JPH0547640B2 - - Google Patents
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- Publication number
- JPH0547640B2 JPH0547640B2 JP58083716A JP8371683A JPH0547640B2 JP H0547640 B2 JPH0547640 B2 JP H0547640B2 JP 58083716 A JP58083716 A JP 58083716A JP 8371683 A JP8371683 A JP 8371683A JP H0547640 B2 JPH0547640 B2 JP H0547640B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- bath
- nickel
- plating
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】
本発明は錫−ニツケル合金電気メツキ浴組成物
に関するものであり、特にブロンズ調で金属光沢
のあるメツキ層を与えるメツキ浴組成物に関する
ものである。
錫−ニツケル合金メツキ層を与える電気メツキ
浴組成物としては、各種のものが知られている。
一般に錫−ニツケル合金メツキ層は、耐蝕性に優
れ、かつ比較的硬くて耐摩耗性に富んでいる。し
かし、その色調はいずれもローズピンクまたはス
テンレス色といわれる明るく白つぽいものであ
り、建材等に使用する場合には装飾的価値に乏し
い欠点がある。
本発明は、ブロンズ調で金属光沢を有し、特に
装飾的用途に有用なメツキ層を与えるメツキ浴組
成物を提供するものである。
すなわち本発明の要旨は、
(a) 錫およびニツケルの塩化物または硫酸塩
(b) モノヒドロキシカルボン酸またはその塩
(c) 導電性塩及び
(d) 水から成り、錫とニツケルとの比率が金属と
して1.5:1〜7:1であり、浴のPHが3.5〜5.5
で、かつ錫が4価の状態にあることを特徴とす
るブロンズ色調の錫−ニツケル合金電気メツキ
浴組成物に存する。
本発明についてさらに詳細に説明すると、本発
明に係る浴組成物は電着金属成分として錫および
ニツケルを含有している。これらの金属としては
塩化物もしくは硫酸塩またはその混合物が用いら
れる。なお2価の錫は浴中で酸化され易く従つて
浴が不安定なので、4価の錫を用いる。これらの
金属の浴中の濃度は、通常、錫が5.0〜40g/、
ニツケルが2.0〜10g/である。また、錫とニ
ツケルの比率(重量比)は1.5:1〜7:1、好
ましくは3:1〜7:1であり、錫の比率がこれ
よりも小さくなると生成するメツキ皮膜がもろく
なりかつ耐蝕性も低下する。逆に錫の比率がこれ
よりも大きくなると皮膜の色調が白つぽくなり、
ブロンズ色の皮膜を生成させるという目的にそぐ
わなくなる。
モノヒドロキシカルボン酸としては、グリコー
ル酸、乳酸、クエン酸、リンゴ酸等のモノカルボ
ン酸またはポリカルボン酸が用いられる。これら
のモヒドロキシカルボン酸はそのままで用いても
よく、またナトリウム塩、カリウム塩、アンモニ
ウム塩等の塩として用いてもよい。モノヒドロキ
シカルボン酸およびその塩の浴中の濃度は、遊離
酸として20〜200g/が適当である。これより
も低濃度ではメツキ皮膜が脆くなり、耐蝕性が低
下する。また、これよりも高濃度では皮膜の色調
が白くなる恐れがある。好ましくはグリコール酸
とクエン酸を併用する、特にグリコール酸6.5〜
60g/とクエン酸7.5〜60g/とを併用する
のが好ましい。導電性塩としては、塩化カリウ
ム、塩化ナトリウム、塩化アンモニウム、硫酸カ
リウム、硫酸アンモニウムなどメツキ浴に常用さ
れているものが用いられる。その濃度は50〜300
g/が適当であり、これよりも高濃度になると
メツキ皮膜に条痕が発生し易く、逆に低濃度では
浴の電気抵抗が高くて発熱が大きいので、いずれ
も不利である。
本発明に係るメツキ浴組成物を用いてメツキを
行なう際の条件は、浴温30〜60℃、陰極電流密度
0.2〜2.0A/dm2、PH3.5〜5.5が適当である。浴温
が低すぎると金属析出が不均一になり、色むらが
発生し易いと同時に、析出速度も遅くなる。一
方、60℃を越えるような高温では浴の蒸発が激し
く、浴の管理上不利である。陰極電流密度が
0.2A/dm2より小さいと金属析出が遅くて生産
性が良くないし、逆に0.2A/dm2より大きくな
ると部分的に皮膜にこげが発生したり析出状態が
不良になる恐れがある。浴のPHは皮膜の色調に影
響し、PHが3.5より小さいと色むらが発生しやす
くなり、さらにPHが小さくなると色調が白つぽく
なつてブロンズ色の皮膜が得られなくなる。一
方、PHが5.5よりも大きくなると金属の析出状態
が不良になるおそれがあり、また、水酸化錫が沈
殿しやすくなり、浴の安定性が得られ難い。上記
理由のため、浴のPHは3.5〜5.5とする必要があ
る。
陽極としては一般に黒鉛やフエライト等の不溶
性陽極が用いられるが、錫やニツケル金属そのも
のを陽極またはその一部として用い、電着により
消費される金属成分を自動的に補給するようにし
てもよい。
以下に実施例により本発明をさらに具体的に説
明するが、本発明はその要旨を超えない限り、以
下の実施例に限定されるものではない。
実施例 1〜8
第1表のNo.1〜8に示す組成の浴を用い、真鍮
板(No.1〜3)または光沢ニツケルメツキを施し
たアルミニウム板(No.4〜8)上に錫−ニツケル
メツキを施した(電着時間5分間)。いずれの浴
