JPH0475652B2 - - Google Patents
Info
- Publication number
- JPH0475652B2 JPH0475652B2 JP57199421A JP19942182A JPH0475652B2 JP H0475652 B2 JPH0475652 B2 JP H0475652B2 JP 57199421 A JP57199421 A JP 57199421A JP 19942182 A JP19942182 A JP 19942182A JP H0475652 B2 JPH0475652 B2 JP H0475652B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealed tube
- container
- partition plate
- forming material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3432—Tellurides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
- C30B19/04—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/46—Sulfur-, selenium- or tellurium-containing compounds
- C30B29/48—AIIBVI compounds wherein A is Zn, Cd or Hg, and B is S, Se or Te
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/263—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using melted materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2913—Materials being Group IIB-VIA materials
- H10P14/2917—Tellurides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Light Receiving Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は液相エピタキシヤル成長装置の改良に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a liquid phase epitaxial growth apparatus.
(b) 従来の背景
赤外線検知素子の形成材料としては、一般にエ
ネルギーギヤツプの狭い水銀、カドミウム、テル
ル(Hg1-XCaXTe)のような化合物半導体結晶が
用いられている。(b) Conventional Background Compound semiconductor crystals such as mercury, cadmium, and tellurium (Hg 1-X Ca X Te), which have narrow energy gaps, are generally used as materials for forming infrared sensing elements.
このような結晶を素子形成に都合が良いよう
に、薄層の単結晶状態で大面積に形成するため、
比較的安価で入手しやすい単結晶のテルル化カド
ミウム(CaTe)の基板を用い、その上にHg1-X
CaXTeの結晶を液相エピタキシヤル成長する方法
がとられている。 In order to form such crystals in a thin layer of single crystal over a large area for convenient device formation,
A relatively inexpensive and easily available single-crystal cadmium telluride (CaTe) substrate is used, and Hg 1-X
A method of growing Ca X Te crystals by liquid phase epitaxial growth has been used.
ところでHg1-XCaXTeの結晶は易蒸発性の水銀
(Hg)を含んでおり、このHgがエピタキシヤル
成長中に飛散しないような密閉型構造で浸漬法を
用いた液相エピタキシヤル成長装置を以前に提案
した。 By the way, the crystals of Hg 1-X Ca The device was previously proposed.
(c) 従来技術と問題点
第1図はこのような従来の液相エピタキシヤル
成長装置の断面図である。図示するように円柱状
の石英等よりなる一対の支持部材1にCaTeの基
板2と該基板2を支えるための石英よりなる基板
設置台3とを設置するための凹所4が設けられて
おり、これら支持部材1は耐熱性の石英封管5内
に内接するようにして収容されている。(c) Prior Art and Problems FIG. 1 is a sectional view of such a conventional liquid phase epitaxial growth apparatus. As shown in the figure, a pair of support members 1 made of cylindrical quartz or the like are provided with a recess 4 for installing a CaTe substrate 2 and a substrate installation stand 3 made of quartz for supporting the substrate 2. These support members 1 are housed in a heat-resistant quartz sealed tube 5 so as to be inscribed therein.
この基板設置台3の下部にはHg1-XCaXTeのエ
ピタキシヤル層形成材料6が収容されており、こ
れらのエピタキシヤル成長装置を反応管中に導入
したのち、加熱炉にて該装置を加熱してエピタキ
シヤル層形成材料6を溶融してから、封管5を回
転させて基板上に溶融材料を接触させその後加熱
炉の温度を降下して基板上にエピタキシヤル層を
形成するようにしている。 The epitaxial layer forming material 6 of Hg 1-X Ca is heated to melt the epitaxial layer forming material 6, and then the sealed tube 5 is rotated to bring the molten material into contact with the substrate, and then the temperature of the heating furnace is lowered to form an epitaxial layer on the substrate. I have to.
ところで従来のこのような装置においては、基
板2を支持部材1に保持する際、基板2が割れた
り、欠けたりする欠点があり、基板2の装着に時
間がかかり過ぎる欠点がある。 However, in such a conventional device, there is a drawback that the substrate 2 is cracked or chipped when the substrate 2 is held on the support member 1, and it takes too much time to attach the substrate 2.
