JPH0451970B2 - - Google Patents
Info
- Publication number
- JPH0451970B2 JPH0451970B2 JP57191057A JP19105782A JPH0451970B2 JP H0451970 B2 JPH0451970 B2 JP H0451970B2 JP 57191057 A JP57191057 A JP 57191057A JP 19105782 A JP19105782 A JP 19105782A JP H0451970 B2 JPH0451970 B2 JP H0451970B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealed tube
- heat
- epitaxial growth
- liquid phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/263—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using melted materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2913—Materials being Group IIB-VIA materials
- H10P14/2917—Tellurides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3432—Tellurides
Landscapes
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Photovoltaic Devices (AREA)
- Light Receiving Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は密閉構造の回転式液相エピタキシヤル
成長装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a rotary liquid phase epitaxial growth apparatus having a closed structure.
(b) 技術の背景
水銀(Hg)を含む化合物半導体結晶、例えば
水銀・カドミウム・テルル(Hg1-XCdXTe)等は
エネルギーギヤツプが狭く、赤外線検知素子のよ
うな光電変換素子の形成材料として用いられてい
る。(b) Technical background Compound semiconductor crystals containing mercury (Hg), such as mercury-cadmium-tellurium (Hg 1-X Cd Used as a forming material.
このようなHg1-XCdXTeの結晶を素子形成に都
合が良いように大面積で、しかも薄層の状態で形
成する方法として液相エピタキシヤル成長法があ
る。 Liquid phase epitaxial growth is a method for forming such Hg 1-X Cd X Te crystals in a large area and in a thin layer, convenient for device formation.
ところでHgは非常に易蒸発性元素であるので、
このようなHg1-XCdXTeの結晶を液相エピタキシ
ヤル方法で形成するための装置として本発明者等
は密閉構造の回転式液相エピタキシヤル成長装置
を以前に提案している。 By the way, Hg is a very easily evaporable element, so
As an apparatus for forming such a crystal of Hg 1-X Cd X Te by a liquid phase epitaxial method, the present inventors have previously proposed a rotary liquid phase epitaxial growth apparatus with a closed structure.
(c) 従来技術と問題点
第1図は先に提案した液相エピタキシヤル成長
装置の斜視図で、第2図はそのA−A′断面図で、
第3図はそのB−B′断面図である。(c) Prior art and problems Figure 1 is a perspective view of the previously proposed liquid phase epitaxial growth apparatus, and Figure 2 is a sectional view taken along line A-A'.
FIG. 3 is a sectional view taken along line B-B'.
第1図、第2図、第3図に示すように先に提案
した液相エピタキシヤル成長装置は、耐熱性の石
英よりなる封管1内に内接するよう一対の石英棒
よりなる支持部材2を設置した構成を有する。該
支持部材2にはそのセンターをはずれた位置で対
向する長方形状の凹所3が切削されており、この
凹所の中に長方形状の石英板よりなる基板設置台
4がはまり込むようになつている。そしてこの凹
所の縦方向の寸法Cはこの基板設置台4の厚さと
その上に設置するテルル化カドミウム(CdTe)
の基板5の厚さの和に等しい寸法とする。 As shown in FIGS. 1, 2, and 3, the previously proposed liquid phase epitaxial growth apparatus has a support member 2 made of a pair of quartz rods inscribed in a sealed tube 1 made of heat-resistant quartz. It has a configuration with . A rectangular recess 3 facing each other is cut in the support member 2 at a position offset from the center thereof, and a substrate installation stand 4 made of a rectangular quartz plate is fitted into this recess. ing. The vertical dimension C of this recess is the thickness of this substrate installation stand 4 and the cadmium telluride (CdTe) installed on it.
The dimensions are equal to the sum of the thicknesses of the substrates 5.
