JPH0544324B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a through-hole forming apparatus, and particularly to a through-hole forming apparatus for forming a plurality of through holes on a ceramic green sheet.

[Prior Art] Ceramic multilayer wiring boards have been put into practical use as high-density mounting boards for large computers, supercomputers, and the like, and are expected to become even more popular in the future. One of the manufacturing processes for the ceramic multilayer wiring board is the process of drilling holes in the ceramic green sheet.

Conventionally, drilling holes in ceramic green sheets is
A ceramic green sheet is sandwiched between a convex mold that has a plurality of protrusions in a limited pattern on the surface by etching a stainless steel plate, and a concave mold that has holes that fit the convex protrusions. A through hole was formed by this.

[Problem that the invention seeks to solve]

However, with this conventional method, (1) the hole positions are determined at the time of etching, and when changing the pattern, the mold must be changed, and (2) a mold is required for each pattern, which increases the manufacturing cost of the mold. (3) The rigidity of the mold is low, making it difficult to form uniform through-holes due to deformation and abrasion during pressurization.

The purpose of the present invention is to provide a through hole formation method that eliminates the above problems, allows through holes to be formed in various patterns with extremely high precision at any position on a ceramic green sheet using a device with a simple structure, and that reduces the number of work steps. The goal is to provide equipment.

[Means for solving problems]

The through-hole forming device of the present invention includes a drilling head having a flight pin that is equipped with a drilling pin and movable on a laminated piezoelectric element, a guide plate provided at a lower part of the drilling head for guiding the drilling pin, and A cassette plate provided at the bottom of the guide plate to fix the ceramic green sheet, a lower die provided at the bottom of the cassette plate and having a hole thicker than the drilling pin, a head support block, and a drive device. a head vertical movement mechanism section that holds the drilling head and moves it up and down; a head movement mechanism section that includes a head movement stage and a drive device and moves the head vertical movement mechanism section in the X-axis direction; and a ceramic green sheet movement section. A green sheet moving mechanism unit that includes a stage and a drive device and moves the cassette plate in the Y-axis direction, controls the timing of energizing the laminated piezoelectric element to blow off the flight pin, and drives the drilling head up and down. a control section that controls a drive device that moves the head up and down movement mechanism section in the X-axis direction; and a control section that controls a drive device that moves the cassette plate in the Y-axis direction. .

[Effect]

By using an automatic device that is equipped with multiple drilling pins and can essentially move the ceramic green sheet in the X-Y axis directions, it is possible to supply through-hole forming sheets of any pattern at high speed, while significantly reducing the number of work steps. can be reduced.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of the center of the drilling head shown in FIG. 1, FIG. 3 is a perspective view of the drilling head, and FIG. 4 2 is an enlarged sectional view of the drilling pin portion of FIG. 2. FIG.

In FIGS. 3 and 4, the drilling head is mainly composed of an E-shaped housing 1, a laminated piezoelectric element 2, and a flight pin 4 provided with a drilling pin 5. That is, one end of each laminated piezoelectric element 2 is fixed to the upper end of both inner surfaces of the E-shaped casing 1, and the concave leaf spring 3 has both ends fixed to the lower corners of both inner surfaces of the casing 1. Fixed. Leaf spring 3
A flight pin 4 having a spherical tip and made of a material with high hardness and high repulsive force (carbide material in this case) is fixed to the upper surface of the central part of the , and the spherical tip of the flight pin 4 is connected to the laminated piezoelectric element 2. It is pressurized and in contact with the other end. A hole pin 5 integrally constructed with the flight pin 4 is fixed to the lower surface of the center of the leaf spring 3 so as to pass through the center portion of the leaf spring 3. The drilling pin 5 is guided at its center by a guide plate 6 having a hole with an appropriate distance from the drilling pin 5.

A lower die support plate 7 is provided below the drilling pin 5, a lower die 8 is fixed to the upper surface of the lower die support plate 7, and a lower die 8 is provided at the center of the lower die 8 directly below the drilling pin and with a hole. A hole 801 having an appropriate distance from the tip edge portion 501 of the opening pin 5 is provided.

The explanation will be given below using both FIGS. 1 and 2.

A ceramic green sheet 9 is attached to the lower surface of a frame-shaped cassette plate 10 and inserted between the lower die 8 and the punching pin 5. A hole 701 provided in the lower die support plate 7 is filled with a ceramic green sheet 9.
This is to make it easier for the debris to fall off. The drilling head 50 is made by stacking multiple sheets to form the hole 10 in the center of the housing.
1 to a head support block 11 constituting a head vertical movement mechanism.

The head vertical movement mechanism section is mainly composed of the head support block 11, a linear guide 12, a head support plate 14, and a drive device 16 consisting of a linear solenoid. The head support block 11 is installed via a linear guide 12 on a head support plate 14 fixed to a head movement stage 13 so as to be vertically slidable. Furthermore, the head support block 11
is rotatably attached to a drive device 16 fixed to the top surface of the head moving stage 13 via a joint 15 fixed to the top surface, and is configured so that it can be moved up and down by the drive device 16.

This head vertical movement mechanism includes a head movement stage 13, a linear guide 17, a portal support 19, a screw device 20, and a drive device 21 consisting of a pulse motor.
The head movement mechanism mainly consists of
Move in the axial direction. The head moving stage 13 is slidably attached to both ends of the upper surface of a gate-shaped support 19 fixed to both ends of the upper surface of the substrate 18 via direct guides 17. Furthermore, the head moving stage 13 is configured to be movable in the X-axis direction by a screw device 20 and a drive device 21, each of which is a ball screw whose one end is rotatably fixed to the upper end of the portal support 19.

A lower mold support plate 7 is fixed to the rear end surface of the head moving stage 13, and since the lower mold support plate 7 is supported on a cantilever, it is fixed on the surface of the substrate 18 and is a roller support base with extremely low frictional force. It is supported by 30. Move the head moving stage 13 together so that the axis of the drilling pin 5 and the axis of the hole 801 of the lower die 8 do not deviate from each other.
Therefore, even if the head moving stage 13 moves, the positional relationship will not shift.
A ceramic green sheet moving stage 22, which constitutes a green sheet moving mechanism, is provided below the head moving stage 13 and on the upper surface of the substrate 18 in a direction perpendicular to the head moving stage 13.

The green sheet moving mechanism section mainly includes a ceramic green sheet moving stage 22, a linear guide 23, a screw device 24 consisting of a ball screw, and a driving device 25 consisting of a pulse motor.
A fixing mechanism 31 for fixing the cassette plate 10 is provided on the upper surface of the ceramic green sheet moving stage 22.
is provided. The ceramic green sheet moving stage 22 is slidably mounted on a linear guide 23 fixed to the upper surface of the substrate 18.
It is configured so that it can be moved in the Y-axis direction by a screw device 24 and a drive device 25.

Photo sensors 26, 27, and 28 fixed to the upper end of the substrate 18 are for detecting the position of the ceramic green sheet moving stage 22, and are fixed to the upper end of the ceramic green sheet moving stage 22, and are turned on and off by a shielding plate 29. do. The photo sensor 26 is for detecting the position of the forward movement limit of the ceramic green sheet moving stage 22, the photo sensor 27 is for detecting the origin position, and the photo sensor 28 is for detecting the position of the backward movement limit. The photo sensor 26 and the photo sensor 28 also serve as safety switches to prevent the ceramic green sheet moving stage 22 from running out of control.

A drive device 1 that controls the timing of energizing the laminated piezoelectric element 2 and drives the drilling head 50 up and down.
6, the control of the drive device 21 that moves the head vertical movement mechanism section in the X-axis direction, and the control of the drive device 25 that moves the cassette plate 10 in the Y-axis direction are automatically controlled by a control device 60 using software. It is configured so that it can be done.

Next, its operation will be explained.

The initial setting of the apparatus is such that a shielding plate 29 fixed on the ceramic green sheet moving stage 22 shields the photo sensor 26. Ceramic green sheet moving stage 22 is placed at this position.
With the cassette plate 10 stuck to the lower surface of the ceramic green sheet 9 in a stopped state, the cassette plate 10 is placed on the upper surface of the ceramic green sheet moving stage 22 and fixed by a fixing mechanism 31.

Next, when the start switch of the control device 60 is turned on, the drive device 25 starts operating, and the ceramic green sheet moving stage 22 moves backward until the shielding plate 29 shields (switches) the photo sensor 27 for detecting the origin (through-hole start position). .
At the same time, the drive device 21 also starts operating and detects the origin of the head moving stage 13 (the starting position of the through hole). At the same time, the drive device 16 is also energized and the head support block 11 is pulled up by about 2 mm. This is because the distance between the tip edge 501 of the drilling pin 5 and the ceramic green sheet 9 at the standard drilling position is about 0.1 mm, so the drilling pin 5 is prevented from coming into contact with the side of the cassette plate and being damaged. This is to prevent this.

