JPH0543475B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a through-hole forming apparatus for ceramic multilayer wiring boards, etc., and particularly relates to a through-hole forming apparatus for forming a plurality of through holes on a ceramic green sheet. It is.

[Prior Art] Ceramic multilayer wiring boards have been put into practical use as high-density mounting boards for large computers, supercomputers, and the like, and are expected to become even more popular in the future. One of the manufacturing processes for the ceramic multilayer wiring board is the process of drilling holes in the ceramic green sheet.

Conventionally, a through-hole forming device as shown in FIG. 5 has been used to make holes in ceramic green sheets. In this device, a drilling head 51 supported by a head support block 50 is attached to a head movement stage 53 via a linear guide 52, and is moved up and down by a linear solenoid 54 to remove the ceramic green below. Make a hole in the sheet.

[Problems to be Solved by the Invention] However, in the above structure, the head is attached to the head movement stage through a large number of parts, so it is not easy to align the drilling pins and the lower die.
Furthermore, since the drilling pin is driven up and down by a linear solenoid, there are problems such as difficulty in adjusting the vertical position of the drilling pin relative to the green sheet.

The purpose of the present invention is to eliminate such problems,
It is an object of the present invention to provide a through-hole forming device which can greatly reduce the number of manufacturing steps and which can extremely easily adjust the vertical position of a lower die relative to a drilling pin.

[Means for Solving the Problems] The present invention provides a drilling head equipped with a flight pin and a drilling pin operated by a laminated piezoelectric element, and a guide plate that guides the drilling pin below the drilling head. a cassette plate provided below the guide plate for fixing the ceramic green sheet; and a cassette plate having a hole larger in diameter than the drilling pin and arranged below the cassette plate via the ceramic green sheet. a vertically moving mechanism section having a first driving means for vertically moving the lower mold with respect to the drilling head and the guide plate; A head moving mechanism section that is provided with a head moving stage that supports the moving mechanism section, a presser plate that fixes the drilling head, and a second driving means, and that moves in the X direction, a ceramic green sheet moving stage that supports the cassette plate, and a green sheet moving mechanism section that includes a third drive means and that moves the cassette board in the Y direction; a first drive section that controls the energization timing of the laminated piezoelectric element that operates the flight pin; and a first drive means for the vertical movement mechanism section; The through-hole forming apparatus is characterized in that it comprises a control section that controls a second driving means of the head moving mechanism section and a third driving means of the green sheet moving mechanism section.

Note that the above-mentioned X direction and Y direction are two directions that are substantially horizontal and orthogonal to each other.

[Function] In the present invention, the ceramic green sheet is fixed to the cassette plate below the drilling head, and the drilling head is moved in the X direction by the head movement mechanism and in the Y direction by the green sheet movement mechanism. The cassette plate is positioned by moving the cassette plate. The drilling head is equipped with a flight pin and a drilling pin, and when the laminated piezoelectric element is energized, the drilling pin is guided by the guide plate and performs a drilling operation on the green sheet below.

A lower die is placed below the cassette plate, and the lower die can be moved up and down by a cam mechanism driven by a stepping motor, which greatly reduces the man-hours required for manufacturing the device. Height can be easily adjusted.

Positioning in the X and Y directions, vertical movement of the head, and timing of energization are controlled by a control section.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIGS. 1, 2, 3, and 4 are diagrams for explaining an embodiment of the present invention, and FIG. 1 shows an embodiment of a through-hole forming apparatus used in the present invention. Partially exploded perspective view, Figure 2 is a sectional view of the central part of the drilling head shown in Figure 1, Figure 3 is a perspective view of the drilling head, and Figure 4 is an enlarged view of the drilling pin shown in Figure 2. FIG. First, to explain the drilling head, as shown in FIG. It is mainly composed of a drilling pin 5 connected to.
That is, one end of the laminated piezoelectric element 2 is fixed to the upper end of the inner surface of the U-shaped casing 1, and both ends of the concave leaf spring 3 are fixed to both corners of the lower inner surface of the casing 1. . The upper surface of the central part of the leaf spring 3 is made of a material with a spherical tip and high hardness and high repulsion (here, a superhard material).
A flight pin 4 formed of
The spherical tip of the fly pie 4 is pressurized and in contact with one end of the laminated piezoelectric element 2 that is not fixed. A hole pin 5 integrally constructed with the flight pin 4 is fixed to the lower surface of the center of the leaf spring 3 so as to pass through the center portion of the leaf spring 3.