このようなエピタキシヤル成長装置の基板設置
台4上にCdTeの基板5を設置し、該基板設置台
の下部に基板上に形成すべきHg1-XCdXTeのエピ
タキシヤル層形成用材料6を充填した状態で該エ
ピタキシヤル成長装置を加熱炉中に挿入し、該加
熱炉を加熱してHg1-XCdXTeの材料を溶融する。
その後Hg1-XCdXTeの材料が溶融した時点で封管
1を180°回転させ基板にHg1-XCdXTeの溶液を接
触させてから加熱炉の温度を所定の降温速度で低
下させ基板上にHg1-XCdXTeの結晶をエピタキシ
ヤル成長させる。その後基板上に所定の厚さエピ
タキシヤル成長した段階で再び封管1を180°回転
させて基板上に付着しているHg1-XCdXTeの溶液
を除去して基板上に所定の厚さのエピタキシヤル
層を形成するようにしている。 A CdTe substrate 5 is placed on the substrate installation stand 4 of such an epitaxial growth apparatus, and a Hg 1-X Cd X Te epitaxial layer forming material 6 to be formed on the substrate is placed at the bottom of the substrate installation stand. The epitaxial growth apparatus filled with Hg 1-X Cd X Te is inserted into a heating furnace, and the heating furnace is heated to melt the Hg 1-X Cd X Te material.
After that, when the Hg 1-X Cd X Te material is melted, the sealed tube 1 is rotated 180 degrees to bring the Hg 1-X Cd X Te solution into contact with the substrate, and then the temperature of the heating furnace is lowered at a predetermined cooling rate. A crystal of Hg 1-X Cd X Te is epitaxially grown on the substrate. After that, when the epitaxial growth reaches a predetermined thickness on the substrate, the sealed tube 1 is rotated 180° again to remove the Hg 1-X Cd The epitaxial layer is formed in a similar manner.
しかし前述したような構造の液相エピタキシヤ
ル成長装置では、溶融したHg1-XCdXTeの溶液が
加熱炉の設定温度で飽和状態となつていない不平
衡の状態であることが多く、またHg1-XCdXTeの
結晶層形成材料の融点より△T℃だけ極く僅か低
温度でエピタキシヤル成長させる過冷却成長がで
きない欠点を生じている。 However, in the liquid phase epitaxial growth apparatus having the structure described above, the molten Hg 1-X Cd This has the drawback that epitaxial growth cannot be performed by supercooling at a temperature slightly lower than the melting point of the material for forming the crystal layer of Hg 1-X Cd X Te by ΔT°C.
このような不平衡な状態で基板上にエピタキシ
ヤル層を形成すると形成されるエピタキシヤル層
に結晶欠陥を生じる。また過冷却成長をすること
で基板とその上のエピタキシヤル層との界面が凹
凸の生じない平坦な界面となり、P−N接合が再
現性良く形成されたり、また形成されるエピタキ
シヤル層が平滑な状態となるが従来のエピタキシ
ヤル成長装置ではこのように溶液を過冷却状に保
つたり飽和状態に保つのは困難である。 If an epitaxial layer is formed on a substrate in such an unbalanced state, crystal defects will occur in the formed epitaxial layer. In addition, by supercooling the growth, the interface between the substrate and the epitaxial layer on it becomes a flat interface without any unevenness, allowing a P-N junction to be formed with good reproducibility, and the epitaxial layer to be formed to be smooth. However, with conventional epitaxial growth equipment, it is difficult to maintain the solution in a supercooled state or in a saturated state.
(d) 発明の目的
本発明は上述した問題点を解決するもので基板
上に形成すべきエピタキシヤル層の形成材料が加
熱炉の所定の設定温度で容易に飽和状態となり、
基板上にエピタキシヤル層が加熱温度に対して溶
液の濃度が変動しない平衡状態で形成でき得るよ
うな、また溶液の融点より極く僅か低い温度で基
板上にエピタキシヤル層を過冷却成長でき得るよ
うな新規な液相エピタキシヤル成長装置の提供を
目的とするものである。(d) Purpose of the Invention The present invention solves the above-mentioned problems, and the material for forming the epitaxial layer to be formed on the substrate easily becomes saturated at a predetermined set temperature of the heating furnace.
An epitaxial layer can be formed on a substrate in an equilibrium state in which the concentration of the solution does not change with respect to the heating temperature, and an epitaxial layer can be grown on the substrate by supercooling at a temperature that is very slightly lower than the melting point of the solution. The object of the present invention is to provide a novel liquid phase epitaxial growth apparatus.
