JPH055173B2 - - Google Patents

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a chip bonding device.

(Background of the Invention) A hybrid IC has multiple chips of different types bonded to one substrate.

By the way, conventional chip bonding equipment is
Chips that have been diced and attached to a wafer ring, or chips that have been sorted out and stored in a tray, are taken out one by one by a suction collector and bonded to a substrate.

Therefore, in order to bond multiple different chips such as hybrid ICs, it is necessary to arrange multiple bonding machines and chip supply machines in series on the line depending on the number of chips, and the equipment is required. The disadvantages were that it was expensive and required a large installation area. In addition, the number of chips attached to one wafer ring or the number of chips stored in one tray is small, and wafers or trays must be set in the chip bonding equipment frequently, resulting in poor workability and , the device becomes larger due to the planar arrangement of the chips.

In some cases, chip bonding involves applying an adhesive such as epoxy resin in advance, and then bonding the chip to the area where the adhesive is applied. Conventionally, in such a device, an adhesive coating device must be provided in addition to the bonding device, which also increases the equipment cost and requires a large installation area.

Generally, in conventional ICs, LSIs, etc., the chip is simply bonded to the substrate, so adhesive needs to be applied only to one central location where the chip is bonded. In such a case, since the dispenser that drips the adhesive and the chip collet that bonds the chips are always kept at a certain distance, the dispenser arm that holds the dispenser and the bonding arm that holds the chip collet should be linked together. This allows adhesive application and chip bonding to be performed simultaneously with one device.

However, as in hybrid ICs, resistors,
When chips such as capacitors and transistors are bonded, adhesive must be applied to multiple locations at a predetermined distance from the center where the chips are bonded. To explain in more detail, resistor chips and capacitor chips have electrodes on both ends of the chip, and one chip has two electrodes corresponding to the electrodes.
Glue needs to be applied to the area. Furthermore, since a transistor chip has electrodes at three locations, it is necessary to apply adhesive to three locations on one chip.

When it is necessary to apply adhesive to multiple locations on one chip like this, the distance between the dispenser and the chip collet varies, so it is possible to apply adhesive and chip bonding at the same time with one device. Can not.

(Objective of the Invention) An object of the present invention is to provide a chip bonding device that can simultaneously apply adhesive to multiple locations on one chip and perform chip bonding with one device.

(Means for Solving the Problems) The configuration of the present invention for solving the above object includes a guide rail for guiding a board, a chip collet disposed above between the guide rails, and a chip collet for holding the chip collet. a bonding arm extending to one side of the guide rail; a dispenser disposed above between the guide rails on the opposite side of the board advancing at a certain distance from the chip collet; and a dispenser that holds the dispenser and extends in the same direction as the bonding arm. The extended dispenser arm and
In the chip bonding apparatus, the chip bonding apparatus includes driving means for holding the bonding arm and the dispenser arm and driving the chip collet and the dispenser in the vertical and XY directions, the chip bonding device being disposed on the other side of the guide rail and disposed on the other side of the guide rail to move the chips at equal intervals. a chip-filling tape reel attachment means for individually rotatably attaching a plurality of chip-filling tape reels wound with stored tape; and a chip filling reel mechanism for driving the chip filling tape reel so as to send the chips to a pick-up position, and the dispenser is attached to the dispenser arm via an XY table driven in the XY direction. It is characterized by being

(Embodiments of the Invention) The present invention will be described below with reference to illustrated embodiments.
FIG. 1 is a plan view showing one embodiment of the present invention, FIG. 2 is a right side view of FIG. 1, and FIG. The figure is an enlarged sectional view of the chip pickup portion. base 1
A guide rail fixing base 2 is fixed on the top, and boards 3A, 3B, 3C... are mounted on this guide rail fixing base 2.
Guide rails 4, 4 are fixed to guide the. Between the guide rails 4, 4, a stopper 5 that is movable up and down, and a presser plate 6 that is movable up and down and in the X direction and presses the boards 3A, 3B, 3C, . . . against the stopper 5 are arranged at a constant interval. It is set up. The above is a conventionally known structure. Also, the substrates 3A, 3B,
3C... are intermittently fed along the guide rails 4, 4 by known means (not shown).

