JPH0431397B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a display device, particularly a panel type display.

[Conventional technology]

FIG. 8 is a plan view showing a conventional display device disclosed in, for example, Japanese Unexamined Patent Publication No. 57-42073 (Japanese Patent Publication No. 3-76466). In the figure, 1 is a display panel substrate such as a liquid crystal panel, and 2 is an ITO (Indium Thin
3 is a flexible film substrate connected to the display panel substrate 1; 4 is a flexible film substrate 1;
The driving ICs mounted on the top, 5a and 5b are conductors on the flexible film substrate 1 made of copper foil, etc. 5a has one end connected to the input terminal of the driving IC 4, and 5b has one end connected to the driving IC. It is connected to the output terminal of IC4 and the other end is connected to conductor 2. Note that the display panel substrate 1 and the flexible film substrate 3 are connected after the conducting wire 2 and the conductors 5a and 5b are wired.

Next, the operation will be explained. Power and control signals are input to the driving IC 4 through the conductor 5a, and the driving IC 4 outputs an output signal for displaying an image on the display panel substrate 1. This output signal is transmitted to the display panel substrate 1 through the conductor 5b and the conducting wire 2, and the display panel substrate 1 displays an image.

[Problems to be Solved by the Invention] Since the conventional display device is configured as described above, the flexible film substrate 3 is relatively large, and due to expansion and contraction due to heat etc. conductor 2 and conductor 5 on flexible film substrate 3
There is a high possibility that the connection misalignment with b will become large.
Further, when connecting the conductors 5a on the flexible film substrate 3 to the driving IC 4, it is necessary to provide complicated two-layer wiring or provide jumper wires to avoid mutual contact. Conventional display devices have had such problems. As a result, the yield and reliability of display devices have been reduced.

This invention was made to solve the above problems, and eliminates the need for double-layer wiring or jumper wires when connecting the conductor on the flexible film substrate to the drive IC. Another object of the present invention is to obtain a display device in which connection deviation between conductive wires on a display panel substrate and conductors on a flexible film substrate is small.

[Means for solving problems]

In the display device according to the present invention, a driving IC is provided on the display panel substrate via a flexible film substrate, and the display panel substrate is provided in parallel with each other and between the flexible film substrate and the display panel substrate. A plurality of first conductive wires arranged on the flexible film substrate are arranged in parallel with each other on the flexible film substrate, and one end is connected to the first conductive wire and the other end is connected to the input terminal of the driving IC. A plurality of second conductive wires are arranged in parallel to each other on the flexible film substrate, and one end is connected to the output terminal of the drive IC, and the other end is arranged at the end of the flexible film substrate. a plurality of third conductive wires, one end of which is connected to the third conductive wire at the end of the flexible film substrate, and a fourth conductive wire whose other end is connected to a plurality of pixels of the display panel substrate. be.

[Effect]

In this invention, the flexible film substrate is smaller than the conventional one, so that its expansion and contraction due to heat and the like is reduced. Further, a first conductive wire is disposed on the display panel substrate passing between the flexible film substrate and the display panel substrate, and a second conductive wire is disposed on the flexible film substrate. Since the first conductive wire is connected to the first conductive wire, unnecessary contact between the first conductive wire and the second conductive wire does not occur.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a driving IC mounted portion of a display device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a flexible film carrier substrate thereof, and FIG. 3 is a perspective view showing the flexible film carrier. Drive IC on the board
FIG. 4 is a perspective view showing the wiring of conductive wires on the liquid crystal panel, and FIG. 5 is a plan view showing the structure of the display device.

In FIG. 1, 11 is a liquid crystal panel that displays images using a plurality of pixels, 12 is a first conductive wire made of copper and disposed on the liquid crystal panel 11, 13 is a flexible film carrier substrate made of, for example, polyimide, and 14 is a driving IC mounted on the flexible film carrier substrate 13, and has an input terminal and an output terminal. A plurality of second leads 15 made of copper have one end connected to the input terminal of the driving IC 14 by wire bonding and the other end connected to the first conductive wire 12.
The conductive wires are arranged parallel to each other and on the flexible film carrier substrate 13. Reference numeral 16 denotes a plurality of third conductive wires made of copper, one end of which is connected to the output terminal of the driving IC 14 by wire bonding, and the other end of which is disposed at the end of the flexible film carrier substrate 13, and which are parallel to each other. It is disposed on a flexible film carrier substrate 13. 17 has one end connected to the third conductive wire at the end of the flexible film carrier substrate 13, and the other end connected to the liquid crystal panel 11.
a plurality of fourth pixels made of copper connected to a plurality of pixels of
The conductive wires are arranged parallel to each other and passing under the flexible film carrier substrate 13.