(e) 発明の構成
このような目的は、L字型の基板設置台が耐熱
封管に内接する一対の支持部材によつて、かつ該
基板設置台の一辺の端部が該耐熱封管内壁に接
し、他辺の端部が該耐熱封管内壁との間に微小な
間隙を形成するように管軸方向に支持され、該基
板設置台の一辺の表面に結晶成長用基板が、裏面
にソース用薄板がそれぞれ載置され、該結晶成長
用基板の下に充填された結晶層形成材料融液に順
次該ソース用薄板と該結晶成長用基板が浸漬され
るように該基板設置台を含む該耐熱封管が回転可
能に構成されてなることを特徴とする液相エピタ
キシヤル成長装置によつて達成される。(e) Structure of the Invention Such an object is to provide an L-shaped board mounting base with a pair of support members inscribed in a heat-resistant sealed tube, and an end of one side of the board mounting base is connected to the inner wall of the heat-resistant sealed tube. The end of the other side is supported in the tube axis direction so as to form a minute gap with the inner wall of the heat-resistant sealed tube, and a substrate for crystal growth is placed on the surface of one side of the substrate mounting table, and a substrate for crystal growth is placed on the back side of the substrate mounting table. The thin plate for source is placed respectively, and the thin plate for source and the substrate for crystal growth are sequentially immersed in the crystal layer forming material melt filled under the crystal growth substrate. This is achieved by a liquid phase epitaxial growth apparatus characterized in that the heat-resistant sealed tube is configured to be rotatable.
(f) 発明の実施例
以下図面を用いて本発明の一実施例につき詳細
に説明する。(f) Embodiment of the Invention An embodiment of the present invention will be described in detail below with reference to the drawings.
第4図は本発明の液相エピタキシヤル成長装置
の斜視図、第5図は該斜視図のD−D′線に沿つ
た断面図、第6図より第8図までは該斜視図のE
−E′線に沿つた断面図で本発明の液相エピタキシ
ヤル成長装置の動作状態を示す図である。 FIG. 4 is a perspective view of the liquid phase epitaxial growth apparatus of the present invention, FIG. 5 is a sectional view taken along the line D-D' of the perspective view, and FIGS.
FIG. 2 is a cross-sectional view taken along line -E', showing the operating state of the liquid phase epitaxial growth apparatus of the present invention.
第4図、第5図に示すように本発明の液相エピ
タキシヤル成長装置は、石英等よりなる封管11
に内接する一対の石英棒よりなる支持部材12
A,12Bに、CdTeの基板13と基板保持台1
4およびCdTeのソース用薄板15とを保持する
ための凹所16が設けられている。第6図に示す
ようにこのような基板保持台14は直角方向に折
れ曲つて下方に延び、その折れ曲つた先端部は封
管の内壁と所定の間隙lを有している。したがつ
て凹所16はL字溝状に基板設置台14の形状に
応じた形とすることが必要となる。そしてCdTe
の基板13とCdTeのソース用薄板15とは基板
保持台14を介して積層するようにして凹所に挿
入されて設置されている。そして基板上に形成す
べきHg1-XCdXTeの結晶層形成材料17を充填し
て封管内を排気したのち、一端Fを封止してから
加熱炉内に導入して、該加熱炉の温度を上昇させ
てHg1-XCdXTeの材料を溶融する。 As shown in FIGS. 4 and 5, the liquid phase epitaxial growth apparatus of the present invention includes a sealed tube 11 made of quartz or the like.
A support member 12 consisting of a pair of quartz rods inscribed in
A, 12B, CdTe substrate 13 and substrate holder 1
4 and a CdTe source thin plate 15 is provided. As shown in FIG. 6, such a substrate holding stand 14 is bent at right angles and extends downward, and its bent end has a predetermined gap l with the inner wall of the sealed tube. Therefore, the recess 16 needs to have an L-shaped groove shape that corresponds to the shape of the board mounting table 14. and CdTe
The substrate 13 and the CdTe source thin plate 15 are inserted into the recess and placed in a stacked manner with the substrate holder 14 in between. Then, after filling the Hg 1-X Cd Melt the Hg 1-X Cd X Te material by increasing the temperature.
