JPH0516680B2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting device, and in detail,
When the nozzle picks up an electronic component, a detection device integrated with the nozzle detects whether or not there is a pick-up error.

(Prior Art) An electronic component mounting device lifts and lowers the nozzle of a transfer head directly above an electronic component supply section such as a tape feeder, tube feeder, or tray to attach electronic components (hereinafter referred to as chips) in the electronic component supply section.
The chip is then picked up by vacuum suction, the transfer head is then moved above the substrate, and the nozzle is raised and lowered again to release the vacuum suction state, thereby mounting the chip on the substrate.

When the nozzle picks up a chip as described above, a pick-up error occurs. These pick-up mistakes include: (1) chips standing up (the top surface of the chips is not attracted to the nozzle, but the sides are attracted, and the chips are picked up in an upright state); (2) chips of different types are picked up. (3) No chip (when the vacuum suction of the chip fails and the chip is not picked up), etc.

Conventionally, as means for detecting pick-up errors such as those described in (1) to (3) above, there has been known a method of separately installing a detection device on the moving path of the transfer bed. This detection device includes a light emitting element, a light receiving element,
It consists of a vertical movement means for vertically moving both elements, and its operation is as follows.

Once the transfer head has picked up the chip from the electronic component supply section, the transfer head is moved around to the above-mentioned detection device, and the chip adsorbed to the lower end of the nozzle of the transfer head is placed between the light emitting element and the light receiving element. , and then temporarily stop the transfer head there. Next, in this state, the detecting device is moved up and down by driving the vertical movement means to detect the chip, thereby determining whether or not there is a pick-up error. If there is no pick-up error, the transfer head resumes movement, moves the transfer head to the board, and mounts the chip on the board.On the other hand, if there is a pick-up error, the chip is stopped from being mounted on the board. Collect in a collection box, etc.

(Problem to be Solved by the Invention) However, in the above-mentioned conventional method, the transfer head that picks up the chip moves in a detour to the detection means, stops there once, and then moves toward the substrate once the inspection is completed. Since the process had to be restarted, the cycle time became longer and work efficiency was not improved. Furthermore, the conventional device described above requires a vertical movement means such as a motor to move the light emitting element and the light receiving element up and down, which has the problem of complicating the device.

In addition, this type of electronic component mounting equipment has a large number of peripheral devices, and therefore does not have enough spare space. However, with the above-mentioned conventional means, it is necessary to secure a special installation space for the inspection equipment, and it is difficult to design the layout. Above all, it was extremely disadvantageous.

In addition, typical pick-up mistakes include those listed in (1), (2), and (3) above, but no method has been established that can collectively detect pick-up mistakes that occur in various ways. Therefore, the yield of implementation was poor.

Therefore, the present invention solves the problems of the conventional means described above and provides a means that can easily detect any chip pick-up errors that occur in various ways such as (1), (2), and (3) above. The purpose is to

(Means for Solving the Problems) For this purpose, the present invention provides a nozzle that sucks and picks up electronic components in an electronic component supply section, an elevating means for elevating and lowering this nozzle, and a nozzle that is located on the lower side of the nozzle. The transfer head is equipped with a detection device that detects the height of the lower end of the nozzle and the height of the lower surface of the electronic component attracted to the nozzle when the nozzle moves up and down. and a control device that calculates the difference between the height of the bottom end of the nozzle and the bottom surface of the electronic component, and determines whether there is a pick-up error based on this calculated value.

(Function) According to the above configuration, when the nozzle moves up and down, the height of the lower end of the nozzle and the lower surface of the chip is detected, and the thickness of the chip is determined from the difference in height to determine the presence or absence of a pick-up error. do. Therefore, according to the present means, there is no need to take the trouble of detouring the transfer head to the inspection equipment as in the above conventional means, and it is possible to shorten the cycle time and increase the mounting speed. It is possible to detect pick-up errors that occur in

(Example) Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of the electronic component mounting device 55. 59 is a printed circuit board on which the chip is mounted;
4 is a conveyor for carrying this substrate 59. Above the conveyor 54, two transfer heads 1 and 2 are provided on the left and right sides. These transfer heads 1 and 2
can move forward, backward, left and right (in the direction of arrow A). Further, a tape feeder 10 is provided on the side of the conveyor 54 as an electronic component supply section. This tape feeder 10 is equipped with a chip 9. In addition, this tape feeder 10 and the conveyor 54
A collection box 11 for collecting chips that are picked up incorrectly is provided between the two.

