JPH0468265B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a joining method and a joining product for joining ceramics and metal to obtain a joining product with high thermal shock resistance.

``Prior Art'' As is well known, for metal parts (metal base material) that are frequently subjected to wear and heat, there is a method to improve the wear resistance and heat resistance of parts by using ceramics. It has been taken.

Conventionally, the above-mentioned ceramic-metal bonded products have been made by integrally bonding a metal base material 1 and a ceramic 2 via an intermediate metal layer 3, as shown in FIG. The following three methods are mainly used to join this joined product. First, in the first method, a metallized layer with a thickness of about 30 to 60 μm is formed in advance on the bonding surface of the ceramic 2, and the intermediate metal layer 3 is brazed to the ceramic 2. This is a method of brazing the metal base material 1 to the metal base material 1. In addition, in the second method, a metal brazing filler metal is applied to the joint surface of the metal base material 1, and at the same time, a ceramic 2
In this method, a brazing material for metallization is applied, an intermediate metal layer 3 is interposed between them, and these are brazed and integrated by heating. The third method is to use metal base material 1 and ceramics 2.
In this method, an intermediate metal layer 3 is interposed between the metal base material 1 and the ceramics 2, and these three are heated under pressure to diffuse the intermediate metal layer 3 into the metal base material 1 and the ceramics 2, respectively, and to bond them.

The intermediate metal layer 3 may include Cu, A, Ni,
In addition, noble metals such as Ag, soft alloys containing these single metals, Fe/Ni/Co alloys,
Alloys such as Fe/Ni alloys, W, and Mo, or single low thermal expansion metals are used.

In the above bonding structure, it is known that the bonding strength is proportional to the bonding area between the ceramics 2 and the intermediate metal layer 3. In addition, in order to alleviate the stress applied between the metal base material 1 and the ceramics 2, the intermediate metal layer 3 needs to have a certain thickness or more, but the deformation force due to the expansion and contraction of the intermediate metal layer 3 itself is When considering the influence on the ceramics 2, it is preferable that the intermediate metal layer 3 be thinner.
Therefore, at present, metallized layers etc. directly bonded to ceramics 2 are 30%
It is formed to a thickness of ~60 μm.

"Problems to be Solved by the Invention" By the way, the above-mentioned conventional bonded products of ceramics and metal have the following problems, and it is desired to solve them.

That is, in the above-mentioned bonded product, as shown in FIG. 14, in order to increase the bonding strength, an intermediate metal layer 3 is usually formed so as to cover almost the entire surface 2a of the ceramics 2 on the bonding side, and then bonded. There is. However, in such a structure, for example, the tensile stress applied to the intermediate metal layer 3 due to cooling contraction of the metal base material 1 having a large coefficient of thermal expansion acts toward the center of each side as shown by the arrow in the figure. As a result, the largest tensile stress acts on the corners C of the intermediate metal layer 3. Therefore, the ceramic 2, which is weak against tensile stress, often experiences stress concentration in the portion corresponding to the corner C, causing cracks and peeling.

On the other hand, as shown in FIG. 15, a structure in which the shape of the intermediate metal layer 3 is made into a disk shape so that no corners are formed in the joint portion 4 can be considered in order to avoid stress concentration. However, for example, the coefficient of thermal expansion of Al ₂ O ₃ is
7.8×10 ^-6 and that of Si ₃ N ₄ is 4×10 ^-6 , so the coefficient of thermal expansion of the metal base material is 2 to 4 compared to that of ceramics.
Therefore, even in the improved structure described above, in which the bonding area is reduced to some extent by adopting a bonding surface without corners, in other words, the bonding strength is sacrificed to some extent, as shown in FIG. However, it is impossible to avoid the phenomenon of deterioration over time in which cracks occur in the ceramic 2 along the outer periphery of the bonded portion and eventually it peels off. Particularly, when the metal base material is subjected to external heat or mechanical force and undergoes large deformation, the force is even more applied to the ceramic, making it more likely that cracks will occur.

This invention was made in view of the above circumstances,
The purpose is to reduce the deformation force that is applied to ceramics due to the thermal expansion and contraction of the metal base material and external forces, thereby reducing cracks in ceramics, improving the thermal shock resistance and reliability of products, and extending their service life. The purpose of the present invention is to provide a method for bonding ceramics and metal with high thermal shock resistance, and a bonding product that can be bonded.

