JPH0548618B2 - - Google Patents

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a chip bonding device.

(Background of the Invention) In chip bonding, an adhesive such as an epoxy resin is applied in advance to the area where the chip is to be bonded, and then, in the next stage, the chip is bonded to the area where the adhesive is applied.

Generally, in normal ICs, LSIs, etc., the chip is simply bonded to the substrate, so the adhesive is applied to the center of the bonding area.
Only the location is sufficient. In such a case, since the dispenser that drips the adhesive and the chip collet that bonds the chips are always kept at a certain distance, it is necessary to interlock the dispenser arm that holds the dispenser and the bonding arm that holds the chip collet. This allows adhesive application and chip bonding to be performed simultaneously with one device.

However, as in hybrid ICs, resistors,
When chips such as capacitors and transistors are bonded, adhesive must be applied to multiple locations at a predetermined distance from the center where the chips are bonded. More specifically, resistor chips and capacitor chips have electrodes on both ends of the chip, and it is necessary to apply adhesive to two locations corresponding to the electrodes on one chip. Furthermore, since a transistor chip has electrodes at three locations, it is necessary to apply adhesive to three locations on one chip.

In this way, when it is necessary to apply adhesive to multiple locations on one chip, the distance between the dispenser and the chip collet varies, making it possible to apply adhesive and chip bonding at the same time with one device. Not.

(Objective of the Invention) An object of the present invention is to provide a chip bonding device that can simultaneously apply adhesive to multiple locations on one chip and perform chip bonding with one device.

(Means for Solving the Problems) The configuration of the present invention for solving the above object includes a dispenser arm, a bonding arm disposed in the substrate advancing direction from the dispenser arm, and a bonding arm held by the bonding arm and bonded. A tip collet that bonds the tip to the area where the agent is applied, and a tip collector that holds the dispenser arm and the bonding arm and simultaneously moves both arms up and down and in XY.
In the chip bonding apparatus, the dispenser arm is provided with a drive means for driving in a direction.
A dispenser XY table that drives the dispenser in the XY direction is provided, and this dispenser
The present invention is characterized in that the table is provided with the dispenser for applying adhesive to the substrate.

(Embodiments of the Invention) The present invention will be described below with reference to illustrated embodiments.
FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a right side view of FIG. 1, and FIG. The figure is an enlarged sectional view of the chip pickup portion. base 1
A guide rail fixing base 2 is fixed on the top, and boards 3A, 3B, 3C... are mounted on this guide rail fixing base 2.
Guide rails 4, 4 are fixed to guide the. Between the guide rails 4, 4, there is a stopper that can move up and down, and a board 3 that can move up and down and in the X direction.
A, 3B, 3C, . . . presser plates 6 for pressing against the stopper 5 are arranged at regular intervals. The above is a conventionally known structure. Also, the substrates 3A, 3B, 3
C... is intermittently fed along the guide rails 4, 4 by known means (not shown).

Mounted on one side of the guide rail 4 on the base 1 is an XY table 12 having a known structure and driven in the XY directions by an X direction drive motor 10 and a Y direction drive motor 11. A rotary shaft support plate 14 that rotatably supports a rotary shaft 13 extending in the X direction is fixed on the XY table 12, and a rotary drive motor fixed to the rotary shaft support plate 14 is attached to the rotary shaft 13. 15 output shafts are connected. Further, the rotating shaft 13 includes substrates 3A, 3B,
A dispenser arm 16 and a bonding arm 17 are fixed from the advancing side of 3C.

The dispenser arm 16 is provided with an X table 2 that is driven in the X direction by an X direction drive motor 20.
1 and a Y table 23 driven in the Y direction by a Y direction drive motor 22.
has been fixed through. Said XY table 24
Since the structure itself is well known, a detailed explanation of the structure will be omitted.
The provision of the table 24 is a novel structure.
On the XY table 24 is a dispenser support plate 26.
is fixed to the tip of the dispenser support plate 26, and the tip of the dispenser 27 is fixed to the guide rail 4.
It is fixed so that it is located above the gap. At the tip of the bonding arm 17, a chip collet 28 for vacuum suctioning a chip, which will be described later, is fixed so as to be located above between the guide rails 4. Here, the coordinate relationship between the tip of the dispenser 27 and the tip of the tip collet 28 is such that they are spaced apart by the same pitch interval as the pitch of the stopper 5 in the X direction, and have the same coordinates in the Y direction.

