JPH0513538B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a carrier tape and a method of using the same.

[Prior Art] Recently, carrier tapes equipped with IC devices have become known. This carrier tape is transported by a sprocket that has feed teeth that mesh with sprocket holes formed at predetermined intervals on both side edges, and the IC device is inserted into the IC device hole formed in the center with TAB ( Tape
It is now attached using the Automated Bonding method. In the case of conventional carrier tape,
IC devices are mounted in one row in the width direction, and one processing of the carrier tape is performed for one row of IC devices. In this case, the feed amount of the carrier tape for one process is set by the sprocket hole in which the feed teeth of the sprocket engage. That is, the carrier tape that has undergone a predetermined process is transferred by rotating the sprocket that engages with the sprocket hole by a predetermined angle, and the IC device portion of the next row to be processed is positioned.

[Problem to be solved by the invention] However, like the conventional tape carrier mentioned above,
If IC devices are mounted in one row in the width direction, and the feed amount is set by the sprocket hole, and one process is performed for one row of IC devices, one process is for only one IC device. Because of this, production efficiency was extremely low.

This invention was made in view of the above-mentioned circumstances, and its purpose is to greatly increase production efficiency by allowing one process to be performed on a carrier tape for multiple IC devices at once. An object of the present invention is to provide a carrier tape and a method for using the same.

[Means for Solving the Problems] In order to achieve the above object, the carrier tape of the present invention has a plurality of rows of IC device holes formed in the width direction, and a sprocket hole for each of the plurality of rows of the IC device holes. Another type of tape is provided with feed amount setting holes or marks.

Further, the method for using the carrier tape of the present invention is to transport the carrier tape having the above structure using a sprocket having a feed tooth that meshes with the sprocket hole, detect the tape feed amount setting hole or mark with a sensor, and perform one operation. This allows the feed amount to be set.

[Function] According to the carrier tape of the present invention configured as described above, by detecting the tape feed amount setting hole or mark with a sensor and setting the feed amount for one time, the carrier tape can be processed once. can now be performed for multiple IC devices at once, and therefore,
Production efficiency can be greatly improved.

[Example] Hereinafter, an example of the present invention will be described based on the drawings.

FIG. 1A shows a carrier tape according to the invention. The illustrated carrier tape 1 has already undergone a bonding process and has IC devices 3 mounted in each IC device hole 2 portion as shown in FIG. 1B.

The carrier tape 1 is made of a flexible and insulating resin film such as polyester resin or polyimide resin, and has a fairly wide dimension. Carrier tape like this 1
has two rows of sprocket holes 4 and 5 on both side edges, and a large number of IC device holes 2 in the center.
have. Two rows of sprocket holes 4 and 5 are arranged facing each other, and are spaced apart from each other by a predetermined distance in the longitudinal direction. Here, the sprocket holes 4 located on the outside are circular holes, and the sprocket holes 5 located on the inside are square holes. The IC device holes 2 are arranged in a plurality of rows at predetermined intervals in the width direction of the carrier tape 1, and an IC device 3 is mounted in each of these 2 IC device holes as shown in FIG. 1B. . The IC device 3 is placed under the carrier tape 1,
Finger leads 7 are formed on the upper surface of the carrier tape 1 and extend to the inside of the IC device hole 2.
An electrode (not shown) is bonded to. In this case, the finger leads 7 are formed by etching a copper foil laminated on the upper surface of the carrier tape 1. In this etching process, when tin or solder plating is applied to the finger leads 7, a grid-like copper foil pattern 8 surrounding each IC device 3 is also used to apply a ground potential for plating to each finger lead 7. It is formed. The grid-like copper foil pattern 8 is formed so as to be continuous throughout, and the finger leads 7 of each IC device 3 are connected to this copper foil pattern 8.

Also, on both side edges of this carrier tape 1,
In addition to the sprocket holes 4 and 5, tape feed amount setting holes (or marks) 9 and 9 for setting the tape feed amount are provided in each of the plurality of rows of IC device holes 2F.

