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JPH0522174B2 - - Google Patents
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JPH0522174B2 - - Google Patents

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Publication number
JPH0522174B2
JPH0522174B2 JP58038623A JP3862383A JPH0522174B2 JP H0522174 B2 JPH0522174 B2 JP H0522174B2 JP 58038623 A JP58038623 A JP 58038623A JP 3862383 A JP3862383 A JP 3862383A JP H0522174 B2 JPH0522174 B2 JP H0522174B2
Authority
JP
Japan
Prior art keywords
ring
image
coordinates
diffraction
uxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58038623A
Other languages
Japanese (ja)
Other versions
JPS59163549A (en
Inventor
Moryasu Tokiwai
Sakuyoshi Moriguchi
Takaaki Shinkawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denryoku Chuo Kenkyusho
NTT Inc
Original Assignee
Denryoku Chuo Kenkyusho
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denryoku Chuo Kenkyusho, Nippon Telegraph and Telephone Corp filed Critical Denryoku Chuo Kenkyusho
Priority to JP58038623A priority Critical patent/JPS59163549A/en
Publication of JPS59163549A publication Critical patent/JPS59163549A/en
Publication of JPH0522174B2 publication Critical patent/JPH0522174B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20058Measuring diffraction of electrons, e.g. low energy electron diffraction [LEED] method or reflection high energy electron diffraction [RHEED] method

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は電子顕微鏡等によつて得られるリング
状電子線回折像の回折リングの径(半径又は直
径)の測定方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for measuring the diameter (radius or diameter) of a diffraction ring in a ring-shaped electron beam diffraction image obtained by an electron microscope or the like.

[従来の技術] 電子顕微鏡を用いて、透過像モード又は走査透
過像モードで、試料の回折像を撮影し、この回折
像を分析して試料の同定や指数付け或いは試料中
の結晶の方位の測定を行なつているが、この従来
の方法において、リング状回折像の各回折リング
の径の測定は手作業で行なつていた。即ち、回折
像を撮影後、この像を現像し、次にネガ上で回折
像の寸法を手作業で測定していた。
[Prior Art] Using an electron microscope, a diffraction image of a sample is taken in transmission image mode or scanning transmission image mode, and this diffraction image is analyzed to identify the sample, add an index, or determine the orientation of crystals in the sample. However, in this conventional method, the diameter of each diffraction ring in a ring-shaped diffraction image was manually measured. That is, after a diffraction image is photographed, this image is developed, and then the dimensions of the diffraction image are manually measured on the negative.

しかしながら、このような従来の回折リング径
測定方法は手作業であるために、測定に経験を要
すると共に、長時間を要するという欠点がある。
However, since such a conventional diffraction ring diameter measuring method is manual, it requires experience and a long time for measurement.

[発明が解決しようとする課題] 本発明は、このような従来の欠点を解決してオ
ンラインで自動的に且つ正確に回折リング径を測
定できるリング状電子線回折像の回折リング径測
定方法を提供することを目的としている。
[Problems to be Solved by the Invention] The present invention provides a method for measuring the diameter of a diffraction ring of a ring-shaped electron beam diffraction image, which solves these conventional drawbacks and can automatically and accurately measure the diameter of a diffraction ring online. is intended to provide.

