JPH0451868B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for inspecting data for creating a pattern film for forming a printed wiring board, and in particular, this invention relates to a method for inspecting data for creating a pattern film for forming a printed wiring board. The present invention relates to a method of inspecting data for creating a pattern film when the pattern is composed of pads.

(Prior Art) In order to form a necessary conductor circuit on a printed wiring board, no matter what method is used, there must be something that will become the basis of the conductor circuit. Usually, a material corresponding to the conductor circuit, that is, a pattern film on which a pattern is drawn, is used as the source of the conductor circuit. To create this pattern film, it is necessary to create a pattern design drawing, which is the basis of the pattern film, from a given circuit diagram. In other words, in order to form the conductor circuits necessary for printed wiring boards,
First, it is necessary to create a pattern design drawing from the circuit diagram, and then create a pattern film from this pattern design drawing.By using this pattern film, it is finally possible to create the necessary conductor circuits on the printed wiring board. It can be formed.

These steps must be taken to
This is because it is difficult to form a conductor circuit directly on a printed wiring board using the circuit diagram as it is, and it is difficult to form a conductor circuit directly on a printed wiring board. This is because the conductor circuit must be designed.

If you want to create a pattern design drawing from the above-mentioned circuit diagram, and then create a pattern film from this pattern design drawing, with the current technology, you can use a computer etc. to input the circuit diagram data. It is possible to immediately form a pattern film by simply doing this. However, in order to carry out such work, it is necessary to introduce and use a fairly sophisticated computer system, which is especially important now that there is a strong demand for high-mix, low-volume production of this type of printed wiring board. This is not practical in terms of cost and efficiency of use of the computer system. In other words, it is impossible to directly form the pattern film used to form the necessary conductor circuits on a printed wiring board from a given circuit diagram using a large-scale computer system. However, such a method is generally too costly, and there is currently no remet for producing printed wiring boards, which are basic components.

Conventional methods for creating such a pattern film have generally been as follows. First, an operator creates a pattern design drawing from a given circuit diagram, taking into account the arrangement of parts and the layout of the pattern. After checking and correcting this pattern design drawing, data for creating a pattern film is created from this pattern design drawing.
It is created using a CAD system (usually a system that includes a digitizer), and a pattern film is created based on this pattern film creation data. Then, in the pattern created on this pattern film, we inspect whether each land and line is formed correctly and whether they are unnecessarily close or in contact with each other, that is, whether there are any errors. That's what I do. However, in conventional pattern film inspection, the pattern film creation data, which is the basis of the pattern film, is first divided into pattern lands and lines and then digitized, and any of these land or line data is The data for pattern film creation is inspected for good or bad by selecting two pieces of data as a pair and inspecting whether the condition between the selected pair of data is within the set range or not. A method has been proposed. For example, the applicant of the present invention has already proposed a method related to this in Japanese Patent Application No. 84810/1983.

However, in recent years, printed wiring boards have become smaller, lighter, and thinner, and various electronic components that make up electronic circuits are made by drilling holes in the printed wiring board and inserting the legs (leads) of the components into them. The use of surface mount devices (SMD), which attach components without making holes on printed wiring boards, is increasing from devices that attach components (DIP type).
The printed wiring boards on which these electronic components are mounted also have higher density, higher precision, and
High quality is required.

Along with this, the pattern on the pattern film for forming the conductor circuit required for conventional printed wiring boards was formed from lands and lines, but the pattern on the printed wiring board for mounting the surface mount components has become more and more popular. In addition to lands and lines, pads for attaching the surface mount components have been formed in the pattern on the pattern film for forming the conductor circuits necessary for the.
As a result, the pattern film creation data includes conventional land data consisting of the center coordinates and radius of a land, line data indicating the coordinates of the end point of the line and its radius, and the coordinates of the end point of the pad. It is formed from pad data indicating the radius. However, since the line data and the pad data are made up of the same data, that is, data indicating coordinates and their radius, it is not possible to clearly distinguish lines and pads from the data.

For this reason, the inspection method already proposed above is sufficient for data for creating a pattern film for patterns consisting of lands and lines. Regarding the inspection of data for creating a pattern film for a pattern including large pads, no support was provided for the pads, and the pad portions remained uninspected.

