JPH047552B2 - - Google Patents

Description

[Detailed description of the invention]

[Field of Application of the Invention] The present invention relates to a novel connector, and particularly to a multi-pin electrical connector suitable for mounting semiconductor devices (LSI). [Background of the Invention] Pin connectors consist of pins, sockets into which they are inserted, and parts that package them, and are widely used as electrical and electronic connecting parts. Furthermore, as computers become more densely packed, the importance of these connectors as one of the mounting techniques is being reconfirmed. An example of the shape of the pin and socket portion of a conventional pin connector is shown in FIG. The socket part 2 is mostly made of a spring material mainly made of Cu-Be alloy, and has a structure in which the inserted pin 1 is connected by the spring force of the socket part 2. Both socket parts 2 are arranged parallel to the pin insertion direction, and the pin 1 is connected to its spring material (or cylinder).
It has a structure that is sandwiched between the two. recent years,
As electrical and electronic components become more highly integrated and computers become more densely packed, there is a growing demand for these connectors to be more compact and micronized.
In order to meet these requirements, conventional socket shapes require a certain amount of height along the pin insertion direction, which increases the wall thickness of the socket package, which poses a major problem in making it more compact. Furthermore, since the shape of the socket is complex, it is difficult to process it when micronizing the connector, so it is necessary to simplify the shape. On the other hand, as the density of computers increases, the number of pins in connectors increases. In other words, as the number of pins inserted at once increases, the force required to join the connectors increases rapidly, and as the number of pins increases, it becomes impossible to join the connectors using human force using conventional spring-forced connectors. It is expected that Therefore, efforts are being made to develop low-insertion-force or zero-insertion-force connectors that require less force when inserting or removing pins and can provide reliable connections when joining. Japanese Patent Application Laid-Open No. 57-185680 discloses a device in which a hole is provided in the center of a spring member on a flat plate, and a male contact is inserted into the hole. However, this one is very difficult to remove. JP-A-58-71572 and JP-A-58-73973 disclose electrical connectors for Josephson element semiconductor devices that operate at extremely low temperatures due to the deformation of bimetals due to temperature changes. However, these bimetallic electrical connectors cannot be made large in size unless they have a predetermined size, so they cannot be made smaller. The electrical connector in which the socket shown in Figure 1a is made of a shape memory alloy is used in the Metal Handbook (revised 4th edition, December 1982).
However, this method does not allow miniaturization. [Object of the Invention] An object of the present invention is to provide a connector that can be inserted with low insertion force and that can be made compact. [Summary of the Invention] (Summary of the Invention) The present invention relates to a connector having a female contact and a male contact inserted into the female contact, wherein the female contact has a hole into which the male contact is inserted. The female contact is made of a shape memory alloy having a plurality of tongues extending toward the center of the hole. The connector of the present invention is characterized in that the tongue portion made of a shape memory alloy memorizes its shape so as to apply pressure to the male contact at a temperature equal to or higher than the transformation temperature of the shape memory alloy, and at least one tongue portion The distance between the tongue and at least one opposing tongue is smaller than the length of the male contact in the longitudinal cross section, and the plurality of tongues recovers the shape memory of the tongue after the male contact is inserted. It is characterized by being electrically and mechanically connected to a male contact. As shape memory alloy, Al0~10%, Zn10~40%
Cu alloy containing Sn23~26%, Al12
~15%, Cu alloy containing 3~5% Ni, 42~48% Ti
An alloy consisting of Ni and the balance Ni is generally known.
Other Fe-Mn series, Fe-Cr-Ni series, U-Mo series,
Mn-Cu type, Au-Cd type, etc. can be used. The table shows Cu-Al-Ni alloy and Ni-Ti alloy as an example.
The composition (wt%) and properties of the alloy are shown. These temperature cycles are important because these alloys can be shape memorized to a final shape at temperatures below the Mf point and a final shape at temperatures above the Af point.