As shown in FIG. 4, the drilling pin 5 is loosely fitted into the hole 601 of the guide plate 6 and guided. A lower mold support plate 7 is arranged below the drilling pin 5,
A lower die 8 is fixed to the upper surface of the lower die support plate 7, and the lower die 8 may have an appropriate gap in the center thereof directly below the punching pin 5 and with the tip edge portion 501 of the punching pin 5. A hole 801 is drilled. A ceramic green sheet 9 is attached to the lower surface of a frame-shaped cassette plate 10 and inserted between the lower die 8 and the punching pin 5. Hole 701 provided in lower mold support plate 7
This is to make it easier for debris from the ceramic green sheet 9 to fall off.

Hereinafter, the present invention will be explained in detail with reference to FIGS. 1 and 2.

On both sides of the center of the head moving stage 11 on which the above-mentioned drilling head is mounted, a plurality of elongated holes 12 are drilled at a uniform pitch so that the housing 1 can be loosely inserted thereinto. The body 1 is inserted into the elongated hole 12 and fixed in the vertical direction by a holding plate 13. Further, the head moving stage 11 is slidably attached via a linear guide 14 to both ends of the upper surface of a gate-shaped support 16 fixed to both ends of the upper surface of the substrate 15. Furthermore, head movement stage 1
1 can be moved left and right by a screw 17 (a ball screw in the embodiment) and a drive means (second drive means) 18 (a pulse motor in the embodiment) installed at the center end of the upper surface of the portal support 16. can. A lower die support plate 7 is fixed to the rear end surface of the head moving stage 11 via a linear guide 19.

The lower surface of the lower die support plate 7 is provided with a camshaft 21 supported at both ends by bearings 20 fixed to the base plate 15, and a radial bearing 22 whose outer peripheral surface is in close contact with the lower surface of the lower die support plate 7 is provided at the tip end. is fixed, and a driving means (first driving means) 23 is connected to the rear end. Although the lower mold support plate 7 is supported in a cantilevered manner, it does not bend because it is supported by a radial bearing 22, and when moving in the X direction, it is supported by this radial bearing 22 and moves. The elongated hole 12, the drilling pin 5, the hole 601 in the guide plate 6, and the hole 801 in the lower die 8 are aligned with each other.

A ceramic green sheet moving stage 24 is disposed below the head moving stage 11 on the upper surface of the substrate 15 in a direction perpendicular to the head moving stage 11, and a fixing mechanism 25 for fixing the cassette plate 10 is attached to the upper surface of the ceramic green sheet moving stage 24. There is. The ceramic green sheet moving stage 24 is slidably mounted on a linear guide 26 fixed to the upper surface of the substrate 15, and includes a screw device 27 (a ball screw in the embodiment) and a drive means (third drive means) 28. It can be moved back and forth by a pulse motor (in the embodiment, a pulse motor).

Photo sensors 29, 30, and 31 fixed to the upper end of the substrate 15 are used to detect the position of the ceramic green sheet moving stage 24, and are turned on and off by the shielding plate 32 fixed to the upper end of the ceramic green sheet moving stage 24. Turn off. The photo sensor 29 is for detecting the position of the forward movement limit of the ceramic green sheet moving stage 24.
The photo sensor 30 is used to detect the origin position, and the photo sensor 31 is used to detect the position of the backward movement limit. The photo sensor 29 and the photo sensor 31 also serve as safety switches to prevent the ceramic green sheet moving stage 24 from running out of control.

Controlling the timing of energizing the laminated piezoelectric element 2 for operating the flight pin 4 and drilling the hole;
Control of the driving means 18 that moves the head moving stage 11 in the X direction, and driving means 28 that moves the ceramic green sheet moving stage 24 supporting the ceramic green sheet 9 in the Y direction.
The control and the control of the driving means 23 for vertically moving the lower mold support plate 7 are automatically controlled by a control device 33 using software.

Next, its operation will be explained.

The initial setting of the apparatus is such that the shielding plate 32 fixed on the ceramic green sheet moving stage 24 shields the photo sensor 29. Ceramic green sheet moving stage 2 is placed in this position.
4 is stopped, a cassette plate 10 with a ceramic green sheet 9 pasted on the lower surface is placed on the upper surface of the ceramic green sheet moving stage 24 and fixed by a fixing mechanism 25.

Next, when the start switch of the control device 33 is turned on, the driving means 28 starts operating, and the ceramic green sheet moving stage 24 moves until the shielding plate 32 shields the photo sensor 30 for detecting the origin (through hole start position) and switches. Move backward in the Y direction. At the same time, the driving means 18 also starts operating, and the head moving stage 11 also detects the origin (the starting position of the through hole). When the ceramic green sheet moving stage 24 stops at the origin position, the driving means 23 also starts operating at the same time.
The lower die support plate 7 is pushed up by a predetermined distance (approximately 2 mm in this device) by the camshaft 21 and the radial bearing 22. This is to prevent the green sheet 9 from being damaged due to contact between the side surface of the cassette plate 10 and the lower mold support plate 7 when the cassette plate 10 is inserted.