その後Hg1-XCdXTeの材料が溶融した時点で第
6図に示すように封管11を矢印G方向に180°回
転する。このようにするとHg1-XCdXTeの溶液1
7が封管11の内壁と基板設置台14の端部との
間隙lを通過して第7図に示すようにソース用薄
板11にHg1-XCdXTeの溶液17が接触し、この
Hg1-XCdXTeの溶液がCdTeのソース用薄板の成
分により飽和される。 Thereafter, when the Hg 1-X Cd X Te material is melted, the sealed tube 11 is rotated 180° in the direction of arrow G, as shown in FIG. In this way, Hg 1-X Cd X Te solution 1
7 passes through the gap l between the inner wall of the sealed tube 11 and the end of the substrate mounting stand 14, and as shown in FIG.
A solution of Hg 1-X Cd X Te is saturated with the components of the CdTe source plate.
したがつて加熱炉の温度を所定の温度に設定す
れば、その温度での飽和状態のHg1-XCdXTeの溶
液が容易に得られる。 Therefore, by setting the temperature of the heating furnace to a predetermined temperature, a solution of Hg 1-X Cd X Te in a saturated state at that temperature can be easily obtained.
また加熱炉の温度をHg1-XCdXTeの融点より極
く僅かの温度、低下せしめたHg1-XCdXTeの過冷
却状態の溶液も容易に実現できる。 Furthermore, a supercooled solution of Hg 1-X Cd X Te in which the temperature of the heating furnace is lowered by an extremely small temperature below the melting point of Hg 1-X Cd X Te can be easily realized.
次いで第7図に示すように封管11を矢印H方
向に360°回転せしめて前述した間隙lを通じて第
8図のようにCdTeの基板13に前述の飽和状態
のHg1-XCdXTeの溶液や、前述の過冷却状態の
Hg1-XCdXTeの溶液を基板13上に接触させたの
ち、加熱炉の温度を低下せしめて基板上に飽和状
態のHg1-XCdXTeの溶液の接触で基板上にHg1-X
CdXTeの結晶を平衡成長させる。また基板上に過
冷却状態のHg1-XCdXTeの溶液の接触で基板上に
Hg1-XCdXTeの結晶を過冷却成長できる。 Next, as shown in FIG. 7, the sealed tube 11 is rotated 360° in the direction of arrow H, and the saturated Hg 1-X Cd solution or the supercooled state mentioned above.
After the Hg 1-X Cd X Te solution is brought into contact with the substrate 13, the temperature of the heating furnace is lowered and the saturated Hg 1- X Cd -X
Equilibrium growth of Cd X Te crystals. In addition, by contacting the substrate with a supercooled Hg 1-X Cd X Te solution,
Hg 1-X Cd X Te crystals can be grown by supercooling.
その後更に封管11を矢印K方向に180°回転せ
しめて基板上に付着しているHg1-XCdXTeの溶液
が間隙lを通じて除去できる。 Thereafter, the sealed tube 11 is further rotated 180° in the direction of arrow K, so that the Hg 1-X Cd X Te solution adhering to the substrate can be removed through the gap l.
このようにすれば基板上にHg1-XCdXTeの結晶
を所定の温度で平衡成長および過冷却成長でき得
る。なおこの場合Hg1-XCdXTeの溶液内にCdTe
のソース用薄板がとけ込んだ量を測定することで
Hg1-XCdXTeの溶液の加熱炉の設定温度での組成
を検知することができ、この温度に加熱炉の温度
をあらかじめ設定し、溶融したHg1-XCdXTeの溶
液にソース薄板の成分を溶解してHg1-XCdXTeの
溶液を飽和状態となし、その溶液を用いて基板上
にエピタキシヤル層を平衡成長させることができ
る。また前述した飽和状態となる温度をソース薄
板の材料の減量より、あらかじめ検知してその温
度より極く僅か低温度に溶液の温度を設定して基
板上にHg1-XCdXTeの結晶層を過冷却成長させる
ことができる。 In this way, a crystal of Hg 1-X Cd X Te can be grown on the substrate in equilibrium and undercooled at a predetermined temperature. In this case, CdTe is added to the Hg 1-X Cd X Te solution.
