JPH0532357B2 - - Google Patents
Info
- Publication number
- JPH0532357B2 JPH0532357B2 JP27366785A JP27366785A JPH0532357B2 JP H0532357 B2 JPH0532357 B2 JP H0532357B2 JP 27366785 A JP27366785 A JP 27366785A JP 27366785 A JP27366785 A JP 27366785A JP H0532357 B2 JPH0532357 B2 JP H0532357B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina substrate
- coating
- plating
- coated
- adhesive strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000576 coating method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000007733 ion plating Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はアルミナ基板へのCuコーテイング方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for coating an alumina substrate with Cu.
（従来の技術）
従来、アルミナ基板へCuをコーテイングする
には、無電解Cuめつきを12μコーテイングする
か、又はイオンプレーテイングにてCuを3μコー
テイングした後、電解Cuめつきを12μするか、若
しくはイオンプレーテイングにてCuを3μコーテ
イングした後、N2とH2との混合雰囲気中1050℃
にて10分間熱処理し、然る後電解Cuめつきを12μ
コーテイングしていた。(Prior art) Conventionally, in order to coat an alumina substrate with Cu, it is necessary to apply electroless Cu plating to 12μ, or to coat Cu by ion plating to 3μ, and then apply electrolytic Cu plating to 12μ. Alternatively, after coating 3μ of Cu using ion plating, heat treatment at 1050℃ in a mixed atmosphere of N 2 and H 2 .
Heat treated for 10 minutes, then electrolytically plated with 12μ
It was coated.
（発明が解決しようとする問題点）
ところで、アルミナとCuとの界面でCuが酸化
アルミナとなじむことがない為、Cuめつきはア
ルミナとの界面での付着力が低い。従つて、上記
のいずれのCuコーテイング方法もCuの接着強度
が弱いものである。(Problems to be Solved by the Invention) By the way, since Cu does not mix with alumina oxide at the interface between alumina and Cu, Cu plating has a low adhesion force at the interface with alumina. Therefore, in any of the above-mentioned Cu coating methods, the adhesive strength of Cu is weak.
そこで本発明は、アルミナ基板に対するCuの
接着強度を高くできるCUコーテイング方法を提
供しようとするものである。 Therefore, the present invention aims to provide a CU coating method that can increase the adhesive strength of Cu to an alumina substrate.
（問題点を解決するための手段）
上記問題点を解決するための本発明によるアル
ミナ基板へのCuコーテイング方法は、アルミナ
基板へ乾式めつきにてMoを10Å〜1000Åコーテ
イングした後、Cuをコーテイングすることを特
徴とする。(Means for solving the problem) The method of coating an alumina substrate with Cu according to the present invention in order to solve the above problem is to coat the alumina substrate with Mo to a thickness of 10 Å to 1000 Å by dry plating, and then coat the alumina substrate with Cu. It is characterized by
本発明のCuコーテイング方法に於いて、アル
ミナ基板へ電解めつきにてCuをコーテイングす
る前に、アルミナ基板へイオンプレーテイング、
スパツタリング、蒸着等の乾式めつきにてMoを
10Å〜1000Åコーテイングする理由は、アルミナ
基板とCuとの接着強度を高くする為で、10Å未
満ではその効果が無く、1000Åを超えるとそれ以
上接着強度の向上がみられなくなるからである。 In the Cu coating method of the present invention, before coating the alumina substrate with Cu by electrolytic plating, ion plating is performed on the alumina substrate.
Mo is applied by dry plating such as sputtering or vapor deposition.
The reason for applying a coating of 10 Å to 1000 Å is to increase the adhesive strength between the alumina substrate and Cu; if it is less than 10 Å, there is no effect, and if it exceeds 1000 Å, no further improvement in adhesive strength can be seen.
（作用）
上記のように本発明のCuコーテイング方法は、
アルミナ基板へCuをコーテイングする前にMoを
コーテイングするので、Cuはアルミナ基板と僅
かに酸化物を作るなじみの良好なMoを介してア
ルミナ基板と接着され、またCuとMoとは金属同
志で良好に付着する。従つてアルミナ基板に対す
るCuの接着強度が著しく高くなる。(Function) As mentioned above, the Cu coating method of the present invention
Since Mo is coated before coating Cu on the alumina substrate, Cu is bonded to the alumina substrate through Mo, which has good compatibility and forms a slight oxide with the alumina substrate, and Cu and Mo are good metal comrades. Attach to. Therefore, the adhesion strength of Cu to the alumina substrate is significantly increased.
（実施例）
本発明によるアルミナ基板へのCuコーテイン
グ方法の一実施例を説明すると、縦25.4mm、横
25.4mm、厚さ１mmの96％アルミナ基板へ、イオン
プレーテイングにてMoを50Åコーテイングし、
さらにCuを3μコーテイングした後、電解めつき
にてCuを12μコーテイングした。(Example) To explain one example of the method of Cu coating on an alumina substrate according to the present invention,
A 25.4mm, 1mm thick 96% alumina substrate was coated with 50Å of Mo using ion plating.
