JPH0460330B2 - - Google Patents
Info
- Publication number
- JPH0460330B2 JPH0460330B2 JP2186180A JP18618090A JPH0460330B2 JP H0460330 B2 JPH0460330 B2 JP H0460330B2 JP 2186180 A JP2186180 A JP 2186180A JP 18618090 A JP18618090 A JP 18618090A JP H0460330 B2 JPH0460330 B2 JP H0460330B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- case
- specific gravity
- film capacitor
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明はケース収納型のフイルムコンデンサの
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a case-housed film capacitor.
従来から、コンデンサ素子をケースに収納し、
樹脂を充填硬化させる製造方法が公知となつてい
る。しかし、一般にケースはコンデンサ素子より
大きな内容積を有しているため、第１図のように
ケースの中心に対して、偏りや傾きの生じやすい
ものであつた。このような欠点を改善するため
に、ケース４とコンデンサ素子２の空〓に注入す
る充填材３を２回またはそれ以上の回数にわけて
注入し、コンデンサ素子２の位置を矯正する手法
をとつているが、手作業になることを免れず、時
間的ならびに工数的に非常に不利である。したが
つて、ケース４の内面に突起を設けたり、またケ
ース底部に凹状曲面を形成して、コンデンサ素子
２を支えることが実開昭52−120339号公報、実開
昭53−164648号公報などによつて知られている
が、コンデンサ素子の大きさによつて、ケース、
突起あるいは凹状曲面の大きさを変更する必要が
あり、極めて不経済であるなどの欠点を有すると
共に、これらのケースにコンデンサ素子を収納
し、樹脂を充填硬化させるものにあつては、コン
デンサ素子をケースに挿入後、エポキシ樹脂など
の液状樹脂を注入硬化させていたが、このときコ
ンデンサ素子と注入樹脂との比重差によるコンデ
ンサ素子の浮きにより、位置ズレなどが多発する
欠点があつた。 Traditionally, capacitor elements are housed in a case,
A manufacturing method in which resin is filled and cured is known. However, since the case generally has a larger internal volume than the capacitor element, it tends to be biased or tilted with respect to the center of the case as shown in FIG. In order to improve such defects, a method is used in which the filling material 3 is injected into the space between the case 4 and the capacitor element 2 in two or more times to correct the position of the capacitor element 2. However, it is inevitable that it will be done manually, which is very disadvantageous in terms of time and man-hours. Therefore, it is recommended to support the capacitor element 2 by providing a protrusion on the inner surface of the case 4 or by forming a concave curved surface at the bottom of the case, as disclosed in Japanese Utility Model Application Publications No. 1984-120339 and No. 164648-1989. However, depending on the size of the capacitor element, the case,
It is necessary to change the size of the protrusion or concave curved surface, which is extremely uneconomical. After being inserted into the case, a liquid resin such as epoxy resin was injected and hardened, but at this time the capacitor element lifted due to the difference in specific gravity between the capacitor element and the injected resin, resulting in frequent misalignment.
また、コンデンサ素子をケースに収容した後、
ケース内にパラフイン等の含浸剤を注入し、最後
に含浸剤の上に合成樹脂等の封口材を充填して固
化させるものにあつては、ケースや引出端子など
のかなり高所にまで含浸剤が付着するために、そ
の部分では封口材がケースや引出端子に良好に接
着せず、素子を十分気密に保ち難い欠点があつ
た。また、そのために封口材をかなり厚く充填し
なければならず、これによつてコンデンサの小型
化が妨げられていた。 Also, after housing the capacitor element in the case,
In cases where an impregnating agent such as paraffin is injected into the case and a sealing material such as synthetic resin is then filled and solidified on top of the impregnating agent, the impregnating agent may reach quite high places such as the case or the lead-out terminals. As a result, the sealing material does not adhere well to the case or the lead-out terminal in that area, making it difficult to keep the device sufficiently airtight. Moreover, it is necessary to fill the capacitor with a considerably thick sealing material, which hinders miniaturization of the capacitor.
本発明は上述の欠点を解消するもので、以下第
２図に示す実施例に基づき詳細に説明する。 The present invention solves the above-mentioned drawbacks and will be explained in detail below based on the embodiment shown in FIG.
