JPH0481287B2 - - Google Patents
Info
- Publication number
- JPH0481287B2 JPH0481287B2 JP7865386A JP7865386A JPH0481287B2 JP H0481287 B2 JPH0481287 B2 JP H0481287B2 JP 7865386 A JP7865386 A JP 7865386A JP 7865386 A JP7865386 A JP 7865386A JP H0481287 B2 JPH0481287 B2 JP H0481287B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- alloy
- layer
- palladium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229910000929 Ru alloy Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- OYJSZRRJQJAOFK-UHFFFAOYSA-N palladium ruthenium Chemical compound [Ru].[Pd] OYJSZRRJQJAOFK-UHFFFAOYSA-N 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 16
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ASMQPJTXPYCZBL-UHFFFAOYSA-N [O-2].[Cd+2].[Ag+] Chemical compound [O-2].[Cd+2].[Ag+] ASMQPJTXPYCZBL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Contacts (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電流回路を断続する継電器の接点に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to contacts of a relay that connects and disconnects a current circuit.
従来、この種の継電器に用いられる接点は、第
３図に示すように、金を含む合金（厚さ10μ）１
の第１層と銀・パラジウム合金２（厚さ100μ）
の第２層と接点ばね４との溶接性を高めるための
銅ニツケル合金３（厚さ100μ）の第３層とから
構成された接点を２つ対向させてこれら接点の接
触または開離により負荷回路を構成している。
Conventionally, the contacts used in this type of relay are made of a gold-containing alloy (thickness: 10μ), as shown in Figure 3.
1st layer and silver/palladium alloy 2 (thickness 100μ)
and a third layer of copper-nickel alloy 3 (thickness 100μ) to improve weldability between the contact spring 4 and the contact spring 4. Two contacts are placed facing each other, and the load is applied by contacting or separating these contacts. It constitutes a circuit.
しかしながら、この構成の接点は、0.1A〜2A
程度の直流負荷を開閉した場合、一方に突起、他
方に穴が形成されてこれら突起と穴が引掛かり、
接点の開離不良を起こすという問題点がある。ま
た、大電流開閉用として、銀ニツケル無垢よりな
る接点や銀酸化カドニウム無垢よりなる接点が公
知であるが、これらのように、表層に金を含む合
金を有しない接点は５〜10グラム程度の接触力で
は安定な接触抵抗が得られないという問題点があ
る。
However, the contacts in this configuration are 0.1A to 2A
When a DC load of about
There is a problem in that contact opening failure occurs. In addition, contacts made of solid silver nickel and solid silver cadmium oxide are known for switching large currents, but these contacts, which do not have an alloy containing gold on the surface layer, weigh about 5 to 10 grams. There is a problem that stable contact resistance cannot be obtained using contact force.
本発明の継電器の接点は、パラジウム・ルテニ
ウム合金から形成される第１層を有する第１の接
点と、純金または金を含む合金から形成される第
１層とニツケルおよびパラジウムのいずれか一方
と銀との合金から形成される第２層とを含み前記
第１の接点に対向する第２の接点とを有すること
を特徴とする。
The contact of the relay of the present invention includes a first contact having a first layer made of a palladium-ruthenium alloy, a first layer made of pure gold or an alloy containing gold, one of nickel and palladium, and a first layer made of a palladium-ruthenium alloy. and a second contact opposite to the first contact.
次に、本発明について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第１図を参照すると、本発明の一実施例におけ
る第１の接点１０（アノード側）はパラジウム
（90％）・ルテニウム（10％）合金５の第１層（厚
さ100μ）と接点ばね４溶解用のベース部材の
銅・ニツケル合金３の第２層（厚さ100μ）から
構成されている。この接点１０に対向する第２の
接点２０（カソード側）は純金６の第１層（厚さ
10μ）と銀（90％）・ニツケル（10％）合金７の
第２層（厚さ100μ）と接点ばね４溶接用のベー
ス部材の銅・ニツケル合金３の第３層（厚さ
100μ）から構成されている。 Referring to FIG. 1, in one embodiment of the present invention, a first contact 10 (anode side) includes a first layer (thickness 100μ) of a palladium (90%)/ruthenium (10%) alloy 5 and a contact spring 4. It consists of a second layer (thickness 100μ) of copper-nickel alloy 3, which is a base member for melting. A second contact 20 (cathode side) opposite to this contact 10 has a first layer of pure gold 6 (thickness
10μ), a second layer (thickness 100μ) of silver (90%)/nickel (10%) alloy 7, and a third layer (thickness 100μ) of copper/nickel alloy 3 of the base member for welding contact spring 4.
100μ).
