JPH0464792B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to printed circuit boards on which electronic components having lead wires and chip components without lead wires are mounted together, or electronic components having only lead wires. The present invention relates to a printed circuit board warpage correction device that corrects warpage that occurs in a printed circuit board during a soldering process of the mounted printed circuit board.

[Conventional technology]

BACKGROUND ART Conventionally, in a soldering process for a printed circuit board to which electronic components having lead wires are mounted, the printed circuit board has been greatly warped and deformed due to the influence of heat such as solder melt. Therefore, it is not possible to cut uniformly with the cutter device in the next stage.
A printed circuit board warpage correction device as shown in FIG. 8 was used.

FIG. 8 is a schematic configuration diagram showing a conventional printed circuit board warpage correction device, in which 1 is a printed circuit board, 2 is an electronic component, 3 is a lead wire of the electronic component 2, and 4 is a chip component, which is bonded to the printed circuit board 1. After being temporarily attached with adhesive or the like, it is soldered. Reference numeral 5 indicates a conveyance chain that engages and moves the printed circuit board 1, 6 indicates a cutter, and 7 and 8 indicate the downwardly curved and warped printed circuit board 1 from below to above. This is a lower warpage corrector provided below the traveling printed circuit board 1 for correction. In addition, FIG. 8 shows an example in which the lower warp correctors 7 and 8 are used in a cutter device.

9a and 9b show the shape of the lower warp corrector 7 in FIG. 8 in detail, FIG. 9a is a front view, and FIG. 9b is a sectional view taken along the line - in FIG. 9a. , the same reference numerals as in FIG. 8 indicate the same parts, 11 is a pin as a pressing tool for pressing the printed circuit board 1 to correct warpage, 12 is a rotatable rotating shaft on which the pin 11 is mounted, 13 is the above-mentioned This is a bearing that supports the rotating shaft 12.

10a and 10b are a front view and a side view showing the shape of the lower warp corrector 8 in FIG. 8 in detail;
The same reference numerals as in FIG. 9 indicate the same parts, 14 is a rotary plate as a pressing tool for pressing the printed circuit board 1 to correct warping, 15 is a rotatable shaft to which the rotary plate 14 is fixed, and 16 is a rotary plate. It is a bearing.

In this way, the printed circuit board 1 is transferred to the conveyor chain 5.
is engaged with an engaging claw (not shown), and transported in the direction of arrow A as shown in FIG. 8, soldered in a soldering bath (not shown), and then in a cooling device (not shown). After cooling, it is sent to a cutter device. Next, as shown in FIG. 8, when the pins 11 of the lower warp corrector 7 come into contact with the printed circuit board 1, the pins 11 rotate, so the pins 11 successively come into contact with the printed circuit board 1, and the warpage of the printed circuit board 1 is prevented. After correction, the lead wire 3 is then cut by the cutter 6. Printed circuit board 1 after lead wire 3 is cut
further comes into contact with the rotating plate 14 of the lower warp corrector 8, and the rotation of the rotating plate 14 corrects the warping of the printed circuit board 1.

[Problem that the invention seeks to solve]

By the way, the conventional lower warpage correctors 7 and 8 as described above are not suitable for the printed circuit board 1 when only the electronic component 2 having the lead wire 3 is mounted on the printed circuit board 1.
It can be corrected that the center part of the image is curved downward, but
In the printed circuit board 1 on which the electronic component 2 and the chip component 4 are mounted together, the chip component 4 or, during soldering, the lead wires 3,
Bridge 3a or lead wire 3 that occurred between 3
The part of the icicle 3b attached to the icicle 3b acts as a protrusion, so when it hits the pin 11 or the rotary plate 14, the printed circuit board 1 is further pressed upward by the height of the chip component 4. When used in a cutter device, there was a problem in that the lead wire 3 could not be cut uniformly because a flat shape could not be obtained by bending upward.

