JPH044053B2 - - Google Patents

Description

[Detailed Description of the Invention] [Background and Objectives of the Invention] The present invention relates to a method for manufacturing a clad pin having a structure in which a solder material is attached in advance to the tip of a wire rod that has been subjected to header processing, and in particular, to improve efficiency by punching out the solder material at the same time as the header processing. The present invention relates to a method for manufacturing a clad pin that can be attached to a metal surface.

Conventionally, lead pins manufactured by headering the tip of a wire rod into a predetermined shape are used as lead pins for electronic components, and the tip of the lead pin is soldered when joining semiconductor elements, etc. . This soldering is necessary for joining (mounting) semiconductor devices, etc., but it is extremely difficult work to attach a small amount of solder material to the tips of the pins, and There was a problem in that it was extremely inefficient to attach solder material to the tip of the device. For this reason, clad pins with a structure in which solder material was preliminarily attached to the tip of the headered wire rod were made, but since the solder material was attached in a separate process after the header processing, Moreover, manufacturing clad pins required considerable time and effort.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a clad pin, which eliminates the drawbacks of the prior art described above and allows solder material to be punched out and efficiently attached at the same time as header processing.

[Summary of the invention]

The method for manufacturing a clad pin of the present invention is to place a predetermined length of wire fed by a wire rod sizing feeding device between a receiving die and a processing die, and fix it with a clamp. When punching the tip of the wire with the processing die to perform header processing on the tip of the wire, a plate-shaped solder material is fed from the side for a predetermined length between the tip of the wire and the processing die during the patching. In this state, punching is performed to header the tip of the wire, and at the same time, a part of the solder material is punched out to a required size using the processing die, and attached to the header-treated tip of the wire. It is characterized by causing

〔Example〕

Next, an embodiment of the method for manufacturing a clad pin of the present invention will be described with reference to the accompanying drawings.

FIG. 1 shows a header processing device used in an embodiment of the present invention, in which a wire rod 1 as a raw material is fed by a wire rod sizing feeding device 2, fixed by a clamp 3, and a die is used to receive the tip of the wire rod 1. 5 and the processing die 6. On the other hand, a plate-shaped solder material 4 is placed between the tip of the wire 1 and the processing die 6 from a direction crossing the feeding direction of the wire 1.
Insert it into the specified position between the two. Here, the cylinder 7 is actuated to perform punching with the processing die 6, and the tip of the wire 1 is processed into a header.At the same time, the tip of the wire 1 is punched with the solder material 4 punched to a required size by the processing die 6. Attach it to the area. The punched and headered wire rod 1 is cut into a desired length by a cutter 9, and finally manufactured as a clad pin 10 shown in FIG. 2. The plate-shaped solder material 4 is also fed to a fixed length by a solder material sizing feeding device (not shown), and solder material 8 (a part of the plate-shaped material is hollowed out and connected) is pushed out from the opposite side and wound up.

Note that 11 is the base of the header processing device.

FIGS. 3 to 10 show the receiving die 5, the receiving die 5 in the above manufacturing process, and
Processing die 6, clamp 3, cutter 9, wire rod 1
The movement of the solder material 4 is explained in an easy-to-understand manner.

Figure 3 shows the initial state where the wire rod 1 is being fed spread across the processing die 6, Figure 4 shows the state where the wire rod 1 is being fed by moving it in the direction of the arrow, and Figure 5 shows the state where the clamp 3 is pushed down in the direction of the arrow. Fig. 6 shows a state in which the solder material 4 is moved in the direction of the arrow and positioned between the wire material 1 and the processing die 6, and Fig. 7 shows a state in which the processing die 6 is moved in the direction of the arrow. The state in which the cutter 9 has been returned to its original position, FIG.
The figure shows the cutter 9 and clamp 3 returned to their original positions. After FIG. 10, the process returns to FIG. 3 and the process is repeated.

〔Effect of the invention〕

According to the manufacturing method of the present invention as described above, the following unique effects are achieved.

(1) The solder material can be punched out and efficiently attached at the same time as the header processing, making the manufacturing of clad pins extremely efficient and making it possible to significantly reduce the cost of the product.

(2) By punching out and attaching solder material at the same time as header processing, it is possible to improve quality by simplifying the process. Furthermore, the method of punching and adhering also makes it possible to make the thickness of the solder material uniform.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram of a header processing device used in an embodiment of the present invention, Fig. 2 is an explanatory diagram of a clad pin, Figs. 3, 4, 5, 6, and 7.
8, 9 and 10 are explanatory diagrams of the header processing process, respectively. 1: Wire rod, 2: Wire rod sizing device, 3: Clamp, 4: Solder material, 5: Receiving die, 6: Processing die, 7: Cylinder, 8: Soldering material, 9: Cutter, 10: Clad pin, 11: Base.

Claims (1)

[Claims] 1. A predetermined length of the wire fed by the wire rod sizing feeding device is positioned between a receiving die and a processing die and fixed with a clamp, and the tip of the wire rod positioned between the receiving die and the processing die is subjected to the processing. When performing header processing on the tip of the wire by punching with a die, a plate-shaped solder material is fed a predetermined length from the side between the tip of the wire and the processing die during the punching, and punching is performed in this state. A clad pin, characterized in that the tip of the wire rod is headered by a machine, and at the same time, a part of the solder material is punched out to a required size using the processing die, and is attached to the header-treated tip of the wire. Production method.