Mounted on one side of the guide rail 4 on the base 1 is an XY table 12 having a known structure and driven in the XY directions by an X direction drive motor 10 and a Y direction drive motor 11. A rotary shaft support plate 14 that rotatably supports a rotary shaft 13 extending in the X direction is fixed on the XY table 12, and a rotary drive motor fixed to the rotary shaft support plate 14 is attached to the rotary shaft 13. 15 output shafts are connected. Further, the rotating shaft 13 includes substrates 3A, 3B,
A dispenser arm 16 and a bonding arm 17 are fixed from the advancing side of 3C.

The dispenser arm 16 is provided with an X table 2 that is driven in the X direction by an X direction drive motor 20.
1 and a Y table 23 driven in the Y direction by a Y direction drive motor 22.
has been fixed through. Said XY table 24
Since the structure itself is well known, a detailed explanation of the structure will be omitted.
The provision of the table 24 is a novel structure.
On the XY table 24 is a dispenser support plate 26.
is fixed to the tip of the dispenser support plate 26, and the tip of the dispenser 27 is fixed to the guide rail 4.
It is fixed so that it is located above the gap. At the tip of the bonding arm 17, a chip collet 28 for vacuum suctioning a chip, which will be described later, is fixed so as to be located above between the guide rails 4. Here, the coordinate relationship between the tip of the dispenser 27 and the tip of the tip collet 28 is such that they are spaced apart by the same pitch interval as the pitch of the stopper 5 in the X direction, and have the same coordinates in the Y direction.

On the other side of the guide rail 4 of the base 1 is a chip supply device 32 comprising a chip filling reel mechanism 30 and a cover tape take-up reel mechanism 31.
is installed.

The chip filling reel mechanism 30 is constructed as follows. That is, a clutch shaft (not shown) extending in the X direction is rotatably supported on a support plate 33 fixed on the base 1, and a clutch shaft (not shown) fixed to the support plate 33 is rotatably supported at one end of the clutch shaft. The output shaft of the motor 34 is connected. In addition, a plurality of chip filling tape reels 35A are mounted on the clutch shaft.
35B, 35C... are rotatably inserted,
Each chip filling tape reel 35A, 35B, 35
C... are adapted to engage with the clutch shaft by turning on electromagnetic clutches (not shown) provided respectively. The chip filling tape reels 35A, 35B, 35C...
Hoop-shaped tapes 37 each containing good chips 36 are wound. The tape 37 is the fourth
As shown in the figure, a hole 38a for housing the chip 36
The chip filling tape 40 is formed by bonding a main tape 39 to the lower surface of the auxiliary tape 38 formed at equal intervals, and a cover tape 41 covers the upper surface of the auxiliary tape 38.

The cover tape winding mechanism 31 is for winding up the cover tape 41, and although only the side view is shown in FIG. 2, it is composed of exactly the same mechanism as the chip filling reel mechanism 30. That is, it is rotatably supported on a clutch shaft (not shown) or a support plate 33 above and parallel to the clutch shaft of the chip filling reel mechanism 30;
An output shaft of a clutch shaft rotating motor 42 is connected to one end of the clutch shaft of the cover tape winding mechanism 31. In addition, the cover tape winding mechanism 3
The chip filling reel mechanism 3 is mounted on the clutch shaft of 1.
0 chip filling tape reel 35A, 35B, 3
A plurality of cover tape take-up reels 43 are rotatably inserted in correspondence with 5C..., respectively.
Each cover tape take-up reel 43 is engaged with a clutch shaft by turning on a corresponding electromagnetic clutch (not shown).

A guide roller 44 for guiding the cover tape 41 is rotatably supported by the support plate 33 between the chip filling reel mechanism 30 and the cover tape winding mechanism 31. Further, between the chip filling reel mechanism 30 and the guide rail 4, two guide rollers 45 and 46 for horizontally guiding the chip filling tape 40 are rotatably supported by the support plate 33.

Next, the operation will be explained. Now, as an example,
Tape 3 wound around chip filling tape reels 35A, 35E, 35G on substrates 3A, 3B, 3C...
Assume that chips 36A, 36E, and 36G housed in 7 are to be bonded. As shown in FIG. 1, the board 3A has chips 36A, 36E, 36G.
has already been bonded, and the chip 3 is on the board 3B.
6A, 36E, 36G are bonded A,
The explanation will be based on a state in which adhesive has already been applied to points E and G.