そこで本発明者等は第2図に示すように耐熱封
管11の内部に例えば一面が開閉蓋となるような
直方体形状容器12の上面に適当な突起を設けて
CaTeの基板13を該上面に対して平行になるよ
うに設置し、また容器12の底部にHg1-XCaXTe
のエピタキシヤル層形成材料14を充填した形で
開閉蓋(図示せず)を閉じて石英製の支持棒15
を用いて容器12を封管11内に固着する。その
後封管11を加熱炉内に挿入してエピタキシヤル
層形成材料14を溶融後、封管11を回転させて
基板13上にエピタキシヤル層形成材料14を接
触させた後加熱炉の温度を低下させて基板上にエ
ピタキシヤル層を形成するようにしている。 Therefore, as shown in FIG. 2, the present inventors provided an appropriate protrusion inside the heat-resistant sealed tube 11, for example, on the upper surface of a rectangular parallelepiped container 12 whose one side serves as an opening/closing lid.
A CaTe substrate 13 is placed parallel to the upper surface, and Hg 1-X Ca X Te is placed at the bottom of the container 12.
The opening/closing lid (not shown) is closed and the support rod 15 made of quartz is filled with the epitaxial layer forming material 14.
The container 12 is fixed inside the sealed tube 11 using a screw. After that, the sealed tube 11 is inserted into the heating furnace to melt the epitaxial layer forming material 14, and then the sealed tube 11 is rotated to bring the epitaxial layer forming material 14 into contact with the substrate 13, and then the temperature of the heating furnace is lowered. An epitaxial layer is formed on the substrate.
ところでこのようなエピタキシヤル層形成材料
14を溶融すると、その材料を形成する際に用い
たカーボン治具中の不純物や、あるいは容器12
内に微量に残存している酸化性のガスによる材料
の酸化物や、あるいは材料が溶融した際に生じる
結晶核が原因となつて薄い膜状のスラツジが形成
され、このスラツジが基板13を溶液に接触させ
たとき、基板表面に接触し、そのためエピタキシ
ヤル成長層がそのスラツジによつて未成長となつ
たり、あるいは成長層に結晶欠陥を生じたりする
欠点を生じる。 By the way, when such epitaxial layer forming material 14 is melted, impurities in the carbon jig used to form the material or the container 12 may be removed.
A thin film-like sludge is formed due to oxides of the material due to a trace amount of oxidizing gas remaining in the material, or crystal nuclei generated when the material is melted, and this sludge forms the substrate 13 in a solution. When brought into contact with the substrate surface, the epitaxially grown layer may not grow due to the sludge, or crystal defects may occur in the grown layer.
(d) 発明の目的
本発明は上述した欠点を除去し、基板上にエピ
タキシヤル層を形成する際、前述したスラツジが
エピタキシヤル層表面に付着しないようにした新
規な液相エピタキシヤル成長装置の提供を目的と
するものである。(d) Object of the Invention The present invention eliminates the above-mentioned drawbacks and provides a novel liquid phase epitaxial growth apparatus which prevents the above-mentioned sludge from adhering to the epitaxial layer surface when forming an epitaxial layer on a substrate. It is intended for the purpose of providing.
(e) 発明の構成
かかる目的を達成するための本発明の液相エピ
タキシヤル成長装置は耐熱性封管内に基板と、基
板上にエピタキシヤル成長すべき結晶層形成材料
とを対向させて収容し、結晶層形成材料を溶融さ
せた状態で前記封管を回転させることにより結晶
層形成材料の溶液に基板を接触させて結晶成長さ
せる構成において、前記基板の下部に前記封管回
転時の基板よりも先に結晶層形成材料の溶液に接
するように一方の縁端部が前記封管の内壁面と微
小間隔を介して仕切り板を設け、該仕切り板を前
記耐熱性封管と一体的に回転させることにより、
該仕切り板にて溶液上のスラツジを除去するよう
にしたことを特徴とするものである。(e) Structure of the Invention In order to achieve the above object, the liquid phase epitaxial growth apparatus of the present invention accommodates a substrate and a crystal layer forming material to be epitaxially grown on the substrate in a heat-resistant sealed tube so as to face each other. , in a configuration in which crystal growth is performed by bringing the substrate into contact with a solution of the crystal layer forming material by rotating the sealed tube in a state in which the crystal layer forming material is melted, a portion of the substrate at the bottom of the substrate when the sealed tube is rotated; First, a partition plate is provided so that one edge thereof is in contact with the solution of the crystal layer forming material through a minute gap from the inner wall surface of the sealed tube, and the partition plate is rotated integrally with the heat-resistant sealed tube. By letting
It is characterized in that the sludge on the solution is removed by the partition plate.