[課題を解決するための手段] 上記目的を達成する本発明は、リング状電子線
回折像を電気信号に変換し、座標x,yに対応す
る画素の強度をUxyとするとき、各xについて 〓y
Uxyを算出して 〓y Uxyが最大となる座標xを求め
てそれを中心スポツトのx座標uoとすると共に、
各yについて 〓x Uxyを算出して 〓x ΣUxyが最大と
なる座標yを求めてそれを中心スポツトのy座標
voとし、この中心スポツトの座標(uo,vo)を
通り回折リングと交差する複数の直線を設定し、
各直線上に存在する画素のうち、中心スポツトの
座標(uo,vo)から同じ距離にある画素同志の
強度値を加算して、中心スポツトの座標(uo,
vo)からの距離に対する前記加算値の分布を求
め、該分布が極大となる点と中心スポツトの座標
(uo,vo)との距離を求め、これを前記リング状
電子線回折像の各回折リングの半径とすることを
特徴とするものである。
[Means for Solving the Problems] The present invention achieves the above object by converting a ring-shaped electron beam diffraction image into an electric signal, and when the intensity of a pixel corresponding to coordinates x and y is Uxy, for each x 〓y
Calculate Uxy, find the coordinate x where y Uxy is maximum, set it as the x coordinate uo of the center spot, and
For each y, calculate 〓 x Uxy, find the coordinate y where 〓 x ΣUxy is maximum, and use it as the y coordinate of the center spot.
vo, set multiple straight lines that pass through the coordinates (uo, vo) of this center spot and intersect with the diffraction ring,
Among the pixels existing on each straight line, the intensity values of pixels located at the same distance from the coordinates (uo, vo) of the center spot are added to calculate the coordinates (uo, vo) of the center spot.
Find the distribution of the added value with respect to the distance from It is characterized by having a radius of .

[作用] 回折像を二次元的に分布する画素に変換した場
合、座標x,yに対応する画素の強度をUxy、中
心スポツト(回折像中には、全く回折を受けずに
直進した電子線の像がその中心位置に存在する。
この直進電子線の像を中心スポツトと呼び、この
中心スポツトの中心に位置する画素の座標を、中
心スポツトの座標と呼ぶ)の座標を(uo,vo)
とすると、中心スポツトは複数の回折リングの中
心であるため、 〓y ΣUxy及び 〓x Uxyは各々座標
uo,voにおいて最大となるはずである。そこで、
各々 〓x Uxy, 〓x Uxyが最大となる座標を求めてこ
れを中心スポツトの座標(uo,vo)とし、この
中心スポツトの座標(uo,vo)が求められた段
階で、この中心スポツトの座標(uo,vo)を通
り回折リングと交差する複数の直線を設定し、各
直線上に存在する画素のうち、中心スポツトの座
標(uo,vo)から同じ距離にある画素同志の強
度値を加算して、中心スポツトの座標(uo,vo)
からの距離に対する前記加算値の分布を調べる
と、回折リングに対応する点においては、強度が
極大となつているはずである。そこで、中心スポ
ツトの座標(uo,vo)から各極大点までの距離
を求め、これを各回折リングの半径とする。
[Effect] When a diffraction image is converted into pixels distributed two-dimensionally, the intensity of the pixel corresponding to the coordinates An image of is present at its center position.
The image of this rectilinear electron beam is called the center spot, and the coordinates of the pixel located at the center of this center spot are called the center spot coordinates).
Then, since the central spot is the center of multiple diffraction rings, 〓 y ΣUxy and 〓 x Uxy are the coordinates, respectively.
It should be maximum at uo and vo. Therefore,
Find the coordinates where 〓 x Uxy, Set multiple straight lines that pass through the coordinates (uo, vo) and intersect the diffraction ring, and calculate the intensity values of pixels located at the same distance from the center spot coordinates (uo, vo) among the pixels on each straight line. Add and get the coordinates of the center spot (uo, vo)
If we examine the distribution of the added value with respect to the distance from the center, we will find that the intensity is at a maximum at the point corresponding to the diffraction ring. Therefore, the distance from the coordinates (uo, vo) of the center spot to each maximum point is determined, and this is used as the radius of each diffraction ring.

[実施例] 以下、本発明方法をそれを実施する装置と共に
具体的に説明する。尚、本発明でいうリング状電
子線回折像とは、周知のように、第1図に示すよ
うな、粉末状の結晶から回折された電子線に基づ
くリング状の回折像から成るものである。
[Example] Hereinafter, the method of the present invention will be specifically explained together with an apparatus for carrying out the method. As is well known, the ring-shaped electron beam diffraction image referred to in the present invention is a ring-shaped diffraction image based on an electron beam diffracted from a powdered crystal, as shown in FIG. .