From the state shown in Figure 1, the X and Y direction drive motor 1
0 and 11 are driven, the XY table 12 moves in the XY direction, and the lower end of the chip collection 28 is at a position (guide rollers 45, 46 (between).
Next, the rotation drive motor 15 drives the rotation shaft 13.
The dispenser arm 16 and the bonding arm 17 are rotated through the dispensing arm 16 and the bonding arm 17, and the dispenser 27 and the tip collet 28 are lowered. As a result, the lower end of the chip collet 28 comes into contact with the chip 36A housed in the tape 37 and is vacuum-adsorbed. here,
Since the lower end of the dispenser 27 is disposed slightly above the lower end of the tip collet 28, even if the dispenser 27 is lowered as described above, the lower end of the dispenser 27 will not come into contact with the tip 36 or the like.

Next, the rotary drive motor 15 is reversely rotated, and the dispenser 27 and tip collet 28 are raised. As a result, the chip 36A is picked up from the tape 37 by the chip collet 28. Subsequently, the X and Y direction drive motors 10 and 11 are driven to move the XY table 12 in the XY directions, and the chip 36A attracted to the chip collet 28 is moved to the substrate 3.
The lower end of the dispenser 27 is located above the point A of the substrate 3C, and the lower end of the dispenser 27 is located above the point A of the substrate 3C. Next, the rotational drive motor 15 rotates normally and the dispenser 27
And the tip collet 28 is lowered. As a result, the chip 36 adsorbed to the chip collet 28
A is pressed against the adhesive applied to point A of the substrate 3B and bonded. Also dispenser 27
The lower end of is close to point A of the substrate 3C, and the adhesive is dropped at point A. Here, if the chip 36A is relatively large and the adhesive force to the chip 36A is insufficient just by dropping adhesive at one point A,
According to a predetermined program, the X and Y drive motors 20 and 22 are driven to drive the XY table 2.
4 moves slightly, and adhesive is applied to multiple locations around point A. When the bonding of the chip 36A to the substrate 3B and the application of adhesive to the point A of the substrate 3C are completed as described above, the rotation drive motor 1
5 is reversed, and the dispenser 27 and tip collet 28 are raised.

Also, as mentioned above, the chip filling tape reel 3
At the same time, the chip 36A stored in the tape 37 wound around the tape 5A is picked up by the chip collet 28, and at the same time, the electromagnetic clutch of the chip filling tape reel 35A of the chip filling reel mechanism 30 and the above-mentioned The electromagnetic clutch of the cover tape take-up reel 43 corresponding to the chip filling tape reel 35A is engaged, and only the chip filling tape reel 35A and the cover tape take-up reel 43 are coupled to the corresponding clutch shaft. And clutch shaft rotation motors 34, 4
2 rotates a certain amount, and the next chip 36A in the next chip filling tape 40 is delivered to the pick-up position. Further, the cover tape 41 is wound up by a cover tape take-up reel 43, and the chip 36A within the tape 37 is exposed.

By the above series of operations, bonding of the chip 36A to point A of the substrate 3B and application of adhesive to point A or around point A of the substrate 3C are completed. Next, chip 36E to points E and G of boards 3B and 3C,
36G bonding and adhesive application are also performed through the above series of operations. Here, the chips 36E and 36G are picked up by the chip collection 28 from the chip filling tape reels 35E and 36G, respectively.
Chip 36E stored in 35G tape 37,
Needless to say, I can pick up the 36G.

In this way, the chips 36A, 3 are attached to the substrate 3B.
When the bonding of 6E and 36G and the application of adhesive to the substrate 3C are completed, the stopper 5 is lowered,
Further, the presser plate 6 descends while moving slightly to the left in FIG. And substrates 3A, 3B, 3C
... is fed one pitch along the guide rail 4 by a well-known feeding means, and the stopper 5 is raised just before this feeding is completed. After that, the holding plate 6 rises and moves to the right in FIG.
3B, 3C... are pressed against the stopper 5. As a result, the board 3C is located below the chip collet 28, and the board 3D is located below the dispenser 27.