By measuring the amount that the thin sauce plate melts into
It is possible to detect the composition of the Hg 1 - X Cd The components of the thin plate are dissolved to saturate the solution of Hg 1-X Cd X Te, and the solution can be used to equilibrate the epitaxial growth on the substrate. In addition, the temperature at which the saturation state described above will occur is detected in advance by the weight loss of the material of the source thin plate, and the temperature of the solution is set to a temperature slightly lower than that temperature, and a crystal layer of Hg 1-X Cd X Te is formed on the substrate. can be grown by supercooling.
(g) 発明の効果
以上述べたように本発明の液相エピタキシヤル
成長装置を用いれば、基板上に易蒸発性のHgを
含むHg1-XCdXTeのエピタキシヤル層をHg1-X
CdXTeの溶液が飽和状態の安定した条件で成長す
ることができ、またHg1-XCdXTeの溶液を過冷却
状態として高品質のエピタキシヤル層が得られる
利点を生じる。(g) Effects of the Invention As described above, if the liquid phase epitaxial growth apparatus of the present invention is used, an epitaxial layer of Hg 1 -X Cd
This method has the advantage that growth can be performed under stable conditions in which the Cd X Te solution is saturated, and that a high-quality epitaxial layer can be obtained by supercooling the Hg 1-X Cd X Te solution.
第1図より第3図までは従来の液相エピタキシ
ヤル成長装置の斜視図およびその断面図、第4図
より第8図までは本発明の液相エピタキシヤル成
長装置の斜視図およびその断面図である。
図において1,11は封管、2,13はCdTe
基板、3,14は基板設置台、4,16は凹所、
5,12A,12Bは支持部材、6,17は
Hg1-XCdXTeの溶液、15はソース用薄板、lは
間隙、C,G,H,Kは回転方向を示す矢印であ
る。
1 to 3 are perspective views and sectional views of a conventional liquid phase epitaxial growth apparatus, and FIGS. 4 to 8 are perspective views and sectional views of a liquid phase epitaxial growth apparatus of the present invention. It is. In the figure, 1 and 11 are sealed tubes, and 2 and 13 are CdTe
Board, 3 and 14 are board installation stands, 4 and 16 are recesses,
5, 12A, 12B are supporting members, 6, 17 are
A solution of Hg 1-X Cd
Claims (1)
対の支持部材によつて、かつ該基板設置台の一辺
の端部が該耐熱封管内壁に接し、他辺の端部が該
耐熱封管内壁との間に微小な間隙を形成するよう
に管軸方向に支持され、該基板設置台の一辺の表
面に結晶成長用基板が、裏面にソース用薄板がそ
れぞれ載置され、該結晶成長用基板の下に充填さ
れた結晶層形成材料融液に順次該ソース用薄板と
該結晶成長用基板が浸漬されるように該基板設置
台を含む該耐熱封管が回転可能に構成されてなる
ことを特徴とする液相エピタキシヤル成長装置。1. An L-shaped board installation stand is inscribed in the heat-resistant sealed tube by a pair of support members, and the end of one side of the board installation stand is in contact with the inner wall of the heat-resistant sealed tube, and the end of the other side is in contact with the inner wall of the heat-resistant sealed tube. The tube is supported in the axial direction so as to form a minute gap with the inner wall of the sealed tube, and a substrate for crystal growth is placed on the surface of one side of the substrate mounting table, and a thin plate for source is placed on the back surface of the substrate mounting table. The heat-resistant sealed tube including the substrate mounting stand is configured to be rotatable so that the source thin plate and the crystal growth substrate are sequentially immersed in the crystal layer forming material melt filled under the growth substrate. A liquid phase epitaxial growth apparatus characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57191057A JPS5979534A (en) | 1982-10-29 | 1982-10-29 | Liquid phase epitaxial growth device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57191057A JPS5979534A (en) | 1982-10-29 | 1982-10-29 | Liquid phase epitaxial growth device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5979534A JPS5979534A (en) | 1984-05-08 |
| JPH0451970B2 true JPH0451970B2 (en) | 1992-08-20 |
Family
ID=16268167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57191057A Granted JPS5979534A (en) | 1982-10-29 | 1982-10-29 | Liquid phase epitaxial growth device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5979534A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228107A (en) * | 1975-08-28 | 1977-03-02 | Taiho Kensetsu Kk | Excavating bucket |
-
1982
- 1982-10-29 JP JP57191057A patent/JPS5979534A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5979534A (en) | 1984-05-08 |
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