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JPS6212653B2 - - Google Patents
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JPS6212653B2 - - Google Patents

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Publication number
JPS6212653B2
JPS6212653B2 JP57133101A JP13310182A JPS6212653B2 JP S6212653 B2 JPS6212653 B2 JP S6212653B2 JP 57133101 A JP57133101 A JP 57133101A JP 13310182 A JP13310182 A JP 13310182A JP S6212653 B2 JPS6212653 B2 JP S6212653B2
Authority
JP
Japan
Prior art keywords
lead
forming
lead portion
transfer device
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57133101A
Other languages
Japanese (ja)
Other versions
JPS5923511A (en
Inventor
Haruo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57133101A priority Critical patent/JPS5923511A/en
Publication of JPS5923511A publication Critical patent/JPS5923511A/en
Publication of JPS6212653B2 publication Critical patent/JPS6212653B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 (a) 発明の技術分野 本発明はプリント板の実装に使用されるラジア
ル回路部品に係り、特に部品に有するリード部の
成形加工を自動化にするために好適なトランスフ
アー装置に関するものである。
[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a radial circuit component used for mounting printed circuit boards, and in particular to a transfer device suitable for automating the molding process of a lead portion of the component. It is related to the device.

(b) 技術の背景 近年端末装置等のプリント板回路を実装したユ
ニツトは高密度化されており、その実装密度の増
加に伴つて、実装作業の効率化を図るために自動
化が進展されている。特にラジアル部品のプリン
ト板実装におけるリード部の挿入しやすく、且
つ、保持されやすいリード成形加工が必要とされ
ている。
(b) Background of the technology In recent years, the density of units mounted with printed circuit board circuits such as terminal equipment has become higher, and as the density increases, automation is progressing in order to improve the efficiency of mounting work. . In particular, there is a need for a lead forming process that allows the lead portion to be easily inserted and held when mounting a radial component on a printed board.

(c) 従来技術と問題点 第1図はプリント板実装を説明するための図で
あり、同図aはラジアル部品を示した立体図、同
図bは実装状態を示した側断面図及び要部上面図
である。同図において、1は部品、2はリード
部、3はプリント板、4は挿入穴、5は先細ペン
チをそれぞれ示す。
(c) Prior art and problems Figure 1 is a diagram for explaining printed board mounting, in which figure a is a three-dimensional view showing a radial component, and figure b is a side sectional view and main points showing the mounted state. FIG. In the figure, 1 is a component, 2 is a lead portion, 3 is a printed board, 4 is an insertion hole, and 5 is a pair of tapered pliers.

従来より、例えばプリンタ装置に使用される制
御部のプリント板ユニツトにおけるプリント板に
は多数のLSI、コンデンサーなどのラジアル部品
等が実装されている。このラジアル部品は第1図
aに示すようにその部品1の下方にリード部2を
有したバイパスコンデンサが形成されており、こ
のバイパスコンデンサ1はそのリード部2下方先
端が角型形状になつている。そして実装方法とし
て第1図bに示すようにプリント板3に設けられ
た多数の挿入穴4にラジアル部品1のバイパスコ
ンデンサのリード部2を挿入し、そのプリント板
3裏面より抜け止めのために先細ペンチ5等でリ
ード部2先端を折曲げて挿入位置1Aの挿入穴4
に保持されている。そのために極細リード部2の
加工に多くの手間を要し、その作業性が悪く、且
つ、手作業によるため自動実装化が阻害される等
の欠点を有していた。
Conventionally, a large number of LSIs, radial components such as capacitors, etc. have been mounted on a printed board in a printed board unit of a control section used in a printer device, for example. As shown in Fig. 1a, this radial component has a bypass capacitor having a lead portion 2 formed below the component 1, and the lower tip of the lead portion 2 of this bypass capacitor 1 has a square shape. There is. As a mounting method, the leads 2 of the bypass capacitor of the radial component 1 are inserted into the many insertion holes 4 provided in the printed board 3 as shown in FIG. Bend the tip of the lead part 2 with tapered pliers 5, etc. and insert it into the insertion hole 4 at the insertion position 1A.
is held in Therefore, processing of the ultra-thin lead portion 2 requires a lot of effort, has poor workability, and has disadvantages such as manual mounting, which hinders automatic mounting.

(d) 発明の目的 本発明は上記従来の欠点に鑑み、簡単な構成
で、容易にバイパスコンデンサのリード部の成形
加工を自動的に行いうるトランスフアー装置を提
供することを目的とするものである。
(d) Purpose of the Invention In view of the above-mentioned conventional drawbacks, an object of the present invention is to provide a transfer device that has a simple configuration and can easily and automatically mold the lead portion of a bypass capacitor. be.

(e) 発明の構成 そしてこの目的は本発明によればリード部を有
する部品のリード成形加工を自動的に行うトラン
スフアー装置であつて、各工程へ移送される該部
品を加工する第1の工程で、該リード部の下端部
を押圧成形する手段と、第2の工程で、該リード
部の押圧した下端部の先端の開きピツチ位置合わ
せすると共に、下方先端を切断する手段と、第3
の工程で、該切断されたリード部に湾曲のフオー
ミングを成形する手段を備えた構成になることを
特徴とするトランスフアー装置を提供することに
よつて達成される。
(e) Structure of the Invention According to the present invention, the purpose is to provide a transfer device that automatically performs lead forming processing on a component having a lead portion, and a first transfer device that processes the component transferred to each process. in a step, means for press-forming the lower end of the lead; in a second step, means for aligning the opening pitch of the tip of the pressed lower end of the lead and cutting the lower tip;
This is achieved by providing a transfer device characterized in that it has a structure that includes means for forming a curved forming on the cut lead portion in the step.

(f) 発明の実施例 以下本発明になる一実施例を図面によつて詳述
する。
(f) Embodiment of the Invention An embodiment of the present invention will be described in detail below with reference to the drawings.

第2図は本発明によるトランスフアー装置を説
明するための図であり、同図aは構造を示す上面
図、同図bは成形加工を示す工程図、第3図はフ
オーミング形状を示す図であり、同図aは正面
図、同図bは側面図、同図cは要部側面図、dは
実装状態を示す側断面図である。
Figure 2 is a diagram for explaining the transfer device according to the present invention; Figure a is a top view showing the structure, Figure b is a process diagram showing the forming process, and Figure 3 is a diagram showing the forming shape. FIG. 3A is a front view, FIG. 1B is a side view, FIG. 1C is a side view of a main part, and FIG.

同図において、第1図に用いた同じものは同一
番号を付す。又、6は固定台、7はシリンダであ
つて、押え具8を固定台6に対して揺動可能に備
える。9は受け具であつて、固定台6に取付けら
れる。10はツブシ型、11は切断型、12はフ
オーミング型、13はフオーミング形状をそれぞ
れ示す。
In this figure, the same parts used in FIG. 1 are given the same numbers. Further, 6 is a fixed base, 7 is a cylinder, and a presser 8 is provided so as to be swingable with respect to the fixed base 6. Reference numeral 9 denotes a receiver, which is attached to the fixed base 6. Reference numeral 10 indicates a spalling type, 11 a cutting type, 12 a forming type, and 13 a forming shape.

本発明のトランスフアー装置は、第2図に示す
ようにシリンダ7に取付けられた押え具8が左
右、前後の揺動可能に固定台6に設けられ、一
方、各工程A,B,C,D,Eのそれぞれの工程
間移送及び成形加工する受け具9が固定台6に設
けられた構成となつている。
In the transfer device of the present invention, as shown in FIG. 2, a presser 8 attached to a cylinder 7 is provided on a fixed base 6 so as to be able to swing from side to side and back and forth. The structure is such that a receiver 9 for transferring and molding between processes D and E is provided on a fixed table 6.