においても、光沢があり、かつブロンズ色を有す
る均一なメツキ皮膜が得られた。この皮膜をオー
ジエ電子分光分析により測定したところ原子%と
して錫10〜40%、ニツケル60〜90%の範囲内の皮
膜であつた。皮膜の組成(錫/ニツケルの原子
比)を第1表最下欄に示した。
このメツキ皮膜に対し、JIS H8502に規定する
中性塩水噴霧試験を24時間行なつたところ、いず
れの皮膜にも何らの変化も認められなかつた。
比較例 1
塩酸を加えて浴のPHを3.0とした以外は、実施
例7と同様にしてメツキを施した。得られた皮膜
は白つぽい色調であり、ブロンズ調の光沢を有さ
ず不良なものであつた。
比較例 2
アンモニア水を加えて浴のPHを6.0とした以外
は、実施例8と同様にしてメツキを施した。浴中
には、水酸化錫の白色沈殿が認められた。得られ
た皮膜はブロンズ調よりも少し黄味を帯びた明る
い色調であつた。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a tin-nickel alloy electroplating bath composition, and more particularly to a plating bath composition that provides a bronze-like plating layer with metallic luster. Various electroplating bath compositions are known that provide tin-nickel alloy plating layers.
Generally, a tin-nickel alloy plating layer has excellent corrosion resistance, is relatively hard, and has high wear resistance. However, the color tone is bright and whitish, which is said to be rose pink or stainless steel color, and they have the disadvantage of lacking decorative value when used as building materials. The present invention provides a plating bath composition that provides a plating layer that is bronze-like and has a metallic luster and is particularly useful for decorative purposes. That is, the gist of the present invention is as follows: (a) a chloride or sulfate of tin and nickel; (b) a monohydroxycarboxylic acid or its salt; (c) a conductive salt; and (d) water, the ratio of tin to nickel being As a metal, the ratio is 1.5:1 to 7:1, and the pH of the bath is 3.5 to 5.5.
The present invention provides a bronze-colored tin-nickel alloy electroplating bath composition characterized in that tin is in a tetravalent state. To explain the present invention in more detail, the bath composition according to the present invention contains tin and nickel as electrodeposited metal components. As these metals, chlorides or sulfates or mixtures thereof are used. Note that tetravalent tin is used because divalent tin is easily oxidized in the bath and therefore the bath is unstable. The concentration of these metals in the bath is usually 5.0 to 40 g of tin,
Nickel is 2.0-10g/. The ratio (weight ratio) of tin to nickel is 1.5:1 to 7:1, preferably 3:1 to 7:1; if the ratio of tin is smaller than this, the plating film formed becomes brittle and corrosion resistant. Sexuality also decreases. On the other hand, if the proportion of tin is higher than this, the color of the film will become whitish.