Figure 2 shows the flexible film carrier substrate 13 before the driving IC 14 is mounted, and 18 is the driving IC.
This is a die bonding pad provided on the flexible film carrier substrate 13 below the IC 14. It is connected to one of the second conducting wires 15. Reference numeral 19 denotes a cover coat that covers the upper part of the second conductive wire 15, which is the lower part of the driving IC 14, and is made of an insulating material such as epoxy or polyimide.

FIG. 3 shows a drive IC 14 mounted on the flexible film carrier substrate 13 shown in FIG. and is bonded to a flexible film carrier substrate 13. The lower surface of the driving IC 14 is kept at the same potential as the die-bonding pad 18 by a conductive die-bonding material, and is insulated from the second conducting wire 15 by a cover coat 19. Further, the second conducting wire 15 and the input terminal of the driving IC 14 are connected by wire bonding using an Au wire or the like. Similarly, the third conducting wire 16 and the driving wire
The output terminal of IC14 is also connected. Thereafter, the drive IC 14 is resin molded and the flexible film carrier substrate 13 is processed (cut).

The flexible film carrier substrate 13 after mounting the driving IC 14 shown in FIG. The conductive wire 12 and the second conductive wire 15 and the third conductive wire 16 and the fourth conductive wire 17 are connected by a method such as soldering so that they correspond to each other. FIG. 5 shows the configuration of the display device configured as described above, in which 20 is an image display area of the liquid crystal panel 11.

In the display device configured as above,
Power and control signals are input to the driving IC 14 through the first conducting wire 12 and the second conducting wire 15, and the driving IC 14 receives power and control signals.
The IC 14 outputs an output signal for displaying an image on the liquid crystal panel 11. This output signal is transmitted to the liquid crystal panel 1 through a third conductor 16 and a fourth conductor 17.
The image is transmitted to each pixel of 1, and an image is displayed on the liquid crystal panel 11. In this display device, the flexible film carrier substrate 13 is smaller than the conventional one, so
Since the expansion and contraction are small, the connection deviation between the first conductive wire 12 on the liquid crystal panel 11 and the second conductive wire 15 on the flexible film carrier substrate 13 is reduced. Further, a first conductive wire 12 is disposed on the liquid crystal panel 11 passing between the flexible film carrier substrate 13 and the liquid crystal panel 11, and a second conductive wire 15 is disposed on the flexible film carrier substrate 13. It is disposed on top of the conductive wire 12 and connected to the first conducting wire 12 . Therefore, there is no need to provide double-layer wiring or jumper wires. Furthermore, a flexible film carrier substrate 13
If the pads connected to the upper second conductive wires 15 and third conductive wires 16 are provided on the overhanging part of the flexible film carrier substrate 13, the pads may be exposed to a prober, etc. before the external shape processing (cutting). By performing burn-in or other tests on the drive IC 14 using this method, it becomes possible to remove defective drive ICs 14, and it is also possible to further improve the yield.

Next, other embodiments of the invention will be described. FIG. 6 is a perspective view showing a driving IC mounted portion of a display device according to another embodiment of the present invention, and FIG. 7 is a perspective view showing wiring of conductive wires on the liquid crystal panel. In the figure, 11 to 16 are similar to those in the above embodiment, and 17 has one end connected to the third conductive wire at the end of the flexible film carrier substrate 13 and the other end connected to a plurality of pixels of the liquid crystal panel 11. A plurality of fourth conductive wires made of copper, nickel, etc. are connected to the fourth conductive wires, and are provided in parallel with each other and outside the flexible film carrier substrate 13, and do not pass through the lower part of the flexible film carrier substrate 13. It is something. A display device configured in this manner also exhibits effects similar to those of the above embodiment. However, since the routing area of the fourth conducting wire 17 is larger than that in the above embodiment, the above embodiment shown in FIGS. .

In the above embodiment, the first conductive wire 12 and the fourth conductive wire 17 are made of copper, but they may also be made of nickel or ITO coated with nickel, copper, or the like.

Further, in the above embodiment, the flexible film carrier substrate 13 is mounted in four directions outside the image display area 20, but it goes without saying that the flexible film carrier substrate 13 may be mounted in two or three directions.

In the above embodiment, one driving IC 14 is mounted on the flexible film carrier substrate 13, but one flexible film carrier substrate 13
It is also possible to mount a plurality of driving ICs 14 thereon. Further, it may be a flexible film substrate, and does not need to be a film carrier substrate using a film carrier method.

As the drive IC 14, one with flat pads such as aluminum thin film is usually used as input/output terminals, but TAB (Tape Aided
It may have protruding bumps such as gold bumps or copper bumps for bonding (bonding), and it is possible to mount TAB ICs without using an expensive TAB bonder.