第２図は本発明の一実施例のケース収納型フイ
ルムコンデンサの斜視図で、１１はコンデンサ素
子１２の電極引出外部リード、１３は熱硬化性樹
脂からなる充填材、１４はケース、１５はコンデ
ンサ素子１２より比重の低いワツクスなどの固定
材で、第２図イのごとくケース１４にコンデンサ
素子１２よりも比重の低いワツクスの適量を充填
し、そして該ケース１４に電極リード１１を上に
してコンデンサ素子１２を収納すると、該素子１
２は自重によりケース１４の底部に接し、第２図
ロのごとく上部が液面から上方へ露出した状態で
収納され、ワツクス１５が固化してコンデンサ素
子１２を固定する。さらにそのワツクス１５上に
熱硬化性樹脂１３を充填硬化し、第２図ハのよう
にフイルムコンデンサを完成する。 FIG. 2 is a perspective view of a case-storage type film capacitor according to an embodiment of the present invention, in which 11 is an electrode external lead of a capacitor element 12, 13 is a filler made of thermosetting resin, 14 is a case, and 15 is a capacitor. Using a fixing material such as wax having a specific gravity lower than that of the capacitor element 12, fill the case 14 with an appropriate amount of wax having a specific gravity lower than that of the capacitor element 12 as shown in FIG. When the element 12 is stored, the element 1
2 is placed in contact with the bottom of the case 14 due to its own weight, and the upper part is exposed above the liquid level as shown in FIG. Further, a thermosetting resin 13 is filled and hardened on the wax 15 to complete a film capacitor as shown in FIG. 2C.
ここで、ケース１４内にコンデンサ素子１２を
固定した状態では、ワツクス１５の表面よりも上
方におけるケース１４、電極引出リード１１及び
コンデンサ素子１２の表面には、ワツクス１５が
付着していない。従つてその後に充填される熱硬
化性樹脂１３は、ケース１４、電極引出リード１
１及びコンデンサ素子１２のワツクス表面より上
方の部分に極めて良好に接着し、熱硬化性樹脂１
３の厚さが薄い場合でも高度の気密性を得ること
ができる。 Here, when the capacitor element 12 is fixed in the case 14, the wax 15 is not attached to the surfaces of the case 14, the electrode lead 11, and the capacitor element 12 above the surface of the wax 15. Therefore, the thermosetting resin 13 filled after that is applied to the case 14 and the electrode lead 1.
1 and capacitor element 12 above the wax surface, and the thermosetting resin 1
A high degree of airtightness can be obtained even when the thickness of the material 3 is thin.
なお、上述の実施例において、比重の低い固定
材としてワツクスを用いたが、固定材は、例え
ば、電極引出リードを有しないフイルムコンデン
サ素子の比重を計算するに際し、メタライズドフ
イルムの比重をノンメタライズド品として計算す
ると、いまポリプロピレンが比重0.91、ポリエチ
レンテレフタレートが比重1.40、半田が比重8.50
を基に寸法3.1×1.1×2.0cmの大きさのコンデンサ
素子にメタリコン半田厚み片面0.1cmｔのメタリ
コンを施し、比重8.2のCP線を0.8φ×５cmに切断
し、２面のメタリコン部に各々接続した状態のコ
ンデンサ素子の比重について計算すると、
コンデンサ素子体積
＝3.1×1.1×2.0＝6.82cm3
メタリコン体積
＝1.1×2.0×0.1×２＝0.44cm3
リード線体積
＝（0.05）2×π×5.0＝0.039×２＝0.078cm3
全体積
＝6.82＋0.44＋0.078≒7.34cm3
コンデンサ素子分比率
＝（6.82／7.34）100＝92.9％
メタリコン分比率
＝（0.44／7.34）100＝6.0％
リード線分比率
＝（0.078／7.34）100＝1.1％
で、ポリプロピレンフイルムコンデンサ素子の
比重は、
0.91×0.929＝0.845
8.5×0.060＝0.510
8.2×0.011＝0.09／1.445
となる。さらに、
コンデンサ素子体積
＝4.1×1.8×2.5＝18.45cm3の場合
メタリコン体積
＝1.8×2.5×0.1×２＝0.90cm3
リード線体積
＝（0.05）2×π×5.0＝0.039×２＝0.078
cm3
全体積
＝18.45＋0.9＋0.078＝19.43cm3
コンデンサ素子分比率
＝（18.45／19.43）100＝94.9％
メタリコン分比率
＝（0.9／19.43）100＝4.6％
リード線分比率
＝（0.78／19.43）100＝0.5％
となり、ポリプロピレンフイルムコンデンサ素子
の比重は
0.91×0.949＝0.863
8.5×0.046＝0.391
8.2×0.005＝0.041／1.295となり、これに対
してケースに充填するエポキシ樹脂、不飽和ポリ
エステルなどの熱あるいは光硬化性高分子材料
は、比重が1.4〜1.7程度で、プラスチツクフイル
ムを用いたコンデンサ素子は先の計算からも明ら
かなように、ケースに充填される樹脂材料に比較
して比重が大幅に小さく、またコンデンサ素子が
大きくなればその比重はさらに低くなる傾向にあ
り、充填樹脂中でコンデンサ素子は浮き上る結果
となる。 In the above example, wax was used as a fixing material with low specific gravity. For example, when calculating the specific gravity of a film capacitor element that does not have an electrode lead, the specific gravity of a metallized film is compared to a non-metalized product. When calculated as follows, the specific gravity of polypropylene is 0.91, the specific gravity of polyethylene terephthalate is 1.40, and the specific gravity of solder is 8.50.
