JPH05304232A - How to fix electronic components with heat sink to radiator - Google Patents
How to fix electronic components with heat sink to radiatorInfo
- Publication number
- JPH05304232A JPH05304232A JP4107685A JP10768592A JPH05304232A JP H05304232 A JPH05304232 A JP H05304232A JP 4107685 A JP4107685 A JP 4107685A JP 10768592 A JP10768592 A JP 10768592A JP H05304232 A JPH05304232 A JP H05304232A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- radiator
- fixing
- thermosetting adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】ヒートシンク付き電子部品のサイズの変更や配
列数の変更に容易に対応できる放熱器へのヒートシンク
付き電子部品の固定方法を提供する。
【構成】放熱器４の取付け凹部４ａの底面上に、熱硬化
型接着剤５を塗布する。放熱器４の取付け凹部４ａの底
面上に、固定すべきヒートシンク付き電子部品３の取付
け位置の周縁に対応して紫外線硬化型接着剤１０を塗布
する。かかる状態で、放熱器４の取付け凹部４ａの底面
上のヒートシンク付き電子部品３の取付け位置に、ヒー
トシンク付き電子部品３をマウントする。次いで、紫外
線を照射し、紫外線硬化型接着剤１０を硬化させ、ヒー
トシンク付き電子部品３を放熱器４に仮固定する。しか
る後、加熱して熱硬化型接着剤５を硬化させ、ヒートシ
ンク付き電子部品３を放熱器４の取付け凹部４ａの底面
上に本固定する。
(57) [Abstract] [Purpose] To provide a method of fixing an electronic component with a heat sink to a radiator, which can easily cope with a change in the size of the electronic component with a heat sink and a change in the number of arrays. [Structure] A thermosetting adhesive 5 is applied on the bottom surface of a mounting recess 4a of a radiator 4. On the bottom surface of the mounting recess 4a of the radiator 4, the ultraviolet curable adhesive 10 is applied so as to correspond to the periphery of the mounting position of the electronic component 3 with a heat sink to be fixed. In this state, the electronic component 3 with a heat sink is mounted at the mounting position of the electronic component 3 with a heat sink on the bottom surface of the mounting recess 4a of the radiator 4. Next, ultraviolet rays are irradiated to cure the ultraviolet curable adhesive 10, and the electronic component 3 with a heat sink is temporarily fixed to the radiator 4. Then, the thermosetting adhesive 5 is cured by heating, and the electronic component 3 with a heat sink is permanently fixed on the bottom surface of the mounting recess 4 a of the radiator 4.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばレクチファイ
ア，レギュレータ，モータコントローラ等に用いられる
トランジスタ，ＳＣＲ，ダイオード等の電子部品がヒー
トシンクに取付けられてなるヒートシンク付き電子部品
を放熱器に熱硬化型接着剤で固定する放熱器へのヒート
シンク付き電子部品の固定方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component with a heat sink, in which electronic components such as transistors, SCRs and diodes used in rectifiers, regulators, motor controllers, etc. are attached to a heat sink and a thermosetting type is used as a radiator. The present invention relates to a method of fixing an electronic component with a heat sink to a radiator fixed with an adhesive.
【０００２】[0002]
【従来の技術】熱硬化型接着剤を用いた従来のこの種の
放熱器へのヒートシンク付き電子部品の固定は、図６
（Ａ）（Ｂ）及び図７に示す位置決めピンを用いる方法
か、図８（Ａ）（Ｂ）及び図９（Ａ）（Ｂ）に示す位置
決め枠を用いる方法により行っていた。2. Description of the Related Art Fixing an electronic component with a heat sink to a conventional radiator of this type using a thermosetting adhesive is shown in FIG.
The method using the positioning pins shown in FIGS. 8A and 8B or the method using the positioning frame shown in FIGS. 8A, 8B and 9A is used.