"Means for Solving the Problems" In order to solve the above problems, the present inventors
As a result of repeated research combining various bonding structures and bonding methods, we have come to the following findings.

() As shown in Fig. 1a and b, the intermediate metal layer interposed between the metal 1 and the ceramics 2 is divided into two, and the area of the layer (intermediate metal layer) 10 to be bonded on the ceramic is determined. By making the area approximately equal to the area of the ceramics 2 and having a thickness of 0.1 to 0.7 mm, the stress applied to the ceramics 2 can be significantly alleviated.

() The other layer (buffer metal layer) 11 has a smaller area than the intermediate metal layer 10 and has a thickness of 0.5 to 3
By setting the thickness to mm, the influence of deformation occurring in the metal 1 on the ceramics 2 can be significantly alleviated.

() A metallized layer 12 is formed on the ceramics 2, and the intermediate metal layer 10 is bonded thereon.
The entire outer periphery 10a of the ceramics 2 by a dimension 1 to 5 times the thickness thereof
The stepped portion 14 formed by the ceramics 2 and the intermediate metal layer 10 is bonded so as to be on the inside of the ceramic layer a, and the buffer metal layer 11 bonded thereon is bonded using the brazing material 13.
The brazing filler metal 13 flows in, fills this step 14, and solidifies.
15 is formed). This fillet 15 is shaped to become thinner toward the outer periphery on the ceramics 2, and the thinner the thickness, the better the ability to follow expansion and contraction deformation, so that the stress applied to the joint end of the ceramics 2 is significantly alleviated.

() Buffer metal layer 11 on the intermediate metal layer 10
The brazing filler metal 13 for bonding the metal 1 to the buffer metal layer 11 and the brazing filler metal 16 for bonding the metal 1 to the buffer metal layer 11 are both brazing filler metals having a slower oxidation rate than the intermediate metal layer 10 and the buffer metal layer 11 (hereinafter referred to as slow oxidizing brazing filler metal). ), the exposed surfaces of the intermediate metal layer 10 and the buffer metal layer 11, as well as the ceramic 2
The surface (upper surface on the joining side) is coated with the above slow oxidizing brazing filler metal 1.
3 and 16, an intermediate metal layer 10, a buffer metal layer 11, and a ceramic layer 2.
It prevents the progress of oxidation that causes hardening of metal materials on each surface, prevents metal embrittlement that is thought to be the cause of cracks in ceramics, and improves product durability and thermal shock resistance. .

This invention has been made based on the above findings.

That is, the method for bonding ceramics and metal with high thermal shock resistance according to the present invention includes (a) forming a metallized layer 12 on the surface of the ceramic 2;
and a thickness of 0.1 to 0.7 mm on top of it.
The entire outer periphery 10a of the intermediate metal layer 10 is 1 to 5 times the thickness of the ceramic 2.
(b) bonding the intermediate metal layer 10 on the intermediate metal layer 10;
a buffer metal layer bonding step of bonding a buffer metal layer 11 with a smaller area and a thickness of 0.5 to 3 mm using a slow oxidizing brazing filler metal 13; 16, and by carrying out all of the above steps, the exposed surface of the upper surface of the ceramic on the joining side and the exposed surfaces of the intermediate metal layer and the buffer metal layer are bonded with a slow oxidizing brazing filler metal. It is characterized by being covered.

In addition, in the ceramic-metal bonded product with high thermal shock resistance according to the present invention, an intermediate metal layer 10 with a thickness of 0.1 to 0.7 mm is formed on the ceramic 2 with a metallized layer 12 interposed therebetween. They are bonded in such a way that the entire outer periphery 10a thereof is inside the entire outer periphery 2a of the ceramics 2, and on this intermediate metal layer 10 there is a layer having a smaller area than this intermediate metal layer 10 and a thickness of 0.5 to 3.
mm thick buffer metal layer 11 is bonded with a slow oxidizing brazing material 13, and a metal 1 is bonded onto this buffer metal layer 11 with a slow oxidizing brazing material 16, and the exposed upper surface of the bonding side of the ceramic, The intermediate metal layer and the exposed surfaces of the buffer metal layer are coated with a slow-oxidizing brazing material.

In the above configuration, the thickness of the intermediate metal layer 10 is
The reason for setting it to 0.1 to 0.7 mm is that if it is less than 0.1 mm, the ability to follow deformation will be too large and stress dispersion will be lost; if it exceeds 0.7 mm,
This is because the ability to follow deformation is lost and the expansion and contraction deformation of itself becomes large.