This defeats the purpose of producing a bronze-colored film. As the monohydroxycarboxylic acid, monocarboxylic acids or polycarboxylic acids such as glycolic acid, lactic acid, citric acid, and malic acid are used. These mohydroxycarboxylic acids may be used as they are, or may be used as salts such as sodium salts, potassium salts, ammonium salts, and the like. The concentration of the monohydroxycarboxylic acid and its salt in the bath is suitably 20 to 200 g/free acid. If the concentration is lower than this, the plating film becomes brittle and corrosion resistance decreases. Moreover, if the concentration is higher than this, the color tone of the film may become white. Preferably a combination of glycolic acid and citric acid, especially glycolic acid 6.5~
It is preferable to use 60g/ of citric acid in combination with 7.5 to 60g/ of citric acid. As the conductive salt, those commonly used in plating baths, such as potassium chloride, sodium chloride, ammonium chloride, potassium sulfate, and ammonium sulfate, are used. Its concentration is 50-300
g/ is suitable; if the concentration is higher than this, streaks are likely to occur in the plating film, and if the concentration is lower than this, the electric resistance of the bath is high and heat generation is large, so both are disadvantageous. The conditions for plating using the plating bath composition according to the present invention are a bath temperature of 30 to 60°C, a cathode current density of
Appropriate values are 0.2 to 2.0 A/dm 2 and PH 3.5 to 5.5. If the bath temperature is too low, metal deposition becomes non-uniform, color unevenness tends to occur, and at the same time, the deposition rate becomes slow. On the other hand, at high temperatures exceeding 60°C, the bath evaporates rapidly, which is disadvantageous in terms of bath management. The cathode current density is
If it is less than 0.2 A/dm 2 , metal deposition will be slow and productivity will not be good, while if it is larger than 0.2 A/dm 2 , there is a risk that the film will be partially scorched or the state of the deposition will be poor. The pH of the bath affects the color tone of the film; if the pH is lower than 3.5, color unevenness is likely to occur, and if the pH is further reduced, the color tone becomes whitish, making it impossible to obtain a bronze-colored film. On the other hand, if the pH is higher than 5.5, the state of metal precipitation may become poor, and tin hydroxide tends to precipitate, making it difficult to obtain bath stability. For the above reasons, the pH of the bath needs to be between 3.5 and 5.5. Generally, an insoluble anode such as graphite or ferrite is used as the anode, but tin or nickel metal itself may be used as the anode or a part thereof so that the metal components consumed by electrodeposition are automatically replenished. The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to the following Examples unless it exceeds the gist thereof. Examples 1 to 8 Using baths with compositions shown in Table 1, Nos. 1 to 8, tin was deposited on brass plates (Nos. 1 to 3) or bright nickel-plated aluminum plates (Nos. 4 to 8). Nickel plating was applied (electrodeposition time: 5 minutes). In all baths, uniform plating films with gloss and bronze color were obtained. When this film was measured by Auger electron spectroscopy, it was found to be a film containing 10 to 40% tin and 60 to 90% nickel in terms of atomic %. The composition of the film (tin/nickel atomic ratio) is shown in the bottom column of Table 1. When this plating film was subjected to a neutral salt spray test specified in JIS H8502 for 24 hours, no change was observed in any of the films. Comparative Example 1 Plating was performed in the same manner as in Example 7, except that hydrochloric acid was added to adjust the pH of the bath to 3.0. The obtained film had a whitish color and did not have a bronze-like luster, and was poor. Comparative Example 2 Plating was performed in the same manner as in Example 8, except that aqueous ammonia was added to adjust the pH of the bath to 6.0. A white precipitate of tin hydroxide was observed in the bath. The resulting film had a brighter color tone, slightly yellowish than bronze tone. 【table】
Claims (1)
して1.5:1〜7:1であり、浴のPHが3.5〜5.5
で、かつ錫が4価の状態にあることを特徴とす
るブロンズ色調の錫−ニツケル合金電気メツキ
浴組成物。 2 モノヒドロキシカルボン酸またはその塩が、
クエン酸およびグリコール酸またはその塩である
ことを特徴とする特許請求の範囲第1項記載の組
成物。[Claims] 1. Consisting of (a) chloride or sulfate of tin and nickel, (b) monohydroxycarboxylic acid or its salt, (c) conductive salt, and (d) water, the ratio of tin and nickel is As a metal, the ratio is 1.5:1 to 7:1, and the pH of the bath is 3.5 to 5.5.
A bronze-colored tin-nickel alloy electroplating bath composition characterized in that the tin is in a tetravalent state. 2 Monohydroxycarboxylic acid or its salt is
The composition according to claim 1, characterized in that it is citric acid and glycolic acid or a salt thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8371683A JPS59208091A (en) | 1983-05-13 | 1983-05-13 | Composition for electroplating bath for tin-nickel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8371683A JPS59208091A (en) | 1983-05-13 | 1983-05-13 | Composition for electroplating bath for tin-nickel alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59208091A JPS59208091A (en) | 1984-11-26 |
| JPH0547640B2 true JPH0547640B2 (en) | 1993-07-19 |
Family
ID=13810229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8371683A Granted JPS59208091A (en) | 1983-05-13 | 1983-05-13 | Composition for electroplating bath for tin-nickel alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59208091A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113781A (en) * | 1984-11-08 | 1986-05-31 | Tokuyama Soda Co Ltd | Cathode for hydrogen generation |
| JPS63219596A (en) * | 1987-03-10 | 1988-09-13 | Kosaku:Kk | Tin-lead alloy electroplating method |
| CN101570870B (en) | 2009-05-05 | 2010-12-29 | 天津大学 | Corrosion resistant nickel-tin alloy plating solution and electroplating technology thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50101236A (en) * | 1974-01-14 | 1975-08-11 |
-
1983
- 1983-05-13 JP JP8371683A patent/JPS59208091A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59208091A (en) | 1984-11-26 |
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