Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPH0464465B2 - - Google Patents
[go: Go Back, main page]

JPH0464465B2 - - Google Patents

Info

Publication number
JPH0464465B2
JPH0464465B2 JP60174644A JP17464485A JPH0464465B2 JP H0464465 B2 JPH0464465 B2 JP H0464465B2 JP 60174644 A JP60174644 A JP 60174644A JP 17464485 A JP17464485 A JP 17464485A JP H0464465 B2 JPH0464465 B2 JP H0464465B2
Authority
JP
Japan
Prior art keywords
pad
probe
pellet
small
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60174644A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233446A (ja
Inventor
Hideo Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60174644A priority Critical patent/JPS6233446A/ja
Publication of JPS6233446A publication Critical patent/JPS6233446A/ja
Publication of JPH0464465B2 publication Critical patent/JPH0464465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP60174644A 1985-08-07 1985-08-07 集積回路装置 Granted JPS6233446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60174644A JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60174644A JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Publications (2)

Publication Number Publication Date
JPS6233446A JPS6233446A (ja) 1987-02-13
JPH0464465B2 true JPH0464465B2 (sr) 1992-10-15

Family

ID=15982196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60174644A Granted JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Country Status (1)

Country Link
JP (1) JPS6233446A (sr)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166730A (ja) * 1982-03-26 1983-10-01 Mitsubishi Electric Corp 半導体装置のボンデイング用電極

Also Published As

Publication number Publication date
JPS6233446A (ja) 1987-02-13

Similar Documents

Publication Publication Date Title
KR100294771B1 (ko) 반도체장치
CN100378979C (zh) 半导体器件
JPH0464465B2 (sr)
JP3990679B2 (ja) 半導体実装用回路基板を備えた半導体装置
JPS62261139A (ja) 半導体装置
JPH0517706B2 (sr)
JP2692620B2 (ja) マルチチップモジュールの実装構造
JP3555828B2 (ja) 半導体実装用回路基板を備えた半導体装置
JPS622458B2 (sr)
JP2001118994A (ja) 半導体装置
JPH0653219A (ja) 半導体装置
JPH05343487A (ja) 半導体集積回路装置
JPH0439950A (ja) 半導体装置
JP2955736B2 (ja) 半導体装置用多層セラミックパッケージ
JP2842430B2 (ja) Ｔａｂテープ
JPS62183134A (ja) 半導体装置
JPH01319956A (ja) 半導体集積回路
JPS6231148A (ja) 半導体装置
JPS63173342A (ja) 半導体装置
JPH03185730A (ja) 半導体装置
JPS6345833A (ja) 半導体装置
JPH0314250A (ja) 半導体装置
JPH1154562A (ja) 半導体パッケージ
JPS6222448A (ja) Ｉｃの形成されたウエ−ハ
JPH02165060A (ja) プローブカード