The carrier tape 1 of the present invention having the above structure is manufactured through steps a to k shown in FIG. That is, first, in the pressing step a, two rows of sprocket holes 4, 5 and
An IC device hole 2 and a tape feed amount setting hole 9 are drilled. In this case, although some of the IC device holes 2 are omitted in the drawing, they are actually formed throughout the lattice portion formed by the copper foil pattern 8. Next, the carrier tape 1 with predetermined holes punched in this pressing process a is sent to a copper foil laminating process, where copper foil for forming the finger leads 7 and the copper foil pattern 8 is laminated on the top surface. be done. This copper foil lamination process b
After completing this process, the carrier tape 1 is sent to a photoresist coating step c, in which a photoresist constituting a photosensitive surface is coated on the copper foil. After completing this photoresist application step c, the carrier tape 1 is sent to an exposure step d, where the photoresist is irradiated with light to expose the finger leads 7 and the copper foil pattern 8. Note that the details of this exposure step d will be described later. Next, the carrier tape 1 is sent to a developing step e, where a developing process is performed to reveal a predetermined image of the finger leads 7 and the copper foil pattern 8. After completing this phenomenon step e, the carrier tape 1 is sent to the device hole covering step f, where the IC device hole 2 is covered from the bottom side of the carrier tape 1, and then the next etching step g is carried out.
IC device hole 2 of finger lead 7 in
To ensure proper etching of the inwardly extending portion. This device hole covering process f
The carrier tape 1 that has been processed is sent to an etching process g, where the image (finger lead 7 and copper foil pattern 8) developed in the development process e is removed.
An etching process is performed to remove the remaining copper foil. After completing this etching step g, the carrier tape 1 is sent to a resist stripping step h, where the photoresist is stripped and removed. Then,
The carrier tape 1 is sent to a plating step i, where the finger leads 7 are plated with tin or solder plating. Next, the carrier tape 1 is sent to a bonding step j, where the unillustrated electrodes of the IC devices 3 placed under each IC device hole 2 are bonded to the finger leads 7,
The IC device 3 is mounted on the carrier tape 1.
In this way, the carrier tape 1 with the IC devices 3 mounted thereon and in the state shown in FIG. The foil pattern 8 is then cut into pieces (sized along the lattice lines of the foil pattern 8) to produce a large number of IC units.

In addition, the carrier tape 1 that has completed the pressing process a in the above is subjected to the following steps until it reaches the bonding process j.
It is transported by a sprocket having feed teeth that mesh with one sprocket hole (here, circular sprocket hole 4) formed on both side edges, and in the bonding process j, it is transferred to the other sprocket hole (here, square sprocket hole 5). It is transported by a sprocket with feed teeth that mesh with the in this way,
The reason why the sprocket holes are changed between the transfer from the copper foil laminating process b to the plating process i and the transfer in the bonding process j is that if the carrier tape 1 is made of a material that is easily deformed, the sprocket holes are deformed by the plating process i. There is a high possibility that
Even in the bonding process j, which requires high positioning accuracy, correct positioning cannot be achieved if a deformed sprocket hole is used for transportation.For this reason, in the bonding process j, an unused sprocket hole that is not deformed is used. This is to achieve high accuracy.

In addition, in each of the above processing steps, copper foil laminating step b, developing step e, etching step g, resist stripping step h, plating step i, etc. do not require alignment and can be performed while transporting the carrier tape. , the processing speed is uniquely determined by the performance of each processing device. but,
In order to perform the pressing process a, the photoresist coating process c, the exposure process d, the device hole covering process f, etc., it is necessary to temporarily stop the carrier tape and perform positioning. Conventionally, each of the above processing steps was performed by moving one row of sprocket holes 4, resulting in very low processing efficiency.

Therefore, in the present invention, each of the above processing steps is performed in units of multiple columns (hereinafter referred to as processing in units of multiple columns) to dramatically improve efficiency.

That is, tape feed amount setting holes (or marks) 9 are formed on both side edges of the carrier tape 1. This tape feed amount setting hole 9 is provided for each of a plurality of F rows of IC device holes 2, and during positioning, this tape feed amount setting hole 9 is detected by a sensor. That is, when the predetermined processing is completed for the entire F row, the sprocket rotates and the carrier tape 1 is transferred. When the next tape feed amount setting hole 9 is detected by the sensor, the rotation of the sprocket is stopped, the carrier tape 1 is positioned, and the process for the next f row is repeated. Unit processing is executed. In the case of the example, for 10 rows x 9 columns = 90 IC devices,
Processing is performed at one time, and positioning only needs to be done once.