(f) 発明の実施例
以下図面を用いて本発明の実施例につき詳細に
説明する。第3図は本発明の液相エピタキシヤル
成長装置の横断面図、第4図は該装置の縦断面図
である。(f) Embodiments of the invention Examples of the invention will be described in detail below with reference to the drawings. FIG. 3 is a cross-sectional view of the liquid phase epitaxial growth apparatus of the present invention, and FIG. 4 is a longitudinal cross-sectional view of the apparatus.
図示するように本発明の液相エピタキシヤル成
長装置は有底の中空の石英よりなる円筒状の容器
21と該容器の開口部に着脱できる円板状の開閉
蓋22とよりなる。ここで容器は説明の便宜上円
筒状としたが従来の装置に用いた直方体形状でも
良いし、第1図のように封管自体を容器としたも
のでも良い。この開閉蓋22は容器21と嵌合す
るような突起23を有している。この開閉蓋22
を開いてこの容器21内の上部へほぼ容器21の
内壁に接触するようにしてCaTeの基板24を容
器21内に形成した石英製の突起25により設置
する。 As shown in the figure, the liquid phase epitaxial growth apparatus of the present invention comprises a hollow cylindrical container 21 made of quartz with a bottom and a disc-shaped opening/closing lid 22 that can be attached to and removed from the opening of the container. Here, the container is assumed to be cylindrical for convenience of explanation, but it may be a rectangular parallelepiped used in conventional devices, or the container may be a sealed tube itself as shown in FIG. This opening/closing lid 22 has a protrusion 23 that fits into the container 21. This opening/closing lid 22
After opening, a CaTe substrate 24 is placed in the upper part of the container 21 so as to substantially contact the inner wall of the container 21 using a quartz protrusion 25 formed inside the container 21 .
一方該基板24の下部に近接して石英製の仕切
り板26を容器21の内壁に形成した石英製の突
起27により設置する。 On the other hand, a partition plate 26 made of quartz is installed near the lower part of the substrate 24 by a protrusion 27 made of quartz formed on the inner wall of the container 21 .
次いで容器21の下部に基板24上に形成すべ
きHg1-XCaXTeのエピタキシヤル層形成材料28
を充填してから容器内を排気したのち開閉蓋22
を閉じる。その後該容器21を有底の石英管29
中に挿入し石英よりなる支持棒30で容器21を
石英管29に保持しながら該石英管内部を排気し
て封管とする。 Next, an epitaxial layer forming material 28 of Hg 1-X Ca X Te to be formed on the substrate 24 is placed in the lower part of the container 21.
After filling the container and evacuating the inside of the container, open and close the lid 22.
Close. Thereafter, the container 21 is placed in a bottomed quartz tube 29.
While the container 21 is held in the quartz tube 29 by a support rod 30 inserted therein and made of quartz, the inside of the quartz tube is evacuated to form a sealed tube.