Based on this, apply metallized solder to a capacitor element with dimensions of 3.1 x 1.1 x 2.0 cm with a metallized solder thickness of 0.1 cm on one side, cut a CP wire with a specific gravity of 8.2 to 0.8φ x 5 cm, and connect each to the metallized parts on the two sides. Calculating the specific gravity of the capacitor element in the state of =0.039×2=0.078cm 3 total volume = 6.82+0.44+0.078≒7.34cm 3 capacitor element ratio = (6.82/7.34) 100=92.9% Metallicon component ratio = (0.44/7.34) 100=6.0% Lead wire The ratio = (0.078/7.34) 100 = 1.1%, and the specific gravity of the polypropylene film capacitor element is 0.91 x 0.929 = 0.845 8.5 x 0.060 = 0.510 8.2 x 0.011 = 0.09/1.445. Furthermore, when capacitor element volume = 4.1 x 1.8 x 2.5 = 18.45 cm 3 Metallicon volume = 1.8 x 2.5 x 0.1 x 2 = 0.90 cm 3 Lead wire volume = (0.05) 2 x π x 5.0 = 0.039 x 2 = 0.078
cm 3 total volume = 18.45 + 0.9 + 0.078 = 19.43 cm 3 capacitor element ratio = (18.45/19.43) 100 = 94.9% Metallic component ratio = (0.9/19.43) 100 = 4.6% Lead wire ratio = (0.78/ 19.43) 100 = 0.5%, and the specific gravity of the polypropylene film capacitor element is 0.91 x 0.949 = 0.863 8.5 x 0.046 = 0.391 8.2 x 0.005 = 0.041/1.295, whereas the specific gravity of the epoxy resin, unsaturated polyester, etc. Thermal or photocurable polymer materials have a specific gravity of about 1.4 to 1.7, and as is clear from the previous calculations, the specific gravity of capacitor elements using plastic film is significantly higher than that of the resin material filled in the case. Moreover, as the capacitor element becomes larger, its specific gravity tends to become even lower, resulting in the capacitor element floating in the filled resin.
したがつて、本発明は上述の実施例で述べたよ
うにコンデンサ素子より比重が低く、かつ保温注
入温度を略170〜200℃とするワツクス（パラフイ
ンワツクス・マイクロクリスタリンワツクスの比
重0.92）あるいはポリオレフイン系（比重0.85〜
0.91）、エチレン酢ビ系（酢ビコンテントwt％に
よつて異なり、40wt％で比重は0.97ｇ／c.c.，
28wt％で0.95g／c.c.，19wt％で0.94ｇ／c.c.，
14wt5％で0.93g／c.c.）、ポリアミド系（比重1.13
〜1.15）などのホツトメルト型高分子材料をケー
ス内に一定量注入し、コンデンサ素子を挿入して
固定するもので、この固定材はその上に充填する
充填材の硬化温度よろも高い融点をもつものを用
いて固定しておけば、充填樹脂の硬化中のその温
度によつてコンデンサ素子が浮き位置ズレするこ
とはない。 Therefore, as described in the above-mentioned embodiments, the present invention uses wax (paraffin wax/microcrystalline wax, specific gravity: 0.92) or Polyolefin type (specific gravity 0.85~
0.91), ethylene vinyl acetate type (varies depending on the content wt% of vinyl acetate, specific gravity is 0.97g/cc at 40wt%,
0.95g/cc at 28wt%, 0.94g/cc at 19wt%,
14wt5% 0.93g/cc), polyamide type (specific gravity 1.13
A fixed amount of hot-melt polymer material such as ~1.15) is injected into the case, and the capacitor element is inserted and fixed. If the capacitor element is fixed using a material, the capacitor element will not float or shift its position due to the temperature during the curing of the filled resin.