このように構成された装置の受け具9は、第2
図bに示す如く第一工程Aの部品送りよりの部品
セツトと、次の第二工程Bのコイニング成形には
リード部2の長さ決め及び先端を押圧成形する手
段のツブシ型10を設け、又、第三工程Cの先端
成形にはリード部2のピツチP決め及び先端を切
断する手段の切断型11を設け、更に第四工程D
のフオーミング成形にはリード部2のリード矯正
及び千鳥フオーミング13の形状をする手段のフ
オーミング型12を設けて形成されてなる。
The receiver 9 of the device configured in this way has a second
As shown in FIG. b, for parts setting by parts feeding in the first step A and coining forming in the second step B, a hammer mold 10 is provided as a means for determining the length of the lead part 2 and press-forming the tip. Further, in the third step C, a cutting die 11 is provided as a means for determining the pitch P of the lead portion 2 and cutting the tip, and further, in the fourth step D.
For forming forming, a forming mold 12 is provided as a means for correcting the leads of the lead portion 2 and shaping the staggered forming 13.

このような装置の動作は、先ず、図示されない
パーツフイーダより部品1が自動的に送り込まれ
第一工程Aにセツトされる。次に図示されない駆
動源によりシリンダ7が駆動され、シリンダ7に
連結する押え具8が下方矢印に揺動され部品1を
挟持すると、シリンダ7が右方矢印に移動して部
品1を第二工程Bに移送すると、図示されない駆
動源によりツブシ型10が駆動され矢印方向の押
圧の動作によつてリード部2の長さ決めと先端コ
イニング成形がなされる。
In the operation of such an apparatus, first, a part 1 is automatically fed from a parts feeder (not shown) and set in a first process A. Next, the cylinder 7 is driven by a drive source (not shown), and the presser 8 connected to the cylinder 7 is swung downward in the direction of the arrow to clamp the part 1, and then the cylinder 7 moves in the right direction to move the part 1 to the second process. When the lead portion 2 is transferred to the point B, the blade mold 10 is driven by a drive source (not shown), and the length of the lead portion 2 is determined and the tip coining is performed by pressing the lead portion 2 in the direction of the arrow.

この時、シリンダ7の駆動で押え具8が挟持を
解除されて一工程間揺動され元に戻ると共に、第
一工程Aに次の部品1がセツトされる。この押え
具8の工程間揺動は第三工程C、第四工程Dも同
様にしてなる。そして、第二工程B完了の部品1
がシリンダ7の駆動により再度押え具8の揺動で
挟持すると共に第三工程Cに移送する。すると図
示されない駆動源により切断型11が駆動され矢
印方向の動作でリード部2のピツチP決めと先端
成形がなされる。そして第四工程Dに部品1を挟
持移送して図示されない駆動源によりフオーミン
グ型12が駆動され矢印方向の動作でリード部2
のリード矯正と千鳥フオーミング13の形状が成
形されて加工済Eに移送がなされる。この際、こ
れが連続動作によつて部品1の各工程の移送及び
リード成形加工を自動的に行われている。
At this time, the holding tool 8 is released from its grip by the drive of the cylinder 7, is swung for one step, and returns to its original position, and the next part 1 is set in the first step A. This inter-process swinging of the presser 8 is performed in the same manner in the third process C and the fourth process D. Then, part 1 of the second process B completed.
The cylinder 7 is driven and the presser 8 swings again to clamp it and transfer it to the third process C. Then, the cutting die 11 is driven by a drive source (not shown), and the pitch P of the lead portion 2 is determined and the tip is formed by movement in the direction of the arrow. Then, in a fourth step D, the part 1 is transferred while being clamped, and the forming mold 12 is driven by a drive source (not shown), and the lead part 2 is moved in the direction of the arrow.
The lead is corrected and the shape of the staggered forming 13 is formed and transferred to the processed E. At this time, the transfer of each step of the component 1 and the lead forming process are automatically performed by continuous operation.

このリード部2の形状は第3図に示すようにピ
ツチPを矯正する(第3図a)、又、位置出しを
する(第3図b)、そして抜け止め用フオーミン
グ13形状となつて、第3図dに示す如くプリン
ト板3に部品1が簡単に実装されてなる。
As shown in FIG. 3, the shape of this lead portion 2 is for correcting the pitch P (FIG. 3a), for positioning (FIG. 3b), and as a form 13 for preventing slippage. As shown in FIG. 3d, the component 1 is simply mounted on the printed board 3.