Further, after coating with 3μ of Cu, a coating of 12μ of Cu was applied by electrolytic plating.
このCuコーテイングのアルミナ基板と、従来
のMo層を介在しないCu12μコーテイングのアル
ミナ基板とを剥離試験により、Cuめつきの接着
強度を測定した処、従来のCuコーテイングアル
ミナ基板におけるCuめつきの接着強度が0.5Kg／
mm2以下であつたのに対し、実施例のCuコーテイ
ングアルミナ基板におけるCuめつきの接着強度
は2.0Kg／mm2以上で、著しく高かつた。 The adhesion strength of Cu plating was measured by a peel test between this Cu-coated alumina substrate and a conventional alumina substrate with Cu12μ coating without an intervening Mo layer, and it was found that the adhesion strength of Cu plating on the conventional Cu-coated alumina substrate was 0.5. Kg/
mm 2 or less, whereas the Cu plating adhesive strength of the Cu-coated alumina substrate of the example was 2.0 Kg/mm 2 or more, which was extremely high.
次に本発明によるアルミナ基板へのCuコーテ
イング方法の他の実施例について説明すると、縦
25.4mm、横25.4mm、厚さ１mmの96％アルミナ基板
へ、イオンプレーテイングにてMoを50Åコーテ
イングし、さらCuを3μコーテイングした後、N2
−H23％雰囲気中にて1050℃、10分間処理し、然
る後電解めつきにてCuを12μコーテイングした。
このCuコーテイングのアルミナ基板と、従来の
Mo層を介在しないCu12μコーテイングのアルミ
ナ基板とを、剥離試験により、Cuめつきの接着
強度を測定した処、従来のCuコーテイングアル
ミナ基板におけるCuめつきの接着強度が0.5Kg／
mm2以下であつたのに対し、実施例のCuコーテイ
ングアルミナ基板におけるCuめつきの接着強度
は2.0Kg／mm2以上で、著しく高かつた。 Next, another example of the method of coating an alumina substrate with Cu according to the present invention will be described.
A 96% alumina substrate measuring 25.4 mm wide, 25.4 mm wide, and 1 mm thick was coated with 50 Å of Mo using ion plating, and further coated with 3 μ of Cu, followed by N 2
-H 2 3% atmosphere at 1050° C. for 10 minutes, and then a 12 μm coating of Cu was applied by electrolytic plating.
This Cu-coated alumina substrate and conventional
When the adhesive strength of Cu plating was measured by a peel test between a Cu12μ coated alumina substrate without a Mo layer, the adhesive strength of Cu plating on a conventional Cu coated alumina substrate was 0.5Kg/
mm 2 or less, whereas the Cu plating adhesive strength of the Cu-coated alumina substrate of the example was 2.0 Kg/mm 2 or more, which was extremely high.
（発明の効果）
以上の説明で判るように本発明のアルミナ基板
へのCuコーテイング方法は、アルミナ基板へCu
コーテイングを施す前に、乾式めつきにてMoを
10Å〜1000Åコーテイングするので、その後施し
たCuコーテイングはMoがアルミナ基板と僅かに
酸化物を作りなじみがよい為、該Moの層を介在
してセラミツク基板と良好に付着して、Cuの接
着強度が著しく高いCuコーテイングアルミナ基
板を得ることができる。(Effects of the Invention) As can be seen from the above explanation, the method for coating an alumina substrate with Cu of the present invention is effective for coating an alumina substrate with Cu.
Before applying coating, remove Mo using dry plating.
Since the coating is applied with a thickness of 10 Å to 1000 Å, the Cu coating that is applied afterwards has good adhesion to the ceramic substrate through the Mo layer because Mo forms a slight oxide with the alumina substrate, increasing the adhesive strength of Cu. It is possible to obtain a Cu-coated alumina substrate with significantly high Cu coating.
Claims (1)
1000Åコーテイングした後、Cuをコーテイング
することを特徴とするアルミナ基板へのCuコー
テイング方法。1 Mo 10Å ~ 10Å by dry plating on an alumina substrate
A method for coating an alumina substrate with Cu, which is characterized by coating an alumina substrate with Cu after coating with a thickness of 1000Å.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27366785A JPS62132790A (en) | 1985-12-05 | 1985-12-05 | Method of coating cu on alumina substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27366785A JPS62132790A (en) | 1985-12-05 | 1985-12-05 | Method of coating cu on alumina substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62132790A JPS62132790A (en) | 1987-06-16 |
| JPH0532357B2 true JPH0532357B2 (en) | 1993-05-14 |
Family
ID=17530867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27366785A Granted JPS62132790A (en) | 1985-12-05 | 1985-12-05 | Method of coating cu on alumina substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62132790A (en) |
-
1985
- 1985-12-05 JP JP27366785A patent/JPS62132790A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62132790A (en) | 1987-06-16 |
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