その後このような封管29を加熱炉内へ挿入し
該加熱炉の温度を上昇させてHg1-XCaXTeの材料
28を溶融する。ここで容器と蓋との間で多少隙
間があつてもHgの表面張力でHg1-XCaXTeの溶
液が外部へこぼれることはない。この状態を第5
図に示す。図示するようにHg1-XCaXTeの材料2
8上には前述したスラツジ31が形成されてお
り、また仕切り板26と容器21の内壁との間の
間隔l1とl2とはl2>l1として仕切り板26と容器2
1とが接触するようにしておく。またこのl1とl2
のいずれを大にするかは容器の回転方向によつて
異なる。 Thereafter, such a sealed tube 29 is inserted into a heating furnace, and the temperature of the heating furnace is increased to melt the Hg 1-X Ca X Te material 28 . Even if there is some gap between the container and the lid, the surface tension of Hg will prevent the Hg 1-X Ca X Te solution from spilling outside. This state is the fifth
As shown in the figure. Hg 1-X Ca X Te material 2 as shown
The above-mentioned sludge 31 is formed on the partition plate 8, and the distances l 1 and l 2 between the partition plate 26 and the inner wall of the container 21 are set such that l 2 > l 1.
1 so that they are in contact with each other. Also this l 1 and l 2
Which of these should be increased depends on the direction of rotation of the container.
次いで第5図の矢印A方向に封管29を回転さ
せ第6図のような状態とする。図示するように仕
切り板26の回転先端が基板24よりも先に溶液
に接触するので、スラツジ31は仕切り板26の
一方の縁端部によつて片方へ寄せられる。 Next, the sealed tube 29 is rotated in the direction of arrow A in FIG. 5 to bring it into the state shown in FIG. 6. As shown in the figure, the rotating tip of the partition plate 26 comes into contact with the solution before the substrate 24, so that the sludge 31 is pushed to one side by one edge of the partition plate 26.
次いで更に矢印B方向に封管を回転し第7図の
ような状態とする。図示するようにスラツジ31
は仕切り板26によつて更に一箇所に集められて
いる。 Next, the sealed tube is further rotated in the direction of arrow B to bring it into the state shown in FIG. Sludge 31 as shown
are further gathered in one place by a partition plate 26.
次いで更に矢印C方向に封管を回転し、第8図
のような状態とする。図示するようにスラツジ3
1は仕切り板26の上部にすくい上げられて集め
られるようになり基板24が浸漬しているHg1-X
CaXTeの溶液28中にはスラツジ31は殆んど存
在しない。この状態で加熱炉の温度を下降させ基
板24上にHg1-XCaXTeのエピタキシヤル層を形
成する。 Next, the sealed tube is further rotated in the direction of arrow C to bring it into the state shown in FIG. Sludge 3 as shown
Hg 1-X 1 is scooped up and collected on the top of the partition plate 26, and the substrate 24 is immersed.
Almost no sludge 31 exists in the CaXTe solution 28. In this state, the temperature of the heating furnace is lowered to form an epitaxial layer of Hg 1-x Ca X Te on the substrate 24 .
その後更に矢印D方向に封管を回転し、第9図
のような状態とする。図示するようにスラツジ3
1は仕切り板26の他方の縁端部によつて所定の
箇所に集められ、基板24上には付着しなくな
る。 Thereafter, the sealed tube is further rotated in the direction of arrow D to obtain a state as shown in FIG. Sludge 3 as shown
1 is collected at a predetermined location by the other edge of the partition plate 26 and no longer adheres to the substrate 24.
次いで矢印E方向に封管を回転し第10図のよ
うな状態とする。図示するように基板24上には
スラツジ31等が付着していない平坦な表面を有
するエピタキシヤル層が形成される。 Next, the sealed tube is rotated in the direction of arrow E to bring it into the state shown in FIG. As shown in the figure, an epitaxial layer having a flat surface to which sludge 31 and the like are not attached is formed on the substrate 24.
(g) 発明の効果
以上述べたように本発明の液相エピタキシヤル
成長装置によればHgのような易蒸発性成分を有
するエピタキシヤル層が平坦な状態で得られ、こ
のようなエピタキシヤル結晶を用いて赤外線検知
素子を形成すれば素子形成の歩留が向上する利点
を有する。(g) Effects of the Invention As described above, according to the liquid phase epitaxial growth apparatus of the present invention, an epitaxial layer containing an easily evaporable component such as Hg can be obtained in a flat state, and such epitaxial crystals can be grown in a flat state. Forming an infrared sensing element using this method has the advantage of improving the yield of element formation.