尚、本発明では2本のリード2を千鳥にしてい
るが同一方向でも良い。
In the present invention, the two leads 2 are staggered, but they may be in the same direction.

従つて、この自動機によつてラジアル部品1の
リード部2が加工されるので、リードのピツチP
と矯正及び先端成形されたリード部2で行うため
プリント板3の挿入穴4への挿入しやすく、又、
リードフオーミング13形状によりプリント板3
から抜けることがない。又、寸法精度が高いので
自動挿入が容易に可能となつて、作業効率が向上
されコストを低減することができる。
Therefore, since the lead portion 2 of the radial component 1 is processed by this automatic machine, the lead pitch P
Since the lead part 2 is corrected and the tip is formed, it is easy to insert into the insertion hole 4 of the printed board 3, and
Printed board 3 due to lead forming 13 shape
I can't get out of it. Furthermore, since the dimensional accuracy is high, automatic insertion is easily possible, which improves work efficiency and reduces costs.

(g) 発明の効果 以上、詳細に説明したように、本発明のトラン
スフオー装置は簡易構成で、且つ、操作性がよ
く、簡単な成形加工工程の構造で容易にリード部
の成形加工を自動化にでき、その作業性の向上が
でき得るといつた効果大なるものである。
(g) Effects of the Invention As explained above in detail, the transfer device of the present invention has a simple configuration, good operability, and a simple structure of the forming process to easily automate the forming process of the lead part. This has a great effect in that it can improve workability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はプリント板実装を説明するための図、
第2図は本発明によるトランスフアー装置を説明
するための図、第3図は本発明のプリント板実装
を説明するための図である。 図において、1は部品、2はリード部、3はプ
リント板、4は挿入穴、6は固定具、7はシリン
ダ、8は押え具、9は受け具、10はツブシ型、
11は切断型、12はフオーミング型、13はフ
オーミング形状をそれぞれ示す。
Figure 1 is a diagram for explaining printed board mounting.
FIG. 2 is a diagram for explaining a transfer device according to the present invention, and FIG. 3 is a diagram for explaining mounting on a printed board according to the present invention. In the figure, 1 is a component, 2 is a lead part, 3 is a printed board, 4 is an insertion hole, 6 is a fixture, 7 is a cylinder, 8 is a presser, 9 is a receiver, 10 is a screw type,
11 is a cutting type, 12 is a forming type, and 13 is a forming shape.

Claims (1)

【特許請求の範囲】[Claims] 1 リード部を有する部品のリード成形加工を自
動的に行うトランスフアー装置であつて、各工程
へそれぞれ移送される該部品を加工する第1の工
程で、該リード部の下端部を押圧成形する手段
と、第2工程で、該リード部の押圧した下端部の
先端の開きピツチ位置合わせすると共に、下方先
端を切断する手段と、第3の工程で、該切断され
たリード部を湾曲のフオーミングを成形する手段
を備えた構成になることを特徴とするトランスフ
アー装置。
1. A transfer device that automatically performs lead forming processing on a part having a lead part, which press-forms the lower end of the lead part in the first step of processing the part transferred to each process. means for, in a second step, aligning the opening pitch of the tip of the pressed lower end of the lead portion and cutting the lower tip; and, in a third step, forming the cut lead portion into a curved shape. A transfer device characterized in that it is configured to include means for molding.
JP57133101A 1982-07-30 1982-07-30 Transfer unit Granted JPS5923511A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57133101A JPS5923511A (en) 1982-07-30 1982-07-30 Transfer unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133101A JPS5923511A (en) 1982-07-30 1982-07-30 Transfer unit

Publications (2)

Publication Number Publication Date
JPS5923511A JPS5923511A (en) 1984-02-07
JPS6212653B2 true JPS6212653B2 (en) 1987-03-19

Family

ID=15096840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57133101A Granted JPS5923511A (en) 1982-07-30 1982-07-30 Transfer unit

Country Status (1)

Country Link
JP (1) JPS5923511A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680950B2 (en) * 1986-10-31 1994-10-12 株式会社日立製作所 Lead molding equipment for electronic parts

Also Published As

Publication number Publication date
JPS5923511A (en) 1984-02-07

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