After all, inspection of the pattern film of a printed wiring board for mounting even one surface mount component, that is, a printed wiring board having pads for mounting the surface mount component, is carried out manually, such as by visual inspection, after the pattern film has been created. Alternatively, after inspecting only the pattern portion consisting of lands and lines using the previously proposed inspection method, a pattern film is prepared and the film is inspected manually, such as by visual inspection. Not only does it take a considerable amount of time, but in some cases, there may be an oversight and a complete check may not be performed. In any case, if there is an error in the completed pattern film, please contact us as described above.
After correcting the CAD data, that is, the data for creating the pattern film, it was necessary to create the pattern film again, which increased the design time and increased the cost of the final product, the printed wiring board.

(Problems to be Solved by the Invention) The present invention has been made in view of the above-mentioned circumstances, and the problems to be solved are for conductive circuits formed on surface-mount printed wiring boards. The problem is low reliability and low efficiency when inspecting data for creating a pattern film, which is the basis of the pattern film.

The purpose of the present invention is to solve various problems when inspecting data for creating a pattern film, which is the basis of a pattern film for such a surface-mounted printed wiring board, and to solve these problems using existing simple equipment. It is an object of the present invention to provide a method for inspecting pattern film creation data efficiently and at low cost using the following. In particular, the present invention facilitates inspection of data for creating a pattern film for surface-mounted printed wiring boards, reduces inspection time, and improves the reliability of finished products. The purpose of this invention is to provide a method for inspecting data for film production.

(Means for Solving the Problems) The means taken by the present invention to solve the above problems are as follows: ``Form a pattern consisting of lands, lines, and pads on a printed wiring board from a given circuit diagram. A pattern design drawing is created for the process, pattern film creation data is created from this pattern design diagram, the correctness of this pattern film creation data is inspected and corrected, and then a pattern on the printed wiring board is formed. In creating a pattern film for the land, the pattern film creation data is composed of land data consisting of the center coordinates and radius of the land, the coordinates and radius of the end points of the line and pad, and the continuity of these end points. data indicating that the printed wiring board is unmasked, and line data consisting of line data that is not masked on the printed wiring board. calculate the area, perform arithmetic processing to determine whether or not the line data is within the non-masked area, and convert the line data into true line data that is not within the non-masked area and pad data that is within the non-masked area. At the same time, the pattern design drawing is disassembled into predetermined sections,
The land data, true line data and pad data that fall within this section are stored for each section,
Select a pair of land data, true line data, or pad data that falls within this section and another land data, true line data, or pad data that falls within the same section, and calculate the distance between them. and detects an error portion of the pattern film creation data by performing arithmetic processing to determine whether the calculated distance is within a predetermined value. A method of inspecting data for creating a pattern film. ”.

That is, the inspection method according to the present invention limits the pattern on the pattern film to only lands and lines, and does not simply decompose the data for creating the pattern film into land and line data and digitize it. After dividing the data into land and line data and converting them into numerical values, the line data is divided into true line data and pad data from data for creating a solder mask film for forming a solder mask on a printed wiring board. Quantify it. After that, by appropriately dividing the pattern design drawing, any two of these land, true line, and pad data are selected and paired for each predetermined divided section, and the pair of data selected in this way is By checking whether the state between the data is within a set range or not across all pairs of divided sections, it is possible to check whether the data for creating the pattern film is good or bad.

In the present invention, it is meaningful to divide pattern film creation data into land data, true line data, and pad data. The pattern film creation data is formed from parameters indicating the land or line, the center coordinates of the land and its radius, and the coordinates of both end points of the line and its radius, and true lines and pads are treated as the same line. This is because these cannot be distinguished. Therefore, in order to distinguish between true lines and pads, we decided to use data for creating a solder mask film for forming an insulating film (solder mask) to cover a pattern on a printed wiring board. In other words, pads for mounting surface mount components are not always covered by the solder mask due to their characteristics, so the unmasked area of the printed wiring board is calculated from the solder mask creation data, and the line data is It is formed by dividing it into true line data that is not in the non-masked area and pad data that is in the non-masked area. In addition, by inspecting the formed land data, true line data, and pad data separated in this way within a certain range obtained by appropriately dividing the pattern design drawing, the inspection can be improved. By significantly reducing the number of data pair combinations required for the process, we can fully cope with the current situation where the frequency of mounting surface-mounted components on printed wiring boards in recent years has increased, and the circuit patterns have become more complex. This is the test that will be carried out to obtain the results.