Next, as a specific embodiment of this invention, the above-mentioned exposure step d will be taken up and explained in detail with reference to FIG.

The exposure apparatus 10 used here includes a light source lamp 12, an XYθ table 13, and a TV camera (sensor) 14 within its main body 11. In this case, the light source lamp 12 placed above the device main body 11 and the XYθ table 13 placed in the center of the device main body 11 are installed horizontally with respect to the device main body 11, and are also placed at the bottom of the device main body 11. The TV camera 14 that was
The XYθ table 13 is installed in an oblique state so that the central portion thereof can be detected. The XYθ table 13 has a frame structure and has a mask 16 in its opening 15. This mask 16 is the above 10 lines x 9
The configuration is such that it can process 90 IC devices in a row for 3 minutes at a time. Such an XYθ table 1
3 is movable in the X direction, Y direction and θ direction, and the position of the carrier tape 1 transferred under the XYθ table 13 is detected by detecting the IC device hole 2 using, for example, another TV camera (not shown). , if there is a positional shift, the table is corrected by moving in an appropriate direction.

The carrier tape 1 has a photoresist coated on the copper foil in the photoresist coating step c.
It is wound on a reel 17 and attached to a tape supply shaft 18, and is attached to an XYθ table 1 in an exposure device 10.
3 and the TV camera 14, and is wound onto a reel 20 attached to a tape winding shaft 19. The carrier tape 1 thus set is transported by sprockets 21 and 22 arranged on both sides of the exposure device 10. In this case, the feed teeth 21a, 2 of the sprockets 21, 22
2a meshes with a circular sprocket hole 4.

The carrier tape 1 is attached to the sprockets 21 and 22.
When it rotates in the direction of the arrow, it is transported within the exposure apparatus 10 while being wound up on the reel 20. When the TV camera 14 recognizes (detects) the next tape feed amount setting hole 9 by this transfer, the sprockets 21 and 2
2 is stopped from rotating, and the carrier tape 1 is positioned within the exposure apparatus 10. Next, light source lamp 1
2 lights up and irradiates the light toward the mask 16 inside the XYθ table 13 as shown by the arrow. Using this irradiation light, processing is performed in units of multiple rows, and in the case of this embodiment, the finger leads 7 and copper foil patterns 8 for 90 IC devices are exposed. Such multi-column unit processing can be performed in exactly the same way not only in the exposure process but also in the other processes mentioned above.

[Effects of the Invention] As explained above, the carrier tape according to the present invention has a plurality of rows of IC device holes formed in the width direction, and a tape feed separate from the sprocket holes for each of the plurality of rows of the IC device holes. Since the tape feed amount setting hole or mark is provided, the sensor detects the tape feed amount setting hole or mark while the tape is being transported by a sprocket having a feed tooth that meshes with the sprocket hole, and the amount to be sent in one process is set. By doing this, one process on the carrier tape can be performed on multiple IC devices at once, and therefore, compared to the conventional carrier tape where one IC device is targeted for one process. It is possible to greatly improve production efficiency.

[Brief explanation of the drawing]

Each of the drawings shows an embodiment of the present invention; FIG. 1A is a perspective view of a carrier tape according to the invention, FIG. 1B is an enlarged view of the main part of FIG. 1A, and FIG. The process diagram, FIG. 3, is a block diagram showing the exposure process of the same carrier tape. 1...Carrier tape, 2...IC device hole,
4, 5... Sprocket hole, 9... Tape feed amount setting hole (or mark), 14... TV camera (sensor), 21, 22... Sprocket, 21a,
22a...Feed dog.

Claims (1)

[Claims] 1. A carrier tape in which sprocket holes are arranged at predetermined intervals on both side edges, with multiple rows in the width direction.
What is claimed is: 1. A carrier tape characterized in that IC device holes are formed, and tape feed amount setting holes or marks separate from the sprocket holes are provided for each of the plurality of rows of the IC device holes. 2 Sprocket holes are arranged at predetermined intervals on both side edges, and a plurality of rows of IC device holes are formed in the width direction, and a tape feed amount setting hole or mark separate from the sprocket holes is provided for each of the plurality of rows of the IC devices. A carrier tape provided with a tape is transported by a sprocket having a feed tooth that meshes with the sprocket hole, and a sensor detects the tape feed amount setting hole or mark to set the feed amount for one time. How to use tape.