This invention was made to solve the above-mentioned problem. Even if the pin or rotary plate of the lower warp corrector comes into contact with a chip component, bridge, or icicle mounted on a printed circuit board, the entire pin or rotary plate will be damaged. It is an object of the present invention to provide a warpage correction device for a printed circuit board, in which the printed circuit board can be held in a flat state by moving downward.

[Means for solving problems]

The printed circuit board warpage correction device according to the present invention includes a pressing tool consisting of a pin or a rotary plate that presses the lower surface of the printed circuit board from below to above, a rotating shaft to which the pressing tool is attached, and a bearing that supports the rotating shaft. a support shaft that holds the bearing movably in the vertical direction; a spring provided on the support shaft that urges the bearing in a direction to move the bearing upward; and the urging force of the spring moves the pressing tool to a predetermined position. a lower warp corrector consisting of a stopper for holding the printed circuit board; and an upper warp corrector comprising a pin that presses the top surface of the printed circuit board from above to below, and a movable plate to which the pin is attached and which can be moved in the vertical direction. It consists of.

[Effect]

In this invention, when the traveling printed circuit board comes into contact with the pressing tool of the lower warp corrector, the warping of the printed circuit board is corrected by rotation of the pressing tool. In addition, the plane of the printed circuit board is held by the pins of the upper warp corrector from the top surface of the printed circuit board, and even if a chip component, bridge, or icicle attached to the printed circuit board comes into contact with the pressing tool, the chip component etc. will not touch the pressing tool. Press down.

〔Example〕

Figures 1, 2a and 2b, 3 and 4 show an embodiment of the present invention. Figure 1 is a schematic diagram, and Figures 2a and 3 are the lower part. 2b is a side view of the lower warp corrector 21, and FIG. 4 is a schematic perspective view of the upper warp corrector 41. In these figures, Fig. 8,
The same reference numerals as in FIG. 9 indicate the same parts. 21 is a lower warpage corrector; 22 is a bearing that supports the rotating shaft 12; 23 is a through hole formed in the vertical direction of the bearing 22; 24 is a support shaft that is slidably fitted into the through hole 23; 25 is a spring attached to the outer periphery of the support shaft 24 and biases the bearing 22 in the upward direction; 26 is attached to the upper part of the support shaft 24;
A stopper 27 that holds the bearing 22 in a predetermined position is a pedestal. Further, 31 is a lower warp corrector, 32
is a pedestal.

41 is a lower warp corrector 21 for correcting the upward bending and warping of the printed circuit board 1;
When the printed circuit board 1 is pressed by 31,
This is an upper warp corrector provided above the traveling printed circuit board 1 to maintain the plane of the printed circuit board 1, and is moved by the driving force of the traveling printed circuit board 1. 42 is a base of the upper warp corrector 41, 43 is a wheel attached to the base 42,
44 is a support shaft to which the base 42 is fixed; 45 is a fixed frame attached to the support shaft 44; 46 is a movable plate that is guided by the support shaft 44 and can move up and down; When in a standby state, it is placed on an arm (not shown) and held at an upper position. 47 is a bearing fixed to the movable plate 46 and slidably fitted to the support shaft 44; 48 is in contact with the upper surface of the printed circuit board 1;
It is fixed movably to the movable plate 46 by a plurality of pins that correct upward warpage of the printed circuit board 1 and hold the printed circuit board 1 flat. Reference numeral 49 denotes an engaging piece attached to the fixed frame 45, which engages with the printed circuit board 1, and the entire upper warp corrector 41 is placed on the guide rail 50 by the driving force generated by the running of the printed circuit board 1. It is something that allows you to move.

The printed circuit board warpage correction device configured as described above is configured such that when the printed circuit board 1 that is engaged with the conveyance chain 5 and travels comes into contact with the engagement piece 49 of the upper warpage corrector 41 that is in a standby state in advance. ,
The upper warp corrector 41 moves in the direction of arrow A. Next, when the upper warp corrector 41 moves, the movable plate 26 is lowered by lowering an arm (not shown), so that the pin 48 comes into contact with the upper surface of the printed circuit board 1. At this time, the arm moves away from the movable plate 26 due to the movement of the upper warp corrector 41.