Next, the principle of the present invention will be schematically explained using the drawings.

The principle used in this invention is as follows. The basic idea of this invention is that the pattern (conductor circuit) on the printed wiring board as shown in Figure 4 has a circular (land) shape and a semicircular shape at both ends, as shown in Figures A to C of Figure 6. Alternatively, it can be seen as a angular band (true line, padsudo). If we consider patterns in this way, no matter how complex the pattern is, we can reliably realize the pattern by combining the circles (lands) and bands (true lines, pads) mentioned above. .

For example, to explain the case where a pattern as shown in Fig. 4 is formed on a printed wiring board, first, this pattern is used as a place where a terminal of an electronic component is inserted or a through hole is formed. The pad 60 is a part to which a terminal of an electronic component is connected, and the true line 50 is a pattern to electrically connect these lands 40 or pads 60. In this case, the straight line 50 is one true line 50 as it is, and if this true line 50 is bent, another true line 50 extends from the bent part. That is to say.

If we enlarge a part of the example of the pattern circuit diagram shown in Figure 4 and consider it by dividing it as above, we can see that
The result will be as shown in the figure. In the case shown in FIG. 5, there are two lands 40 and one pad 6.
0 and three true lines 50, but of course there is one land 4 in the pattern.
0, a pad 60 or a true line 50.

6A to 6C show the land 40, true line 50, and pad 60 taken out and shown separately. When defining the land 40, the true line 50, and the pad 60, the land 40 is quantified using its center coordinates and the radius of the land 40 itself. In this case, the true line 50 is digitized based on the coordinates of the end points of the true line 50, the thickness (or width) of the true line 50, and data indicating that both end points are connected. In addition, for Pad 60,
The pad 60 is digitized using data indicating the coordinates of the end points of the pad 60 and the thickness (or width) of the pad 60. In other words, in the present invention, each data defining these lands 40, true lines 50, and pads 60 is used as data consisting of vector quantities.

When inspecting pattern film production data using the vector data as described above, normal states are defined as shown in A to C of FIGS. 7, 8, and 9. That is, FIG. 7 shows a case where the land 40 and the true line 50 are located normally, and the center of the land 40 and the true line 5
This is a case where the center of 0 coincides with one end point. FIG. 8 shows a case where the true lines 50 and the true lines 50 are positioned normally, and the end point of one true line 50 and the end point of the other true line 50 coincide. A in Figure 9, B in Figure 9, and C in Figure 9 are the true line 50 and the pad 6.
9A and 9B are cases in which the true line 50 and the pad 60 intersect in the horizontal direction, and the true line 50 protrudes from the pad 60 in the vertical direction. This is the case where there is no.
9C is a case where the true line 50 and the pad 60 intersect perpendicularly, and the true line 50 does not penetrate through the pad 60.

In other words, the true line 50 and the pad 60 are in a normal state if their center lines are parallel and orthogonal, respectively.

●When the center lines of both are parallel If the radius of the end point 51 of the true line 50 is R ₁ , the radius of the end point 61 of the pad 60 is R ₂ , and the distance between both center lines is L ₁ , then R ₂ ≧R ₁ +L ₁ A normal state is when the following conditions are met.

●When the center lines of both are orthogonal, both end points 51 of the true line 50 and the pad 60
The distance between the center line connecting both end points 61 is L ₂ ,
Assuming L ₃ , the normal state is when either of the conditions R ₂ ≧R ₁ +L ₂ or R ₂ ≧R ₁ +L ₃ is satisfied.

Of course, if there is a sufficient distance between any two of the land 40, true line 50, or pad 60, that is considered normal.

In contrast, I to C in Figure 10 are land 4
0, a typical example is shown in which a pair of true lines 50 or pads 60 are not properly positioned. A in Figure 10 is land 40 and true line 50
Or the state where the pad 60 is too close, the 10th
B of the figure shows a state where the true line 50 and the true line 50 intersect, and FIG.
This is a state in which the true line 50 or the pad 60 are interfering with each other. All of these conditions cause shortening of each conductor circuit when it is formed as a pattern on a printed wiring board.

Land 4 created with the above vector quantities
0 data and true line 50 data and pad 60
In combination with the data, the entire image of the pattern formed on the printed wiring board can be taken, thereby making it easier to inspect the data for creating the pattern film.