In the above embodiment, the liquid crystal panel 11 was used as the display panel substrate, but it may also be an electrochromic (EC) panel or an LED panel.

〔Effect of the invention〕

As described above, according to the present invention, the driving IC is provided on the display panel substrate via the flexible film substrate, and the display device is provided parallel to each other and between the flexible film substrate and the display panel substrate. A plurality of first conducting wires are arranged on the panel board, and are arranged in parallel with each other on the flexible film board, one end of which is connected to the first conducting wire, and the other end is connected to the input terminal of the drive IC. A plurality of connected second conducting wires are arranged parallel to each other on the flexible film substrate, and one end is connected to the output terminal of the drive IC and the other end is connected to the end of the flexible film substrate. A plurality of third conductive wires are arranged, one end of which is connected to the third conductive wire at the end of the flexible film substrate, and the other end of which is connected to the plurality of pixels of the display panel substrate, and a fourth conductive wire is provided. Therefore, when connecting the first conducting wire on the display panel substrate and the second conducting wire on the flexible film substrate, there is no need to perform double-layer wiring or provide a jumper wire. It is possible to obtain a display device with small connection deviation between the conductive wires on the flexible film substrate and the conductive wires on the flexible film substrate.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a driving IC mounted portion of a display device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a flexible film carrier substrate thereof, and FIG. 3 is a perspective view showing the flexible film carrier. Figure 4 is a perspective view showing the wiring of conductors on the liquid crystal panel; Figure 5 is a plan view showing the configuration of the display device; Figure 6 is a perspective view showing the structure of the display device. FIG. 7 is a perspective view showing a driving IC mounted part of a display device according to another embodiment of the invention, FIG. 7 is a perspective view showing the wiring of conductive wires on the liquid crystal panel, and FIG. 8 is a plan view showing a conventional display device. be. In the figure, 11 is a display panel substrate, 12 is a first wiring, 13 is a flexible film substrate, 14 is a driving IC, 15 is a second conductive wire, 1
6 is a third conducting wire, 17 is a fourth conducting wire, 18 is a die bonding pad, and 19 is an insulator. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] 1. A display panel substrate having an image display section composed of a plurality of pixels, a flexible film substrate installed on the display panel substrate, and the above display via the flexible film substrate. A driving IC provided on the panel substrate and having an input terminal for inputting a control signal and an output terminal for outputting an output signal for displaying an image on the image display section, and the flexible film arranged in parallel with each other and having an input terminal for inputting a control signal and an output terminal for outputting an output signal for displaying an image on the image display section A plurality of first conductive wires are disposed on the display panel substrate through between the substrate and the display panel substrate, and are disposed in parallel on the flexible film substrate, with one end connected to the first conductive wire. A plurality of second conductive wires are connected to the first conductive wire and have their other ends connected to the input terminal, and are arranged in parallel to each other on the flexible film substrate, and have one end connected to the output terminal. a plurality of third conductive wires having ends disposed at the ends of the flexible film substrate, one end connected to the third conductive wires at the end of the flexible film substrate, and the other end connected to the plurality of pixels; A display device comprising a fourth conducting wire connected to. 2. The display device according to claim 1, wherein the display panel substrate is a liquid crystal panel. 3. The display device according to claim 1, wherein the display panel substrate is an electrochromic panel. 4. The display device according to claim 1, wherein the display panel substrate is an LED panel. 5. The display device according to claim 1, wherein the flexible film substrate is made of polyimide. 6. The display device according to claim 1, wherein the input terminal and the second conductive wire are connected by wire bonding. 7. The display device according to claim 1, wherein the output terminal and the third conducting wire are connected by wire bonding. 8. The display device according to claim 1, wherein the fourth conductive wire is disposed under the flexible film substrate. 9 Cover the second conductive wire under the driving IC with an insulator, and provide a die-bonding pad connected to one of the second conductive wires on the flexible film substrate under the driving IC. 2. The display device according to claim 1, wherein the display device is bonded to the flexible film substrate by covering the entire lower surface of the driving IC with a conductive die-bonding material. 10. The display device according to claim 1, wherein the input terminal and the output terminal are either planar pads or protruding bumps. 11 The flexible film substrate is made of polyimide, and has an input terminal and a second conducting wire, an output terminal and a third
The fourth conductive wire is connected to each of the conductive wires by wire bonding, and the fourth conductive wire is placed under the flexible film substrate, and covers the second conductive wire under the drive IC with an insulating material. A die-bonding pad connected to one of the second conductive wires is provided on the lower flexible film substrate, and the conductive die-bonding material covers the entire bottom surface of the driving IC and the flexible film substrate. The display device according to any one of claims 1 to 4, characterized in that the display device is bonded by covering.