JPH0454377B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is based on a semiconductor chip mounted on a ceramic substrate, and the electrodes of the semiconductor chip and the wiring conductors on the substrate are connected by lead wires. The present invention relates to a method for manufacturing a hybrid integrated circuit.

[Conventional technology]

Previously, when performing die bonding for mounting a semiconductor chip in such a hybrid integrated circuit or wire bonding for connection to a semiconductor chip, the position was confirmed visually using a microscope. . However, recently there has been an increasing demand for automation of die bonding and wire bonding in order to streamline production.

In this case, it is necessary to accurately recognize the position to be bonded, and for this purpose alignment marks are provided on the substrate. The alignment marks are attached, for example, by printing and firing gold paste in the same process as the conductor material paste for the wiring conductor. Furthermore, in addition to the gold mark formed by printing and firing such gold paste, it is conceivable to print a color that is easy to distinguish from a ceramic substrate in a separate process.

[Problem to be solved by the invention]

First, the former problem is that printed gold marks cannot be distinguished from ceramic substrates using a normal optical pattern recognition machine.

In addition, when printing and firing easily distinguishable colors in the latter separate process, the number of steps for printing easily distinguishable colors increases. Furthermore, since the marks for identification and the wiring conductors using gold paste are formed separately, it is inevitable that the mutual spacing between the wiring conductors and the marks will differ slightly depending on each board.
It is inappropriate as an alignment mark. In other words,
In extreme cases, the problem arises that the semiconductor chip has bridging connections between different conductor patterns, or that wire bonds are not connected to the conductors.

The problem to be solved by the present invention is to provide a method for manufacturing a hybrid integrated circuit that can accurately detect the position of a substrate using a regular pattern recognition machine and can perform reliable die bonding and wire bonding.

[Means to solve the problem]

This subject is a method for manufacturing a hybrid integrated circuit in which alignment marks set on a substrate of a hybrid integrated circuit are optically detected and semiconductor chips are bonded on the substrate. , by first forming a dark-colored peripheral green part on the substrate at the same time as the resistor of the circuit, and then forming a light-colored central part on the peripheral green part simultaneously with the formation of the circuit conductor. achieved.

[Effect]

The positioning mark consists of a peripheral green part that is formed at the same time as the resistor and a central part that is formed on the peripheral green part at the same time as the conductor. By performing this at the boundary, the boundary can be easily distinguished by an optical pattern recognition machine, and even if there is a misalignment between the printing of the conductor paste and the resistor paste, the boundary between the peripheral green part and the center part of the mark and the conductor can be easily distinguished. There is no positional deviation between the pattern and the alignment is extremely accurate.
Die bonding and wire bonding can be performed accurately and automatically at predetermined locations.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. In the plan view of FIG. 1 and the cross-sectional view of FIG. 2, thick film conductors 2 and 3 are formed on a ceramic substrate 1 by printing and firing a conductor paste. The alignment mark 4 consists of a dark color part 41 and a light color part 42 in the center. For example, the dark color (black) part 41 is first formed by printing and firing a resistor burst, and then the light color (metallic color) is formed by printing and firing a gold paste. ) portion 42 is formed. The dark color portion 41 can be printed and fired at the same time as the thick film resistor (not shown) of the hybrid integrated circuit, and the light color portion 42 can be printed and fired simultaneously with the thick film conductors 2 and 3.

Due to the difference in color tone of the alignment mark 4 consisting of the dark color part 41 and the light color part 42, a normal pattern recognition machine can distinguish it and output a clear binary signal. Based on the signal, die bonding of the semiconductor chip 5 onto the conductor 2 and wire bonding of the lead wire 6 connecting the chip 5 and the conductor 3 can be carried out as desired.

Furthermore, since the position of the mark 4 is recognized at the boundary 43 between the dark color 41 and the light color portion 42, even if there is a misalignment between the screen printing of the conductor paste and the resistor paste, the position of the mark 4 is recognized between the boundary 43 and the conductors 2 and 3. There is no positional deviation between them, resulting in extremely high precision positioning, and die bonding and wire bonding can be performed accurately and automatically at predetermined positions.

Furthermore, in this embodiment, the resistor and conductor as alignment marks can be formed simultaneously in the resistor printing/firing process and the conductor pattern printing/baking process, which are performed when constructing a hybrid integrated circuit. Therefore, there is no need to worry about an increase in assembly man-hours.

The positioning marks are not limited to the two locations shown in the figure, but may be provided at one location if the requirements for position accuracy are low, or may be provided at three or more locations if the requirements are high.

〔Effect of the invention〕

As described above, the hybrid integrated circuit according to the present invention has alignment marks on the substrate, which are made up of a light colored part formed at the same time as the circuit conductor and a dark colored part formed at the same time as the circuit resistor. The boundary between the bright color part and the dark color part can be easily distinguished by an optical pattern recognition machine, and a clear position recognition signal can be sent by a normal optical pattern recognition machine without increasing the number of assembly steps. Since it becomes possible to automate die bonding or wire bonding extremely easily, the effect of reducing manufacturing costs is extremely large.

In addition, even if there is a misalignment between the printing of the conductor paste and the resistor paste, there is no misalignment between the border between the green peripheral part and the center of the mark and the conductor pattern and the bright center, resulting in extremely high accuracy. can be aligned.

[Brief explanation of the drawing]

Fig. 1 is a plan view of essential parts of an embodiment of the present invention;
The figure is also a sectional view of the main part. 1... Ceramic substrate, 4... Positioning mark, 41... Dark color part, 42... Light color part.

Claims (1)

[Claims] 1. A method for manufacturing a hybrid integrated circuit in which alignment marks set on a substrate are optically detected and semiconductor chips are bonded and connected on the substrate, the alignment marks being first detected by the resistance of the circuit. Manufacturing a hybrid integrated circuit characterized in that a dark colored peripheral green part is formed on the substrate at the same time as the body, and then a light colored central part is formed on the peripheral green part at the same time as the conductor of the circuit is formed. Method.