[Embodiments of the invention]

Embodiment 1 FIG. 2 is a sectional view of the electrical connector of the present invention. This electrical connector has a simplified structure in the insertion direction 4 of the pin 1 (thickness direction of the female contact 2) as a male contact in the form of a flat plate, and is easy to process and mold when making it compact and micro. It is characterized in that a female contact 2 in the form of a thin plate or film is disposed in the pin insertion hole 6 of the insulating substrate 3 at right angles to the pin insertion direction 4. This female contact 2 is made of a shape memory alloy. The pin 1 is pushed into a slit-like gap formed in the female contact for pin joining formed on the pin insertion hole 6. The shape of the pin is memorized so that the joining force of the pin is exerted by the spring force at a temperature higher than the matrix transformation temperature or lower than the martensitic transformation temperature. The female contactor 2 is fixed to the pin insertion hole 6 of the substrate 3 by adhesive or other method. This structure allows the thickness in the wall direction to be made thinner than the conventional one, and is effective in making the connector more compact. Furthermore, since the female contact 2 with this structure is provided flatly on the substrate, it can be manufactured by direct molding from a gas phase or liquid phase such as PVD method (vapor deposition, sputtering method, etc.), CVD method, molten metal quenching method, thermal spraying, etc. And it can be integrally molded onto a substrate. It is possible to bond or form a thin plate or film to serve as a female contact and integrally mold this into a predetermined shape by photolithography, chemical etching, or the like. The above-mentioned advantages are very effective in micro-fabrication of connectors because it is possible to mold a multi-pin joint part at one time in a multi-pin connector, and microfabrication is easy. In the connector structure of the present invention, when a shape memory alloy with thermoelastic martensitic transformation is applied to the female contact, the following effects can be obtained. Shape memory alloys are generally Cu-Al-Zn, Cu-Al-Ni and Ti.
-Ni alloys are known, but these are all materials that are difficult to process by rolling or forming. FIGS. 3 and 4 are cross-sectional views showing the process of joining a connector in which a shape memory alloy is formed on an insulating substrate 3. FIG. It is known that there are several types of shape memory effects, and FIG. 3 uses a one-way shape memory effect, and FIG. 4 uses a two-way shape memory effect. In either case, a shape memory alloy whose martensitic transformation temperature is lower than the operating temperature of the connector (generally room temperature) is used. Fig. 3a shows a female contact 2 made of a shape memory alloy whose operating temperature and flat state have been memorized, and Fig. 3b shows a state where it has been lowered to below the martensitic transformation temperature. In this state, the alloy undergoes martensitic transformation, and although the shape does not change accordingly, it becomes very soft. Pin 1 is inserted in this soft state at c, and when the temperature is returned to operating temperature at d, the martensite returns to its original matrix and the alloy hardens accordingly, returning to its original shape (state A) due to the shape memory effect. There is a force trying to return.
Accordingly, a large bonding force is applied to the inserted pin 1. From these results, it is possible to realize a low insertion force pin connector by using the shape memory effect. FIG. 4 shows a state in which reversible shape memory occurs due to transformation in the a and b states. At the operating temperature of the connector, the shape is memorized so that it becomes state a, and then below the martensitic transformation temperature, it becomes state b.
The shape is memorized so that it becomes the state of . When cooled to the martensitic transformation temperature, the pin insertion hole 5' is particularly formed into a slit shape due to the shape memory effect.
A gap opens. When a pin is inserted there as shown in c, and the temperature is returned to the operating temperature state as shown in d, the alloy returns to its matrix state due to the shape memory effect, becomes hard, and returns to state a, so that the female contact and pin Bonding force is applied. When this is cooled again to a state below the martensitic transformation temperature as shown in e, the pin insertion hole opens and the pin can be easily removed. By applying the two-way shape memory effect to the connector structure of the present invention in this way, an electrical connector with almost zero insertion/extraction force can be realized. As mentioned above, shape memory alloys are difficult to process, so even if an attempt is made to micronize a conventional socket shape, the shape is complicated and processing is difficult. In comparison, since the structure of the present invention is simple, shape memory alloys can be easily applied to such difficult-to-process materials, which is a great advantage of the present invention. Example 2 In this example, processing of the shape of the female contactor was investigated. For the female contact, a spring material (JISC1700) made of a Cu-Be alloy with a plate thickness of 0.08 mm, and a Cu-Al-Ni type and Ni-based shape memory alloy shown in the table above are used as the shape memory alloy.
A quenched Ti-based alloy molten ribbon material was used. This quenching material was produced using a twin-roll type quenching device, and was a thin plate with a thickness of 0.06 to 0.09 mm and a width of 5 to 10 mm. The manufacturing conditions were as follows: A quartz nozzle with a round hole of 0.8 to 1.0 mmφ was used as the nozzle, and high pressure Ar gas (pressure 1.0 to
The molten metal was jetted out at a rate of 1.5 kg/cm ² ) and rapidly solidified.
The properties in the table were measured at room temperature. FIG. 5 is a plan view showing four types of planar shapes in which the outer shape of the female contact 2 is machined into a circular shape using the thin alloy plate. A and b are cases where the cross section of the male contact is circular, and c and d are cases where the cross section is rectangular. For these processes, we tried electrical discharge machining using a wire, chemical etching, and punching. In electrical discharge machining using wires, the holes through which the wires will be passed are first drilled. It was possible to process the drill diameter down to a minimum diameter of 0.1 mm. The wire used was a copper wire with a minimum diameter of 0.1 mm or a tungsten wire with a diameter of 0.05 mm. As a result, the width of the slit 7 could be up to 0.1 mm. In addition, in chemical etching, a slit shape printed on a photographic film is layered with a photocurable resin on a ribbon and cured, and only the resin on the surface of the slit portion after exposure is used to clean it. As a result, only the slit portion is not covered with the resin. As a result of etching this by immersing it in a ferric chloride solution,
It was possible to process the width of slit 7 to 0.1 mm.
The punching was performed using an SKD11 die steel mold with zero clearance. Even with this method, it was possible to process the slit width to a minimum of 0.1 mm. A pin was inserted into the thus processed female contact to evaluate the bonding force. The female contact shape is shown in Figure 5 a and b.
In the case of c and d, one side of the rectangle is 3 mm and the width of the slit 7 is 0.2 mm. , the length of the central slit 7
1.5mm). As for the pin shape, a rod shape with a diameter of 0.8 mm was used for the former female contacts a and b, and a rectangular rod shape with a diameter of 0.4 mm x 1 mm was used for the latter female contacts c and d. The female contact was shaped so that it would be flat in the operating state, and the pin was inserted into liquid nitrogen. Note that the above-mentioned Cu-14%Al-4%Ni alloy thin plate was slit and deformed in liquid nitrogen, and then the shape recovery due to the shape memory effect as the temperature rose was continuously observed using an optical microscope. When it was deformed into the open state as shown in Figure 4b in liquid nitrogen using a pin with a diameter of 1.5 mm, and then returned to room temperature, the shape at room temperature was almost completely restored to its original shape. When joined under the above conditions, the pulling force was 200 g for a and b, and 150 g for c and d.
There was no significant difference in this force depending on the material. Also, the contact resistance at the pin contact part is 10mΩ
That's all. FIG. 6 is a plan view showing the planar shape of a slit designed to facilitate removal of the pin connector after joining. a is the three slits 7 in Fig. 5b
The fan-shaped slits 7 and b are the fifth
This is the shape of the rectangle in Figure c, with the lower half removed.
Insert the pin into the shaded area 8 in the figure, and when removing it, slide it in the direction of the arrow to release it from the bonded state and then pull it out. FIG. 7 shows the shape of b in three dimensions. The sliding force is about 1/10 of the bonding force, and it can be easily pulled out. In addition, when a shape memory alloy was slid under liquid nitrogen temperature, it was possible to slide with about 1/50th the force because the material is soft. An attempt was made to insert and remove a pin using the two-way shape memory effect when a shape memory alloy was applied to the female contact. The slit shapes are shown in Figures 5a and 5c. In order to memorize the shape in two directions, first 2 mmφ or 1.2
A 1mm rectangular pin is inserted under liquid nitrogen temperature and subjected to strong machining. This was repeated 2 to 3 times to memorize the shape. When a pin under the above conditions was inserted into this female contact, the force required for insertion and removal was zero because a gap was created between the pin and the joint. It was found that the connector can withstand up to 150 g of pull-out force during bonding, confirming that a low-insertion-force connector can be obtained. Example 3 In this example, a method of fixing the female contact fabricated in Example 2 to a substrate having a pin insertion hole was investigated. The material of the female contact is the same as in Example 2 above.
, and glass epoxy resin, epoxy resin, and alumina plate were used as the substrate materials. The former uses a general drill to process holes in these boards.
The latter were each performed with a CO ₂ laser. First, we investigated a fixing method using adhesive. FIG. 8 is a sectional view of a female contact with a different adhesive method. A is a method of simply fixing onto the substrate with an adhesive 9.
Generally, any adhesive can be used as long as it has sufficient bonding strength, but when a shape memory alloy is used, it must be able to withstand thermal cycles from room temperature to liquid nitrogen.