Therefore, the printed circuit board 1 is pressed down from above by the pins 48 and kept flat.

By the way, as shown in FIG.
When the chip component 4 having a height h with its upper surface pressed by the pin 48 of the upper warp corrector 41 comes into contact with the pin 11 of the lower warp corrector 21, the chip component 4 touches the tip 11a of the pin 11. , the pin 11, rotating shaft 12, and bearing 22 also descend to the position shown by the two-dot chain line, compressing the spring 25. Therefore, even if the pin 11 comes into contact with the chip component 4, the printed circuit board 1 will not be pushed upward because it is held down by the pin 48. Also, Bridge 3
Even if the pin 11 comes into contact with the icicles 3b and 3b, the same result will occur.

In this way, the chip part 4 or the bridge part 3
Even if pin 11 comes into contact with a and icicles 3b, pin 11
is pushed down, no strong force is applied to the chip parts 4, pins 11, etc., so that the chip parts 4 and pins 11 are not damaged, and the printed circuit board 1 is maintained flat.

Next, after the chip part 4 passes the pin 11, the restoring force of the spring 25 causes the pin 11, the rotating shaft 12,
The bearing 22 rises and comes into contact with the stopper 26, and the fifth
Since the pin 11 returns from the position indicated by the two-dot chain line to the position indicated by the solid line in the figure, the pin 11 can be held at a predetermined position.

Therefore, since the printed circuit board 1 is held flat by the pins 48, even when the lead wire 3 is cut by the cutter 6 of the cutter device, no vibration is applied to the printed circuit board 1, and many The lead wires 3 are cut evenly.

Also in the lower warp corrector 31 shown in FIG. 3, when the rotating plate 14 comes into contact with the chip component 4, the rotating plate
4 is lowered, the rotating shaft 15 and bearing 22 are also lowered by a height h to the position shown by the two-dot chain line. In addition, after the chip part 4 has passed, the rotating plate 14, the rotating shaft 1
5. The bearing 22 rises and returns from the position indicated by the two-dot chain line to the position indicated by the solid line, so that the rotating plate 14 can be held at a predetermined position.

FIGS. 6a and 6b are a plan view and a side view showing another embodiment of the present invention, showing a different shape of the lower warp corrector 21 shown in FIG. 2. FIGS. In FIGS. 6a and 6b, the same reference numerals as in FIG. 2 indicate the same parts, 51 is a lower warp corrector, 52 is a lever, and a rotating shaft 1 is attached to the tip of the printed circuit board 1 in the running direction (direction of arrow A).
A bearing part 52a is formed on which the lever 52 rotatably supports the lever 52, and the rear end of the lever 52 is attached to the mounting part 52 of the support shaft 53.
b. Reference numeral 54 designates a support plate for the lever 52, into which the support shaft 24 is slidably fitted.
55 is a bearing of the support shaft 53, and 56 is the spring 2.
In order to hold the pin 11 in a predetermined position by the urging force of 5, a stopper 57 that prevents rotation of the lever 52 is a base.

Regarding the operation, when the chip component 4 mounted on the printed circuit board 1 comes into contact with the pin 11, the pin 11
is lowered, the lever 52 rotates counterclockwise about the support shaft 53, compressing and biasing the spring 25 via the support plate 54. After the chip part 4 passes through the pin 11, the restoring force of the spring 25 causes the pin 11, rotating shaft 12, and lever 52 to return to their original positions, and can be held at a predetermined position.

7a and 7b are a plan view and a side view showing still another embodiment of the present invention, showing another shape of the lower warp corrector 31 of FIG. 3. FIG. Figure 7 a, b
, the same symbols as in FIG. 2 indicate the same parts,
61 is the lower warp corrector, 62 is the rotation shaft 15
63 is a support for the bearing 62, and 64 is a base.