Furthermore, the reason why the bonding area of the buffer metal layer 11 is made smaller than that of the intermediate metal layer 10 is to prevent large deformation occurring in the metal 1 from being transmitted to the intermediate metal layer 10 and, by extension, to the ceramics 2. The reason for setting 0.5 to 3 mm is that when it becomes less than 0.5 mm, the shear strength decreases rapidly.
This is because if it exceeds this, the thickness of the bonded product will increase unnecessarily and the strength will tend to decrease.

Furthermore, the thickness of the intermediate metal layer 10 is 1 to 1.
The reason why the entire outer periphery 10a is bonded on the ceramic 2 so that it is inside the entire outer periphery 2a of the ceramic 2 by 5 times the dimension is that if it is less than 1 time, the Fillet 15 will not be formed.
When it exceeds double, the end of Fillet 15 becomes ceramic 2.
This is because it does not reach the vicinity of the outer peripheral edge 2a.

Further, the metallized layer 12 was formed on the ceramics 2 because the wettability of the brazing material to the ceramics 2 is very poor, and the Fillet 15 can be easily formed only by forming the metallized layer 12. Because it will be.

Further, in the intermediate metal layer bonding process having the above structure, as shown in FIG. Alternatively, the intermediate metal layer 10 may be stacked on the ceramics 2 via a brazing material and heated, thereby forming the metallized layer and bonding the intermediate metal layer in a single heat treatment. To carry out the process all at once, for example, an Ag-Cu-Ti active metal brazing material is used as the brazing material. In addition, if metallized layer formation and bonding are performed separately,
A known method such as metallizing using the Mo/Mn method is used.

Further, in the present invention, the slow oxidizing brazing material refers to a brazing material whose oxidation rate is slower than that of the intermediate metal layer 10 and the buffer metal layer 11, as described above.As such a slow oxidizing brazing material, for example, ,
When the intermediate metal layer 10 and the buffer metal layer 11 are made of copper or nickel, silver, gold, palladium, etc. can be used. When selecting this slow-oxidizing brazing filler metal, it is desirable to use one with high spreadability in consideration of coverage and fillet forming properties.

In addition, in this invention, the slow oxidizing brazing material 13 applied on the intermediate metal layer 10 is the fillet 15 described above.
In order to facilitate the formation of the metal layer 10, it is preferable to coat the metal layer in the same area as the intermediate metal layer 10 or slightly larger than the area.

Further, in the present invention, brazing is performed at 700 to 1250° C. under vacuum or a non-oxidizing atmosphere such as an inert gas, at normal pressure. Also, when forming a metallized layer alone, under a non-oxidizing atmosphere,
It is carried out at 700-1400℃.

In addition, in the bonded product of the present invention, as is clear from the examples shown below, the strength reduction rate in the thermal shock resistance test shows an actual value of about 14% or less. On the other hand, although it generally varies depending on the type of ceramic or metal base material, measurement errors are usually included in the initial bonding strength (mainly shear strength).
A decrease in strength of about 30% is within a practically acceptable range. Therefore, it is judged that the bonded product of the present invention has high practical performance.

Next, the present invention will be explained in more detail with reference to Examples.

"Examples 1 to 4" In the structure shown in FIG. 1, the metal base material 1 is not bonded, that is, the metallized layer 12 is formed on the ceramic 2, and a slow oxidizing brazing filler metal 17 is formed on the metallized layer 12. Bonded products having a structure in which an intermediate metal layer 10 was bonded and a buffer metal layer 11 was further bonded thereon by a slow-oxidizing brazing filler metal 13 were prepared using the materials and dimensions shown below.

(Example 1) Silver on Si ₃ N ₄ ceramics of 30×15×5t (mm)
A mixture of gold and titanium powders was applied and heated under vacuum at 1000°C for 10 minutes to form a 50 μm metallized layer. On top of this, as a slow oxidizing brazing material
BAg-8 (JIS Z3261) powder was applied, and a 29.5 x 14.5 x 0.1 t (mm) Cu plate was placed thereon as an intermediate metal layer, and bonded by heating at 850°C for 10 minutes under vacuum.
Furthermore, BAg-8 powder is applied on the intermediate metal layer, and a buffer metal layer of 10φ×2t (mm) is applied on top of this as a buffer metal layer.
Two Cu disks were placed on top and heated at 850°C for 10 minutes under vacuum to bond them.

