectional view of the main part of the invention, and Fig. 3 is a microwave of the invention. FIG. 3 is a side sectional view of a device housing incorporating a module.

In FIG. 1, the microwave module 20
The microwave circuit board 1 is mounted on a box-shaped metal base 1 made of, for example, copper material and whose surface is coated with gold.
0, a cover 11 is fixed to the upper end surface of a metal base 10, and the microwave circuit board 1 is sealed.

The microwave circuit board 1 has several functions such as a frequency converter function, a low noise amplifier function, a high output amplifier function, a switch function, and an attenuator function formed on the surface of the ceramic substrate 1A. This requires a large number of terminals.

In addition, in order to fix the microwave module 20 to a device housing (not shown) with screws, the bottom plate member of the metal base 10 is extended to provide a flange 10a, and a notch into which the neck of a machine screw is inserted is provided in the flange 10a. A hole is provided.

In order to connect the microwave circuit board 1 to the outside, a desired number of coaxial vertical terminals 16 are provided which vertically penetrate the ceramic substrate 1A and are fixed to the bottom plate member of the metal base 10 via a dielectric 16A.

As shown in detail in FIG. 2, the coaxial vertical terminal 16 is constructed such that an inner conductor passes through the center of a dielectric material 16A made of ceramic material, for example, whose cylindrical surface is covered with a metal film 16B. Terminal 1
6 is inserted into a hole provided in the bottom plate member of the metal base 10, and the metal film 16B and the metal base 10 are soldered to be sealed and fixed.

Further, the terminal tip 16a of the pin of the inner conductor is attached so as to be lower than the top surface of the ceramic substrate 1A, and the terminal tip 16a is connected to the DC line, baseband line, intermediate frequency line, etc. of the microwave circuit board 1, for example, using a metal They are connected via a connecting wire 17 made of a ribbon.

Note that, unlike the one shown in FIG. 2, the coaxial vertical terminal 16 may be provided so as to penetrate through the bottom plate member of the metal base 10 at a position outside the ceramic substrate 1A.

On the other hand, the microwave line of the microwave circuit board 1 is connected to the dielectric 15 in parallel to the ceramic substrate 1A.
It is connected to a coaxial horizontal terminal 15 fixed to the side wall of the metal base 10 via A.

Specifically, a groove or hole is provided at a desired location on the side wall of the metal base 10, and the surface in contact with the inner wall of the groove or hole is coated with a metal film 15B.The center of the dielectric body 15A made of, for example, a ceramic material is The inner conductor passes through to form a coaxial horizontal terminal 15.

A desired number of such coaxial horizontal terminals 15 are sealed and fixed to the side wall by soldering the metal film 15B and the metal base 10, respectively, and then the tips of the inner conductors of the coaxial horizontal terminals 15 are Connected to the desired microwave line.

Microwave module 2 configured as described above
0 to the device housing, connect the coaxial horizontal terminal 15 and the coaxial vertical terminal 16 as shown in FIG.

In FIG. 3, a box-shaped device housing 30 made of, for example, aluminum and having open top and bottom surfaces,
A housing base 31 is provided horizontally in the center, and the device housing 3
0 is separated into an upper chamber and a lower chamber.

A low frequency ceramic substrate 33 on which glass epoxy resin is laminated, for example, under the housing base 31
Attach it to a desired location on the top surface of the housing base 31,
Square recesses are provided, and microwave modules 20 having different functions are mounted in each recess.

Note that the low frequency ceramic substrate 33 has a power supply circuit, an intermediate frequency circuit, a baseband circuit, etc. formed thereon.

After installing the microwave module 20 and the low frequency ceramic substrate 33, a housing cover 32 is fixed to the open upper and lower surfaces of the device housing 30 for shielding.

The implementation of the microwave module 20 will be specifically described below.

A line board 35A made of, for example, an alumina substrate, with a ground conductor 35B formed on the entire bottom surface and a strip line 35 formed on the top surface, is tightly attached to a desired location on the top surface of the housing base 31, and the microwave module 20 is The lower surface of the tip side of the conductor pin of the coaxial horizontal terminal 15 is brought into contact with this strip line 35 and connected by soldering.

This strip line 35 is connected to another adjacent microwave module or to a coaxial connector 34 mounted on the side wall of the device housing 30.

On the other hand, in the coaxial vertical terminal 16, the dielectric 16A portion penetrates the hole in the housing base 31, the metal film 16B is soldered, and the inner conductor of the coaxial vertical terminal 16 extending downward is connected to the low frequency ceramic substrate 33. connected to the desired pattern.

Since the microwave module 20 is mounted as described above, it is electromagnetically isolated from intermediate frequency signals, baseband signals, and DC circuits such as a power supply by the housing base 31, and no noise is exchanged.

〔Effect of the invention〕

As explained above, the present invention provides a desired number of terminals that have sufficiently high strength, have a predetermined impedance, and are matched to cope with the increase in the number of terminals accompanying the multifunctionalization of microwave circuit boards. In addition, it can be applied to a wide band from the microwave band to the millimeter wave band, and has excellent practical effects such as almost no interference between terminals.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention, in which a is a perspective view, b is a partially cutaway side view, FIG. 2 is a side sectional view of the main part of an embodiment of the present invention, and FIG. FIG. 4 is a side sectional view of a conventional example, and FIG. 5 is a side sectional view of another conventional example. In the figure, 1 is a microwave circuit board, 1A is a ceramic substrate, 4A, 4B, and 10 are metal bases,
6 and 16 are coaxial vertical terminals, 8 and 15 are coaxial horizontal ends, 15A and 16A are dielectrics, 15B and 16B are metal films, 16a is a terminal tip, 20 is a microwave module, 30 is a device housing, and 31 is a housing base. stand, 3
3 is a low frequency ceramic substrate, 35 is a strip line, 35A is a line board, and 3 and 35B are ground conductors.

Claims (1)

[Claims] 1. The microwave circuit board 1 is mounted on a box-shaped metal base 10.
In the module sealed and mounted on the microwave circuit board 1, the microwave line of the microwave circuit board 1 is
The line other than the microwave line is connected to the coaxial horizontal terminal 15 that airtightly penetrates the side wall of the metal base 10, and the terminal tip of the inner conductor is connected to the ceramic substrate 1 of the microwave circuit board 1.
A coaxial vertical terminal 16 is connected to the ceramic substrate 1A and the bottom of the metal base 10 in an airtight manner so as to be below the top surface of the ceramic substrate 1A, or the terminal tip of the inner conductor is connected to the ceramic substrate 1A. A coaxial vertical terminal 16 is hermetically installed through only the bottom of the metal base 10 so as to be located below the top surface of the metal base 10.
A microwave module characterized in that it is connected to.