When the lower mold 8 stops at a predetermined position, the laminated piezoelectric elements 2 at the predetermined pattern positions are energized. When the laminated piezoelectric element 2 is energized, it instantaneously expands by several micrometers due to the characteristics of the laminated piezoelectric element 2, so the flight pin 4 pressurized to the laminated piezoelectric element 2 is thrown off and the tip of the drilling pin 5 A through hole is formed in the ceramic green sheet 9 at the edge 501 and the outer diameter edge portion of the upper surface of the hole 801 of the lower mold 8.

When the flight pin 4 operates, the concave leaf spring 3 is deflected, but once the force reaches its limit, the resilient restoring force of the leaf spring 3 returns it to its initial position. When the flight pin 4 returns to its initial state (in the embodiment, it is determined by time), a predetermined pulse for one pitch is applied to the drive means 18, and the head moving stage 1
1 moves a distance of 1 pitch. When it stops after moving, the laminated piezoelectric element 2 and flight pin 4 perform a predetermined operation as described above, and the head moving stage 11 moves one pitch again, and the laminated piezoelectric element 2 and flight pin 4 perform a predetermined operation. When the operation is completed, a predetermined pulse for one pitch is applied to the driving means 28, and the ceramic green sheet moving stage 24 moves by one pitch. When the stage 24 stops after moving, the moving stage 11 performs a predetermined operation as described above. By repeating these operations, a predetermined pattern of through holes is formed on the ceramic green sheet 9.

When a series of through-hole forming operations are completed in this way, the driving means 23 is reversed and the lower mold support plate 7
descends and stops at a predetermined position, the driving means 2
8 is activated, the ceramic green sheet moving stage 24 moves to the initial state, blocks the photo sensor 29, and stops. This completes the through-hole forming operation, so the operator can remove the cassette plate 10.
All you have to do is replace it and start the series of operations again.

As described above, according to the present invention, the lower die can be moved up and down by a cam mechanism driven by a stepping motor, thereby greatly reducing the number of steps required for manufacturing the device. It has the advantage of being easy to do.

[Effects of the Invention] As explained above, according to the present invention, by making it possible to move the lower die up and down using a combination of a cam mechanism and a stepping motor, it is possible to significantly reduce the manufacturing process, and it is possible to reduce the drilling process. It is possible to provide a through-hole forming device in which vertical position adjustment of the lower die relative to the pin is extremely easy.

[Brief explanation of the drawing]

FIG. 1 is a partially exploded perspective view of an embodiment of the through-hole forming apparatus according to the present invention, FIG. 2 is a longitudinal cross-sectional view of the drilling head of the embodiment shown in FIG. 1, and FIG. 3 is a perspective view of the drilling head. , FIG. 4 is a longitudinal sectional view of the drilling pin portion of the embodiment shown in FIG. 1, and FIG. 5 is a partially exploded perspective view of the conventional through-hole forming device. 1... Housing, 2... Laminated piezoelectric element, 3... Leaf spring, 4
...Flight pin, 5...Drilling pin, 6...Guidance plate,
7... Lower die support plate, 8... Lower die, 9... Ceramic green sheet, 10... Cassette plate, 11... Head moving stage, 12... Elongated hole, 13... Holding plate, 14...
Linear guide, 15... Board, 16... Portal support, 1
7, 27... Screw, 18, 23, 28... Drive means,
19, 26, 52... Linear guide, 24... Ceramic green sheet moving stage, 25... Fixing mechanism, 32... Shielding plate, 33... Control device, 50... Head support block, 51... Drilling head, 53... Head moving stage, 54...Linear solenoid, 50
1... Edge portion, 601, 801... Hole, 701... Scrap removal hole.

Claims (1)

[Claims] 1. A drilling head equipped with a flight pin and a drilling pin operated by a laminated piezoelectric element, a guide plate that guides the drilling pin below the drilling head, and a ceramic green plate provided below the guide plate. A cassette plate for fixing the sheet, a lower mold having a hole larger in diameter than the drilling pin and disposed below the cassette plate via the ceramic green sheet, and the lower mold having the hole with the hole. a vertical movement mechanism section including a first driving means for vertically moving the head and the guide plate; a head movement stage that supports the plurality of aligned drilling heads and the vertical movement mechanism section; and a drilling head. comprising a presser plate for fixing and a second driving means,
A head moving mechanism section that moves in the X direction, a ceramic green sheet moving stage that supports the cassette plate, and a third driving means, a green sheet moving mechanism section that moves the cassette plate in the Y direction, and a flight pin. Control of the energization timing of the laminated piezoelectric element to be operated, and control of the first drive means of the vertical movement mechanism, the second drive means of the head movement mechanism, and the third drive means of the green sheet movement mechanism. A through-hole forming apparatus characterized by comprising a control section for controlling the through-hole formation.