The resulting bonded product was subjected to the following thermal shock test. That is, the temperature was raised from room temperature to 350°C at 200°C/min, then held at 350°C for 15 minutes, and then heated at 50°C.
In this test, one cycle consists of lowering the temperature to room temperature at a rate of °C/min and holding it at room temperature for 15 minutes.

As a result, as shown in FIG.
The bonded product has an initial shear strength of 4.20 on average of 10 points.
Kg/mm ² (hereinafter, all strength values are the average value of 10 points), but after 50 cycles, the average was 3.90 Kg/mm ² , and the rate of decrease in heat resistance strength was showed a high performance of about 14% or less.

(Example 2) In Example 1, only the thickness of the intermediate metal layer was changed to 0.2 t (mm), and the other conditions were kept the same to create a bonded product.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in FIG.
The bonded product has an average initial shear strength of 11.40Kg/mm ²
However, after adding 50 cycles, the average
The result was 10.80Kg/mm ² , and the rate of decrease in heat resistance strength was approximately 5% or less, demonstrating high performance.

(Example 3) In Example 1, only the thickness of the intermediate metal layer was changed to 0.7 t (mm), and the other conditions were kept the same to create a bonded product.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in FIG.
The initial shear strength of the jointed products was 8.30 Kg/ ^mm2 on average, but after 50 cycles, the average shear strength decreased.
7.30Kg/mm ² , and the rate of decrease in heat resistance strength is approximately 12
% or less.

(Example 4) Silver on Al ₂ O ₃ ceramics of 30×15×5t (mm)
A mixture of copper and titanium powders was applied and heated under vacuum at 1000°C for 10 minutes to form a 50μm metallized layer. On top of this, as a slow oxidizing brazing material
BAg-8 powder was applied, a 29.5 x 14.5 x 0.2t (mm) Cu plate was placed on top of this as an intermediate metal layer, and under vacuum,
Bonding was performed by heating at 850°C for 10 minutes. Furthermore, BAg-8 powder was applied on the intermediate metal layer, two Cu disks of 10φ x 2t (mm) were placed on top of this as a buffer metal layer, and they were bonded by heating at 850℃ for 10 minutes under vacuum. did.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in FIG.
The initial shear strength of the jointed products was 7.14 Kg/ ^mm2 on average, but after 50 cycles, the average shear strength decreased.
6.80Kg/ ^mm2 , and the rate of decrease in heat resistance strength is approximately 5
% or less.

“Example 5” Silver on Si ₃ N ₄ ceramics of 30×15×5t (mm)
A mixture of copper and titanium powders was applied and heated under vacuum at 1000°C for 10 minutes to form a 50μm metallized layer. On top of this, as a slow oxidizing brazing material
BAg-8 powder was applied, a 29.5 x 14.5 x 0.2t (mm) Cu plate was placed on top of this as an intermediate metal layer, and under vacuum,
Bonding was performed by heating at 850°C for 10 minutes. Furthermore, BAg-8 powder was applied on the intermediate metal layer, and a buffer metal layer of 10φ (mm) was applied on top of this to form a buffer metal layer of 0.5, 1.0,
Two Cu disks of 1.5, 2.0, and 3.0 t (mm) were mounted and bonded by heating at 850°C for 10 minutes under vacuum.

When we measured the shear strength of each bonded product obtained, as shown in Figure 6, it was 8.09Kg/8.09Kg on average for 0.5t.
mm ² , 1.0t average 11.74Kg/mm ² , 1.5t average 11.63
Kg/mm ² , 2.0t average 11.40Kg/mm ² , 3.0t average
The shear strength was 11.20 Kg/mm ² , and the shear strength decreased rapidly below 0.5 t, and the decline in shear strength was gradual even when it exceeded 3.0 t.

“Example 6” Silver on Si ₃ N ₄ ceramics of 30×15×5t (mm)
A mixture of copper and titanium powder is applied, a 29.5 x 14.5 x 0.2t (mm) Cu plate is placed on top of this as an intermediate metal layer, and heated under vacuum at 1000℃ for 10 minutes to form a metallized layer. It was joined to. Furthermore, a mixture of silver and copper powders was applied on the intermediate metal layer, and two Cu disks of 10φ x 2t (mm) were placed on top of this as a buffer metal layer, and the mixture was heated at 850℃ for 10 minutes under vacuum. They were joined by heating.