In operation, when the chip component 4 mounted on the printed circuit board 1 comes into contact with the rotating plate 14, the rotating plate 14 descends, compressing the spring 25 via the rotating shaft 15, bearing 62, and support base 63. energize. After the chip component 4 passes through the rotating plate 14, the rotating plate 14 returns to its original position due to the restoring force of the spring 25, and can be held at a predetermined position.

Note that the printed circuit board 1 after the lead wire 3 has been cut by the cutter 6 is transported by the transport chain 5 and taken out from the exit of the cutter device. Further, the upper warp corrector 41 is disengaged from the printed circuit board 1, placed on a lifting device (not shown), raised, and sent upward. Next, printed circuit board 1
is sent in the opposite direction to the running direction (direction of arrow A),
Further, it is placed on a lowering device (not shown) and lowered to return to the initial standby position.

〔Effect of the invention〕

As explained above, the present invention includes a pressing tool consisting of a pin or a rotary plate that presses the bottom surface of a printed circuit board from below to above, a rotating shaft to which this pressing tool is mounted, a bearing that supports this rotating shaft, and a rotating shaft that supports this rotating shaft. A support shaft that holds the bearing movably in the vertical direction, a spring that is biased to the support shaft in a direction that moves the bearing upward, and the urging force of this spring holds the pressing tool in a predetermined position. a lower warp corrector comprising a stopper; a pin for pressing the top surface of the printed circuit board from above to the bottom; and an upper warp corrector comprising a movable plate to which the pin is attached and which is movable in the vertical direction; Therefore, when the printed circuit board is fixed and held flat by pressing from the top surface of the printed circuit board with the pins of the upper warp corrector, the pressing tool of the lower warp corrector may come into contact with the chip parts, bridges, or icicles. Since the chip parts and the like press down on the pressing tool, damage to the chip parts and the pressing tool can be prevented. In addition, when used with a cutter device, the lead wires are cut evenly and the lead wires are not cut diagonally because the cutter does not apply vibration to the printed circuit board when cutting the lead wires. has advantages.

[Brief explanation of drawings]

Figures 1, 2a and 2b, 3 and 4 show an embodiment of the present invention. Figure 1 is a schematic diagram, and Figures 2a and 3 are the lower part. A front view of the warp corrector, FIG. 2b is a side view of the lower warp corrector,
Fig. 4 is a schematic perspective view of the upper warp corrector, Fig. 5 is a front view showing the operation of Fig. 2a, and Figs. 6a and b.
7A and 7B are a plan view and a side view of a lower warp corrector showing still another embodiment of the present invention, and FIGS. Fig. 8 is a schematic configuration diagram showing a conventional printed circuit board warp corrector, Figs. 9 a and b show details of the shape of the lower warp corrector in Fig. 8, and Fig. 9 a is a front view. , FIG. 9b is - of FIG. 9a
10a and 10a are a front view and a side view showing the shape of the other lower warp corrector shown in FIG. 8 in detail. In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a lead wire, 4 is a chip component, 5 is a conveyance chain,
11 is a pin, 12 and 15 are rotating shafts, 14 is a rotating plate, 21 and 31 are lower warp correctors, 22 is a bearing,
23 is a through hole, 24 is a support shaft, 25 is a spring, 26 is a stopper, 41 is an upper warpage corrector, 42 is a base, 4
3 is a wheel, 44 is a support shaft, 45 is a fixed frame, 46 is a movable plate, 47 is a bearing, 48 is a pin, and 49 is an engagement piece.

Claims (1)

[Claims] 1. A pressing tool consisting of a pin or rotating plate that presses the bottom surface of a printed circuit board from below to above, a rotating shaft to which this pressing tool is attached, a bearing that supports this rotating shaft, and moving this bearing in the vertical direction. A lower curvature consisting of a support shaft that can be held, a spring that is provided on the support shaft to urge the bearing in a direction to move it upward, and a stopper that holds the pressing tool in a predetermined position by the urging force of the spring. A corrector; a pin that presses the top surface of the printed circuit board from above to below; and an upper warp corrector equipped with a movable plate to which the pin is attached and which is movable in the vertical direction. Warp correction device for printed circuit boards.