13 is a motor, and a timing belt 1
4. The transfer heads 1 and 2 are rotated via the pulley 16 and the timing belt 16, and their angles are set to change the direction of rotation of the chips picked up by the transfer heads 1 and 2. The transfer heads 1 and 2 are used to simultaneously mount chips 9 on two substrates 59.Next, the detailed structure of one transfer head 1 will be explained with reference to FIG. do.

A nozzle shaft 41 has a nozzle 51 at its lower end for sucking the chip 9 under vacuum. A guide ring 52 is provided at the upper end of the nozzle shaft 41.
A roller 31 is fitted in the . This roller 31
is pivoted to the tip of the arm 22 which is pivoted to the pin 27.

5 is a cylinder, and the rear end of an arm 22 is connected to the tip of a rod 28 via a screw 29. When the rod 28 of the cylinder 5 protrudes and retracts in the direction of arrow B, the arm 22 swings vertically about the pin 27. Then, nozzle shaft 4
1 moves up and down in the vertical direction C, and the nozzle 51 also moves up and down to pick up the chip 9 of the tape feeder 10 by vacuum suction.

26 is a main body block, and a head block 37 is rotatably mounted on bearings 38 and 39 provided on this main body block 26, and the nozzle shaft 41 is fitted into the inside of this head block 37 so as to be freely movable up and down. has been done.

42 is a chuck claw, and head block 37
It is rotatably mounted inside the body around a pin 50. 44 is a holding ring provided so as to surround the chuck claw 42; 45 is a pressure spring; 43
46 is an outer ring attached to the outer surface of the retainer ring 44, and 46 is an inner ring attached to the inner surface of the retainer ring 44.

23 is a cylinder attached to the main body block 26, and an arm 24 is connected thereto. When the cylinder 23 is actuated, the arm 24 is connected to the pin 49
It swings vertically around the center. Then outer ring 4
3 moves up and down, and in conjunction with this, the inner ring 46 also moves up and down, and the chuck pawl 42 opens and closes. This chuck pawl 42 chucks the chip 9 attracted to the lower end of the nozzle 51 and corrects its positional deviation. 40 is a pulley to which the timing belt 6 is adjusted.

In Fig. 2, 33 and 34 are the main body block 2.
This is a pulley provided on the timing belt 6, and the timing belt 17 is adjusted. This timing belt 17 is coupled to the arm 22 by a fixing jig 32. Further, a position detector 3 is provided coaxially with the upper pulley 33.

As mentioned above, the arm 22 swings and the nozzle 5
1 moves up and down, the timing belt 17 is pulled by the arm 22 and rotates, and in conjunction with this, the pulley 33 and position detector 3 also rotate in the F direction, so the height of the current position of the nozzle 51 can be detected.

In FIG. 2, 4a is a light emitting element, and 4b is a light receiving element, which are provided at the lower side of the nozzle 51. Both elements 4a and 4b are detection devices for the lower end of the nozzle 51 or the lower surface of the chip 9 adsorbed by the nozzle 51, and are integrally assembled with the nozzle 51 at the lower part of the main body block 26 by a jig 25. It moves integrally with the nozzle 51 in the above direction A. Detection signals from the detection devices 4a and 4b are input to a control device 48 through an amplifier 47. Further, the signal from the position detector 3 is also input to this control device 48 .

This device has the above-mentioned configuration, and its operation will be explained next.

The transfer head 1 moves directly above the tape feeder 10 to pick up the chip 9. Here, in FIG. 2, the cylinder 23 is actuated and the arm 24 swings upward about the pin 49. Then, as the inner ring 46 rises via the rings 43, 44 and the pressure spring 45, the chuck pawl 42 swings outward around the pin 50 and opens.
The chip 9 can now be picked up by the nozzle 51.

At the same time, the cylinder 5 is also activated and its rod 28 is retracted. Then, the arm 22 rotates counterclockwise around the pin 27, the nozzle shaft 41 and the nozzle 51 descend, and by evacuation in the direction of arrow G, the nozzle 51 vacuum-chucks the chip 9 of the tape feeder 10.

Next, as the rod 28 of the cylinder 5 protrudes, the arm 22 rotates clockwise, the nozzle shaft 41 rises, and the nozzle 51 picks up the tip 9. Next, this chip 9 is attached to the substrate 5.
During the transfer, the cylinder 23 operates in the opposite direction to that described above, causing the chuck pawl 42 to close inward and chuck the chip 9 adsorbed at the lower end of the nozzle 51. Correct the positional deviation. Next, this chuck state is released, and the transfer head 1 is moved onto the substrate 59,
Thereupon, the chip 9 is mounted on the substrate 59 by moving the nozzle 51 up and down again in the same manner as described above.

Next, referring to FIG. 3, a method for determining pick-up errors will be explained.