Therefore, ordinary organic adhesives cannot withstand this cycle. Inorganic adhesives made of alumina or zirconia and water glass can withstand this. Furthermore, by sufficiently drying the silver paste, sufficient adhesion strength was obtained with a peel strength of approximately 150 g. If the substrate is alumina, at 500-600℃
After firing for 1 hour, the adhesive strength increases by about 50%. FIG. 8b shows a method in which, when the substrate is ceramic, a plating layer 10 is provided on the substrate after metallization and then bonded with a brazing filler metal 11 as an adhesive that can withstand thermal cycles. In this example, metallization was performed at 1100° C. for 1 hour using Mo-Mn paste, Ni plating was applied, and then bonding was performed using silver solder. Good adhesion with a peel strength of 300 g or more was obtained for all alloys. Using such brazing adhesion and the chemical etching described in the above embodiment, an attempt was made to directly mold a female contact into a hole on a substrate having a hole for inserting a pin. Indium solder, silver solder, lead solder, etc. are used as the brazing material. A perspective view showing the process is shown in FIG. A shows an alumina substrate 3 with a hole 6, and a Cu-14 plate with a weight that will become a female contact as shown in b is placed on top of the alumina substrate 3.
A thin plate 12 of %Al-4%Ni alloy was bonded by the brazing described above, and this was etched by the chemical etching described above, leaving a portion that would become a female contact around the hole, as shown in c. In this state, the masking was further changed, and the pin joint slit was etched and molded. It has been found that since this process is possible, it is possible to manufacture a large number of female contacts corresponding to a large number of pins at once. As another example of the fixing method, we considered a method in which the female contact is sandwiched between two substrates, as shown in FIG. A is for the upper and lower boards with the same pin insertion hole diameter, b is for the upper and lower holes that are slightly larger than the pin diameter and serves as a guide for the pin, and c is for the lower board to completely fit the upper and lower boards. A groove is formed in the substrate, and a female contact is placed in the groove. These methods have a slightly more complicated structure than the adhesive method described above, but the reliability of the fixing strength is high. In addition, by simply adhering it and then sandwiching it between the substrates from above as shown in Figure 8a, it was possible to achieve fixing that could withstand thermal cycles. A perspective view of a pin connector to which this fixing method is applied is shown in FIGS. 11 and 12.
FIG. 11 shows the method shown in FIG. 10b, and FIG. 12 shows the method shown in FIG. 10c, in which the number of pins is 30 and the pitch between the pins is 2 inches. The pin has a round shape with a diameter of 0.8 mm, and the slit shape of the female contact has a length of 3 mm, as shown in Figure 5b. The substrate is acrylic resin. Figure 11 shows the board fixed with screws 18, and Figure 12 shows the upper board 15 inserted into both ends of the lower board 17, provided with guide grooves 16 for fixing, and horizontally moved the upper board as shown by the arrow. It has a structure that looks like it's inserted from the inside. In the case of Fig. 11, it is necessary to fix the female contact on the lower board with simple adhesive to fix the position, but in the case of Fig. 12, the position can be fixed simply by placing it in the groove on the lower board. Therefore, there is an advantage that even if there is a problem such as damage to a joint with only one pin, it can be replaced immediately. Example 4 A Cu-Ni-Al shape memory alloy was sputtered onto an insulating substrate having various pin insertion holes.
Cu and Al foils were placed and laminated on top of them.
Alloy composition: Cu-4%Ni-14%Al (weight)
Oxygen-free copper (JIS class 1), electrolytic Ni (purity 99.5%)
and Al (purity 99.8%) in vacuum (10 ^-5 ~
High frequency melting of 2.5 kg per charge at 10 ^-4 Torr)
This was cast into a mold with a diameter of 95 mm. A disk having a diameter of 90 mm and a thickness of 5 mm was machined from the obtained ingot and used as a sputtering target.
A two-pole DC-magnetron type sputtering device was used. After creating a vacuum of 3 × 10 ^-7 Torr in the chamber of the device, Ar was introduced to a pressure of 30 μmHg, and Cu foil and Al foil (both The film was deposited on one side with a thickness of 20 μm). The dependence of the sputtered film thickness on the sputtering time when deposited on these substrates increases almost linearly with time, with a thickness of 50μ in 4.5h.