通常、この種の継電器に用いられる直流負荷は
10V〜100Vの範囲が多く、この場合アークのエ
ネルギーによつてアノード側の第１の接点１０か
らカソード側の第２の接点２０へ金属は転移す
る。本実施例においては、転移側（すなわちアノ
ード側）接点に融点が高く硬度も高いパラジウ
ム・ルテニウム合金５を用いているため、接点の
消耗は平坦にしか起こらない。また消耗量も銀・
ニツケル合金などに比べて極端に少なくなる。こ
の結果、従来構造のような穴と突起による開離不
良はほとんど起こらない。第１図では、前記パラ
ジウム・ルテニウム合金５の厚さを100μと説明
したが、負荷によつては約30μでも充分使用でき
る。また、前記第２の接点２０の第１層に金を使
用しているので、低接点負荷のみならず高接点負
荷においても安定な接触抵抗が得られる。 Normally, the DC load used in this type of relay is
The voltage is often in the range of 10V to 100V, and in this case, the metal is transferred from the first contact 10 on the anode side to the second contact 20 on the cathode side due to the energy of the arc. In this embodiment, since the palladium-ruthenium alloy 5 having a high melting point and high hardness is used for the transition side (ie, anode side) contact, the wear of the contact occurs only evenly. Also, the amount of consumption is silver/
This is extremely low compared to nickel alloys, etc. As a result, separation defects due to holes and protrusions that occur in conventional structures hardly occur. In FIG. 1, the thickness of the palladium-ruthenium alloy 5 is explained to be 100μ, but depending on the load, a thickness of about 30μ may be sufficient. Furthermore, since gold is used for the first layer of the second contact 20, stable contact resistance can be obtained not only under low contact loads but also under high contact loads.
第１図に示した本実施例と第３図に示した従来
接点とを電圧96V、抵抗負荷700Ω、周囲温度50
℃の条件で試験し、動作回数一累積不良率特性を
得た。第２図に示すように、本実施例は従来接点
と比較して寿命が５倍程度延びていることがわか
る。 The present embodiment shown in Fig. 1 and the conventional contact shown in Fig. 3 were connected at a voltage of 96V, a resistive load of 700Ω, and an ambient temperature of 50°C.
The test was conducted under the conditions of ℃, and the characteristics of the number of operations and cumulative failure rate were obtained. As shown in FIG. 2, it can be seen that the life of this example is approximately five times longer than that of the conventional contact.
なお、前記第２の接点２０において、第１層に
金（90％）・銀（10％）合金を、第２層に銀（40
％）パラジウム（60％）合金をそれぞれ使用して
も同様の効果を達成できる。 In addition, in the second contact 20, the first layer is made of gold (90%)/silver (10%) alloy, and the second layer is made of silver (40%).
%) palladium (60%) alloy can be used to achieve a similar effect.
以上説明したように、本発明には、第１層にパ
ラジウム・ルテニウム合金を用いた第１の接点と
第１層に純金または金合金を用い第２層に銀合金
を用いた第２の接点とで対向接点を構成すること
により、高接点負荷における解離不良発生率を飛
躍的に低下させるとともに、低接点負荷における
接触抵抗の安定性を確保できるという効果があ
る。
As explained above, the present invention includes a first contact using a palladium-ruthenium alloy for the first layer, and a second contact using pure gold or a gold alloy for the first layer and a silver alloy for the second layer. By configuring the opposing contacts with these, it is possible to dramatically reduce the occurrence rate of defective dissociation under high contact loads, and to ensure the stability of contact resistance under low contact loads.
第１図は本発明の一実施例の断面図、第２図は
本実施例と従来接点の動作回数一累積不良率特
性、および第３図は従来の接点の断面図である。
１０……第１の接点、２０……第２の接点、３
……銅・ニツケル合金、４……接点ばね、５……
パラジウム・ルテニウム合金、６……純金、７…
…銀・ニツケル合金。
FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a graph showing the operation frequency vs. cumulative failure rate characteristic of the present example and a conventional contact, and FIG. 3 is a cross-sectional view of a conventional contact. 10...first contact, 20...second contact, 3
...Copper/nickel alloy, 4...Contact spring, 5...
Palladium-ruthenium alloy, 6...Pure gold, 7...
...Silver/nickel alloy.
Claims (1)
第１層を有する第１の接点と、純金または金を含
む合金から形成される第１層とニツケルおよびパ
ラジウムのいずれか一方と銀との合金から形成さ
れる第２層とを含み前記第１の接点に対向する第
２の接点とを有することを特徴とする継電器の接
点。1. A first contact having a first layer formed from a palladium-ruthenium alloy, a first layer formed from pure gold or an alloy containing gold, and an alloy of either nickel or palladium and silver. A contact for a relay, comprising a second layer and a second contact facing the first contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7865386A JPS62234810A (en) | 1986-04-04 | 1986-04-04 | Contact of relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7865386A JPS62234810A (en) | 1986-04-04 | 1986-04-04 | Contact of relay |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62234810A JPS62234810A (en) | 1987-10-15 |
| JPH0481287B2 true JPH0481287B2 (en) | 1992-12-22 |
Family
ID=13667816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7865386A Granted JPS62234810A (en) | 1986-04-04 | 1986-04-04 | Contact of relay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234810A (en) |
-
1986
- 1986-04-04 JP JP7865386A patent/JPS62234810A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62234810A (en) | 1987-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |