JPH0463559B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a substrate through-hole forming apparatus for forming through-holes in a substrate such as a ceramic substrate on which an electric circuit is formed using a thick film circuit coating.

PRIOR ART In general, electric circuits manufactured by thick film circuit forming equipment have thick films of various shapes, such as conductors, resistors, and non-conductors, depending on the type of circuit forming material discharged from the nozzle. These film layers were stacked to form a circuit.

FIG. 3 is a configuration diagram of a conventional thick film circuit forming apparatus for forming this thick film circuit, in which a syringe 1 equipped with a nozzle 2 for discharging thick film circuit paint is mounted on a holding part 4 mounted on a frame 3. Retained. Further, a table 5 that moves in the XY directions is attached to the lower part of the nozzle 2, and a substrate 6 made of ceramic or the like is placed on this table 5. Further, as shown in FIG. 4, when the thick film circuit paint 7 is put into the syringe 1 and compressed air is sent into the syringe 1 from the tube 8, the thick film circuit paint 7 comes out from the nozzle 2. Then, a thick film circuit 9 is formed on the substrate 6. Note that the nozzle 2 is movable in the vertical direction with respect to the frame 3.

Generally, when filling the through holes 6a of the ceramic substrate 6 with the thick film circuit paint 7 as shown in FIG. By pressing the ceramic substrate 6 into the through hole 6a and applying negative pressure around the through hole from below the table 5 of the substrate 6, the pressure film circuit paint 7 is filled as shown in FIG. 5B.

Problems to be Solved by the Invention However, the manual process of pushing the thick film circuit paint 7 on the screen 11 into the through holes 6a with the squeegee 10 has a problem in that the work efficiency is very low. .

In order to make this work more efficient, if the thick film circuit paint 7 is discharged into the through hole by the nozzle 2, it cannot be rubbed in like a squeegee 10.
After applying the thick film circuit paint 7 from the nozzle 2, use a jig or the like to penetrate the through hole 6a to form a through hole.If you do not carefully perform the troublesome work, a stable through hole will be formed. The problem was that I couldn't do it.

Means for Solving the Problems In order to solve the above problems, the present invention provides a table mechanism for driving a substrate in XY directions, and a thick film that is discharged onto the substrate and becomes an electric circuit through a firing process. In a thick film circuit forming apparatus having a nozzle portion for dispensing circuit paint, a through hole having a predetermined diameter for forming a through hole in the substrate, and a hole at least wider than the through hole above the through hole of the substrate. A nozzle part that discharges the thick film circuit paint to place a predetermined amount of the thick film circuit paint, and an air supply source downward from above the through hole of the board on which the predetermined amount of the thick film circuit paint is placed. a first air jetting nozzle which jets out compressed air through a solenoid valve; and compressed air is jetted from an air supply source from above to the bottom around the outer periphery of the thick film circuit paint on the upper surface of the substrate in the through hole through the solenoid valve. an air ejection nozzle portion forming a second air ejection nozzle, and a negative pressure generation source that generates negative pressure at a lower portion of a through hole in the substrate through an electromagnetic valve; and a control device that controls the negative pressure generation timing of the negative pressure generation source via the electromagnetic valve, and controls the ejection timing of the first and second air injection nozzles via the electromagnetic valve. Features.

According to the present invention, there is provided a nozzle portion for discharging thick film circuit paint at least wider than the through hole onto the through hole having a predetermined diameter of the substrate placed on the table mechanism, and an air supply source via the electromagnetic valve. An air ejection nozzle section forming first and second air ejection nozzles connected to controlled by the device. Therefore, the thick film circuit paint can be prevented from spreading on the substrate surface, and the thick film circuit paint can adhere to the periphery of the through hole to form a stable through hole.

Embodiment FIGS. 1a and 1b are main part configuration diagrams illustrating a through hole forming apparatus for a substrate according to an embodiment of the present invention, in which a through hole 6a is formed in a ceramic substrate 6 on a table 5, and FIG. As shown in a, a predetermined amount of the thick film circuit paint 7 is discharged from the nozzle 2 onto the through hole 6a.
Since the discharged thick film circuit paint 7 does not enter the through hole 6a as it is, air is jetted from the air jet nozzle 12 from above the thick film circuit paint 7 as shown in FIG. 1b. The thick-film circuit paint 7 adheres to the periphery of the through-hole 6a, and the excess thick-film circuit paint 7 at the center is blown away by the air, so that the thick-film circuit paint 7 adheres to the through-hole 6a. A hole is formed.

That is, in FIG. 1b, the second air jet nozzle 19 is configured in an outer ring concentric with the first air jet nozzle 12, and the second air jet nozzle 19
is connected to the air supply source 14 via the electromagnetic valve 13, and the outer second air jet nozzle 19 is connected to the air supply source 1 via the electromagnetic valve 20.
Connected to 4. A negative pressure generating cover 15 is provided at a position below the through hole 6a that faces at least the first air jet nozzle 12, and this negative pressure generating cover 15 is connected to the negative pressure generating source via an electromagnetic valve 16.
7 is connected. And the electromagnetic valve 13,
16 and 20 are connected so that opening and closing thereof are controlled by a control device 21.

In this embodiment configured in this way, after a predetermined amount of the thick film circuit paint 7 is placed on the through hole 6a of the ceramic substrate 6, the through hole 6a of the substrate 6 blows out compressed air from above to below. A through-hole is formed by the first air jet nozzle 12 on the inside, and compressed air is sprayed from above to the bottom on the outer periphery of the thick film circuit paint 7 from the second air jet nozzle 19 on the outside. Membrane circuit paint 7
can prevent the spread of. Further, in this embodiment, by ejecting air from the first air ejection nozzle 12 and generating negative pressure within the negative thickness generating cover 15, a good through hole can be formed. In addition, by controlling the opening and closing of the electromagnetic valves 13, 16, 20 by the control device 21, the timing for ejecting compressed air from the first and second air ejection nozzles 12, 19 and the timing for generating negative pressure can be adjusted. Optimal through holes can be formed by controlling.

FIGS. 2a and 2b are schematic configuration diagrams illustrating a through-hole forming apparatus for a substrate according to another embodiment of the present invention,
In this embodiment, a paint discharge nozzle 22 is formed outside the first air discharge nozzle 12.

In this embodiment configured in this way, after the paint 7 for thick film circuit is discharged into the through hole 6a of the ceramic substrate 6 by the outer paint discharge nozzle 22 as shown in FIG. As shown, compressed air is ejected from the central first air ejection nozzle 12 to fill the through holes 6a with the thick film circuit paint 7 to form through holes, thereby improving the work efficiency. In addition to ceramic substrates, the present invention can also be applied to PCBs such as ordinary glass-filled epoxy substrates.

Effects of the Invention As is clear from the above description, the present invention is capable of discharging a predetermined amount of thick film circuit paint onto a through hole having a predetermined diameter in a ceramic substrate placed on a table mechanism, at least wider than the through hole. a first air ejection nozzle that ejects compressed air from an air supply source through a solenoid valve from above the through hole of the substrate on which a predetermined amount of thick film circuit paint is placed; An air jet nozzle portion is formed around the outer periphery of the thick film circuit paint on the upper surface of the substrate, and a second air jet nozzle that jets compressed air from above to below from an air supply source via a solenoid valve, and the lower part of the through hole. A negative pressure generation source is provided to generate negative pressure via a solenoid valve, and each solenoid valve is controlled by a control device to prevent the thick film circuit paint from spreading on the substrate surface and prevent the short circuit from drawing the circuit. It has the advantage that it can prevent this and also form a stable through-hole by adhering to the periphery of the through-hole.

[Brief explanation of the drawing]

1A and 1B are main part configuration diagrams illustrating a through-hole forming apparatus for a substrate according to an embodiment of the present invention, and FIGS. 2A and 2B are illustrating a through-hole forming apparatus for a substrate according to another embodiment of the present invention. 3 is a block diagram of a conventional thick film circuit forming apparatus, FIG. 4 is a sectional view of a conventional nozzle, and FIG. 5 is a through hole forming method formed by a conventional screen printing method. FIG. 5...Table, 6...Ceramic substrate, 7...
... Thick film circuit paint, 12... First air jet nozzle, 13, 16, 20... Solenoid valve, 14...
... Air supply source, 15 ... Negative pressure generation cover, 17
... Negative pressure generation source, 21 ... Control device, 19 ... Second air jet nozzle, 22 ... Paint discharge nozzle.

Claims (1)

[Claims] 1. A table mechanism that drives the substrate in the XY directions;
A thick film circuit forming apparatus having a nozzle portion for discharging a thick film circuit coating material that is discharged onto the substrate and becomes an electric circuit through firing process, the thick film circuit forming device having a predetermined diameter for forming a through hole in the substrate. a nozzle portion for discharging a thick film circuit paint to place a predetermined amount of the thick film circuit paint on the through hole of the substrate at least wider than the through hole; and the predetermined amount of the thick film circuit. A first air jetting nozzle that jets compressed air from an air supply source through a solenoid valve downwardly from above the through hole of the substrate on which the paint for circuits is placed, and the outer periphery of the thick film circuit paint on the upper surface of the substrate in the through hole. and a second air jet nozzle for jetting compressed air from above to below from an air supply source through a solenoid valve; a negative pressure generation source that generates negative pressure via a solenoid valve; and a negative pressure generation timing of the negative pressure generation source that is controlled via the electromagnetic valve, and a jetting timing of the first and second air jetting nozzles; A through-hole forming apparatus for a substrate, comprising: a control device for controlling the above-mentioned electromagnetic valve through the electromagnetic valve. 2. The through-hole forming device for a substrate according to claim 1, wherein a paint discharge nozzle portion is provided on the outer periphery of at least the first air jet nozzle of the air jet nozzle portion.