The aluminum foil could be laminated up to nearly m, and the laminated state adhered well to the Al foil. A film with almost the same time dependence of sputtered film thickness and high adhesion was also obtained on Cu foil. The martensitic transformation initiation temperature (Ms) of these sputtered films was -123°C as a result of four-terminal electrical resistance measurement. Therefore, this shape memory alloy exhibits a significant shape memory effect between liquid nitrogen and room temperature, and can be used for members that operate between these temperatures. When the rapidly cooled structure was observed with a scanning electron microscope, a fine crystal layer with a diameter of about 2 to 3 μm was formed on the surface, and the bending ductility was improved because stress concentration at the grain boundaries was alleviated due to bending deformation. A female contact was manufactured using the substrate on which the shape memory alloy was deposited on the Al and Cu foils in the chemical etching process shown in FIG. Thickness 50μm
A good shape memory effect was observed by laminating shape memory alloys with a thickness of approximately 2 μm or more in a composite with Al foil, and approximately 4 μm or more in a composite with Cu foil. was formed. In this embodiment, the outer diameter is 1 mm, and the diameter of the central hole 5 is
A 0.5 mm, slit 7 length of 3 mm and width of 0.2 mm was manufactured by chemical etching. A pin with a diameter of 0.8 mm is inserted into this material in liquid nitrogen, and the central hole 5 is bent to make it larger.
Next, the temperature was returned to room temperature, and it was confirmed that the contact portion of the female contact returned to its original flat state. Next, I put this thing in liquid nitrogen again and inserted the pin in the same way, but it was inserted without any resistance, and I brought it back to room temperature.
Its withdrawal force is approximately 100 g, resulting in a zero insertion force connector. Example 5 This example shows an example in which a pin as a male contact was manufactured from a shape memory alloy. As a shape memory alloy, the diameter of the molten Cu-Al-Ni alloy shown in the table above is
High-pressure Ar applied to the surface of a 120mm Be-containing Cu-based alloy roll.
The gas is injected from a quartz nozzle to a diameter of approx.
A thin wire of 0.5 mm was rapidly solidified and manufactured. The characteristics of this thin wire are almost the same as those shown in the table above. Using this thin wire, a pin having the shape shown in FIG. 1a was plastically worked at a temperature higher than the matrix transformation temperature to bend the contact portion with the female contact into a "dog" shape. This material was then plastically worked in liquid nitrogen so that the contact area was straight. The pin thus obtained was inserted into the female contact shown in FIG. It was confirmed that the pin and the female contact were electrically connected to each other. The pull-out force of this product was smaller than that of a female contact using a shape memory alloy. In addition, when inserting in liquid nitrogen, even if it cannot be deformed straight in advance, it is in a soft martensitic state, so insertion can be performed with low insertion force. Example 6 This example shows an example applied to LSI implementation. 1st
FIG. 3 is a perspective view of a printed circuit board 22 on which LSI packages 19, 19' using the electrical connector of the present invention are mounted. The LSIs 19, 19' are soldered to a ceramic multilayer printed circuit board 20 and further connected to a connector 21 of the present invention. The connector of the present invention has solder 2 on the printed circuit board 22.
5. FIG. 14 is a cross-sectional configuration diagram in which a connector of the present invention is placed on a printed circuit board 22, and a multilayer printed wiring board 20 is placed on the connector. The connector of the present invention has pin 1' of the ceramic insulating substrate 15.
A conductive film 23 is provided in the insertion hole 6 to electrically connect the female contact 2 and the pin 1'' inserted into the printed circuit board 22, and the female contact 2 made of a shape memory alloy is placed on top of the conductive film 23. It is fixed by an upper ceramic insulating substrate 14.The female contact 2 of the present invention is formed into a thin film by quenching a molten metal, vapor deposition, sputtering, etc. as described above, and the thin film is attached to an insulating substrate. , which is etched into a predetermined shape as described above. Fig. 15 shows an example in which a female contactor 2 of the present invention is formed on a printed circuit board 22 and a multilayer printed wiring board 20 is placed on it. It is a sectional view.Wiring is formed on the printed circuit board 22 by a normal method, and the female contact 2 made of a shape memory alloy is formed in the insertion hole of the pin 1' in the same manner as described above.Wiring. membrane 24
and the female contactor 2 are joined with conductive paste or the like. The female contact 2 is coated with resin as shown at 26. In both FIGS. 14A and 14B, the pin 1' can be inserted with a low insertion force if it is in a soft martensite state. In FIGS. 14 and 15, in order to form the female contact 2 in a vapor phase such as sputtering or vapor deposition, it is necessary to close the pin insertion hole, so a metal foil film is placed on the insulating substrate 3 or printed circuit board. 22, a shape memory alloy is formed thereon, and etched into the desired shape. FIG. 16 is a sectional view showing another example of the electrical connector of the present invention similarly applied to LSI mounting. It has a structure in which female contacts 2 and 2' made of a shape memory alloy are provided on both sides of an insulating substrate 3. The female contacts 2 and 2' are provided with a conductive film 23 so as to be electrically connected to each other, and the female contacts 2 are provided with a multilayer printed wiring board 2.