【０００３】まず、図６（Ａ）（Ｂ）及び図７に示す位
置決めピンを用いる方法について説明する。この方法
は、トランジスタ，ＳＣＲ，ダイオード等の電子部品１
がヒートシンク２に取付けられてなるヒートシンク付き
電子部品３を、放熱器４に固定するに際し、まず放熱器
４の取付け凹部４ａの底面上の該ヒートシンク付き電子
部品３の固定位置に熱硬化型接着剤５を塗布し、この熱
硬化型接着剤５を介して放熱器４の取付け位置にヒート
シンク付き電子部品３をマウントする。次いで、該ヒー
トシンク付き電子部品３と放熱器４とに予め設けた位置
決め孔６，７に位置決めピン８を挿入して該ヒートシン
ク付き電子部品３を放熱器４に仮固定する。かかる状態
で、加熱して熱硬化型接着剤５を硬化させる。なお、１
ａは電子部品１の端子、４ｂは放熱器４の放熱フィンで
ある。First, a method of using the positioning pin shown in FIGS. 6A and 6B and FIG. 7 will be described. This method is used for electronic components such as transistors, SCRs and diodes.
When fixing the electronic component 3 with a heat sink attached to the heat sink 2 to the radiator 4, first, a thermosetting adhesive is applied to the fixing position of the electronic component 3 with a heat sink on the bottom surface of the mounting recess 4 a of the radiator 4. 5 is applied, and the electronic component 3 with a heat sink is mounted at the mounting position of the radiator 4 via the thermosetting adhesive 5. Next, the positioning pin 8 is inserted into the positioning holes 6 and 7 provided in advance in the electronic component 3 with the heat sink and the radiator 4 to temporarily fix the electronic component 3 with the heat sink to the radiator 4. In this state, heat is applied to cure the thermosetting adhesive 5. 1
Reference numeral a is a terminal of the electronic component 1, and reference numeral 4b is a heat radiation fin of the radiator 4.
【０００４】次に、図８（Ａ）（Ｂ）及び図９（Ａ）
（Ｂ）に示す位置決め枠を用いる方法について説明す
る。この方法は、ヒートシンク付き電子部品３を、放熱
器４に固定するに際し、まず放熱器４の取付け凹部４ａ
の底面上の該ヒートシンク付き電子部品３の固定位置に
熱硬化型接着剤５を塗布し、この熱硬化型接着剤５を介
して放熱器４の取付け位置にヒートシンク付き電子部品
３をマウントする。次いで、予め作成した仮固定枠９を
放熱器４の取付け凹部４ａの立上り面とヒートシンク付
き電子部品３の外周との間に嵌めて該ヒートシンク付き
電子部品３を放熱器４に仮固定する。かかる状態で、加
熱して熱硬化型接着剤５を硬化させる。Next, FIGS. 8A and 8B and FIG. 9A
A method of using the positioning frame shown in (B) will be described. According to this method, when fixing the electronic component 3 with the heat sink to the radiator 4, first, the mounting recess 4a of the radiator 4 is attached.
The thermosetting adhesive 5 is applied to the fixing position of the electronic component 3 with the heat sink on the bottom surface of the above, and the electronic component 3 with the heat sink is mounted at the attaching position of the radiator 4 via the thermosetting adhesive 5. Next, the previously prepared temporary fixing frame 9 is fitted between the rising surface of the mounting recess 4 a of the radiator 4 and the outer periphery of the electronic component 3 with a heat sink to temporarily fix the electronic component 3 with a heat sink to the radiator 4. In this state, heat is applied to cure the thermosetting adhesive 5.
【０００５】このように位置決めピン８や位置決め枠９
を用いるのは、熱硬化型接着剤５を加熱して硬化させる
際の加熱初期に、熱硬化型接着剤５の樹脂粘度が低下す
るので、振動や傾斜によってヒートシンク付き電子部品
３が動き、位置精度が確保できないためである。In this way, the positioning pin 8 and the positioning frame 9
The resin viscosity of the thermosetting adhesive 5 decreases at the initial stage of heating when the thermosetting adhesive 5 is heated and cured, so that the electronic component 3 with a heat sink moves due to vibration or inclination, This is because accuracy cannot be secured.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の放熱器へのヒートシンク付き電子部品の固定
方法では、ヒートシンク付き電子部品３の位置決めのた
め位置決めピン８や仮固定枠９の如き専用の位置決め部
品が必要になり、このためヒートシンク付き電子部品３
のサイズの変更や配列数の変更に対応できない問題点が
あった。However, in such a conventional method for fixing the electronic component with the heat sink to the radiator, a dedicated pin such as the positioning pin 8 or the temporary fixing frame 9 is used for positioning the electronic component 3 with the heat sink. Positioning components are required, and therefore electronic components with heat sink 3
There was a problem that it was not possible to cope with the change of the size and the number of arrays.
【０００７】本発明の目的は、ヒートシンク付き電子部
品のサイズの変更や配列数の変更に容易に対応できる放
熱器へのヒートシンク付き電子部品の固定方法を提供す
ることにある。It is an object of the present invention to provide a method of fixing an electronic component with a heat sink to a radiator, which can easily cope with a change in the size of the electronic component with a heat sink and a change in the number of arrangements.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成する本
発明の手段を説明すると、次の通りである。The means of the present invention for achieving the above object will be described below.
【０００９】請求項１に記載の発明は、ヒートシンク付
き電子部品を放熱器に熱硬化型接着剤で固定する放熱器
へのヒートシンク付き電子部品の固定方法において、前
記放熱器に前記ヒートシンク付き電子部品を前記熱硬化
型接着剤で固定する際に、前記放熱器に前記ヒートシン
ク付き電子部品を紫外線硬化型接着剤で仮固定してお
き、かかる状態で前記熱硬化型接着剤を加熱して硬化さ
せることを特徴とする。According to a first aspect of the present invention, there is provided a method for fixing an electronic component with a heat sink to a radiator by fixing the electronic component with a heat sink to the radiator with a thermosetting adhesive. When fixing the thermosetting adhesive with the thermosetting adhesive, the heat sink-equipped electronic component is temporarily fixed to the radiator with the ultraviolet curing adhesive, and the thermosetting adhesive is heated and cured in this state. It is characterized by
【００１０】請求項２に記載の発明は、請求項１におい
て、前記熱硬化型接着剤として絶縁粒子を混入した絶縁
粒子入り熱硬化型接着剤を用いることを特徴とする。A second aspect of the present invention is characterized in that, in the first aspect, a thermosetting adhesive containing insulating particles mixed with insulating particles is used as the thermosetting adhesive.
【００１１】[0011]
【作用】請求項１に記載のように、放熱器にヒートシン
ク付き電子部品を熱硬化型接着剤で固定する際に、放熱
器にヒートシンク付き電子部品を紫外線硬化型接着剤で
仮固定し、この状態で熱硬化型接着剤を加熱して硬化さ
せると、位置決めピンの如き専用の位置決め部品を用い
ないでも熱硬化型接着剤の硬化を行わせることができ
る。According to the first aspect of the present invention, when the electronic component with the heat sink is fixed to the radiator with the thermosetting adhesive, the electronic component with the heat sink is temporarily fixed with the ultraviolet curing adhesive. When the thermosetting adhesive is heated and cured in this state, the thermosetting adhesive can be cured without using a dedicated positioning component such as a positioning pin.
【００１２】また、このような紫外線硬化型接着剤と熱
硬化型接着剤とを用いた固定方法によれば、ヒートシン
ク付き電子部品のサイズの変更や配列数の変更に容易に
対応することができる。Further, according to the fixing method using such an ultraviolet curable adhesive and a thermosetting adhesive, it is possible to easily cope with a change in the size and the number of arrangement of the electronic components with a heat sink. ..
【００１３】特に、紫外線硬化型接着剤は熱を加えない
で硬化させることができるので、該紫外線硬化型接着剤
の硬化時にヒートシンク付き電子部品が動くのを防止す
ることができる。In particular, since the ultraviolet curable adhesive can be cured without applying heat, it is possible to prevent the electronic component with the heat sink from moving during curing of the ultraviolet curable adhesive.
【００１４】請求項２に記載のように、絶縁粒子が混入
されている電気絶縁性接着剤を用いると、該絶縁粒子に
よりヒートシンクと放熱器との電気絶縁間隔を確実に保
持することができる。When an electrically insulating adhesive containing insulating particles is used as described in the second aspect, the electrically insulating space between the heat sink and the radiator can be reliably maintained by the insulating particles.
【００１５】[0015]
【実施例】以下、本発明の各実施例を図を参照して詳細
に説明する。なお、前述した図６（Ａ）（Ｂ）及び図７
と対応する部分には、同一符号を付けて示している。Embodiments of the present invention will now be described in detail with reference to the drawings. In addition, the above-mentioned FIG. 6 (A) (B) and FIG.
The same reference numerals are given to the portions corresponding to.
【００１６】図１（Ａ）（Ｂ）及び図２は、本発明に係
る放熱器へのヒートシンク付き電子部品の固定方法の第
１実施例を示したものである。その工程に従って順次説
明する。FIGS. 1A and 1B and FIG. 2 show a first embodiment of a method of fixing an electronic component with a heat sink to a radiator according to the present invention. The steps will be sequentially described.
【００１７】（１）放熱器４の取付け凹部４ａの底面上
に、熱硬化型接着剤５を塗布する。(1) A thermosetting adhesive 5 is applied on the bottom surface of the mounting recess 4a of the radiator 4.
【００１８】（２）また、該放熱器４の取付け凹部４ａ
の底面上に、固定すべきヒートシンク付き電子部品３の
取付け位置の周縁に対応して紫外線硬化型接着剤１０を
塗布する。(2) Also, the mounting recess 4a of the radiator 4
The ultraviolet curable adhesive 10 is applied to the bottom surface of the above, corresponding to the periphery of the attachment position of the electronic component 3 with a heat sink to be fixed.
【００１９】（３）かかる状態で、該放熱器４の取付け
凹部４ａの底面上のヒートシンク付き電子部品３の取付
け位置に、該ヒートシンク付き電子部品３をマウントす
る。(3) In this state, the electronic component 3 with a heat sink is mounted at the mounting position of the electronic component 3 with a heat sink on the bottom surface of the mounting recess 4a of the radiator 4.
【００２０】（４）次いで、該放熱器４の取付け凹部４
ａに紫外線を照射し、紫外線硬化型接着剤１０を硬化さ
せ、ヒートシンク付き電子部品３を放熱器４に仮固定す
る。(4) Next, the mounting recess 4 of the radiator 4
A is irradiated with ultraviolet rays to cure the ultraviolet curable adhesive 10, and the electronic component 3 with a heat sink is temporarily fixed to the radiator 4.
【００２１】（５）しかる後、該放熱器４の取付け凹部
４ａを加熱し、熱硬化型接着剤５を硬化させ、ヒートシ
ンク付き電子部品３を該放熱器４の取付け凹部４ａの底
面上に本固定する。(5) Then, the mounting recess 4a of the radiator 4 is heated to cure the thermosetting adhesive 5 and the electronic component 3 with a heat sink is placed on the bottom surface of the mounting recess 4a of the radiator 4. Fix it.
【００２２】このように、放熱器４にヒートシンク付き
電子部品３を熱硬化型接着剤５で固定する際に、放熱器
４にヒートシンク付き電子部品３を紫外線硬化型接着剤
１０で仮固定し、この状態で熱硬化型接着剤５を加熱し
て硬化させると、位置決めピンの如き専用の位置決め部
品を用いないでも熱硬化型接着剤５の硬化を行わせるこ
とができる。Thus, when fixing the electronic component 3 with a heat sink to the radiator 4 with the thermosetting adhesive 5, the electronic component 3 with a heat sink is temporarily fixed to the radiator 4 with the ultraviolet curing adhesive 10, When the thermosetting adhesive 5 is heated and cured in this state, the thermosetting adhesive 5 can be cured without using a dedicated positioning component such as a positioning pin.
【００２３】また、このような紫外線硬化型接着剤１０
と熱硬化型接着剤５とを用いた固定方法によれば、ヒー
トシンク付き電子部品３のサイズの変更や配列数の変更
に容易に対応することができる。Further, such an ultraviolet curable adhesive 10 is used.
According to the fixing method using the thermosetting adhesive 5 and the thermosetting adhesive 5, it is possible to easily cope with a change in size of the electronic component 3 with a heat sink and a change in the number of arrays.
【００２４】特に、紫外線硬化型接着剤１０は熱を加え
ないで硬化させることができるので、該紫外線硬化型接
着剤１０の硬化時にヒートシンク付き電子部品３が動く
のを防止することができる。In particular, since the ultraviolet curable adhesive 10 can be cured without applying heat, it is possible to prevent the electronic component 3 with the heat sink from moving when the ultraviolet curable adhesive 10 is cured.
【００２５】図３は、本発明に係る放熱器へのヒートシ
ンク付き電子部品の固定方法の第２実施例を示したもの
である。FIG. 3 shows a second embodiment of a method of fixing an electronic component with a heat sink to a radiator according to the present invention.
【００２６】本実施例では、熱硬化型接着剤５によるヒ
ートシンク付き電子部品３の固定に際し、絶縁粒子１１
を混入した熱硬化型接着剤５を用い、ヒートシンク付き
電子部品３を該絶縁粒子１１を混入した熱硬化型接着剤
５を介して放熱器４に電気絶縁して固定する。絶縁粒子
１１としては、例えば、粒度が80〜120 μm 程度のシリ
カ粒子やアルミナ粒子の如きフィラーを用いる。熱硬化
型接着剤５としては、例えばエポキシ樹脂を用いる。In this embodiment, when fixing the electronic component 3 with the heat sink by the thermosetting adhesive 5, insulating particles 11 are used.
The thermosetting adhesive 5 mixed with is used to electrically insulate and fix the heat sink-equipped electronic component 3 to the radiator 4 via the thermosetting adhesive 5 mixed with the insulating particles 11. As the insulating particles 11, for example, a filler such as silica particles or alumina particles having a particle size of about 80 to 120 μm is used. As the thermosetting adhesive 5, for example, epoxy resin is used.
【００２７】このように絶縁粒子１１を混入した熱硬化
型接着剤５を用いてヒートシンク付き電子部品３を放熱
器４に固定すると、該絶縁粒子１１によりヒートシンク
２と放熱器４との間の所要の電気絶縁間隔Ｈを確実に保
持することができる。When the electronic component 3 with a heat sink is fixed to the radiator 4 by using the thermosetting adhesive 5 mixed with the insulating particles 11 as described above, the insulating particles 11 provide a required space between the heat sink 2 and the radiator 4. The electrical insulation distance H can be reliably maintained.
【００２８】図４（Ａ）（Ｂ）及び図５は、本発明に係
る放熱器へのヒートシンク付き電子部品の固定方法の第
３実施例を示したものである。本実施例では、ヒートシ
ンク付き電子部品３は、ヒートシンク２にパワートラン
ジスタの如き１個の電子部品１が固定されている例を示
したものである。このようなものでも、第１実施例と同
様にして、ヒートシンク付き電子部品３を紫外線硬化型
接着剤１０と熱硬化型接着剤５とを用いて放熱器４に固
定することができる。また、このときにも絶縁粒子１１
を混入した熱硬化型接着剤５を用いることができる。FIGS. 4 (A), (B) and FIG. 5 show a third embodiment of a method for fixing an electronic component with a heat sink to a radiator according to the present invention. In the present embodiment, the electronic component 3 with a heat sink shows an example in which one electronic component 1 such as a power transistor is fixed to the heat sink 2. Even in such a case, the electronic component 3 with a heat sink can be fixed to the radiator 4 by using the ultraviolet curable adhesive 10 and the thermosetting adhesive 5 as in the first embodiment. Also at this time, the insulating particles 11
It is possible to use a thermosetting adhesive 5 in which is mixed.
【００２９】[0029]
【発明の効果】以上説明したように本発明に係る放熱器
へのヒートシンク付き電子部品の固定方法によれば、下
記のような効果を得ることができる。As described above, according to the method of fixing the electronic component with the heat sink to the radiator according to the present invention, the following effects can be obtained.
【００３０】請求項１に記載の発明では、放熱器にヒー
トシンク付き電子部品を熱硬化型接着剤で固定する際
に、放熱器にヒートシンク付き電子部品を紫外線硬化型
接着剤で仮固定し、この状態で熱硬化型接着剤を加熱し
て硬化させるので、位置決めピンの如き専用の位置決め
部品を用いないでも熱硬化型接着剤の硬化を行わせるこ
とができる。According to the first aspect of the present invention, when fixing the electronic component with the heat sink to the radiator with the thermosetting adhesive, the electronic component with the heat sink is temporarily fixed with the ultraviolet curing adhesive, Since the thermosetting adhesive is heated and cured in this state, the thermosetting adhesive can be cured without using a dedicated positioning component such as a positioning pin.
【００３１】また、このような紫外線硬化型接着剤と熱
硬化型接着剤とを用いた固定方法によれば、ヒートシン
ク付き電子部品のサイズの変更や配列数の変更に容易に
対応することができる。Further, according to the fixing method using such an ultraviolet curable adhesive and a thermosetting adhesive, it is possible to easily cope with a change in the size and the number of arrangement of the electronic components with a heat sink. ..
【００３２】特に、紫外線硬化型接着剤は熱を加えない
で硬化させることができるので、ヒートシンク付き電子
部品の動きを防止して仮固定を行うことができる。In particular, since the ultraviolet curable adhesive can be cured without applying heat, it is possible to prevent movement of the electronic component with the heat sink and perform temporary fixing.
【００３３】更に、このような固定方法によれば、ロボ
ット等でヒートシンク付き電子部品のマウント作業を行
うことができるため、配列数や配列方向など柔軟な対応
が可能となる。Further, according to such a fixing method, the mounting work of the electronic component with the heat sink can be carried out by the robot or the like, so that it becomes possible to flexibly deal with the number of arrangements and the arrangement direction.
【００３４】請求項２に記載の発明では、絶縁粒子が混
入されている電気絶縁性接着剤を用いるので、該絶縁粒
子によりヒートシンクと放熱器との電気絶縁間隔を確実
に保持することができる。According to the second aspect of the invention, since the electrically insulating adhesive agent containing the insulating particles is used, the electrically insulating space between the heat sink and the radiator can be reliably maintained by the insulating particles.
【図面の簡単な説明】[Brief description of drawings]
【図１】（Ａ）（Ｂ）は本発明に係る放熱器へのヒート
シンク付き電子部品の固定方法の第１実施例を示す平面
図及び側面図である。1A and 1B are a plan view and a side view showing a first embodiment of a method for fixing an electronic component with a heat sink to a radiator according to the present invention.
【図２】図１（Ａ）のＸ−Ｘ線拡大断面図である。FIG. 2 is an enlarged cross-sectional view taken along line XX of FIG.
【図３】本発明に係る放熱器へのヒートシンク付き電子
部品の固定方法の第２実施例を示す縦断面図である。FIG. 3 is a vertical cross-sectional view showing a second embodiment of a method of fixing an electronic component with a heat sink to a radiator according to the present invention.
【図４】（Ａ）（Ｂ）は本発明に係る放熱器へのヒート
シンク付き電子部品の固定方法の第３実施例を示す平面
図及び側面図である。4A and 4B are a plan view and a side view showing a third embodiment of a method for fixing an electronic component with a heat sink to a radiator according to the present invention.
【図５】図４で用いているヒートシンク付き電子部品の
斜視図である。5 is a perspective view of an electronic component with a heat sink used in FIG. 4. FIG.
【図６】（Ａ）（Ｂ）は従来の放熱器へのヒートシンク
付き電子部品の固定方法を示す平面図及び側面図であ
る。6A and 6B are a plan view and a side view showing a method for fixing an electronic component with a heat sink to a conventional radiator.
【図７】図６（Ａ）のＹ−Ｙ線拡大断面図である。FIG. 7 is an enlarged cross-sectional view taken along the line YY of FIG.
【図８】（Ａ）（Ｂ）は従来の放熱器へのヒートシンク
付き電子部品の固定方法の他の例を示す平面図及び側面
図である。8A and 8B are a plan view and a side view showing another example of a method of fixing an electronic component with a heat sink to a conventional radiator.
【図９】（Ａ）（Ｂ）は図８の固定方法で用いる固定枠
の２種の例を示す平面図ある。9A and 9B are plan views showing two examples of a fixing frame used in the fixing method of FIG.
１…電子部品、１ａ…端子、２…ヒートシンク、３…ヒ
ートシンク付き電子部品、４…放熱器、５…熱硬化型接
着剤、１０…紫外線硬化型接着剤。DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Terminal, 2 ... Heat sink, 3 ... Electronic component with a heat sink, 4 ... Radiator, 5 ... Thermosetting adhesive, 10 ... Ultraviolet curing adhesive.
Claims (2)
硬化型接着剤で固定する放熱器へのヒートシンク付き電
子部品の固定方法において、 前記放熱器に前記ヒートシンク付き電子部品を前記熱硬
化型接着剤で固定する際に、前記放熱器に前記ヒートシ
ンク付き電子部品を紫外線硬化型接着剤で仮固定してお
き、かかる状態で前記熱硬化型接着剤を加熱して硬化さ
せることを特徴とする放熱器へのヒートシンク付き電子
部品の固定方法。1. A method of fixing an electronic component with a heat sink to a radiator by fixing the electronic component with a heat sink to the radiator with a thermosetting adhesive, wherein the electronic component with a heat sink is attached to the radiator. When fixing with, the electronic component with the heat sink is temporarily fixed to the radiator with an ultraviolet curable adhesive, and the thermosetting adhesive is heated and cured in such a state. Method of fixing electronic components with heat sink to the.
入した絶縁粒子入り熱硬化型接着剤を用いることを特徴
とする請求項１に記載の放熱器へのヒートシンク付き電
子部品の固定方法。2. The method of fixing an electronic component with a heat sink to a radiator according to claim 1, wherein a thermosetting adhesive containing insulating particles mixed with insulating particles is used as the thermosetting adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107685A JP2770646B2 (en) | 1992-04-27 | 1992-04-27 | How to fix electronic components with heat sink to radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107685A JP2770646B2 (en) | 1992-04-27 | 1992-04-27 | How to fix electronic components with heat sink to radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05304232A true JPH05304232A (en) | 1993-11-16 |
| JP2770646B2 JP2770646B2 (en) | 1998-07-02 |
Family
ID=14465376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4107685A Expired - Fee Related JP2770646B2 (en) | 1992-04-27 | 1992-04-27 | How to fix electronic components with heat sink to radiator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2770646B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006233153A (en) * | 2005-02-28 | 2006-09-07 | Nec Tokin Corp | Assembly connection method of work |
| WO2007138681A1 (en) | 2006-05-30 | 2007-12-06 | Kokusan Denki Co., Ltd. | Resin-sealed semiconductor device and electronic device using such semiconductor device |
| JP2011066281A (en) * | 2009-09-18 | 2011-03-31 | Tokai Rika Co Ltd | Heat generating device |
| JP2011066282A (en) * | 2009-09-18 | 2011-03-31 | Tokai Rika Co Ltd | Heat generating device apparatus |
-
1992
- 1992-04-27 JP JP4107685A patent/JP2770646B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006233153A (en) * | 2005-02-28 | 2006-09-07 | Nec Tokin Corp | Assembly connection method of work |
| WO2007138681A1 (en) | 2006-05-30 | 2007-12-06 | Kokusan Denki Co., Ltd. | Resin-sealed semiconductor device and electronic device using such semiconductor device |
| JP2011066281A (en) * | 2009-09-18 | 2011-03-31 | Tokai Rika Co Ltd | Heat generating device |
| JP2011066282A (en) * | 2009-09-18 | 2011-03-31 | Tokai Rika Co Ltd | Heat generating device apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2770646B2 (en) | 1998-07-02 |
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