When the ceramic green sheet moving stage 22 stops at the original position, the excitation of the drive device 16 is cut off and the head support block 11 is also lowered to a predetermined position. Subsequently, the laminated piezoelectric elements 2 at predetermined pattern positions are energized. When the laminated piezoelectric element 2 is energized, due to the characteristics of the laminated piezoelectric element 2, the laminated piezoelectric element 2 instantaneously stretches several μm, so the flight pin 4 that is in contact with the laminated piezoelectric element 2 is pressurized and is blown away, creating a hole. A through hole is formed in the ceramic green sheet 9 at the tip edge 501 of the pin 5 and the upper outer diameter edge of the hole 801 in the lower mold. When the flight pin 4 is blown off, the concave leaf spring 3 is deflected. Once the force reaches its limit, the restoring force of the leaf spring 3 returns it to its initial position. When the flight pin 4 returns to its initial state (in the embodiment, it is determined by time), a predetermined pulse for one pitch is applied to the drive device 21, and the head moving stage 13 moves a distance for one pitch. When the movement is stopped, the laminated piezoelectric element 2 and the flight pin 4 perform a predetermined operation as described above, and the head moving stage 13 moves one pitch again, and the laminated piezoelectric element 2 and the flight pin 4 perform a predetermined operation.

When the series of operations is completed, a predetermined pulse for one pitch is applied to the drive device 25, and the ceramic green sheet moving stage 22 is moved by one pitch. When the movement stops, the head moving stage 13 performs a predetermined operation as described above.

By repeating these operations as described above, a predetermined pattern of through holes is formed on the ceramic green sheet 9. When the through hole forming operation is completed, the drive device 16 is energized and the head support block 11 is pulled up. Subsequently, the drive device 25 is activated, and the ceramic green sheet moving stage 22 moves to its initial state, blocks the photo sensor 26, and stops. When the ceramic green sheet moving stage 22 stops, the drive device 16 is also deenergized and the head support block 11 is also lowered.

This completes the series of through-hole forming operations, so the operator only has to replace the cassette plate 10 and start the series of operations again.

〔Effect of the invention〕

As explained above, according to the present invention, by mounting a plurality of hole punching pins and configuring the ceramic green sheet to be movable in the X-Y axis directions, through-hole forming sheets with various patterns can be formed at high speed. It has the effect of being able to supply a large amount of material and significantly reducing the number of man-hours required.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of the center of the drilling head shown in FIG. 1, FIG. 3 is a perspective view of the drilling head, and FIG. 4 2 is an enlarged sectional view of the drilling pin portion of FIG. 2. FIG. 1... Housing, 2... Laminated piezoelectric element, 3... Leaf spring, 4... Flight pin, 5... Drilling pin, 6
...Guidance plate, 7...Lower die support plate, 8...Lower die, 9
... Ceramic green sheet, 10 ... Cassette plate, 11 ... Head support block, 12 ... Linear guide, 13 ... Head movement stage, 14 ...
... Head support plate, 15 ... Joint, 16 ... Drive device, 17 ... Linear guide, 18 ... Board, 19 ...
...Portal support base, 20...Screw device, 21...Driving device, 22...Ceramic green sheet moving stage, 23...Linear guide, 24...Screw device, 25...Driving device, 26, 27, 28 ... Photo sensor, 29 ... Shielding plate, 30 ... Roller support base, 31 ... Fixing mechanism, 50 ... Drilling head, 60 ... Control device, 101 ... Hole, 501 ...
...Edge part, 701...Dust removal hole, 801...
hole.

Claims (1)

[Claims] 1. A drilling head having a flight pin equipped with a drilling pin and movable by a laminated piezoelectric element, a guide plate provided at the bottom of the drilling head to guide the drilling pin, and a ceramic plate provided at the bottom of the guide plate. A cassette plate for fixing green sheets, a lower mold provided at the bottom of the cassette plate and having a hole thicker than the punching pin, a head support block and a drive device, and a cassette plate that holds a plurality of the punching heads and supports the top and bottom holes. a head up/down movement mechanism for moving the head up and down, a head movement stage and a drive device; a head movement mechanism for moving the head up and down movement mechanism in the X-axis direction; a ceramic green sheet movement stage and the drive device; A green sheet moving mechanism unit that moves the cassette plate in the Y-axis direction, a timing control for energizing the laminated piezoelectric element in order to blow off the flight pin, a control for a drive device that drives the drilling head up and down, and a green sheet moving mechanism for moving the cassette plate in the Y-axis direction; A through-hole forming apparatus comprising a control section that controls a drive device that moves the vertical movement mechanism section in the X-axis direction and a control section that controls a drive device that moves the cassette plate in the Y-axis direction.