第2図は本発明を実施するための装置の概略構
成を示すためのもので、図中1は電子顕微鏡であ
り、4は電子計算機である。電子計算機4より電
子顕微鏡1には電子顕微鏡1を透過像観察モード
にしたり、走査透過像観察モードにしたりするた
めの制御信号が供給される。この電子顕微鏡1に
は透過像を電気信号に変換するための撮像装置2
が取り付けられており、電子顕微鏡1が透過像観
察モードになつた際に、この撮像装置2によつて
得られた画像に対応するアナログの時系列信号は
AD変換器3によりデジタル信号に変換されて電
子計算機4に供給される。又、電子顕微鏡1が走
査透過像観察モードになつた際には、透過電子検
出器5が光軸上に挿入され、試料を電子線で走査
した際の透過電子の検出信号がAD変換器6によ
りデジタル信号に変換されて電子計算機4に供給
される。電子計算機4には、撮像装置2又は透過
電子検出器5より供給される画像信号等を記憶す
る外部記憶装置7が接続されている。更に、電子
計算機4には、回折像モニター用のCRT8や、
キーボード9、コンソール用のCRT10が接続
されている。
FIG. 2 is for showing a schematic configuration of an apparatus for carrying out the present invention, in which numeral 1 is an electron microscope and numeral 4 is an electronic computer. The electronic computer 4 supplies the electron microscope 1 with a control signal for setting the electron microscope 1 to a transmission image observation mode or a scanning transmission image observation mode. This electron microscope 1 includes an imaging device 2 for converting a transmitted image into an electrical signal.
is attached, and when the electron microscope 1 enters the transmission image observation mode, the analog time-series signal corresponding to the image obtained by the imaging device 2 is
The AD converter 3 converts it into a digital signal and supplies it to the computer 4. Further, when the electron microscope 1 enters the scanning transmission image observation mode, the transmission electron detector 5 is inserted on the optical axis, and the detection signal of the transmission electrons when the sample is scanned with the electron beam is sent to the AD converter 6. The signal is converted into a digital signal and supplied to the electronic computer 4. The computer 4 is connected to an external storage device 7 that stores image signals and the like supplied from the imaging device 2 or the transmission electron detector 5. Furthermore, the electronic computer 4 includes a CRT8 for diffraction image monitor,
A keyboard 9 and a CRT 10 for console are connected.

このような構成の装置を用いて、まず、操作者
はキーボード9により電子計算機4に指令を与え
て、例えは、試料の透過像モードにおける回折像
が撮像装置2に投影されるようにする。そこで、
キーボード9により電子計算機4に測定の開始を
指令すると、電子計算機4は以下に述べる作業を
進めて行く。
Using the apparatus configured as described above, an operator first issues a command to the electronic computer 4 using the keyboard 9 so that, for example, a diffraction image of the sample in a transmission image mode is projected onto the imaging device 2. Therefore,
When the electronic computer 4 is instructed to start measurement using the keyboard 9, the electronic computer 4 proceeds with the operations described below.

即ち、電子計算機4は、まず撮像装置2によつ
てこの撮像装置2上に投影された回折像をAD変
換器3によつてデジタル信号に変換して取り込
み、電子計算機4内の記憶部に例えば512×512個
の画素データとして一旦記憶する。次に、電子計
算機4は、この記憶した画像データを読み出し
て、回折リングの半径Rrを求める。このステツ
プを詳細に示したものが第3図である。ここで、
前述のように、画像の縦横にX座標及びY座標を
とり、X座標がx、Y座標がyである画素の強度
をUxyで現わすものとし、第4図に示すような画
像を処理する場合を例にとると、まず、電子計算
機4は、各画素の座標xに対して 〓y Uxyを算出し
(この操作を画像のX軸への射影操作とよぶもの
とする)、同様に各画素の座標yに対しても 〓x
Uxyを算出(この操作を画像のY軸への射影操作
とよぶものとする)する(ステツプa)。この 〓y
Uxy及び 〓x Uxyの値は各々x,yの値に対して例
えば第4図の曲線A,Bで示すようなものとな
り、中心スポツトの中心位置において最大とな
る。そこで、射影強度を示す曲線A,Bにおい
て、その値が最大となるx座標とy座標を求めれ
ば、これが中心スポツトの座標(uo,vo)であ
る。このようにして中心スポツトの座標(uo,
vo)を求めた後(ステツプb)、中心スポツトの
座標を通りX軸に平行な線分I,mとY軸に平行
な線分n,s(第4図参照)上の画素の値Uxyを
読み出す。これら各線分上の画素の値Uxyを、中
心スポツトの中心位置に向う向きに座標軸の向き
を揃えて図示すると、各々第5図のa,b,c,
dで示すように互いに略相似形をしており、いず
れも回折リングの位置に極大値を有している。そ
こで、電子計算機4は、第5図a,b,c,dに
示した強度値を足し合わせて(ステツプc)、第
5図eに示すような結果(加算値の分布)を得る
演算を行ない、先に求めた中心スポツトの座標
(uo,vo)とこの第5図eに示す分布が極大とな
る点との距離を求め、これを各回折リングの半径
Rrとする(ステツプd)。第5図a〜dに示した
分布を直接用いずに、これらを加算した第5図e
の分布を用いて、各回折リングの半径Rrを求め
たのは、加算により測定誤差が小さくなり、各回
折リングの半径Rrを高精度に求められるからで
ある。
That is, the computer 4 first converts the diffraction image projected onto the image pickup device 2 by the image pickup device 2 into a digital signal using the AD converter 3, captures it, and stores it in a storage section within the computer 4, for example. It is temporarily stored as 512×512 pixel data. Next, the electronic computer 4 reads out this stored image data and determines the radius Rr of the diffraction ring. FIG. 3 shows this step in detail. here,
As mentioned above, the X and Y coordinates are taken in the vertical and horizontal directions of the image, and the intensity of the pixel whose X coordinate is x and Y coordinate is y is expressed as Uxy, and the image shown in Figure 4 is processed. For example, first, the electronic computer 4 calculates 〓 y Uxy for the coordinate x of each pixel (this operation is called the operation of projecting the image onto the X axis), and similarly Also for the pixel coordinate y 〓 x
Uxy is calculated (this operation is called an operation of projecting the image onto the Y axis) (step a). This 〓 y
The values of Uxy and 〓 x Uxy are as shown, for example, by curves A and B in FIG. 4 for the x and y values, respectively, and are maximum at the center position of the center spot. Therefore, if the x and y coordinates of the curves A and B representing the projected intensity are found to have the maximum values, these are the coordinates (uo, vo) of the center spot. In this way, the coordinates of the center spot (uo,
vo) (step b), the pixel value Uxy on the line segment I, m that passes through the coordinates of the center spot and is parallel to the X axis, and the line segment n, s that is parallel to the Y axis (see Figure 4). Read out. If the value Uxy of the pixel on each of these line segments is illustrated with the coordinate axes aligned toward the center position of the center spot, the values a, b, c, and
As shown by d, they have substantially similar shapes to each other, and both have a maximum value at the position of the diffraction ring. Therefore, the electronic computer 4 performs an operation to add up the intensity values shown in FIG. 5 a, b, c, and d (step c) to obtain a result (distribution of added values) as shown in FIG. Then, find the distance between the coordinates (uo, vo) of the center spot found earlier and the point where the distribution shown in Figure 5e is maximum, and calculate this as the radius of each diffraction ring.
Rr (step d). Figure 5 e shows the sum of the distributions shown in Figures 5 a to d, without directly using them.
The reason why the radius Rr of each diffraction ring was determined using the distribution is that the measurement error is reduced by addition, and the radius Rr of each diffraction ring can be determined with high accuracy.

[発明の効果] 上述したように、本発明によれば、自動的に且
つ正確に各回折リング径を求めることが可能にな
る。
[Effects of the Invention] As described above, according to the present invention, it is possible to automatically and accurately determine the diameter of each diffraction ring.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はリング状の回折像を示す図、第2図は
本発明方法を実施するための装置の一例を示す概
略構成図、第3図は回折リングの半径を求めるた
めの流れ図、第4図は画素の射影操作によつて得
られる強度を説明するための図、第5図は中心ス
ポツトの座標(uo,vo)からリングまでの距離
を求める処理を説明するための図である。 1……電子顕微鏡、2……撮像装置、3……
AD変換器、4……電子計算機、5……透過電子
検出器、6……AD変換器、7……外部記憶装
置、8……モニター用CRT、9……キーボード、
10……コンソール用CRT。
Fig. 1 is a diagram showing a ring-shaped diffraction image, Fig. 2 is a schematic configuration diagram showing an example of an apparatus for carrying out the method of the present invention, Fig. 3 is a flowchart for determining the radius of the diffraction ring, and Fig. 4 is a diagram showing a ring-shaped diffraction image. The figure is a diagram for explaining the intensity obtained by the pixel projection operation, and FIG. 5 is a diagram for explaining the process of determining the distance from the coordinates (uo, vo) of the center spot to the ring. 1... Electron microscope, 2... Imaging device, 3...
AD converter, 4...Electronic computer, 5...Transmission electron detector, 6...AD converter, 7...External storage device, 8...CRT for monitor, 9...Keyboard,
10... CRT for console.

Claims (1)

【特許請求の範囲】 1 リング状電子線回折像を電気信号に変換し、
座標x,yに対応する画素の強度をUxyとすると
き、各xについて 〓y Uxyを算出して 〓y Uxyが最大
となる座標xを求めてそれを中心スポツトのx座
標uoとすると共に、各yについて 〓x xyを算出し
て 〓x Uxyが最大となる座標yを求めてそれを中心
スポツトのy座標voとし、この中心スポツトの
座標(uo,vo)を通り回折リングと交差する複
数の直線を設定し、各直線上に存在する画素のう
ち、中心スポツトの座標(uo,vo)から同じ距
離にある画素同志の強度値を加算して、中心スポ
ツトの座標(uo,vo)からの距離に対する前記
加算値の分布を求め、該分布が極大となる点と中
心スポツトの座標(uo,vo)との距離を求め、
これを前記リング状電子線回折像の各回折リング
の半径とすることを特徴とするリング状電子線回
折像の回折リング径測定方法。
[Claims] 1. Converting a ring-shaped electron beam diffraction image into an electrical signal,
When the intensity of the pixel corresponding to the coordinates x and y is Uxy, for each x, calculate 〓 y Uxy, find the coordinate x where 〓 y Uxy is maximum, and set it as the x coordinate uo of the center spot, and For each y, calculate 〓 x xy, find the coordinate y where 〓 Set a straight line of Find the distribution of the added value for the distance, find the distance between the point where the distribution is maximum and the coordinates (uo, vo) of the center spot,
A method for measuring the diameter of a diffraction ring in a ring-shaped electron beam diffraction image, characterized in that this is taken as the radius of each diffraction ring in the ring-shaped electron beam diffraction image.
JP58038623A 1983-03-09 1983-03-09 Automatic analysis of electron-ray diffraction figure Granted JPS59163549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58038623A JPS59163549A (en) 1983-03-09 1983-03-09 Automatic analysis of electron-ray diffraction figure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58038623A JPS59163549A (en) 1983-03-09 1983-03-09 Automatic analysis of electron-ray diffraction figure

Publications (2)

Publication Number Publication Date
JPS59163549A JPS59163549A (en) 1984-09-14
JPH0522174B2 true JPH0522174B2 (en) 1993-03-26

Family

ID=12530362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58038623A Granted JPS59163549A (en) 1983-03-09 1983-03-09 Automatic analysis of electron-ray diffraction figure

Country Status (1)

Country Link
JP (1) JPS59163549A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004264260A (en) * 2003-03-04 2004-09-24 Kyocera Corp Analytical method and analytical device of electron diffraction pattern

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838622A (en) * 1981-04-20 1983-03-07 Keiichiro Yamazaki Method for connecting hollow vertical frame and cross frame in handrail or the like
JPS5838624A (en) * 1981-09-01 1983-03-07 Yamada Dobby Co Ltd Clutch device of transfer feed device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004264260A (en) * 2003-03-04 2004-09-24 Kyocera Corp Analytical method and analytical device of electron diffraction pattern

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Publication number Publication date
JPS59163549A (en) 1984-09-14

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