Furthermore, in the case of pattern films for recent printed wiring boards that require high-density mounting, land 40 and true line 5
Since the number of arbitrary two combinations of 0 and pad 60 is enormous, the standard pattern design drawing is decomposed into predetermined sections, and the land 40, true line 50, and By considering only the combination of pads 60,
This reduces the number of land 40, true line 50, and pad 60 combinations that must be inspected. This is possible because any two lands 40, true lines 50, or pads 60 that are too close together or short need to be considered only in the adjacent lands 40, true lines 50, or pads 60; Distant land 40, true line 50 or padded 60
This is because a pair of tests would be practically wasted.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a drawing corresponding to the scope of the claims, and shows the steps according to the present invention in order.
This FIG. 1 corresponds to steps (C) to (E) in FIG. 2. The steps shown in Figure 2 are:
From the circuit diagram 10 as illustrated in FIG.
This figure shows the procedure for forming the pattern film 30 as shown in Figure 3. In step (A), the circuit diagram 10 in which the necessary electronic components are combined and electrically connected is created using a normal design method. Create it. From the circuit diagram 10 created in this way, a pattern design drawing 20 is created in step (B) while taking into account the size and position of the electronic components, the size of the printed layout board, and the layout of various electronic components placed on it. Create. After that, predetermined data (pattern film creation data) is created from the pattern design drawing 20 in step (C) so that the pattern film 30 can be easily formed by arithmetic processing, and this is inspected in step (D). do. and,
Based on the results obtained from this inspection, the data is corrected in step (E), and finally, the pattern film 30, which is the final objective, is formed from this corrected data using an automatic drawing device.

As mentioned above, the method of the present invention is an improvement of the steps (C) to (E) of the above steps shown in FIG. This will be explained in detail using figures.

First, for step (a) in Fig. 1, circuit diagram 10
From pattern design drawing 20 created based on
Each land 40 and line (true line 50 or pad 60) formed as a pattern on the printed wiring board is digitized using a digitizer or the like. In this case, each land 40 and line (true line 50 or pad 60) is defined by the land data consisting of the center coordinates 41 and radius of the land 40 and the end points 51, 61 of the line (true line 50 or pad 60), as described above. It is decomposed into line data consisting of the coordinates of , its radius, and data indicating that these end points are continuous, and then converted into numerical values.

Next, in step (b) of Figure 1, from the data for creating a solder mask film for forming a solder mask to cover the pattern on the printed wiring board, a non-mask film that does not cover the pattern on the printed wiring board is selected. Calculate area 70. Then, in step (c), arithmetic processing is performed to determine whether the line data obtained in step (a) is within the non-masked area. As a result, line data can be separated into true line data that is not within the non-masked area 70 and pad data that is within the non-masked area 70.

With respect to the land data, true line data, and pad data formed as described above, the pattern design drawing 20 is conceptually decomposed into predetermined sections, and the land data, true line data, or pad data that fall within these sections are stored. This is step (d) in Figure 1. In this case, by assigning a sequence number to each section, the arithmetic processing described below can be performed efficiently. Conceptually disassembling the pattern design drawing 20 into predetermined sections does not mean drawing lines directly on the pattern design drawing 20 and disassembling it.
As will be described later, this means determining the range in which each land data, true line data, and pad data can fit, and therefore the pattern film 3 after completion.
0 may be decomposed into predetermined sections.

In this way, conceptually dividing the pattern design drawing 20 etc. into predetermined sections is one piece of land data,
When selecting a set of true line data or pad data and another piece of land data, true line data or pad data, if the total number of line data, true line data or pad data is large, the number of combinations of both. This is done to avoid this, since the amount of data would be enormous.

The land 40, the true line 50, and the pad 6 that are digitized to fit within the predetermined section in this way
0, select any set of these,
The procedure is to calculate the distance between these sets of data.
(e). In this case, if true line data is included as a set of data, a line segment connecting both end points 51 of this true line 50 and the center coordinates 41 of another land 40 or both end points of the true line 50 51 or both end points 61 of the pad 60. Note that the distance between the lands 40 can be easily calculated by calculating the distance between the center coordinates 41 of the two.