Pins 1 provided on the printed circuit board 22 are inserted into pins 0 and 2'. The thin film constituting the female contact can be manufactured by various methods as described above, but
Forming the shape memory alloy in a gas phase such as sputtering or vapor deposition can be done by closing the pin insertion hole with metal foil in the same manner as described above. According to this example, a soft martensitic state,
Alternatively, the hole space of the female contact can be memorized at low temperatures so that the space in the hole widens, allowing insertion with low insertion force, and can be manufactured using etching technology, making micronization possible, and production by integral molding. An electrical connector with high performance can be obtained. FIG. 17 is a sectional view showing an LSI mounting structure in which a multilayer printed wiring board 20 is provided with a connector 2 using the shape memory alloy of the present invention. Multilayer printed wiring board 2
The thin film connector 2 to 0 was manufactured in the same manner as described above using a thin ribbon made of a shape memory alloy by rapidly cooling a molten metal, or by a method of forming it in a gas phase such as vapor deposition or sputtering. A thin film can be formed directly on a multilayer printed wiring board by making it conductive, and can be formed into a desired shape using an etching technique. Effects of the Invention According to the present invention, it is possible to manufacture an electrical connector that can be inserted with low insertion force, can be made microscopic and compact, and can be integrally molded.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a pin (male contact) and female contact (socket) of a conventional pin connector, Fig. 2 is a sectional view showing the connection state of the connector of the present invention, and Fig. 3 is a one-way shape memory FIG. 4 is a cross-sectional view showing the connection state of the pin connector of the present invention that utilizes the two-way shape memory effect, and FIG. 5 is the female contact of the present invention. FIG. 6 is a plan view of a female contact showing another example of the present invention and a plan view showing the state of insertion or removal of a male contact, and FIG. 7 is a plan view of the female contact shown in FIG. 6b. and a perspective view showing the state when inserting and removing the male contact;
Fig. 8 shows a connector part showing another example of the present invention in which a female contact is formed on an insulating substrate, and Fig. 9 shows a manufacturing process for integrally molding the female contact of the present invention by adhesion and chemical etching. FIG. 10 is a sectional view of a connector component of the present invention in which a female contact is sandwiched between insulating substrates, and FIGS.
FIG. 13 is a perspective view showing an LSI mounting using the connector of the present invention, and FIGS. This is a cross section to which the connector is applied. 1, 1', 1, 1''''...Male contact (pin),
2, 2'... female contact, 3, 14... insulating board,
5...Male contact (pin) insertion hole, 7...Slit, 9...Adhesive, 10...Metallized layer, plating layer, 11...Solder, 12...Thin film of shape memory alloy, 19, 19'...Semiconductor device (LSI), 20
...Multilayer printed wiring board, 21...Connector, 22
... Printed circuit board, 23, 24 ... Conductive film, 25 ... Solder, 26 ... Protective film.

Claims (1)

[Scope of Claims] 1. A connector having a female contact and a male contact inserted into the female contact, the female contact comprising:
It is made of a shape memory alloy that has a hole into which the male contact is inserted and has a plurality of tongues extending toward the center of the hole, and the tongues made of the shape memory alloy have a temperature higher than the transformation temperature of the shape memory alloy. The shape of the male contact is memorized so as to apply pressure to the male contact, and the distance between at least one tongue and at least one tongue opposing this tongue is the length of the male contact in a longitudinal cross section. A connector characterized in that the plurality of tongues recovers the shape memory of the tongues after the male contact is inserted, and is electrically and mechanically connected to the male contact. 2. The connector according to claim 1, wherein the hole portion is an H-shaped slit formed in the female contact. 3. The connector according to claim 1, wherein the female contact is formed on a substrate.