FIG. 3A shows a state in which the rod 28 of the cylinder 5 is retracted and the nozzle 51 begins to descend in the direction of the arrow D1, as described above. In this state,
The light 61 emitted from the light emitting element 4a is transmitted to the light receiving element 4.
The light is received by b. When the nozzle 51 further descends to block the light 61, the lower end of the nozzle 51 is detected by the light receiving element 4b (see FIG. 4B).

This signal from the light receiving element 4b is input to the control device 48. At this time, the timing belt 17 is rotating in conjunction with the lowering of the nozzle 51, and the position detector 3 calculates the height of the lower end of the nozzle 51 at the time when the light is blocked by the control device 48.

Next, the nozzle 51 further descends to vacuum-adsorb the chip 9 (see C in the figure), and then the nozzle 51 ascends. FIG. 3 D shows that the nozzle 51 rises in the direction of arrow D2 and switches from the light shielding state to the light receiving state,
The state in which the detection devices 4a and 4b are detecting the lower surface of the chip 9 is shown, and the height of the lower surface of the chip 9 is calculated by the control device 48 using a method similar to the method for detecting the lower end of the nozzle 51 described above. be done. Then, the difference between the height of the lower end of the nozzle 51 and the height of the lower surface of the chip 9 is calculated, and this calculated value is the thickness of the chip 9 that has been picked up.

By the way, chips of various types are sequentially mounted on the board 59 in accordance with the program. Therefore, the thickness of each chip is stored in advance in the control device 48, and the thickness of the chip 9 calculated as described above is compared with the thickness of the chip stored in advance. If the thicknesses match, it is determined that there is no pick-up error, and the chip 9 is checked by the chuck claw 42 to correct the positional deviation, and the transfer head 1 is moved above the substrate 59. This chip 9 is mounted on a substrate 59.

If they do not match as a result of the above comparison, it is determined that a pick-up error has occurred, and the transfer head 1 moves above the collection box 11 to collect the chips 9 into the collection box 11.

As described above, according to the above means, when the nozzle 51 performs the vertical movement to pick up the chip 9, the thickness of the chip 9 is detected, and the result is combined with the thickness of the chip stored in the control device 48. Since the presence or absence of a pick-up error is determined by comparison, the cycle time does not become long and the chip 9 can be mounted on the board 59 at high speed.

Next, the other transfer head 2 will be explained with reference to FIG. This transfer head 2 is different from the above-mentioned moving head 1 in the height detection means of the nozzle 51. That is, in this case, instead of the timing belt 17, one end of a wire 19 is attached to the arm 22. This wire 19 is wound around a roller 21 coaxial with the position detector 3 and fixed at a position 53, and furthermore, the upper end is attached to a spring 18.
It is attached to and is biased upward by its spring force. 20 is a mounting rod for the spring 18.

When the arm 22 swings and the nozzle 51 goes up and down, the wire 19 is pulled in the direction of arrow E, and the roller 21 rotates in conjunction with this, so the nozzle 5
The height of the current position of 1 can be detected.

(Effects of the Invention) As explained above, the present invention incorporates the detection device into the transfer head integrally with the nozzle, and when the nozzle moves up and down, the height of the lower end of the nozzle and the height of the lower surface of the chip can be checked. Since the thickness of the chip is detected, the thickness of the chip is determined from this, and the presence or absence of a pick-up error is determined based on this, the cycle time does not become long and the chip can be mounted on the board at high speed. In addition, the nozzle lifting means of this type of transfer head can also be used as a lifting means for raising and lowering the nozzle to detect the lower end of the nozzle or the bottom surface of the chip, thereby eliminating the need for installation space for the inspection means. At the same time, the device can be simplified.

[Brief explanation of the drawing]

The figure shows an embodiment of the present invention.
2 is a sectional view of the transfer head, FIG. 3 is a side view during pickup, and FIG. 4 is a sectional view of the transfer head. 1...Transfer head, 2...Transfer head, 4a,
4b...detection device, 5, 22...lifting means, 9...
...Electronic parts, 10...Electronic parts supply department, 48...
Control device, 51... nozzle.

Claims (1)

[Claims] 1. A nozzle that suctions and picks up electronic components in the electronic component supply section, a lifting means for raising and lowering this nozzle, and a means that is integrally assembled with this nozzle at the lower side of the nozzle, and when this nozzle moves up and down. , a transfer head equipped with a detection device that detects the height of the lower end of the nozzle and the height of the lower surface of the electronic component attracted to the nozzle; Calculate the difference in
An electronic component mounting device comprising: a control device that determines the presence or absence of a pick-up error from this calculated value.