Step (e) is to perform arithmetic processing on each distance calculated in this way to determine whether it is within a predetermined range, and then a similar calculation process is performed on each data in step (f). Step (g) is performed for each group, and for all groups in each divided section.

Details of the above steps (e) to (g) will be explained with reference to FIG.

First, in step one section as the inspection range is selected. Then, in the next step, it is checked whether all the sections have been inspected. If all the sections have been inspected, the inspection job moves to step 〓〓 and ends, but if not, the inspection job ends. to move to.

In this step, a set of data within one section is selected. The step checks whether this set of data is the last one, and if so, returns to the step; if not, moves to the step.

In this step, it is checked whether the set of data selected in the step consists of true line data and genuine line data. If it consists of genuine line data and true line data, the process moves to the next step and checks whether or not there is an intersection between the two. The case where the two intersect refers to the states A and B in Fig. 15, where A in Fig. 15 is a normal state (each end point 51 coincides), and B in Fig. 15 is a normal state. (the end points 51 do not match).

If these two true line data intersect, the step is to check whether it is in the state A or B in FIG. 15. That is, if any of the end points 51 match in this step, it means that each true line 50 is bent normally, and the process moves on to the next step to perform the next inspection. Furthermore, if none of the end points 51 match in this step, it means that the true lines 50 do not intersect normally, and the process moves on to this step and an error is registered.

If it is determined in the step that there is no intersection, the relationship between the two true line data will be in the state C or D in FIG. 15.
The condition C in FIG. 15 is a case where both true lines 50 are too close together, and the condition D in FIG. 15 is a case where both true lines 50 are normally separated.
A determination as to whether the true line 50 is normally separated is made based on whether it is longer or shorter than a preset distance _l1 . The value of this distance _l1 can be set depending on the shape of the printed wiring board or each true line 5.
It is determined as appropriate depending on the degree of refinement of 0 required. After the cases are divided in this step, it is checked whether the distance is longer or shorter than the value of the distance _l1 mentioned above, and then the process moves to step or.

On the other hand, in the above step, if the set of data selected in the step is not the true line data and the true line data, the process moves to the step.

In this step, it is checked whether the set of data selected in the step consists of land data and true line data. If it consists of land data and true line data, the process moves to the next step and checks whether or not there is an intersection between the two. The case where the two intersect refers to the states A and B in FIG. 16, and A in FIG.
1), and b in FIG. 16 shows an abnormal state (the center coordinates 41 of the land 40 and the end point 51 of the true line 50 do not match).

If there is this intersection, the step is to check whether it is in the state A or B in FIG. 16.
That is, if the center coordinates 41 of the land 40 and the end point 51 of the true line 50 match in this step, it means that the land 40 and the true line 50 are in a normal state, and the process moves to the next step for the next inspection. It is. Furthermore, if the center coordinates 41 of the land 40 and the end point 51 of the true line 50 do not match in this step, it means that the land 40 and the true line 50 do not intersect normally, so proceed to the step and register an error. will be done. In this case, the inspection is performed by setting a minimum deviation distance _l2 between the land 40 and the true line 50 in advance, and determining whether the calculated distance is larger or smaller than this distance _l2 . When the land 40 and the true line 50 are formed as a pattern on the printed wiring board, it is sufficient that they are electrically conductive, and the intersection between the land 40 and the true line 50 does not need to be a perfect match; There is a reason why the minimum deviation distance l ₂ can be set.

If it is determined that there is no intersection in the step, the relationship between the land data and the true line data will be in the state C or D in FIG. 16. The state of C in Figure 16 is land 40.
This is a case where the land 40 and the true line 50 are too close to each other, and the state D in FIG. 16 is a case where the land 40 and the true line 50 are normally separated. A determination as to whether the true line 50 is normally separated is made based on whether it is longer or shorter than a preset distance _l3 . The setting of the value of this distance l ₃ is determined as appropriate depending on the shape of the printed wiring board, the degree of refinement of each true line 50, and the like. After the cases are divided in this step, it is checked whether the distance is longer or shorter than the value of the distance _l3 mentioned above, and then the process moves to step or.

On the other hand, in the above step, if the set of data selected in step is not true line data and line data, the process moves to step.

In this step, it is checked whether the set of data selected in the step consists of land data and land data. If it consists of land data and land data, move to the next step. In this step, it is inspected whether both lands 40 are in the state A or B in FIG. 17, and A in FIG. 17 shows a normal state (the center coordinates 41 of both lands 40 are separated by a predetermined distance _l4 or more). In this step, the center coordinates 4 of both lands 40
1 is longer or shorter than the predetermined value of distance _l4 , and the process moves to step or step.

On the other hand, in the above step, if the set of data selected in the step is not the land data and the land data, the process moves to the step.

In this step, it is checked whether the set of data selected in the step consists of true line data and pad data.
If it consists of true line data and pad data, move to the next step and check whether or not there is an intersection between the two. The case where there is an intersection between the two refers to the states A, B, C, D, and Ho in Fig. 18, and the states A, B, and C in Fig. 18 are normal states, and the states D and H in Fig. 18 are normal states. indicates an abnormal state. That is, in A and B, the true line 50 and the pad 60 intersect in the horizontal direction, and the true line 50 does not protrude in the width direction of the pad 60, and in the state C, the true line 50
and pad 60 intersect perpendicularly, and true line 5
0 indicates a state in which the pad 60 does not penetrate in the width direction. In addition, state 2 is a state in which the true line 50 protrudes in the width direction of the pad 60,
In the state E, the true line 50 penetrates through the pad 60 in the width direction.

If there is an intersection between the true line data and the pad data, the step is to check which of the states A, B, C, D, and E in FIG. 18 is present. That is, in this step, if the true line 50 and pad 60 are in any of the states shown in A, B, or C in Fig. 18, they are in a normal state, and the next step is to be performed. be. Furthermore, if the true line 50 and pad 60 are in the state shown in FIG. 18 (D) or (E) in this step, they do not intersect normally, so the process moves on to step and an error is registered.

If it is determined that there is no intersection in the step, the relationship between the true line 50 and the pad 60 will be in the state shown in FIG. In the situation shown in FIG. 18, the true line 50 and the pad 60 are too close to each other, and the
The state shown in Figure 8 is the true line 50 and the pad 60.
This is the case when the distance is normal. A determination as to whether the true line 50 and the pad 60 are normally separated is made by determining whether the distance is longer or shorter than a preset distance _l5 , and then the process moves to step or step.

On the other hand, in the above step, if the set of data selected in step is not true line data and pad data, the process moves to step.

In this step, it is checked whether the set of data selected in the step consists of pad data and pad data. If the data consists of pad data and pad data, move to the next step. In this step, it is checked whether both pads 60 are in the state A or B in FIG.
The condition A in the figure is when both pads 60 are too close together, and the condition B in FIG. 19 is when both pads 60 are too close together.
This is the case when the distance is normal. In this step, it is checked whether both pads 60 are longer or shorter than a predetermined distance _l6 , and the process moves to step or step.

In the above step, if the set of data selected in the step is not the pad data and the pad data, inspections other than the five cases mentioned above are performed, so the state inspection of the land 40 and pad 60 is performed. become. That is, in this step, it is inspected whether the land 40 and pad 60 are in the state A or B in FIG. 20, and the state A in FIG. This is a case where they are too close to each other, and the state B in Figure 20 is land 40.
This is a case where the pad 60 and the pad 60 are normally separated.
In this step, land 40 and pad 6
It is checked whether the distance of 0 is longer or shorter than the predetermined value of distance _l7 , and the process moves to step or step.

By performing the above arithmetic processing, the inspection according to the present invention ends when step 〓〓 is reached. However, if there is an error registered in the step, the The data for creating the pattern film is corrected. This is the procedure (h) shown in FIG. Note that it is preferable to return to step (a) again and sequentially perform the above-described inspection on the pattern film creation data corrected by this means (h).

Based on the pattern film creation data completely corrected as described above, the pattern film 30 shown in FIG. 13 is finally formed. In other words, by employing the present invention, the pattern film 30 only needs to be formed once.

(Effects of the Invention) As detailed above, in the present invention, "a pattern design diagram for forming a pattern consisting of lands, lines, and pads on a printed wiring board is created from a given circuit diagram, Data for creating a pattern film is formed from this pattern design drawing, and after checking and correcting the correctness of this data for creating a pattern film, the process is performed to create a pattern film for forming the pattern on the printed wiring board. Then, the data for creating the pattern film is obtained from land data consisting of the center coordinates and radius of the land, coordinates of the end points of the lines and pads, their radii, and data indicating that these end points are continuous. calculating an unmasked area of the printed wiring board from data for creating a solder mask film for forming a solder mask of the printed wiring board; Performing arithmetic processing to determine whether or not the line data is within the non-masked area, and newly decomposing the line data into true line data that is not within the non-masked area and pad data that is within the non-masked area, and forming the pattern. Break down the blueprint into designated sections,
The land data, true line data and pad data that fall within this section are stored for each section,
Select a pair of land data, true line data, or pad data that falls within this section and another land data, true line data, or pad data that falls within the same section, and calculate the distance between them. However, the feature lies in that the error portion of the pattern film creation data is calculated by calculating whether or not the calculated distance is within a predetermined value. ,
We have already solved the low reliability and inefficiency when inspecting the pattern film forming data that is the basis of the pattern film for conductor circuits formed on conventional printed wiring boards for surface mounting. This makes it possible to provide a method that allows pattern film formation data to be inspected efficiently and at low cost using some simple equipment.

In particular, the present invention facilitates the checking of pattern film creation data, reduces checking time, and improves the reliability of the finished product.Inspection of pattern film creation data for printed wiring boards We can provide a method.

[Brief explanation of the drawing]

Fig. 1 is a flowchart showing the procedure for explaining the method according to the present invention, Fig. 2 is a flowchart showing the procedure for creating a pattern film from a circuit diagram, and Fig. 3 is a flowchart showing the procedure for creating a pattern film from a circuit diagram. This is a flowchart showing the procedure for inspecting data. Also, Fig. 4 is a plan view showing a part of the pattern film after completion, Fig. 5 is a plan view showing a part of Fig. 4 enlarged and divided into lands, true lines, and pads, and Fig. 6. A to C are plan views showing the schematic configuration of the land, true line, and pad;
The figure is a plan view showing a state in which the land and the true line are positioned normally, Figure 8 is a plan view showing a state in which the true line and the true line are positioned normally, and Figure 9
Each of Figures A to C is a plan view showing a state in which the true line and pad are positioned normally, and Figure 10 is a plan view showing a state in which a set of lands, true line, or pad is not properly positioned. be. moreover,
11 is a plan view showing an example of a circuit diagram, FIG. 12 is a pattern design diagram formed based on the circuit diagram in FIG. 11, and FIG. 13 is a pattern film formed from the pattern design diagram in FIG. 12. A plan view, FIG. 14 is a plan view of a solder mask film created to cover a pattern on a printed wiring board, FIG. 15 is a plan view illustrating the relationship between true lines, and FIG. FIG. 17 is a plan view illustrating the relationship between lands and true lines, FIG. 18 is a plan view illustrating the relationship between true lines and pads, and FIG. 19 is a plan view illustrating the relationship between lands and pads. Plan view illustrating the relationship between pads, No. 20
The figure is a plan view illustrating the relationship between lands and pads. Explanation of symbols, 10...Circuit diagram, 20...Pattern design drawing, 30...Pattern film, 40...
Land, 41... Center coordinates of land, 50... True line, 51... End point of true line, 60...
Pad, 61... end point of pad, 70... non-masked area.

Claims (1)

[Claims] 1. Create a pattern design drawing for forming a pattern consisting of lands, lines, and pads on a printed wiring board from a given circuit diagram, and create data for creating a pattern film from this pattern design drawing. After inspecting and correcting the correctness of this pattern film creation data, when creating a pattern film for forming patterns on the front and rear printed wiring boards, the pattern film creation data is Land data consisting of the center coordinates and radius of the land, and line data consisting of the coordinates of the end points of the lines and pads, their radii, and data indicating that these end points are continuous. Calculate a non-masked area of the printed wiring board from data for creating a solder mask film for forming a solder mask on the printed wiring board, and calculate whether or not the line data is within the non-masked area. processing to newly decompose and form the line data into true line data that is not in the non-masked area and pad data that is in the non-masked area, and decompose the pattern design drawing into predetermined sections,
The land data, true line data and pad data that fall within this section are stored for each section,
Select a pair of land data, true line data, or pad data that falls within this section and another land data, true line data, or pad data that falls within the same section, and calculate the distance between them. and detects an error portion of the pattern film creation data by performing arithmetic processing to determine whether the calculated distance is within a predetermined value. A method of inspecting data for creating a pattern film.