The obtained bonded product was subjected to the same thermal shock test as described above.

As a result, as shown in FIG.
The bonded product has an average initial shear strength of 10.49Kg/mm ²
However, after 50 cycles, the average value was 9.22Kg/ ^mm2 , and the rate of decrease in heat resistance strength was approximately
It showed a high performance of 12%.

In each of the above embodiments, the metal base material 1 is not bonded, that is, the metallized layer 12 is formed on the ceramic 2, and the intermediate metal layer 10 is formed on this using a slow oxidizing brazing material 17. The strength of the bonded product was measured on a bonded product with a buffer metal layer 11 bonded thereon using a slow-oxidizing brazing filler metal 13, in place of the strength measurement of a finished product with the metal base material 1 bonded. However, as shown in the following reference example, when the temperature is raised and lowered to 350℃,
This is because it has come to be known that a product with a structure in which the metal base material 1 is not bonded is subjected to more severe conditions than a finished product in which the metal base material 1 is bonded.

(Reference example) Figure 8 is 30×15×5t as shown in Figure 9.
A mixture of BAg-8 powder and titanium powder is applied onto Si ₃ N ₄ ceramics 20 (mm), and two Cu disks 21, 21 of 10φ x 2t (mm) are placed on top of this as an intermediate metal layer. Furthermore, BAg-8 powder was applied on top of this, a metal base material (steel material) 22 of 30 x 60 x 5 t (mm) was placed on top of this, and the bonded product was heated under vacuum at 850°C for 10 minutes and bonded. This shows the shear strength as a result of a thermal shock resistance test. As shown in the figure, the initial shear strength of the bonded product was 8.58 Kg/ ^mm2 on average, but after 10 cycles the shear strength was 5.60 Kg/mm2 on average.
Kg/mm ² , average 2.45 after 20 cycles
Kg/ ^mm2 .

On the other hand, when the metal base material 20 is not bonded in the above structure, the change in shear strength was initially 8.58 Kg/ ^mm2 on average, as shown in Figure 10, but when 10 cycles were added, the change in shear strength was Later on the average is 0.76Kg/mm ² , after adding 20 cycles the average is 0.60Kg/mm ² ,
It has been found that the performance test is more severe when the metal base material 20 is not bonded.

This seems to be due to the following reasons. That is, as mentioned earlier, in order to avoid the effects of heat shrinkage of the metal base material (iron), a copper plate is interposed as a metal intermediate layer between the metal base material and ceramics, and the heat shrinkage of the metal base material is prevented. This is alleviated by the use of a copper plate that has high flexibility, malleability, and conformability. This is not because copper has a smaller thermal expansion than iron; on the contrary, copper has a larger thermal expansion, but when joined to iron, iron is rigid, whereas copper is flexible and expandable. Due to its high ductility and conformability,
This is because the thermal contraction is restricted by the iron material and is apparently equivalent to that of the iron material.As a result, the copper plate as the intermediate metal layer exhibits only its flexibility, malleability, and followability, and the iron material This is because it reduces the load on the ceramics. Therefore, if a copper plate is simply bonded onto ceramics as an intermediate metal layer, there is nothing to restrict the thermal shrinkage of the copper plate, and the deformation force caused by the thermal contraction of the copper plate will be transferred directly to the ceramic. Therefore, as shown in the above-mentioned reference example, it is thought that the structure in which the metal base materials are not bonded will be subjected to more severe conditions in the thermal shock test.

"Comparative Example" Next, a comparative example based on the conventional example will be shown to confirm the high performance of the product of the present invention.

(Comparative Example 1) Figure 11 shows the change in shear strength in a thermal shock test of a bonded product that corresponds to the conventional example shown in Figure 14 and has a structure in which the metal base materials are not bonded. is a 13 x 13 x 2 t (mm) Cu plate bonded to a 30 x 15 x 5 t (mm) Si ₃ N ₄ ceramics using a brazing filler metal (BAg-8).

This comparative product has an average initial shear strength of 4.46 kg/
mm ² , but by the 10th cycle the average
It has decreased to 2.58 Kg/mm ² , which shows the high performance of the product of the present invention.