In this way, the chip filling tape reel 35 is wound with a tape 37 containing chips 36 at regular intervals.
A, 35B... are individually and rotatably attached to the chip filling tape reel attachment means, and a desired selected chip filling tape reel 35A,
35B... with the chip 36 inside the tape 37 exposed, the chip 36 inside the tape 37 is sent to the chip pick-up position by a driving means, and the desired chip 3
6 is picked up and bonded using the chip collet 28, so one bonding device can perform one bonding process.
A plurality of chips 36 can be bonded to each substrate 3A, 3B, . . . , which is advantageous in terms of equipment cost and installation area. Moreover, the chips 36 are stored in the tape 37 and the chip filling tape reels 35A, 35
Since the chips are wound around B..., a large number of chips can be stored three-dimensionally, providing excellent workability and miniaturization. Also Chip Collection 2
Guide rail 4 on the board advancing side at a certain distance from 8.
A dispenser 27 is disposed above between the dispenser arm 1 that holds the dispenser 27.
6 is attached to the drive means to which the bonding arm 17 is attached, chip bonding and adhesive application can be performed at the same time, which is also advantageous in terms of equipment cost and installation area. Also, only the dispenser 27 can move in the XY direction.
Dispenser arm 1 via XY table 24
6, adhesive can be applied to multiple locations around the bonding point.

In the above embodiment, the chip filling tape reels 35A, 35B, . . . are provided in a common chip filling tape reel attachment means, but they may be provided separately and independently. If the chip filling tape reels 35A, 35B, . . . are disposed separately and independently in this manner, the chip filling tape reels 35A, 35B, . . . can be easily replaced. Further, in the above embodiment, the chips are picked up from the tape 37 by the chip collector 28, and the chips are directly transferred to the substrates 3A and 3A.
3B..., but a known chip positioning means is provided between the guide rail 4 and the guide roller 46, the chip is picked up from the tape 37 by the chip collet 28 or a separately provided chip collet, and the chip is once positioned. The chip may be positioned by placing it on a means, and then the positioned chip may be sucked and bonded by the chip collet 28. This improves the bonding accuracy of the chip. When storing the chip 36 in the tape 37, the chip 36 is not only stored in the tape 37, but also the chip storage side of the main tape 39 has a weak adhesive, and the chip 36 is stored in a state in which it is attached to the main tape 39. It's okay. In this case, the cover tape 41 may or may not be provided, but since the chip 36 cannot be easily picked up by the chip collet 28, the cover tape 41 may be moved downwardly between the guide rollers 45 and 46 as shown in FIG. It is necessary to provide a known push-up needle 50 to push up the tip 36 from the lower surface of the tape 39.

(Effects of the Invention) As is clear from the above description, according to the present invention, a chip bonding apparatus that is superior in terms of equipment cost and installation area and has excellent workability can be obtained.

Furthermore, one device can simultaneously apply adhesive to multiple locations on one chip and perform chip bonding.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing one embodiment of the present invention, and FIG.
The drawings are a right side view of FIG. 1, FIG. 3 shows the adhesion mechanism section, a is a plan view, b is a side view, and FIG. 4 is an enlarged sectional view of the tip pick-up portion. 3A, 3B... Board, 4... Guide rail, 1
0... Motor for driving in the X direction, 11... Motor for driving in the Y direction, 12... XY table, 13... Rotating shaft, 14... Rotating shaft support plate, 15... Motor for rotating driving, 16... Day Spencer Arm, 17...
Bonding arm, 20...X-direction drive motor, 22...Y-direction drive motor, 24...XY
Table, 26... Dispenser support plate, 27...
... Dispenser, 28 ... Chip collect, 30
...Chip filling reel mechanism, 31...Cover tape winding mechanism, 32...Chip supply device, 33...
...Support plate, 34...Clutch shaft rotation motor, 3
5A, 35B... Chip filling tape reel, 3
6, 36A, 36B... Chip, 37... Tape, 40... Chip filling tape, 42... Clutch shaft rotation motor, 43... Cover tape take-up reel.

Claims (1)

[Claims] 1. A guide rail that guides the board, a chip collet disposed above between the guide rails, a bonding arm that holds the chip collet and extends to one side of the guide rail, and a board that advances the chip at a certain distance from the chip collet. a dispenser disposed above between the guide rails on the opposite side; a dispenser arm that holds the dispenser and extends in the same direction as the bonding arm; and a dispenser arm that holds the bonding arm and the dispenser arm and that holds the tip collet and A chip bonding device comprising driving means for driving the dispenser up and down and in the XY directions, wherein a plurality of chip filling tape reels are disposed on the other side of the guide rail and are wound with tape storing chips at equal intervals. a chip filling tape reel attachment means that is rotatably attached to each independently;
a chip filling reel mechanism comprising a driving means for driving the selected chip filling tape reel so as to send the selected chip filling tape reel to a pick-up position with the chips in the tape exposed; The dispenser is
A chip bonding device, characterized in that the chip bonding device is attached to the dispenser arm via an XY table driven in the XY directions.