A chip supply device 30 is disposed on the other side of the guide rail 4 of the base 1. That is,
A chip filling reel rotation motor 32 is fixed to a support plate 31 fixed on the base 1, and a chip filling tape reel 33 is detachably attached to the output shaft of the chip filling reel rotation motor 32. . A hoop-shaped tape 35 for storing good chips 34 is wound around the chip filling tape reel 33. As shown in FIG. 4, the tape 35 has a main tape 37 on the underside of an auxiliary tape 36 in which holes 36a for storing chips 34 are formed at equal intervals.
Chip filling tape 38 formed by pasting together
and a cover tape 3 that covers the top surface of the auxiliary tape 36.
It consists of 9. Further, above the chip filling reel rotation motor 32, although only the side surface is shown in FIG. 2, a cover tape winding motor 40 is fixed, and the output shaft of the cover tape winding motor 40 is fixed. A cover tape take-up reel 41 is detachably attached to the cover tape.

A cover tape 39 is disposed between the chip filling tape reel 33 and the cover tape take-up reel 41.
A guide roller 42 that guides the supporting plate 31
It is rotatably supported. Further, between the chip filling tape reel 33 and the guide rail 4, there is a 2-way guide for horizontally guiding the chip filling tape 38.
Guide rollers 43 and 44 are rotatably supported by the support plate 31.

Next, the operation will be explained. As shown in FIG. 1, the chip 34 has already been bonded to the substrate 3A, and adhesive has already been applied to the substrate 3B at points B and C at a predetermined distance from the center point A where the chip 34 is bonded. I will explain further.

From the state shown in Figure 1, the X and Y direction drive motor 1
0 and 11 are driven, the XY table 12 moves in the XY direction, and the lower end of the chip collection 28 reaches a position (guide rollers 43, 44 (between). Next, the rotation drive motor 15 is driven to rotate the dispenser arm 16 and bonding arm 17 via the rotation shaft 13, and the dispenser 27 and tip collet 28 are lowered. As a result, the lower end of the chip collet 28 comes into contact with the chip 34 housed in the tape 35 and is vacuum-adsorbed.

Next, the rotary drive motor 15 is reversely rotated, and the dispenser 27 and tip collet 28 are raised. As a result, the chip 34 is picked up from the tape 35 by the chip collet 28. Subsequently, the X and Y direction drive motors 10 and 11 are driven.
The XY table 12 moves in the XY direction, the chip 34 attracted to the chip collet 28 is placed above point A of the board 3B, and the lower end of the dispenser 27 is placed above the board 3B.
They are respectively located above point A of C. Next, the rotational drive motor 15 rotates normally, and the dispenser 27 and tip collet 28 descend. As a result, the chip 34 attracted to the chip collet 28 is pressed against the adhesive applied to the point A of the substrate 3B and bonded. Further, at the same time as the dispenser 27 is lowered, or according to a predetermined program before the dispenser 27 is positioned above point A of the substrate 3C, the X and Y drive motors 20 and 22 are driven to slightly move the XY table 24. Dispenser 2
When 7 descends and approaches the substrate 3C, it approaches point B, and the adhesive is dripped at point B. Next, according to a predetermined program, the X and Y drive motors 20 and 22 are driven again to move the XY table 24.
moves slightly and approaches point C, and adhesive is dripped at point C. The chip 34 is attached to the substrate 3B as described above.
When bonding and application of adhesive to points B and C of the substrate 3C are completed, the rotation drive motor 1
5 is reversed, and the dispenser 27 and tip collet 28 are raised.

Also, as mentioned above, the chip filling tape reel 3
Chip 3 stored in tape 35 wound around 3
4 is picked up by the chip collet 28, and at the same time, the motor 3 for rotating the chip filling reel is activated.
2 and the cover tape winding motor 40 rotate a certain amount, and the next chip 34 in the next chip filling tape 38 is fed to the pick-up position. Further, the cover tape 39 is wound up by a cover tape take-up reel 41, and the chip 34 within the tape 35 is exposed.