本発明は以上のように、一対の引出端子を有す
るフイルムコンデンサ素子を、ケース内でワツク
スあるいはホツトメルト型高分子材料などの固定
材で一次固定し、さらに熱または光硬化性高分子
材料からなる充填材を注入硬化するもので、コン
デンサ素子固定に係る位置ズレ不良率を低下させ
ると同時に、比重の小さいワツクスあるいはホツ
トメルト型高分子材料を用いることにより、コス
ト高な充填樹脂の注入量を減少させることができ
製品のコストダウンをはかることができ、しかも
ワツクス等の付着によるケースや電極引出リード
と充填樹脂との接着不良を生ずることがなく、充
填樹脂の厚さが薄くても十分な気密性が得られる
ためにコンデンサを小型化できるなど、工業上な
らびに実用上有益なものである。 As described above, the present invention primarily fixes a film capacitor element having a pair of lead-out terminals in a case with a fixing material such as wax or a hot-melt polymer material, and then fills the film capacitor element with a fixing material such as a heat-curable or photocurable polymer material. By injecting and hardening the material, it reduces the defective rate due to positional deviation related to fixing capacitor elements, and at the same time reduces the amount of costly filling resin injection by using wax or hot melt type polymer material with low specific gravity. In addition, it does not cause poor adhesion between the case or electrode lead and the filled resin due to adhesion of wax, etc., and provides sufficient airtightness even if the filled resin is thin. Because of this, it is possible to miniaturize capacitors, which is useful industrially and practically.
第１図は従来のフイルムコンデンサを示し、イ
は正断面図、ロは側断面図、第２図は本発明の一
実施例の製造工程を示し、イはケースにワツクス
を充填した透過斜視図、ロはイにコンデンサ素子
を収納した透過斜視図、ハは完成したフイルムコ
ンデンサの斜視図である。
１１……電極引出リード、１２……コンデンサ
素子、１３……熱硬化性樹脂からなる充填材、１
４……ケース、１５……固定材。
Fig. 1 shows a conventional film capacitor, A is a front sectional view, B is a side sectional view, Fig. 2 shows the manufacturing process of an embodiment of the present invention, and A is a transparent perspective view of a case filled with wax. , B is a transparent perspective view of the capacitor element housed in A, and C is a perspective view of the completed film capacitor. DESCRIPTION OF SYMBOLS 11... Electrode extraction lead, 12... Capacitor element, 13... Filling material made of thermosetting resin, 1
4...Case, 15...Fixing material.
Claims (1)
も比重の低い未固化状態にあるワツクスあるいは
ホツトメルト型高分子材料などの固定材を注入
し、該固定材が未固化状態にある間にその中に一
対の引出端子を有するフイルムコンデンサ素子を
上記引出端子を上方にしかつ上記フイルムコンデ
ンサ素子の上部を上記未固化固定材の液面から上
方に露出させて上記ケースの底に接触する状態に
自重によつて沈め、上記固定材を固化させて上記
フイルムコンデンサ素子を固定した後、上記ケー
ス内の残存空間に熱または光硬化性高分子材料か
らなる充填材を注入してこれを硬化させることを
特徴とするフイルムコンデンサの製造方法。1 A fixing material such as wax or hot melt type polymer material in an unsolidified state with a specific gravity lower than that of the film capacitor element is poured into a bottomed case, and while the fixing material is in an unsolidified state, a pair of fixing materials are injected into it. A film capacitor element having a lead-out terminal is sunk by its own weight so that the lead-out terminal faces upward and the upper part of the film capacitor element is exposed above the liquid level of the unsolidified fixing material and contacts the bottom of the case. , a film characterized in that after the fixing material is solidified and the film capacitor element is fixed, a filler made of a heat or photo-curable polymer material is injected into the remaining space in the case and cured. Method of manufacturing capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18618090A JPH0340411A (en) | 1990-07-12 | 1990-07-12 | Manufacture of film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18618090A JPH0340411A (en) | 1990-07-12 | 1990-07-12 | Manufacture of film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0340411A JPH0340411A (en) | 1991-02-21 |
| JPH0460330B2 true JPH0460330B2 (en) | 1992-09-25 |
Family
ID=16183794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18618090A Granted JPH0340411A (en) | 1990-07-12 | 1990-07-12 | Manufacture of film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340411A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4671220B2 (en) * | 2005-01-26 | 2011-04-13 | 東日本旅客鉄道株式会社 | AC voltage regulator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115574B2 (en) * | 1972-07-22 | 1976-05-18 | ||
| JPS5545282U (en) * | 1978-09-19 | 1980-03-25 | ||
| JPS55173127U (en) * | 1979-05-28 | 1980-12-12 |
-
1990
- 1990-07-12 JP JP18618090A patent/JPH0340411A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340411A (en) | 1991-02-21 |
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