第1図、第2図は従来の液相エピタキシヤル成
長装置の断面図、およびその平面図、第3図、第
4図は本発明の液相エピタキシヤル成長装置の横
断面図および縦断面図、第5図より第10図まで
は本発明の液相エピタキシヤル成長装置の動作状
態を示す図である。
図において、1は支持部材、2,13,24は
CaTe基板、3は基板設置台、4は凹所、5,1
1,29は封管、6,14,28はHg1-XCaXTe
の材料、12,21は容器、15,30は保持
具、22は開閉蓋、23,25,27は突起、2
6は仕切り板、31はスラツジ、A,B,C,
D,Eは容器の回転方向を示す矢印、l1,l2は仕
切り板と容器との間隔を示す。
1 and 2 are a cross-sectional view and a plan view of a conventional liquid phase epitaxial growth apparatus, and FIGS. 3 and 4 are a cross-sectional view and a vertical cross-sectional view of a liquid-phase epitaxial growth apparatus of the present invention. , FIG. 5 to FIG. 10 are diagrams showing the operating state of the liquid phase epitaxial growth apparatus of the present invention. In the figure, 1 is a support member, 2, 13, 24 are
CaTe substrate, 3 is the substrate installation stand, 4 is the recess, 5, 1
1, 29 are sealed tubes, 6, 14, 28 are Hg 1-X Ca X Te
12, 21 are containers, 15, 30 are holders, 22 are opening/closing lids, 23, 25, 27 are projections, 2
6 is a partition plate, 31 is a sludge, A, B, C,
D and E indicate the direction of rotation of the container, and l 1 and l 2 indicate the distance between the partition plate and the container.
Claims (1)
ピタキシヤル成長すべき結晶層形成材料28とを
対向させて収容し、結晶層形成材料28を溶融さ
せた状態で前記封管29を回転させることにより
結晶層形成材料28の溶液に基板24を接触させ
て結晶成長させる構成において、 前記基板24の下部に前記封管回転時の基板2
4よりも先に結晶層形成材料28の溶液に接する
ように一方の縁端部が前記封管29の内壁面と微
小間隔を介して仕切り板26を設け、該仕切り板
26を前記耐熱性封管29と一体的に回転させる
ことにより、該仕切り板26にて溶液上のスラツ
ジ31を除去するようにしたことを特徴とする液
相エピタキシヤル成長装置。[Claims] 1. A substrate 24 and a crystal layer forming material 28 to be epitaxially grown on the substrate are placed facing each other in a heat-resistant sealed tube 29, and the crystal layer forming material 28 is melted. In a configuration in which crystal growth is performed by bringing the substrate 24 into contact with the solution of the crystal layer forming material 28 by rotating the sealed tube 29, the substrate 2 at the time of rotation of the sealed tube is placed below the substrate 24.
A partition plate 26 is provided with one edge thereof being in contact with the solution of the crystal layer forming material 28 with a minute gap from the inner wall surface of the sealed tube 29, and the partition plate 26 is connected to the heat-resistant seal. A liquid phase epitaxial growth apparatus characterized in that the sludge 31 on the solution is removed by the partition plate 26 by rotating it integrally with the tube 29.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199421A JPS5988834A (en) | 1982-11-12 | 1982-11-12 | Liquid phase epitaxial growth device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199421A JPS5988834A (en) | 1982-11-12 | 1982-11-12 | Liquid phase epitaxial growth device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988834A JPS5988834A (en) | 1984-05-22 |
| JPH0475652B2 true JPH0475652B2 (en) | 1992-12-01 |
Family
ID=16407521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57199421A Granted JPS5988834A (en) | 1982-11-12 | 1982-11-12 | Liquid phase epitaxial growth device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988834A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121023647B (en) * | 2025-10-30 | 2026-02-10 | 北京晶格领域半导体有限公司 | Device and method for growing silicon carbide by liquid phase method capable of removing residual liquid drops |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5325317A (en) * | 1976-08-13 | 1978-03-09 | Kokusai Electric Co Ltd | Data item input device |
-
1982
- 1982-11-12 JP JP57199421A patent/JPS5988834A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5988834A (en) | 1984-05-22 |
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