When bonding of the chip 34 to point A of the substrate 3B and application of adhesive to points B and C of the substrate 3C are completed by the above series of operations, the stopper 5
is lowered, and the presser plate 6 is lowered while moving slightly to the left in FIG. And the substrate 3A,
3B, 3C, . . . are fed one pitch along the guide rail 4 by a well-known feeding means, and the stopper 5 is raised just before this feeding is completed. Thereafter, the holding plate 6 rises, moves to the right in FIG. 1, and presses the substrates 3A, 3B, 3C, etc. against the stopper 5. As a result, the board 3C is connected to the chip collet 28.
The substrate 3D is located below the dispenser 27.

In this way, the dispenser 27 is arranged above between the guide rails 4 on the substrate advancing side at a certain distance from the chip collet 28, and the dispenser 27
The dispenser arm 16 that holds the bonding arm 17 is attached to the drive means to which the bonding arm 17 is attached, and the dispenser arm 16 is attached to the dispenser arm 16 via the XY table 24 so that only the dispenser 27 can move in the XY direction. One device can simultaneously apply adhesive to a plurality of points B and C and bond the chip 34 to one chip.

In the above embodiment, the case where the chip is picked up from the tape 35 by the chip collet 28 and bonded directly to the substrates 3A, 3B, etc. has been explained, but the guide rail 4 and the guide roller 4 are
A known chip positioning means is disposed between the chips 4 and 4, and the chip is picked up from the tape 35 by the chip collet 28 or a separately provided chip collet, placed on the chip positioning means once to position the chip, and then the positioned chip is The chip collet 28 may be used to adsorb and bond. This improves the bonding accuracy of the chip. Furthermore, when storing the chips 34 on the tape 35, the chips 34 are not simply stored, but the chip storage side of the main tape 37 has a weak adhesive, and the chips 34 are stored with the chips 34 affixed to the main tape 37. It's okay. In this case, the cover tape 39 may or may not be provided, but since the chip 34 may not be easily picked up by the chip collet 28, the cover tape 39 may be moved downward between the guide rollers 43 and 44 as shown in FIG. A known push-up needle 50 is provided, and this push-up needle 5
0, it is necessary to push the chip 34 up from the bottom surface of the tape 37. Also, the chip supply device 3
0 used a tape 35 in which chips 34 were stored, but a mechanism for driving a wafer ring in which diced chips were attached or a tray in which chips from which only good products were selected was stored in the XY direction was used in the same way as in the past. May be used.

(Effects of the Invention) As is clear from the above description, according to the present invention, adhesive application to multiple locations and chip bonding can be performed simultaneously on one chip using one device.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing one embodiment of the present invention, and FIG.
The drawings are a right side view of FIG. 1, FIG. 3 shows the adhesive mechanism section, a is a front view, b is a side view, and FIG. 4 is an enlarged sectional view of the tip pick-up portion. 3A, 3B...: Board, 4... Guide rail,
10... Motor for driving in the X direction, 11... Motor for driving in the Y direction, 12... XY table, 13... Rotating shaft, 14... Rotating shaft support plate, 15... Motor for rotating driving, 16... Day Spencer arm, 17...
...Bonding arm, 20...X-direction drive motor, 22...Y-direction drive motor, 24...
XY table, 26...dispenser support plate, 2
7... Dispenser, 28... Chip collection.

Claims (1)

[Claims] 1. A dispenser arm, a bonding arm disposed in the substrate advancing direction from the dispenser arm, a chip collet held by the bonding arm for bonding a chip to an adhesive application location, and holding the dispenser arm and the bonding arm. and move both arms up and down at the same time.
In the chip bonding apparatus, the dispenser arm is provided with a dispenser XY table that drives the dispenser in the XY directions, and the dispenser arm is provided with a dispenser XY table that drives the dispenser in the XY directions.
A chip bonding apparatus characterized in that an XY table is provided with the dispenser for applying adhesive to a substrate.