(Comparative Example 2) Figure 12 shows the change in shear strength in a thermal shock test of a bonded product that corresponds to the conventional example shown in Figure 15 and has a structure in which the metal base materials are not bonded. This is a 10φ x 2t (mm) Cu disk bonded to a 30 x 15 x 5t (mm) Si ₃ N ₄ ceramics using a brazing filler metal (BAg-8).

This comparative product has an average initial shear strength of 9.44 kg/
mm ² , but by the 10th cycle the average
It has decreased to 3.63Kg/mm ² , which shows the high performance of the product of the present invention.

"Effects of the Invention" As explained above, according to the present invention, it is possible to easily obtain a ceramic-metal bonded product that has high thermal shock resistance, excellent reliability, and long life.

[Brief explanation of the drawing]

Figures 1 to 7 are for explaining the present invention. Figure 1a is a side sectional view showing an example of a high thermal shock resistant bonded product according to the present invention, and Figure 1b is an enlarged view of the main part of Figure a. Figures 2 to 5 show first to fourth embodiments of the present invention, respectively.
A graph showing changes in shear strength due to thermal shock tests of each obtained bonded product. Figure 6 shows the fifth example, and is a graph showing changes in shear strength when the thickness of the buffer metal layer is changed. , Fig. 7 shows the sixth example, and is a graph showing the change in shear strength of the obtained bonded product due to thermal shock tests, and Figs. This is a reference example showing that the thermal shock test is more severe than the test on the finished joined product where the metal base material is joined.
Figure 8 is a graph showing changes in shear strength of the finished joined product, Figure 9 is a perspective view showing the configuration of the completed joined product used in Figure 8, and Figure 10 is the shear strength of the joined product without the metal base material. Graphs showing changes, Figures 11 to 16 are for explaining conventional bonded products, Figures 11 and 12 are graphs showing changes in shear strength due to thermal shock, and Figure 13 is for conventional bonded products. A side configuration diagram showing an example of FIG. 14 is FIG. 13A-
FIG. 15 is a sectional view taken along line A, FIG. 15 is a plan view of the main part of another conventional example, and FIG. 16 is a side view of the main part of the same conventional example. 1...metal base material, 2...ceramics, 2a...
...Outer periphery of ceramics, 10...Intermediate metal layer,
10a... Outer periphery of intermediate metal layer, 11... Buffer metal layer, 12... Metallized layer, 13, 16, 17
...Slow oxidizing brazing filler metal, 14...Step part, 15...
Fillet.

Claims (1)

[Scope of Claims] 1 (a) A metallized layer is formed on the ceramic, and an intermediate metal layer with a thickness of 0.1 to 0.7 mm is formed on the metallized layer by a dimension of 1 to 5 times the thickness, so that the entire outer periphery of the metallized layer is formed on the ceramic. (b) Slow oxidation of a buffer metal layer having a smaller area than this intermediate metal layer and a thickness of 0.5 to 3 mm on the intermediate metal layer. (c) a metal bonding step of bonding metal onto the buffer metal layer using a slow-oxidizing brazing material, and by carrying out all of the above steps. A method for bonding ceramics and metal with high thermal shock resistance, characterized in that the exposed upper surface of the ceramic and the exposed surfaces of the intermediate metal layer and the buffer metal layer are coated with a slow-oxidizing brazing material. 2. The intermediate metal layer bonding process is performed by forming a metallized layer on the ceramic and then bonding the intermediate metal layer using a slow oxidizing brazing filler metal. A high thermal shock resistant bonding method. 3. A patent claim characterized in that in the intermediate metal layer bonding process, the intermediate metal layer is stacked on the ceramics via a brazing material, and this is heated to perform bonding of the metallized layer and the intermediate metal layer in a single heat treatment. A method for bonding ceramics and metal with high thermal shock resistance according to item 1. 4 An intermediate metal layer with a thickness of 0.1 to 0.7 mm is placed on the ceramic through a metallized layer.
It is bonded so that its entire outer periphery is inside the entire outer periphery of the ceramic by 5 times the dimension, and on this intermediate metal layer, a buffer metal layer having a smaller area than this intermediate metal layer and a thickness of 0.5 to 3 mm is provided. A metal is bonded to the buffer metal layer using a slow oxidizing brazing material, and the exposed surface of the upper surface of the ceramic on the bonding side and the exposed surfaces of the intermediate metal layer and the buffer metal layer A highly heat-resistant bonding product between ceramics and metal, which is characterized by being coated with a slow-oxidizing brazing filler metal.